CN218846213U - Cooking device - Google Patents

Abstract

The application provides a cooking device, relates to household electrical appliances technical field to solve the problem that the temperature measurement subassembly among the correlation technique damages because of high temperature easily. The cooker comprises a panel, a bottom shell, a temperature measuring component and a heat insulation piece, wherein the panel covers the bottom shell and forms a cavity together with the bottom shell; the temperature measuring component and the heat insulation piece are both accommodated in the cavity, the temperature measuring component is positioned on one side close to the panel, and the heat insulation piece is positioned between the temperature measuring component and the surface of the panel on one side close to the cavity; at least part of the temperature measuring assembly penetrates through the heat insulation piece, and the temperature measuring end is abutted to the surface of the panel close to one side of the cavity. This application is through increasing the heat insulating part between temperature measurement subassembly and panel, can effectively cut off the high temperature direct radiation on the panel and give temperature measurement subassembly to reduce temperature measurement subassembly's temperature, prevent that temperature measurement subassembly from because of the risk of high temperature damage, further prolong temperature measurement subassembly's life, be favorable to improving temperature measurement subassembly's temperature measurement degree of accuracy, simultaneously, guarantee cooking device and cooking utensil's security performance.

Description

Cooking device

Technical Field

The application relates to the technical field of household appliances, in particular to a cooker.

Background

Cookers such as induction cookers have the advantages of rapid heating, no open fire, safety, convenience, etc., and are increasingly popular and accepted by consumers. The induction cooker comprises a bottom shell, a heating element and a panel, wherein the panel is connected to the top of the bottom shell, the panel and the bottom shell surround to form a cavity, and the heating element is positioned in the cavity.

When the induction cooker works, high-frequency current passes through the heating element to generate countless closed magnetic field force, and magnetic force lines cut the cookware to generate countless small eddy currents so that the cookware placed on the panel generates heat. In the heating process, the temperature in the pot is often required to be detected, so that the working state of the heating element is adjusted according to the temperature in the pot. In the related technology, a temperature measuring component is arranged in the cavity, and the temperature measuring end of the temperature measuring component is abutted against the inner surface of the panel, so that the purpose of detecting the temperature in the cooker is realized.

However, in the above temperature measuring method, the temperature measuring component is radiated by the high temperature on the panel, and the temperature measuring component is easily damaged by the high temperature.

SUMMERY OF THE UTILITY MODEL

The embodiment of the application provides a cooking device, through increase the heat insulating part between temperature measurement subassembly and panel, can effectively cut off the high temperature direct radiation on the panel and give temperature measurement subassembly to avoid temperature measurement subassembly because of the risk of high temperature damage, further prolong temperature measurement subassembly's life, and be favorable to improving temperature measurement subassembly's temperature measurement degree of accuracy, simultaneously, guarantee cooking device and cooking utensil's security performance.

In order to achieve the above object, an embodiment of the present application provides a cooking device, including a panel, a bottom case, a temperature measuring assembly, and a heat insulating member, wherein the panel covers the bottom case and forms a cavity with the bottom case; the temperature measuring assembly and the heat insulation piece are both accommodated in the cavity, the temperature measuring assembly is positioned on one side close to the panel, and the heat insulation piece is positioned between the temperature measuring assembly and the surface of the panel on one side close to the cavity; the temperature measuring component is provided with a temperature measuring end, at least part of the temperature measuring component penetrates through the heat insulation piece, and the temperature measuring end is abutted to the surface of the panel close to one side of the cavity.

The application provides a cooking device, including panel, drain pan, temperature measurement subassembly and heat insulating part. Through closing the panel lid on the drain pan, the one side that the panel deviates from the drain pan can be used for placing the pan to not only can realize cooking ware and cooking utensil's heating function, make the pan can not scald with drain pan direct contact moreover, with the pan of avoiding the high temperature and damage the drain pan. Through including temperature measurement component, can realize the effect to the accurate temperature measurement of pot temperature. Through including the heat insulating part, the heat insulating part is located between the surface that is close to cavity one side of temperature measurement subassembly and panel, can effectively cut off the high temperature direct radiation on the panel and give temperature measurement subassembly to reduce temperature measurement subassembly's temperature, prevent that temperature measurement subassembly from because of the risk of high temperature damage, further prolong temperature measurement subassembly's life, be favorable to improving temperature measurement subassembly's the temperature measurement degree of accuracy, simultaneously, guarantee cooking device and cooking utensil's security performance.

In a possible implementation manner, the temperature measuring component comprises a temperature measuring circuit board and a temperature measuring element arranged on the temperature measuring circuit board; the first end of the temperature measuring element is fixedly connected with the temperature measuring circuit board, the second end of the temperature measuring element penetrates through the heat insulation piece and abuts against the surface of the panel close to one side of the cavity, and the temperature measuring end is the end part of the temperature measuring element close to one side of the panel; the heat insulation piece is positioned between the temperature measurement circuit board and the surface of the panel close to one side of the cavity.

Through including temperature measurement circuit board and setting up the temperature element on the temperature measurement circuit board, the surface that is close to cavity one side of temperature element butt panel to be used for realizing the effect to the accurate temperature measurement of pot temperature. The temperature measurement circuit board can play fixed, assembly and the effect of support to the temperature element to be favorable to realizing the accurate temperature measurement of temperature element. Meanwhile, the heat insulation piece is located between the temperature measurement circuit board and the panel, the effect that high temperature on the panel directly radiates to the temperature measurement circuit board can be effectively isolated, and the risk that the temperature measurement circuit board is damaged due to high temperature is further prevented.

In a possible implementation manner, the panel is provided with temperature measuring holes, the temperature measuring holes are blind holes, the orifices of the temperature measuring holes face the cavity, and the second end of the temperature measuring element penetrates through the heat insulation part and is located in the temperature measuring holes.

The panel is provided with the temperature measuring hole, the second end of the temperature measuring element is located in the temperature measuring hole, the temperature measuring hole can play a role in mounting the temperature measuring element, and meanwhile, the distance between the temperature measuring element and the top surface of the panel can be shortened by the aid of the temperature measuring hole, so that the temperature measuring effect of the temperature measuring element is improved.

In a possible implementation manner, the temperature measuring circuit board is provided with a first heat dissipation hole, and the heat insulation piece is provided with a second heat dissipation hole and a temperature measuring avoiding hole; the first heat dissipation holes and the second heat dissipation holes are correspondingly arranged, and the second end of the temperature measurement element penetrates through the temperature measurement avoiding holes and is abutted to the surface, close to one side of the cavity, of the panel.

Through including first louvre and second louvre, can improve the radiating effect to temperature measurement subassembly. Through avoiding the hole including the temperature measurement, be convenient for the temperature element to wear to establish and the surface of the close to cavity one side of butt panel.

In a possible implementation manner, an adhesive piece is arranged between the temperature measuring component and the surface of the panel close to one side of the cavity, and the temperature measuring component is connected with the panel through the adhesive piece.

Through including bonding the piece, can play the effect that bonds the temperature measurement subassembly on the panel to improve the assembly stability of temperature measurement subassembly, further guarantee the precision of temperature measurement.

In a possible implementation manner, the bonding piece is positioned at the periphery of the heat insulation piece, and the orthographic projection of the temperature measurement assembly on the panel covers the orthographic projection of the bonding piece and the orthographic projection of the heat insulation piece on the panel; the heating member is arranged in the cavity, the heating member is positioned on one side of the temperature measuring component, which deviates from the panel, and the orthographic projection of the heating member on the panel and the orthographic projection of the bonding member on the panel are mutually staggered and have a distance.

The bonding piece is arranged on the periphery of the heat insulation piece, and the orthographic projection of the temperature measurement component on the panel covers the orthographic projection of the bonding piece and the orthographic projection of the heat insulation piece on the panel, so that the problem of mutual interference with the heat insulation piece can be avoided during assembly. Through setting up the heating member is in orthographic projection on the panel with the piece that bonds is in orthographic projection on the panel misplaces each other, and has the interval, can effectively prevent the risk that the piece that bonds because of the high temperature damage of heating member.

In a possible implementation manner, the first heat dissipation holes include a plurality of first heat dissipation holes which are arranged at intervals along the circumferential direction of the temperature measurement circuit board; the second heat dissipation holes comprise a plurality of second heat dissipation holes which are arranged at intervals along the circumferential direction of the heat insulation piece, and the first heat dissipation holes and the second heat dissipation holes are arranged in a one-to-one correspondence mode.

Through including a plurality of first louvres and second louvre, can be on guaranteeing that the thermal-insulated basis of heat insulating part, improve temperature components's radiating effect at the at utmost.

In a possible implementation manner, the temperature measuring elements comprise a plurality of temperature measuring elements which are arranged at intervals along the circumferential direction of the temperature measuring circuit board; the temperature measurement avoidance holes are arranged at intervals along the circumferential direction of the heat insulation piece, the temperature measurement holes are arranged at intervals along the circumferential direction of the panel, and the temperature measurement holes are arranged at intervals along the circumferential direction of the panel; the temperature measuring elements penetrate through the temperature measuring avoiding holes in a one-to-one correspondence mode and are located in the temperature measuring holes in a one-to-one correspondence mode.

Through including a plurality of temperature elements, a plurality of temperature measurement hole and a plurality of temperature measurement dodge the hole, can realize the accurate temperature measurement to the interior temperature of pot from the multi-azimuth.

In one possible implementation, the thickness of the thermal insulation is in the range of 0.3mm to 2mm; and/or the distance between the bottom wall surface of the temperature measuring hole and the top surface of the panel ranges from 0.5mm to 1.1mm.

The thickness range of the heat insulation piece is set to be 0.3mm-2mm, so that the height of the heat insulation piece is kept within a reasonable range, and the heat insulation piece is used for directly radiating high temperature on the partition panel to the temperature measurement component to the maximum extent. The distance between the bottom wall surface of the temperature measuring hole and the top surface of the panel is set to be 0.5mm-1.1mm, so that the second end of the temperature measuring element can be completely positioned in the temperature measuring hole.

In one possible implementation, a heat conducting member is accommodated between the inner wall surface of the temperature measuring hole and the outer surface of the temperature measuring element.

The heat conducting piece is accommodated between the inner wall surface of the temperature measuring hole and the outer surface of the temperature measuring element, so that the contact area between the temperature measuring element and the temperature measuring hole can be increased, and the temperature measuring effect of the temperature measuring element on the temperature in the pot is further improved.

The construction of the present application and other objects and advantages thereof will be more apparent from the following description of the preferred embodiments taken in conjunction with the accompanying drawings.

Drawings

In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly introduced below, and it is obvious that the drawings in the following description are some embodiments of the present application, and for those skilled in the art, other drawings can be obtained according to these drawings without inventive exercise.

Fig. 1 is a schematic structural diagram of a cooking device according to an embodiment of the present application;

FIG. 2 is an exploded view of a cooking apparatus according to an embodiment of the present application;

FIG. 3 is a top view of a cooking apparatus according to an embodiment of the present application;

FIG. 4 isbase:Sub>A cross-sectional view taken along line A-A of FIG. 3;

FIG. 5 is an enlarged partial view of portion I of FIG. 4;

FIG. 6 is a cross-sectional view taken along line B-B of FIG. 3;

FIG. 7 is a partial enlarged view of portion II of FIG. 6;

FIG. 8 is a first schematic view of a temperature measuring assembly of the cooking device according to an embodiment of the present invention;

FIG. 9 is a second schematic view of a temperature measuring assembly of a cooking device according to an embodiment of the present disclosure;

FIG. 10 is a top view of a temperature measuring assembly of a cooking appliance according to an embodiment of the present application;

FIG. 11 is a side view of a temperature measuring assembly of the cooking appliance according to the embodiment of the present application;

FIG. 12 is a schematic view showing the structure of an insulator of a cooking apparatus according to an embodiment of the present invention;

FIG. 13 is a top view of an insulator for a cooking apparatus according to an embodiment of the present application;

FIG. 14 is a side view of an insulator for a cooking apparatus according to an embodiment of the present application;

FIG. 15 is a first schematic structural view illustrating a temperature measuring hole formed in a panel of a cooking device according to an embodiment of the present invention;

FIG. 16 is a second schematic structural view illustrating a temperature measuring hole formed in a panel of a cooking device according to an embodiment of the present invention;

fig. 17 is a partially enlarged view of the portion III in fig. 16.

Description of reference numerals:

100-a cooking device;

110-a panel; 111-thermometric hole; 120-a bottom shell;

121-a lower cover; 122-upper cover; 123-cavity;

130-a temperature measuring component; 131-a temperature measuring circuit board; 1311-first louvers;

132-a temperature sensing element; 1321-a first end; 1322-a second end;

133-temperature measuring conducting wire; 134-plug connector; 140-insulation;

141-second heat dissipation hole; 142-temperature measurement avoiding hole; 150-a thermally conductive member;

160-a bonding member; 170-heating element; 180-a heat dissipation fan;

190-a heat generating member; 191-a control panel; 192-circuit board.

Detailed Description

The cooker comprises a bottom shell and a panel, wherein the bottom shell and the panel enclose a cavity for assembling a heating element and a circuit board, the circuit board is electrically connected with the heating element, and the circuit board is used for controlling the opening and closing of the heating element. During operation, high-frequency current passes through the heating element to generate countless closed magnetic field force, and magnetic force lines cut the cookware to generate countless small eddy currents so that the cookware placed on the panel generates heat.

When the cooker is used, the cooker is placed on the cooker, the cooker is used for cooking food materials in the cooker, the temperature in the cooker is often required to be detected in real time in the heating process, and therefore the working condition of the heating element is adjusted according to the temperature in the cooker. In the related art, a temperature measuring component is arranged in the cavity, and the temperature measuring end of the temperature measuring component is abutted against the inner surface of the panel, so that the purpose of detecting the temperature in the pot is realized.

However, in the related art, because the temperature measurement component is in direct contact with the panel, the high temperature on the panel can directly radiate to the temperature measurement component, and the temperature measurement component is easily damaged due to the high temperature, so that the temperature measurement effect of the temperature measurement component is affected, and meanwhile, the service life of the temperature measurement component can be shortened.

Based on the technical problem, the embodiment of the application provides a cooking device, through including the temperature measurement subassembly, can realize the effect to the accurate temperature measurement of pot temperature. Through including the heat insulating part, the heat insulating part is located between the surface of being close to cavity one side of temperature measuring component and panel, can effectively cut off the high temperature direct radiation on the panel and give temperature measuring component to reduce temperature measuring component's temperature, prevent that temperature measuring component from because of the risk that high temperature damaged, further prolong temperature measuring component's life, be favorable to improving temperature measuring component's the temperature measurement degree of accuracy, simultaneously, guarantee cooking device and cooking utensil's security performance.

In order to make the purpose, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all embodiments of the present invention. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Fig. 1 isbase:Sub>A schematic structural view ofbase:Sub>A cooker according to an embodiment of the present application, fig. 2 is an exploded view of the cooker according to the embodiment of the present application, fig. 3 isbase:Sub>A plan view of the cooker according to the embodiment of the present application, fig. 4 isbase:Sub>A sectional view taken alongbase:Sub>A-base:Sub>A direction in fig. 3, fig. 5 isbase:Sub>A partially enlarged schematic view ofbase:Sub>A portion I in fig. 4, fig. 6 isbase:Sub>A sectional view taken alongbase:Sub>A B-B direction in fig. 3, and fig. 7 isbase:Sub>A partially enlarged schematic view ofbase:Sub>A portion II in fig. 6.

Referring to fig. 1 to 7, an embodiment of the present invention provides a cooking device 100, where the cooking device 100 includes, but is not limited to, an induction cooker and an electric ceramic cooker, and in the embodiment, the induction cooker is mainly used as an example for description. The pan is placed on the electromagnetism stove, and the electromagnetism stove is used for cooking the edible material in the pan.

Referring to fig. 1 and 2, the cooking device 100 includes a panel 110 and a bottom case 120, the panel 110 covers the bottom case 120 and forms a cavity 123 with the bottom case 120, the cavity 123 can be used to accommodate various electrical components such as a heating element 170, a heat dissipation fan 180, and a heating element 190, the heating element 190 mainly includes a control board 191 and a circuit board 192, the heating element 170 is mainly a coil disc, and the heat dissipation fan 180 is used to dissipate heat of the heating element 190 in the cavity 123.

The bottom case 120 may be made of polypropylene (PP), polybutylene terephthalate (PBT), polyester resin (PET), nylon 6 (PA 6), nylon 66 (PA 66), or Polyphenylene Sulfide (PPs) which can resist temperature higher than 125 degrees, or the bottom case 120 may be made of PP, PBT, PET, PA6, PA66, or PPs plus glass fiber.

The panel 110 may be a high temperature resistant non-metallic material such as a high borosilicate glass panel, a ceramic panel, and a glass ceramic panel. When the cooker is an induction cooker, the heating member 170 is a coil panel including a coil panel support and a coil wound on the coil panel support; when the cooker is an electric ceramic oven, the heating member 170 may be formed by winding a resistance heating wire.

For example, referring to fig. 2, the bottom housing 120 may include a lower cover 121 and an upper cover 122, the upper cover 122 is covered on the lower cover 121, and the panel 110 is disposed on a side of the upper cover 122 away from the lower cover 121. One side of the panel 110 departing from the bottom case 120 can be used for placing a pot, so that not only the heating function of the cooker 100 can be realized, but also the pot does not directly contact with the bottom case 120, thereby preventing the pot with high temperature from scalding the bottom case 120.

Referring to fig. 2, the cooking device 100 further includes a temperature measuring component 130, the temperature measuring component 130 is disposed in the cavity 123, the temperature measuring component 130 is located at a side close to the panel 110, and the temperature measuring component 130 has a temperature measuring end. When the temperature measuring component 130 is assembled, the temperature measuring end is abutted to the surface of the panel 110 close to one side of the cavity 123, so that the purpose of accurately measuring the temperature in the cooker is realized, and the phenomena of overflowing, dry burning and the like of the induction cooker are avoided.

In order to avoid the risk that the temperature measuring component 130 is damaged due to high temperature when the temperature on the panel 110 is too high, the high temperature may be directly radiated to the temperature measuring component 130. In the embodiment of the present application, please refer to fig. 2, which further includes a heat insulation member 140, wherein the heat insulation member 140 is disposed in the cavity 123 and located between the temperature measurement component 130 and the surface of the panel 110 near the cavity 123. During assembly, at least part of the temperature measuring assembly 130 penetrates through the heat insulation member 140, and the temperature measuring end is abutted against the surface of the panel 110 close to one side of the cavity 123.

In the embodiment of the present application, the heat insulation member 140 may be a heat insulation pad made of a heat insulation material, for example: the thermal insulation member 140 may be made of mica sheet, aerogel or vacuum insulation panel, etc.

Through including heat insulating part 140, heat insulating part 140 parts panel 110 and temperature measurement subassembly 130, thereby in the electromagnetism stove in the heating process, when the high temperature on the panel 110 is too high, can effectively cut off high temperature direct radiation on the panel 110 and give temperature measurement subassembly 130, help reducing the temperature of temperature measurement subassembly 130, prevent temperature measurement subassembly 130 because of the risk of high temperature damage, further prolong the life of temperature measurement subassembly 130, be favorable to improving the temperature measurement accuracy of temperature measurement subassembly 130, and simultaneously, guarantee cooking device 100 and cooking utensil's security performance, and can promote user experience.

It should be noted that, in the embodiment of the present application, the specific location of the thermal insulation member 140 between the panel 110 and the temperature measurement assembly 130 is not further limited, and for example, the following manner may be referred to for the location:

in a possible implementation manner, the heat insulation member 140 may be disposed on a surface of the panel 110 near the cavity 123, so as to isolate the high temperature on the panel 110 from directly radiating to the temperature measurement component 130, thereby preventing the risk of damage to the temperature measurement component 130 due to high temperature. For example, the thermal insulation member 140 may be disposed on a surface of the panel 110 near the cavity 123 by means of bonding, clamping, or the like; alternatively, the thermal insulation member 140 may be a single piece with the panel 110, which is not further limited in the embodiments of the present application.

In a possible implementation manner, the heat insulation member 140 may also be disposed on a surface of the temperature measurement component 130 close to the panel 110, and also can play a role in directly radiating high temperature on the partition panel 110 to the temperature measurement component 130, thereby preventing the risk of damage to the temperature measurement component 130 due to high temperature. For example, the heat insulating member 140 may be disposed on the temperature measuring assembly 130 by bonding, clipping, screwing, or the like, or the heat insulating member 140 may be integrated with the temperature measuring assembly 130, for example, it may be processed by injection molding, so as to not only ensure the stability and reliability of the connection between the temperature measuring assembly 130 and the heat insulating member 140, but also reduce the number of mounting parts of the cooking apparatus 100, and improve the production efficiency of the cooking apparatus 100.

It should be noted that, the present embodiment includes, but is not limited to, the two setting manners, and the setting may be specifically performed according to actual situations.

Specifically, referring to fig. 14 in advance, the thickness of the heat insulation element 140 may range from 0.3mm to 2mm, and for example, the thickness H1 of the heat insulation element 140 may be set to any value between 0.3mm, 0.4mm, 0.5mm, 0.6mm, 0.7mm, 0.8mm, 0.9mm, 1mm, 1.2mm, 1.4mm, 1.6mm, 1.8mm, 2mm, or 0.3mm to 2mm according to actual needs.

The thickness range of the heat insulation member 140 is set to be between 0.3mm and 2mm, so that the height of the heat insulation member 140 is kept within a reasonable range, the heat insulation effect cannot be influenced due to too thick or too thin thickness, and the heat insulation member is used for directly radiating high temperature on the partition panel 110 to the temperature measurement component 130 to the maximum extent.

Fig. 8 is a first schematic structural diagram of a temperature measuring component of a cooking apparatus according to an embodiment of the present invention, fig. 9 is a second schematic structural diagram of the temperature measuring component of the cooking apparatus according to the embodiment of the present invention, fig. 10 is a top view of the temperature measuring component of the cooking apparatus according to the embodiment of the present invention, fig. 11 is a side view of the temperature measuring component of the cooking apparatus according to the embodiment of the present invention, fig. 12 is a schematic structural diagram of an insulating member of the cooking apparatus according to the embodiment of the present invention, fig. 13 is a top view of the insulating member of the cooking apparatus according to the embodiment of the present invention, and fig. 14 is a side view of the insulating member of the cooking apparatus according to the embodiment of the present invention.

In one possible implementation manner, referring to fig. 8 to 11, the temperature measuring assembly 130 may include a temperature measuring circuit board 131 and a temperature measuring element 132 disposed on the temperature measuring circuit board 131.

It should be noted that, referring to fig. 2, the temperature measuring element 132 has a first end 1321 and a second end 1322, the first end 1321 is an end close to one side of the cavity 123, the second end 1322 is an end close to one side of the faceplate 110, and the temperature measuring end is the second end 1322.

In addition, as shown in fig. 8 and fig. 9, the temperature measuring assembly 130 further includes a temperature measuring wire 133 and a plug 134, one end of the temperature measuring wire 133 is electrically connected to the temperature measuring element 132, the other end of the temperature measuring wire 133 is electrically connected to the plug 134, the plug 134 is electrically connected to other electrical components in the cavity 123, for example, the plug 134 may be electrically connected to the circuit board 192.

During assembly, the first end 1321 of the temperature measuring element 132 is fixedly connected to the temperature measuring circuit board 131, the second end 1322 of the temperature measuring element 132 is inserted through the heat insulating member 140 and abuts against the surface of the panel 110 close to the cavity 123, and the heat insulating member 140 is located between the temperature measuring circuit board 131 and the surface of the panel 110 close to the cavity 123.

By including the temperature measuring element 132, the second end 1322 of the temperature measuring element 132 abuts against the surface of the panel 110 close to the cavity 123, so as to achieve the effect of accurately measuring the temperature in the pan.

Through including the temperature measurement circuit board 131, the temperature measurement circuit board 131 can play fixed, assembly and the effect of support to the temperature measurement element 132 to be favorable to realizing the accurate temperature measurement of temperature measurement element 132. Meanwhile, the heat insulation member 140 is located between the temperature measurement circuit board 131 and the panel 110, and can effectively isolate the effect of high temperature on the panel 110 directly radiating to the temperature measurement circuit board 131, thereby preventing the risk of damage of the temperature measurement circuit board 131 due to high temperature.

In a possible implementation manner, referring to fig. 8 to 14, the temperature measuring circuit board 131 is provided with a first heat dissipating hole 1311, the heat insulating member 140 is provided with a second heat dissipating hole 141 and a temperature measuring avoiding hole 142, and the first heat dissipating hole 1311 and the second heat dissipating hole 141 are correspondingly disposed.

During assembly, the second end 1322 of the temperature measuring element 132 penetrates the temperature measuring avoiding hole 142 and abuts against the surface of the panel 110 close to the cavity 123.

By arranging the first heat dissipation hole 1311 and the second heat dissipation hole 141, when the temperature on the panel 110 is too high during the heating process of the induction cooker, the temperature measurement component 130 can be further cooled, and the temperature measurement component 130 is ensured to be in a proper temperature range. In addition, the first heat dissipation holes 1311 and the second heat dissipation holes 141 are correspondingly arranged, which is beneficial to improving the heat dissipation speed.

It can be understood that the first heat dissipation hole 1311, the second heat dissipation hole 141, and the temperature measurement avoiding hole 142 are all through holes. In addition, in the embodiment of the present application, the number, the size, the shape, the position, and the like of the first heat dissipation hole 1311, the second heat dissipation hole 141, and the temperature measurement avoidance hole 142 are not limited, and may be specifically set according to an actual situation.

Fig. 15 is a first schematic view of a cooking device according to an embodiment of the present invention, fig. 16 is a second schematic view of a cooking device according to an embodiment of the present invention, and fig. 17 is an enlarged partial view of a portion III in fig. 16.

In a possible implementation manner, referring to fig. 15 to 17, a temperature measuring hole 111 is formed on the panel 110, and an opening of the temperature measuring hole 111 faces the cavity 123. During assembly, the second end 1322 of the temperature measuring element 132 penetrates through the temperature measuring avoiding hole 142 and is located in the temperature measuring hole 111.

The temperature measuring hole 111 is formed in the panel 110, and the second end 1322 of the temperature measuring element 132 is located in the temperature measuring hole 111, so that the temperature measuring hole 111 can play a role in installing the temperature measuring element 132. Meanwhile, it should be noted that the temperature measuring hole 111 in the embodiment of the present application is a blind hole, so that the distance between the temperature measuring element 132 and the top surface of the panel 110 can be shortened, and the temperature measuring effect of the temperature measuring element 132 is improved.

Specifically, as shown in fig. 17, the distance between the bottom wall surface of the temperature measuring hole 111 and the top surface of the panel 110 may be in a range of 0.5mm to 1.1mm, and for example, the distance H2 between the bottom wall surface of the temperature measuring hole 111 and the top surface of the panel 110 may be set to any value between 0.5mm, 0.6mm, 0.7mm, 0.8mm, 0.9mm, 1.0mm, 1.1mm, or 0.5mm to 1.1mm according to actual needs.

By setting the distance between the bottom wall surface of the temperature measuring hole 111 and the top surface of the panel 110 to be within the range of 0.5mm-1.1mm, the second end 1322 of the temperature measuring element 132 can be ensured to be completely positioned in the temperature measuring hole 111, and meanwhile, the distance between the temperature measuring element 132 and the top surface of the panel 110 can be shortened, and the temperature measuring effect of the temperature measuring element 132 is improved.

With continued reference to FIGS. 5 and 7, a thermally conductive member 150 can be received between the inner wall surface of the temperature sensing bore 111 and the outer surface of the temperature sensing element 132, and in particular, the thermally conductive member 150 is received in the space between the inner wall surface of the temperature sensing bore 111 and the outer surface of the temperature sensing element 132. By accommodating the heat conduction member 150, the contact area between the temperature measurement element 132 and the temperature measurement hole 111 can be increased, thereby improving the temperature measurement effect of the temperature measurement element 132.

It should be supplemented that the heat conducting member 150 in the embodiment of the present application is mainly heat conducting grease, and the air gap between the contact surfaces of the temperature measuring hole 111 and the temperature measuring element 132 can be eliminated by coating the heat conducting member 150 in the gap, so as to increase the heat circulation, reduce the working temperature of the temperature measuring assembly 130, ensure the use reliability of the temperature measuring assembly 130, and prolong the service life of the temperature measuring assembly 130.

In addition, after the heat conducting member 150 is coated, the performances of high and low temperature resistance, ozone resistance and weather aging resistance can be achieved, so that the working temperature of the induction cooker is ensured, and the induction cooker is not easy to break down.

In a possible implementation manner, as shown in fig. 5, an adhesive 160 may be disposed between the temperature measuring component 130 and the surface of the panel 110 near the cavity 123, and the temperature measuring component 130 and the panel 110 are connected by the adhesive 160.

Through including bonding piece 160, can play the effect of bonding temperature measurement subassembly 130 on panel 110 to improve the assembly stability of temperature measurement subassembly 130, further guarantee the precision of temperature measurement.

Specifically, during assembly, the adhesive member 160 is located on the outer periphery of the heat insulation member 140, and the orthographic projection of the temperature measurement assembly 130 on the panel 110 covers the orthographic projection of the adhesive member 160 and the heat insulation member 140 on the panel 110.

It can be understood that the bonding member 160 is a ring-shaped member, and the bonding member 160 is disposed around the periphery of the thermal insulation member 140, so as to facilitate assembly, and on the other hand, can maximally bond the thermometric assembly 130 and the panel 110, and the connection stability is high.

The cavity 123 accommodates the heating element 170, the heating element 170 is located on a side of the temperature measurement component 130 away from the panel 110, and an orthographic projection of the heating element 170 on the panel 110 and an orthographic projection of the bonding element 160 on the panel 110 are staggered and have a distance.

With this arrangement, since the heating temperature of the heating member 170 near the center is high and the heating temperature near the edge is low, the orthographic projection of the heating member 170 on the panel 110 and the orthographic projection of the adhesive member 160 on the panel 110 are staggered with each other and have a distance therebetween, that is, the adhesive member 160 is located at a position near one side of the edge of the heating member 170, so that the risk of damage of the adhesive member 160 due to the high temperature of the heating member 170 can be effectively prevented.

The value of the distance between the orthographic projection of the heating member 170 on the panel 110 and the orthographic projection of the bonding member 160 on the panel 110 is not further limited. For example, referring to fig. 5, a distance between an orthographic projection of the heating element 170 on the panel 110 and an orthographic projection of the adhesive element 160 on the panel 110 may be H3, wherein H3 is not less than 0mm, and H3 may be any value greater than 0mm, and may be set according to actual conditions.

In a possible implementation manner, please refer to fig. 2, the first heat dissipation holes 1311 may include a plurality of holes, the second heat dissipation holes 141 may include a plurality of holes, and the plurality of first heat dissipation holes 1311 and the plurality of second heat dissipation holes 141 are disposed in a one-to-one correspondence manner.

The arrangement of the first heat dissipation holes 1311 on the temperature measurement circuit board 131 and the arrangement of the second heat dissipation holes 141 on the heat insulation member 140 are not particularly limited. For example: the plurality of first heat dissipation holes 1311 may be arranged at intervals in the circumferential direction of the temperature measurement circuit board 131, and the plurality of second heat dissipation holes 141 may be arranged at intervals in the circumferential direction of the heat insulating member 140. In addition, when the materials are arranged at intervals along the circumferential direction, the materials can be uniformly arranged, or the materials can be non-uniformly arranged.

The arrangement mode can improve the heat dissipation effect of the temperature measurement component 130 to the maximum extent on the basis of ensuring the heat insulation of the heat insulation piece 140.

In a possible implementation manner, the temperature measuring elements 132 may include a plurality of temperature measuring elements 132, the plurality of temperature measuring elements 132 are arranged along the circumferential direction of the temperature measuring circuit board 131 at intervals, the temperature measuring avoiding holes 142 may include a plurality of temperature measuring avoiding holes 142 are arranged along the circumferential direction of the heat insulating member 140 at intervals, the temperature measuring holes 111 may include a plurality of temperature measuring holes 111 are arranged along the circumferential direction of the panel 110 at intervals.

Thus, during assembly, the temperature measuring elements 132 penetrate through the temperature measuring avoiding holes 142 in a one-to-one correspondence manner and are positioned in the temperature measuring holes 111 in a one-to-one correspondence manner, so that the temperature measuring component 130 can accurately measure the temperature in the pot from multiple directions.

In the description of the present application, it is to be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like, indicate orientations or positional relationships based on those shown in the drawings, and are used merely for convenience of description and for simplicity of description, and do not indicate or imply that the referenced device or element must have a particular orientation, be constructed in a particular orientation, and be operated, and thus should not be considered as limiting the present application.

In the description of the present application, it is to be understood that the terms "comprises" and "comprising," and any variations thereof, as used herein, are intended to cover a non-exclusive inclusion, such that a process, method, system, article, or apparatus that comprises a list of steps or elements is not necessarily limited to those steps or elements expressly listed, but may include other steps or elements not expressly listed or inherent to such process, method, article, or apparatus.

Unless expressly stated or limited otherwise, the terms "mounted," "connected," "secured," and the like are to be construed broadly and can, for example, be fixedly connected, detachably connected, or integral to one another; either directly or indirectly through intervening media, may be used in either the internal or the external relationship of the two elements. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art as appropriate. Furthermore, the terms "first", "second", etc. are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated.

Finally, it should be noted that: the above embodiments are only used to illustrate the technical solutions of the present application, and not to limit the same; although the present application has been described in detail with reference to the foregoing embodiments, it should be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some or all of the technical features may be equivalently replaced; and the modifications or the substitutions do not make the essence of the corresponding technical solutions depart from the scope of the technical solutions of the embodiments of the present application.

Claims (10)

1. A cooking device is characterized by comprising a panel (110), a bottom shell (120), a temperature measuring component (130) and a heat insulation piece (140), wherein the panel (110) covers the bottom shell (120) and forms a cavity (123) with the bottom shell (120);

the temperature measuring component (130) and the heat insulation piece (140) are accommodated in the cavity (123), the temperature measuring component (130) is positioned at one side close to the panel (110), and the heat insulation piece (140) is positioned between the temperature measuring component (130) and the surface of the panel (110) at one side close to the cavity (123);

the temperature measuring component (130) is provided with a temperature measuring end, at least part of the temperature measuring component (130) penetrates through the heat insulation piece (140), and the temperature measuring end is abutted to the surface of one side, close to the cavity (123), of the panel (110).

2. The cooking apparatus according to claim 1, wherein the temperature measuring assembly (130) comprises a temperature measuring circuit board (131) and a temperature measuring element (132) disposed on the temperature measuring circuit board (131);

the first end (1321) of the temperature measuring element (132) is fixedly connected with the temperature measuring circuit board (131), the second end (1322) of the temperature measuring element (132) penetrates through the heat insulation piece (140) and is abutted against the surface of the panel (110) on the side close to the cavity (123), and the temperature measuring end is the end part of the temperature measuring element (132) on the side close to the panel (110);

the heat insulation piece (140) is positioned between the temperature measurement circuit board (131) and the surface of the panel (110) close to one side of the cavity (123).

3. The cooking apparatus according to claim 2, wherein the panel (110) has temperature measuring holes (111) formed thereon, the temperature measuring holes (111) are blind holes, the opening of the temperature measuring holes (111) faces the cavity (123), and the second end (1322) of the temperature measuring element (132) is inserted through the thermal insulation member (140) and is located in the temperature measuring holes (111).

4. The cooking device according to claim 3, wherein the temperature measuring circuit board (131) is provided with a first heat dissipating hole (1311), and the heat insulating member (140) is provided with a second heat dissipating hole (141) and a temperature measuring avoiding hole (142);

the first heat dissipation hole (1311) and the second heat dissipation hole (141) are correspondingly arranged, and the second end (1322) of the temperature measurement element (132) penetrates through the temperature measurement avoiding hole (142) and is abutted against the surface, close to the cavity (123), of the panel (110).

5. The cooking apparatus according to any one of claims 1 to 4, wherein an adhesive member (160) is provided between the thermometric assembly (130) and a surface of the panel (110) on a side close to the cavity (123), and the thermometric assembly (130) and the panel (110) are connected by the adhesive member (160).

6. The cooking apparatus according to claim 5, wherein the adhesive member (160) is located at an outer periphery of the heat insulating member (140), and an orthographic projection of the thermometric assembly (130) on the panel (110) covers the orthographic projection of the adhesive member (160) and the heat insulating member (140) on the panel (110);

the cavity (123) is internally provided with a heating element (170), the heating element (170) is positioned on one side of the temperature measuring component (130) departing from the panel (110), and the orthographic projection of the heating element (170) on the panel (110) and the orthographic projection of the bonding element (160) on the panel (110) are mutually staggered and have a distance.

7. The cooking apparatus according to claim 4, wherein the first heat dissipation holes (1311) comprise a plurality of first heat dissipation holes (1311) arranged at intervals in a circumferential direction of the temperature measurement circuit board (131);

the second heat dissipation holes (141) comprise a plurality of second heat dissipation holes (141), the second heat dissipation holes (141) are arranged at intervals along the circumferential direction of the heat insulation piece (140), and the first heat dissipation holes (1311) and the second heat dissipation holes (141) are arranged in a one-to-one correspondence mode.

8. The cooking device according to claim 4, wherein the temperature measuring element (132) comprises a plurality of temperature measuring elements (132), and the plurality of temperature measuring elements (132) are arranged at intervals along the circumferential direction of the temperature measuring circuit board (131);

the temperature measurement avoiding holes (142) are arranged at intervals along the circumferential direction of the heat insulation piece (140), the temperature measurement holes (111) are arranged at intervals along the circumferential direction of the panel (110), and the temperature measurement avoiding holes (142) are arranged at intervals along the circumferential direction of the panel (110);

the temperature measuring elements (132) penetrate through the temperature measuring avoiding holes (142) in a one-to-one correspondence mode and are located in the temperature measuring holes in a one-to-one correspondence mode.

9. A cooking apparatus according to claim 3, wherein the thermal insulation (140) has a thickness in the range of 0.3mm-2mm; and/or the distance between the bottom wall surface of the temperature measuring hole (111) and the top surface of the panel (110) ranges from 0.5mm to 1.1mm.

10. A cooking apparatus according to claim 3, wherein a heat conducting member (150) is accommodated between an inner wall surface of the temperature measuring hole (111) and an outer surface of the temperature measuring element (132).

Images