CN218842185U - Heating array chip under different microcavities - Google Patents
Heating array chip under different microcavities Download PDFInfo
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- CN218842185U CN218842185U CN202223493737.0U CN202223493737U CN218842185U CN 218842185 U CN218842185 U CN 218842185U CN 202223493737 U CN202223493737 U CN 202223493737U CN 218842185 U CN218842185 U CN 218842185U
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Abstract
The utility model relates to a heating array chip under different microcavities, include: a substrate; the heating modules are arranged on the substrate according to a preset rule; the connecting terminals are in one-to-one correspondence with the heating modules, connected with the corresponding heating modules and used for connecting different voltage output controllers; and the heat dissipation grooves are etched on the substrate and are arranged around each heating module. The utility model discloses can improve biological detection experimental efficiency.
Description
Technical Field
The utility model relates to a micro heater technical field especially relates to a heating array chip under different microcavities.
Background
The micro heater is a heating device with a smaller size than a common heating device, the resistance heating sheet is a heating device which is widely applied, resistance wires made of common metals such as platinum and copper are deposited on substrate materials of common resistance heating sheets such as silicon and polyimide, and voltage is applied to two ends of the resistance wires to generate joule heat, so that the heating function is realized. Various micro heaters have been proposed in many fields due to their inherent advantages such as miniaturized size, low power consumption, fast response time, long-term reliability, low manufacturing cost, etc.
However, the resistance heating sheet used at present can only control the temperature of all the heating units on the heating sheet to be the same, and it is impossible to maintain different temperatures of different heating units on the same heating sheet. And when a plurality of heating modules need to heat different micro-cavities of the same biochip and are integrated on the same heating chip, although a gap exists between the heating modules, the heating modules and the heating modules are also influenced mutually, and accurate experiments cannot be carried out.
SUMMERY OF THE UTILITY MODEL
The utility model aims to solve the technical problem that a heating array chip under different microcavities is provided, biological detection experimental efficiency can be improved.
The utility model provides a technical scheme that its technical problem adopted is: providing a heating array chip under different microcavities, comprising:
a substrate;
the heating modules are arranged on the substrate according to a preset rule;
the connecting terminals are in one-to-one correspondence with the heating modules, connected with the corresponding heating modules and used for connecting different voltage output controllers;
and the heat dissipation grooves are etched on the substrate and are arranged around each heating module.
The heating module is formed by a resistance wire in a shape like a Chinese character 'hui' or a snake.
The resistance wire is made of platinum or copper.
And an oxide layer is paved on the surface of the substrate at the position where the heating module is arranged.
The distance between the heat dissipation groove and the heating module is 0.5-1mm.
Each heating module is the same in size and is arranged on the substrate in an array form.
The area occupied by the heating module corresponds to the area occupied by the micro-cavity, and the micro-cavity is a micro-fluidic micro-cavity formed by PDMS, a silicon chip or transparent glass and used for storing biological reaction liquid.
The heating array chip is suitable for high-flux detection experiments of independent biochemical reaction reagents, such as PCR nucleic acid detection reaction or escherichia coli enzymatic reaction and the like, and the temperature during the experiments can be constant or the integration of a subsequent rapid temperature raising and lowering module.
Advantageous effects
Since the technical scheme is used, compared with the prior art, the utility model, have following advantage and positive effect: each heating module in the utility model is independent, and different voltages can be applied and the PID control algorithm can control the heating modules to reach different target heating temperatures to heat different micro-cavities; the utility model discloses still design through the radiating groove improves intensification rate and temperature homogeneity, and the design that utilizes the radiating groove can fall to minimum with the influence between each independent heating module.
Drawings
Fig. 1 is a schematic structural diagram of heating array chips under different micro-cavities according to an embodiment of the present invention.
Detailed Description
The present invention will be further described with reference to the following specific examples. It should be understood that these examples are for illustrative purposes only and are not intended to limit the scope of the present invention. Furthermore, it should be understood that various changes and modifications of the present invention may be made by those skilled in the art after reading the teachings of the present invention, and these equivalents also fall within the scope of the appended claims.
The utility model discloses an embodiment relates to a heating array chip under different microcavities, as shown in FIG. 1, include: a substrate 1; the heating modules 2 are arranged on the substrate 1 according to a preset rule; the connecting terminals 3 correspond to the heating modules 2 one by one, are connected with the corresponding heating modules 2 and are used for connecting different voltage output controllers; and heat dissipation grooves 4 etched on the substrate 1 and arranged around each of the heating modules 2.
The heater modules 2 in the present embodiment are arranged in a 2 × 3 array with 6 in total. Each heating module can be formed by resistance wires in a shape like a Chinese character 'hui' or a snake-shaped design, and the temperature uniformity of a heating area is ensured by the shape like the Chinese character 'hui' or the snake-shaped design, so that the heating effect is improved. The resistance wire can be made of copper or platinum and other metals with good conductivity.
The substrate 1 in this embodiment may be a silicon wafer or other material with good thermal conductivity, and if the substrate itself has a certain conductivity like silicon, an oxidation treatment may be performed on the surface of the position where the heating module needs to be disposed to form an insulating layer.
Therefore, in the embodiment, the plurality of heating modules are arranged on the substrate, so that a plurality of independent microcavity reaction tanks can be formed, and each heating module is connected with different voltage output controllers through respective connecting terminals, so that different voltages and PID control programs can be applied to different heating modules, thereby obtaining different temperatures, for example, temperature gradient heating can be performed on all microcavity reaction tanks, so that a suitable reaction temperature can be found more quickly.
In order to avoid temperature interference between a plurality of different temperature zones on the same heating substrate, the heating target area can not actually reach the required target temperature. According to the embodiment, the heat dissipation grooves are etched around each heating module, so that air with large heat resistance is blocked between the heating modules, heat between the heating modules is difficult to transfer, local temperature uniformity of a target area is higher, and a heating effect is better.
The heating array chip under different microcavities of the embodiment can be prepared in the following way, specifically including:
the method comprises the steps of firstly, selecting a proper heating chip substrate according to use requirements, and cleaning one surface of a resistance wire to be deposited. If the substrate itself is conductive, oxidation treatment is performed on the side where the resistance wire is to be deposited to form an insulating layer.
And secondly, etching a heat dissipation groove on the substrate and cleaning again. The size of the radiating groove is determined according to the distance between the independent heating modules, and the distance between the boundary of the radiating groove and the resistance boundary of the heating module is ensured to be 0.5-1mm.
And thirdly, depositing a resistance wire with a zigzag design or a snake-shaped design on the clean surface of the substrate, wherein the resistance wire can be made of platinum, copper and the like. In depositing the resistance wire, a sputtering process may be used.
The area occupied by the heating module of the heating array chip under different microcavities of the embodiment corresponds to the area occupied by the microcavity, and the microcavity is a microfluidic microcavity formed by PDMS, a silicon wafer or transparent glass and used for storing biological reaction liquid. The heating array chip of the embodiment is suitable for high-flux detection experiments of independent biochemical reaction reagents, such as PCR nucleic acid detection reaction or escherichia coli enzymatic reaction, and the temperature during the experiments can be constant, and can also be integration of a subsequent rapid temperature rise and fall module.
It is not difficult to find that each heating module in the utility model is independent, different voltages can be applied and PID control algorithm can be controlled to reach different target heating temperatures to heat different micro-cavities; the utility model discloses still improve intensification rate and temperature homogeneity through the design of radiating groove, the design that utilizes the radiating groove can fall minimum with the influence between each independent heating module.
Claims (8)
1. A heating array chip under different microcavities, comprising:
a substrate;
the heating modules are arranged on the substrate according to a preset rule;
the connecting terminals are in one-to-one correspondence with the heating modules, connected with the corresponding heating modules and used for connecting different voltage output controllers;
and the heat dissipation grooves are etched on the substrate and are arranged around each heating module.
2. The array chip for heating under different microcavities of claim 1, wherein said heating module is formed of a meander-shaped or serpentine resistance wire.
3. The array chip for heating under different microcavities of claim 2, wherein said resistance wires are made of platinum or copper.
4. The different sub-microcavity heating array chip of claim 1, wherein the surface of the substrate is coated with an oxide layer at the location where the heating module is disposed.
5. The different sub-microcavity heating array chip as recited in claim 1, wherein the heat sink is spaced from the heating module by a distance of 0.5-1mm.
6. The different sub-microcavity heating array chips of claim 1, wherein each of the heating modules is the same size and is arranged in an array on the substrate.
7. The array chip for heating under different microcavities according to claim 1, wherein the area occupied by the heating module corresponds to the area occupied by the microcavity, and the microcavity is a microfluidic microcavity formed by PDMS, a silicon wafer or transparent glass for storing the biological reaction liquid.
8. The heating array chip under different microcavities of claim 1, wherein the heating array chip is suitable for high throughput assay of independent biochemical reagents.
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CN202223493737.0U CN218842185U (en) | 2022-12-27 | 2022-12-27 | Heating array chip under different microcavities |
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CN202223493737.0U CN218842185U (en) | 2022-12-27 | 2022-12-27 | Heating array chip under different microcavities |
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