CN218849437U

CN218849437U - Chip jointing device

Info

Publication number: CN218849437U
Application number: CN202320031067.6U
Authority: CN
Inventors: 赵偲; 郑文; 申童童
Original assignee: Taiyuan University of Technology
Current assignee: Taiyuan University of Technology
Priority date: 2023-01-06
Filing date: 2023-01-06
Publication date: 2023-04-11
Anticipated expiration: 2033-01-06

Abstract

The utility model relates to a chip processing technology field just discloses a chip jointing device, include: a supporting bench fixed cleaning mechanism, set up in the top of a supporting bench, fixed cleaning mechanism, fixed disk fixed mounting is at the top of a supporting bench, curb plate fixed mounting is in one side of fixed disk, and quantity is two sets of, a spring, one end fixed connection is in the inner wall of curb plate, the other end inwards extends, fixed plate fixed connection is in the extension end of spring, and quantity is two sets of, handle fixed mounting is in the top of fixed plate, and quantity is two sets of, brush board fixed mounting is in the upper and lower both ends of handle, the fixed plate sets up for falling L shape, install the curb plate on the fixed disk, fixedly connected with spring on the curb plate, it fixes the chip to be connected with the fixed plate on the spring, install the handle on the fixed plate, install the brush board from top to bottom on the handle, when through fixing different chips, make the brush board clean the screen cloth of processing bench when opening and shutting the operation through the handle.

Description

Chip jointing device

Technical Field

The utility model relates to a chip processing technology field specifically is a chip jointing device.

Background

According to the Chinese patent: "a chip bonding apparatus for chip processing", and publication No. is: CN 215771075U', the patent is provided with a second hydraulic rod, and the height of the jointing device can be adjusted; through being provided with the sliding tray, can adjust a connecting plate position, advantages such as raise the efficiency, but in the use of reality, combine to use the welder to the chip, can produce the piece so and produce the influence and can appear scrapping condition even to next chip if not in time clear up on the processing bench, consequently released a chip jointing device according to the problem that above-mentioned provided.

SUMMERY OF THE UTILITY MODEL

Technical problem to be solved

To the deficiency of the prior art, the utility model provides a chip jointing device.

(II) technical scheme

In order to achieve the above purpose, the utility model provides a following technical scheme: a chip bonding apparatus comprising: the supporting platform is characterized in that a first supporting plate is fixedly mounted at the top of the supporting platform, a second supporting plate is fixedly mounted at the top of the first supporting plate, a guide rail is connected to the left side of the first supporting plate in a sliding manner, and a processing mechanism is fixedly mounted at the bottom of the guide rail;

the fixed cleaning mechanism is arranged at the top of the supporting platform;

fixed clearance mechanism includes:

the fixed disc is fixedly arranged at the top of the support platform;

the side plates are fixedly arranged on one side of the fixed disc, and the number of the side plates is two;

one end of the spring is fixedly connected with the inner wall of the side plate, and the other end of the spring extends inwards;

the fixing plates are fixedly connected to the extending ends of the springs, and the number of the fixing plates is two;

the handles are fixedly arranged at the top of the fixed plate, and the number of the handles is two;

and the brush plates are fixedly arranged at the upper end and the lower end of the handle.

Preferably, the support table is hollow, and a screen is fixedly mounted on the top of the support table.

Preferably, the bottom of the supporting platform is provided with a collecting box, and the inside of the collecting box is arranged in a hollow manner.

Preferably, the bottom of the supporting table is fixedly provided with supporting legs, and the number of the supporting legs is four.

Preferably, the inner wall of the collection box is provided with two groups of sliding rods, the two groups of sliding rods are connected with a collection frame in a sliding mode, and the collection frame is provided with a handle.

Preferably, the fixed plate is the setting of falling L shape, and two sets of fixed plates are the symmetry installation, and be the setting of falling L shape through the fixed plate, it is better to the fixed effect of chip.

(III) advantageous effects

Compared with the prior art, the utility model provides a chip connecting device possesses following beneficial effect:

1. the chip jointing device is characterized in that a fixed disc is installed at the top of a supporting table, a side plate is installed on the fixed disc, a spring is fixedly connected onto the side plate, a fixed plate is connected onto the spring to fix a chip, a handle is installed on the fixed plate, brush plates are installed on the handle vertically, and when different chips are fixed, the brush plates are used for cleaning a screen on a processing table when the different chips are opened and closed through the handle.

2. This chip jointing device brushes the collection case of bottom through the piece on the screen cloth, installs the slide bar at the collecting box inner wall, and it has the collection frame to slide on the slide bar, collects fast through collecting the frame, is convenient for clear up.

Drawings

The accompanying drawings are included to provide a further understanding of the invention, and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention, and together with the description serve to explain the principles of the invention. In the drawings:

FIG. 1 is a main schematic view of the present invention;

FIG. 2 is a schematic main sectional view of the present invention;

fig. 3 is a partially enlarged schematic view of the present invention.

In the figure: 1. a support table; 2. a first support plate; 3. a second support plate; 4. a guide rail; 5. a processing mechanism; 6. a fixed cleaning mechanism; 61. fixing the disc; 62. a side plate; 63. a spring; 64. a fixing plate; 65. a handle; 66. brushing a plate; 7. screening a screen; 8. a collection box; 9. support the feet.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments.

Examples of which are illustrated in the accompanying drawings, wherein like reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below by referring to the drawings are exemplary intended for explaining the present invention, and should not be construed as limiting the present invention.

In the description of the present invention, it is to be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", and the like, indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for convenience of description and simplicity of description, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore, should not be construed as limiting the present invention.

In the present invention, unless otherwise expressly stated or limited, the terms "mounted," "connected," and "fixed" are to be construed broadly and may, for example, be fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meaning of the above terms in the present invention can be understood according to specific situations by those of ordinary skill in the art.

Example 1

As shown in fig. 1-3, the present invention provides a chip bonding apparatus, comprising: brace table 1, brace table 1's top fixed mounting has backup pad one 2, and the top fixed mounting of backup pad one 2 has backup pad two 3, and the left side sliding connection of backup pad one 2 has guide rail 4, and the bottom fixed mounting of guide rail 4 has processing agency 5, and fixed clearance mechanism 6 sets up in brace table 1's top, and fixed clearance mechanism 6 includes: fixed disk 61, fixed mounting is in the top of brace table 1, curb plate 62, fixed mounting is in one side of fixed disk 61, and the quantity is two sets of, spring 63, one end fixed connection is in the inner wall of curb plate 62, the other end inwards extends, fixed plate 64, fixed connection is in the extension end of spring 63, and the quantity is two sets of, handle 65, fixed mounting is in the top of fixed plate 64, and the quantity is two sets of, brush board 66, fixed mounting is in the upper and lower both ends of handle 65, fixed plate 64 sets up for falling L shape, and two sets of fixed plate 64 are the symmetry installation, set up for falling L shape through fixed plate 64, fixed effect to the chip is better.

In this embodiment, the side plate 62 is attached to the fixed plate 61, the spring 63 is fixedly connected to the side plate 62, the fixing plate 64 is connected to the spring 63 to fix the chip, the handle 65 is attached to the fixing plate 64, and the brush plate 66 is attached to the handle 65 in the vertical direction, so that the brush plate 66 cleans the screen 7 on the processing table when the handle 65 is opened and closed to fix different chips.

Example 2

As shown in fig. 1-3, on the basis of embodiment 1, the utility model provides a technical solution: the inside of brace table 1 is the cavity setting, and the top fixed mounting of brace table 1 has screen cloth 7, and collecting box 8 is installed to the bottom of brace table 1, and collecting box 8's inside is the cavity setting, and brace table 1's bottom fixed mounting has supporting legs 9, and supporting legs 9's quantity is four groups, and the slide bar is installed to collecting box 8's inner wall, and the quantity of slide bar is two sets of, and sliding connection has the collection frame on two sets of slide bars, and installs the handle on the collection frame.

In this embodiment, install the slide bar through 8 inner walls of collecting box, it has the collection frame to slide on the slide bar, collects fast through collecting the frame, is convenient for clear up.

The working principle of the chip bonding apparatus will be described in detail below.

As shown in fig. 1-3, in use, the existing mechanism on the patent is installed on a support table 1 for processing, a fixed disc 61 is installed on the top of the support table 1, a side plate 62 is installed on the fixed disc 61, a spring 63 is fixedly connected to the side plate 62, a fixed plate 64 is connected to the spring 63 for fixing a chip, a handle 65 is installed on the fixed plate 64, and a brush plate 66 is installed on the handle 65 from top to bottom, when different chips are fixed, the brush plate 66 cleans a screen 7 on a processing table through the handle 65 during opening and closing operations, scraps on the screen 7 are brushed into a collection box 8 at the bottom, a slide rod is installed on the inner wall of the collection box 8, a collection frame slides on the slide rod, and the collection frame is used for rapid collection so as to facilitate cleaning.

It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising a reference structure" does not exclude the presence of other identical elements in a process, method, article, or apparatus that comprises the element.

Claims

1. A chip bonding apparatus, comprising: the supporting device comprises a supporting table (1), wherein a first supporting plate (2) is fixedly mounted at the top of the supporting table (1), a second supporting plate (3) is fixedly mounted at the top of the first supporting plate (2), a guide rail (4) is slidably connected to the left side of the first supporting plate (2), and a processing mechanism (5) is fixedly mounted at the bottom of the guide rail (4);

the fixed cleaning mechanism (6) is arranged at the top of the supporting table (1);

fixed cleaning mechanism (6) comprising:

a fixed disc (61) fixedly arranged on the top of the support table (1);

the side plates (62) are fixedly arranged on one side of the fixed plate (61), and the number of the side plates is two;

one end of the spring (63) is fixedly connected to the inner wall of the side plate (62), and the other end of the spring extends inwards;

the fixing plates (64) are fixedly connected to the extending ends of the springs (63) and are two groups in number;

the handles (65) are fixedly arranged at the top of the fixing plate (64), and the number of the handles is two;

and brush plates (66) fixedly arranged at the upper end and the lower end of the handle (65).

2. The die bonding apparatus of claim 1, wherein: the inside of brace table (1) is cavity setting, and the top fixed mounting of brace table (1) has screen cloth (7).

3. The die bonding apparatus of claim 1, wherein: the bottom of the supporting table (1) is provided with a collecting box (8), and the inside of the collecting box (8) is arranged in a hollow mode.

4. The die bonding apparatus of claim 1, wherein: the bottom of the supporting table (1) is fixedly provided with four groups of supporting legs (9), and the number of the supporting legs (9) is four.

5. A die-bonding apparatus according to claim 3, wherein: the inner wall of the collection box (8) is provided with two groups of sliding rods, the two groups of sliding rods are connected with a collection frame in a sliding mode, and a handle is arranged on the collection frame.

6. The die bonding apparatus of claim 1, wherein: the fixing plates (64) are arranged in an inverted L shape, and the two groups of fixing plates (64) are symmetrically arranged.