CN218847286U - Temperature vibration sensor - Google Patents
Temperature vibration sensor Download PDFInfo
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- CN218847286U CN218847286U CN202320072562.1U CN202320072562U CN218847286U CN 218847286 U CN218847286 U CN 218847286U CN 202320072562 U CN202320072562 U CN 202320072562U CN 218847286 U CN218847286 U CN 218847286U
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- temperature
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- sensor
- vibration sensor
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
- Y02E60/10—Energy storage using batteries
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Abstract
A temperature vibration sensor comprising: the temperature sensor comprises a base and a sensor main body arranged on the base, wherein a temperature probe which is detachably mounted is arranged in the base, the temperature probe is connected with the sensor main body through a lead, a probe accommodating cavity for accommodating the temperature probe and a lead accommodating cavity for accommodating the lead are arranged in the base, and a limiting sheet for limiting the lead is arranged on the lead accommodating cavity; above-mentioned temperature vibration sensor through setting up the base, separates temperature probe and sensor main part, and when the installation was located the security better, during the not high equipment of trouble temperature rise, put temperature probe in base center department. The temperature probe voltage component is connected to the sensor interior by a lead. When the temperature sensor is installed on equipment with general safety and higher fault temperature rise, the temperature probe is separated from the sensor main body, the temperature probe is installed at a position with higher temperature in normal work or at a position with higher fault temperature rise, and the sensor main body is installed at a position with lower fault temperature rise.
Description
Technical Field
The utility model relates to a sensor, in particular to temperature vibration sensor.
Background
It is known that there is often a very high risk in the coal mine collection process, and when the machines under the mine work abnormally, the temperature and vibration frequency of the mining machines often deviate considerably from normal values. Therefore, the acquisition of temperature vibration sensing has important significance for detecting the working state of the machine, prolonging the service life and protecting the life safety of field personnel.
According to the communication between the post-analysis survey report of a large number of underground safety accidents and mine safety managers, when the underground operation is abnormal due to various reasons, the temperature of the abnormal machine is increased. Since the temperature of some key components of the machine during operation is about 50 ℃, if the sensor happens to be in a dormant state during fault, the sensor, particularly a battery therein, is likely to be seriously affected along with the rise of the temperature, and even the battery can explode.
Disclosure of Invention
In view of this, it is necessary to provide a temperature vibration sensor with improved adaptability.
A temperature vibration sensor comprising: the base and the setting are in sensor main part on the base, be provided with demountable installation's temperature probe in the base, temperature probe passes through the wire and is connected with sensor main part, be provided with in the base and hold temperature probe's probe holds the chamber and holds the wire that holds the wire and hold the chamber, the wire holds the spacing piece that is provided with spacing wire on the chamber.
In a preferred embodiment, the probe accommodating cavity is relatively arranged at the central position of the lead accommodating cavity and is a hollow through hole cavity.
In a preferred embodiment, the base comprises: the base main part reaches and sets up the installation ear that is in on the base main part and with sensor main part erection joint.
In a preferred embodiment, the probe accommodating cavity is arranged on the base main body and is arranged at a central position, the mounting ears form two wing structures of the base main body, and the mounting ears are provided with fixing columns.
In a preferred embodiment, the base main body is of a cylindrical structure, the probe accommodating cavity is arranged in a size suitable for the temperature probe, and a limiting step which is matched with the temperature probe and limits the temperature probe is arranged in the probe accommodating cavity.
In a preferred embodiment, the sensor body comprises: the temperature sensor comprises a bottom shell and an upper cover which are matched with each other, a vibration chip PCB arranged in the bottom shell, a main board connected with the vibration chip PCB and a temperature probe, a battery box accommodated in the bottom shell and oppositely arranged above the main board, a battery accommodated in the battery box, and an antenna module arranged beside the battery box.
In a preferred embodiment, the main control module, the radio frequency module and the temperature acquisition module are arranged on the main board; and an acceleration acquisition module is arranged on the vibration chip PCB.
In a preferred embodiment, the bottom shell is connected with the upper cover through a threaded interface, and a waterproof ring is arranged between the bottom shell and the upper cover.
In a preferred embodiment, the bottom case includes: the bottom shell comprises a bottom shell main body and an assembling lug which is arranged on the bottom shell main body and matched with the installing lug, wherein the assembling lug is arranged on the side wall of the bottom shell main body and is formed by outwards extending the end part of the bottom shell main body.
In a preferred embodiment, the bottom casing main body is larger than the base main body in size, the bottom casing main body is provided with a bottom casing accommodating cavity for accommodating the mainboard, and a hollow hole for a lead to pass through is formed in the middle of the bottom casing accommodating cavity.
Above-mentioned temperature vibration sensor through setting up the base, separates temperature probe and sensor main part, and when the installation was located the security better, during the not high equipment of trouble temperature rise, put temperature probe in base center department. The center of the base is the position for installing the temperature probe. At this time, the lead wire of the temperature probe is placed on the base after being wound. The output of the temperature probe is connected with the sensor main body after being wound. The temperature probe voltage component is connected to the sensor interior by a lead wire. When the temperature sensor is installed on equipment with general safety and higher fault temperature rise, the temperature probe needs to be separated from the sensor main body, the temperature probe is installed at a position with higher temperature in normal work or at a position with higher fault temperature rise, and the sensor main body is installed at a position with lower fault temperature rise, so that the adaptability of the temperature sensor is improved.
Drawings
Fig. 1 is a schematic view of a partial structure of a temperature vibration sensor according to an embodiment of the present invention;
fig. 2 is an exploded view of a part of a temperature vibration sensor according to an embodiment of the present invention;
fig. 3 is a partial sectional view of the temperature vibration sensor according to an embodiment of the present invention;
fig. 4 is a schematic structural diagram of a base of a temperature vibration sensor according to an embodiment of the present invention;
fig. 5 is a schematic structural diagram of a temperature probe of a temperature vibration sensor according to an embodiment of the present invention.
Detailed Description
The following examples are provided to facilitate a better understanding of the invention, but are not intended to limit the invention.
As shown in fig. 1 to 5, the present invention provides a temperature vibration sensor 100, including: a base 20, and a sensor body 40 provided on the base 20. A removably mounted temperature probe 60 is provided in the base 20. The temperature probe 60 is connected to the sensor body 40 by a lead 80.
The base 20 is provided with a probe accommodating chamber 222 for accommodating the temperature probe 60 and a lead accommodating chamber 224 for accommodating the lead 80. A limiting sheet 227 for limiting the lead is arranged on the lead accommodating cavity 224. A winding boss 229 is provided in the wire accommodation chamber 224.
The probe-receiving cavity 222 is relatively centered in the wire-receiving cavity 224 and is a hollow through-bore cavity.
The base 20 includes: the base body 22, and the mounting ears 24 that are disposed on the base body 22 and are connected to the sensor body 40. The base body 22 has a cylindrical shape.
The probe receiving cavity 222 is disposed on the base body 22 and is disposed in a central position. The mounting ears 24 form the wing structures of the body of the base 20. The mounting ears 24 are provided with fixing posts 242.
The probe receiving cavity 222 is sized to accommodate the temperature probe 60. The probe accommodating cavity 222 is provided therein with a limit step 223 which is matched with the temperature probe 60 and limits the temperature probe 60.
Further, the sensor main body 40 of the present embodiment includes: a bottom case 42 and an upper cover 44 which are matched with each other, a vibration chip PCB 46 arranged in the bottom case 42, a main board 48 connected with the vibration chip PCB 46 and a temperature probe 60, a battery box 49 accommodated in the bottom case 42 and oppositely arranged above the main board 48, a battery 43 accommodated in the battery box 49, and an antenna module 45 arranged beside the battery box 49.
Further, the main board 48 of this embodiment is provided with a main control module, a radio frequency module, and a temperature acquisition module. An acceleration acquisition module is arranged on the vibration chip PCB 46.
The bottom shell 42 and the top cover 44 are connected by a threaded interface. A waterproof ring 47 is arranged between the bottom shell 42 and the upper cover 44.
The bottom case 42 includes: a bottom case body 422, and a fitting ear 424 provided on the bottom case body 422 and fitted with the mounting ear 24. The fitting lugs 424 are provided on the sidewalls of the bottom case body 422 and are formed by extending the ends of the bottom case body 422 outward. The bottom case body 422 has a cylindrical shape.
The bottom case body 422 is larger in size than the base body 22. The bottom case main body 422 is provided with a bottom case accommodating chamber 423 that accommodates the main board 48. A hollow hole through which the wire passes is provided at a middle position of the bottom case receiving cavity 423.
The utility model discloses an acceleration acquisition module is on the vibration chip PCB; the relevant components of the main control and radio frequency module are arranged on the main board 48; the temperature probe 60 is present at a cutout in the center of the base 20; the components and parts related to the temperature acquisition module are arranged on the mainboard. The dimension of the vibration quantity is m/s ^2, and the dimension is used for measuring the strength of the vibration generated by the measured machine; the installation mode of the sensor is that the screw holes at the two ends of the base are fixed on a machine through screws.
After detaching the base 20 from the bottom case 42, the temperature probe 60 is separated from the base 20, and the temperature probe 60 is connected to the bottom center of the bottom case through a line.
The structure separated from the temperature probe 60 enables the sensor to measure higher temperature, simultaneously prevents the frequency response of the sensor from being too poor as much as possible, and can obtain good response in a required measuring frequency range. The frequency response is the ratio of acceleration input to acceleration output at different vibration frequencies, approximately 1 being better.
In the case of disassembly, the base and bottom shell are disassembled and the probe is taken out separately. The temperature probe is connected with the center of the bottom shell through a line.
When the temperature probe is installed on equipment with better safety and low fault temperature rise, the temperature probe is placed at the center of the base. The central circle of the base is the position for installing the temperature probe. At this time, the lead wire of the temperature probe is placed on the base after being wound. The output of the temperature probe is connected with the sensor base after being wound. The output of the temperature probe is led out from the side part, so that the vibration quantity is conveniently and completely transmitted to the sensor base from the vibration source. The temperature probe voltage component is connected to the sensor interior by a lead.
When the temperature sensor is installed on equipment with general safety and higher fault temperature rise, the temperature probe needs to be separated from the metal base of the sensor, the temperature probe is installed at a position with higher temperature in normal work or at a position with higher fault temperature rise, and the sensor main body is installed at a position with lower fault temperature rise.
The utility model discloses a temperature vibration sensor is arranged in detecting the machine temperature and vibration frequency under the ore deposit in the working process, through carrying out the analysis to the temperature and the vibration frequency who gather, judges whether the machine is normal work, can send the warning to abnormal conditions simultaneously.
The utility model discloses a temperature vibration sensor scheme adopts the structure that becomes the loading and unloading with temperature probe and sensor overall structure design, has solved this problem. For a working machine with low temperature and relatively good safety, the sensor is adjusted into an integrated installation mode; under the condition of higher working temperature, the temperature probe is detached and installed at other positions, and the probe is connected with the sensor by adopting a lead.
The utility model discloses place position and mounting means with the temperature detection module of sensor through changing the structure for it not only can deal with general-40 ~70 temperature detection, is greater than the abnormal conditions of extreme high temperature more than 70 to the temperature, also can carry out temperature detection under the condition of guaranteeing battery safety.
The temperature and vibration sensor is applied to the field of temperature and vibration sensing under mines, and the problem that the temperature and vibration sensor can be protected from being damaged by sudden temperature rise when a machine under the mines breaks down at high temperature is solved, so that the temperature and vibration data can be completely uploaded to a base station when the machine breaks down.
The utility model discloses make the sensor can be protected to the at utmost when unusual high temperature appears in the machine under the ore deposit on the temperature vibration sensor, make it not receive the proruption temperature rise and destroy to guarantee that unusual data can upload the alarm that sends out smoothly.
In light of the foregoing description of the preferred embodiments according to the present application, it is to be understood that various changes and modifications may be made by those skilled in the art without departing from the scope of the invention as defined by the appended claims. The technical scope of the present application is not limited to the contents of the specification, and must be determined according to the scope of the claims.
Claims (10)
1. A temperature vibration sensor, comprising: the base and the setting are in sensor main part on the base, be provided with demountable installation's temperature probe in the base, temperature probe passes through the wire and is connected with sensor main part, be provided with in the base and hold temperature probe's probe holds the chamber and holds the wire that holds the wire and hold the chamber, the wire holds the spacing piece that is provided with spacing wire on the chamber.
2. The temperature vibration sensor as claimed in claim 1, wherein the probe receiving cavity is disposed opposite to a central position of the wire receiving cavity and is a hollow through-hole cavity.
3. The temperature vibration sensor as claimed in claim 1, wherein the base includes: the base body and the mounting lug are arranged on the base body and are connected with the sensor body in a mounting mode.
4. The temperature vibration sensor according to claim 3, wherein the probe accommodating cavity is disposed on the base body and disposed at a central position, the mounting ears form two wing structures of the base body, and the mounting ears are provided with fixing posts.
5. The temperature vibration sensor according to claim 3, wherein the base body has a cylindrical shape, the probe accommodating cavity is adapted to the temperature probe in size, and a limiting step matched with and limiting the temperature probe is arranged in the probe accommodating cavity.
6. The temperature vibration sensor according to any one of claims 3 to 5, wherein the sensor main body includes: the temperature sensor comprises a bottom shell and an upper cover which are matched with each other, a vibration chip PCB arranged in the bottom shell, a main board connected with the vibration chip PCB and a temperature probe, a battery box accommodated in the bottom shell and oppositely arranged above the main board, a battery accommodated in the battery box, and an antenna module arranged beside the battery box.
7. The temperature vibration sensor according to claim 6, wherein a main control module, a radio frequency module and a temperature acquisition module are arranged on the main board; and an acceleration acquisition module is arranged on the vibration chip PCB.
8. The temperature vibration sensor according to claim 6, wherein the bottom shell is connected with the upper cover through a threaded interface, and a waterproof ring is arranged between the bottom shell and the upper cover.
9. The temperature vibration sensor according to claim 6, wherein the bottom case includes: the bottom shell comprises a bottom shell main body and an assembling lug which is arranged on the bottom shell main body and matched with the installing lug, wherein the assembling lug is arranged on the side wall of the bottom shell main body and is formed by outwards extending the end part of the bottom shell main body.
10. The temperature vibration sensor according to claim 6, wherein the bottom housing body is larger than the base body in size, the bottom housing body is provided with a bottom housing accommodating cavity for accommodating the main board, and a hollow hole for passing a wire is formed in a middle position of the bottom housing accommodating cavity.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202320072562.1U CN218847286U (en) | 2023-01-10 | 2023-01-10 | Temperature vibration sensor |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202320072562.1U CN218847286U (en) | 2023-01-10 | 2023-01-10 | Temperature vibration sensor |
Publications (1)
Publication Number | Publication Date |
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CN218847286U true CN218847286U (en) | 2023-04-11 |
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Family Applications (1)
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CN202320072562.1U Active CN218847286U (en) | 2023-01-10 | 2023-01-10 | Temperature vibration sensor |
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CN (1) | CN218847286U (en) |
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2023
- 2023-01-10 CN CN202320072562.1U patent/CN218847286U/en active Active
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Denomination of utility model: A temperature vibration sensor Effective date of registration: 20230706 Granted publication date: 20230411 Pledgee: Shenzhen SME financing Company limited by guarantee Pledgor: SHENZHEN YIRI TECHNOLOGY Co.,Ltd. Registration number: Y2023980047679 |