CN218841273U - Microcrystal paster rubberizing device and microcrystal paster production line - Google Patents

Abstract

The application discloses a microcrystal chip gluing device and a microcrystal chip production line, wherein the microcrystal chip gluing device comprises an adhesive film unwinding roller, a release film hole cutting module, an adhesive film die cutting module and a release film slitting module; the adhesive film unwinding roller is used for unwinding the adhesive film; the release film hole cutting module comprises a release film unwinding roller and a first circular cutter station, and the first circular cutter station is used for cutting a mold on the release film to form a through hole and a cutter line; the adhesive film die-cutting module comprises a second circular knife station, and the second circular knife station is used for die-cutting an adhesive film to form an adhesive film; the release film slitting module comprises a third circular knife station, a carrier film unwinding mechanism and a composite product winding mechanism, wherein the carrier film unwinding mechanism is used for unwinding the carrier film, the third circular knife station is used for die cutting the release film to form a release film sheet, and a composite product consisting of a rubber sheet and the release film sheet is obtained; the composite product rolling mechanism is used for rolling the bearing film adhered to the composite product. The utility model provides a micrite paster rubberizing device degree of automation is high, can effectively improve cross cutting compound efficiency.

Description

Microcrystal paster rubberizing device and microcrystal paster production line

Technical Field

The application relates to the technical field of production equipment of microcrystal patches, in particular to a microcrystal patch rubberizing device and a microcrystal patch production line.

Background

In the related art, the production of the microcrystalline patch comprises the following steps: firstly, cutting a through hole and forming a knife line on a release film, die-cutting the release film into release film sheet materials with the through hole and the knife line in a flat cutting mode, simultaneously die-cutting a salicylic acid and other material adhesive film into adhesive sheets in the flat cutting mode, and then attaching the adhesive sheets to the positions of the release film sheet materials corresponding to the through holes in a one-to-one correspondence mode, thereby completing the compounding of the adhesive sheets and the release film sheet materials. The die cutting compounding process of the film and the release film sheet material in the microcrystalline patch production step has low automation degree and low speed, and the production capacity cannot meet the requirement of batch production.

SUMMERY OF THE UTILITY MODEL

The present application is directed to solving at least one of the problems in the prior art. Therefore, the application provides a micrite paster rubberizing device in the first aspect, and its degree of automation is higher, and can effectively improve the film and from the cross cutting compound efficiency of type membrane sheet stock.

The application second aspect still provides a micrite paster production line with micrite paster rubberizing device.

The microcrystalline patch rubberizing device comprises an adhesive film unwinding roller, a release film hole cutting module, an adhesive film die cutting module and a release film slitting module; the adhesive film unwinding roller is used for unwinding the adhesive film; the release film hole cutting module comprises a release film unwinding roller and a first circular cutter station, the release film unwinding roller is used for unwinding the release film to the first circular cutter station, the first circular cutter station is used for cutting the release film to form through holes, a cutter line and Kong Fei, and the cutter line is connected with a plurality of the through holes; the adhesive film die-cutting module comprises a second circular knife station which is arranged on a moving path of the adhesive film and the release film and is used for die-cutting the adhesive film so as to form an adhesive film and first edge waste on the adhesive film and enable the adhesive film to be attached to the position of the release film corresponding to the through hole; the third circular knife station is arranged on the moving path of the release film and used for die cutting the release film to form a release film piece and a second edge waste, wherein the film piece is attached to the release film piece and forms a composite product with the release film piece; the composite product winding mechanism is used for winding the bearing film adhered with the composite product.

The microcrystalline patch rubberizing device according to the embodiment of the first aspect of the application has at least the following beneficial effects:

the microcrystal paster rubberizing device can release a strip-shaped release film through a release film unwinding roller, realize continuous and rapid die cutting of the release film through a first circular cutter station, form through holes in the release film, release the strip-shaped adhesive film through the adhesive film unwinding roller, and perform die cutting on the adhesive film entering the station along with the release film through a second circular cutter station, so that the adhesive film is continuously and rapidly die-cut and forms adhesive sheets in one-to-one correspondence with the through holes, and the strip-shaped carrier film released through a carrier film unwinding mechanism enters a third circular cutter station along with the release film and the adhesive sheet, when the release film is cut into release film pieces through the third circular cutter station, a composite product formed by the adhesive sheet and the release film pieces can be obtained, the carrier film can carry the composite product, and the composite product can be rolled up along with the carrier film through a carrier film rolling mechanism; consequently, the micrite paster rubberizing device of this embodiment can realize from the continuous quick cross cutting and the complex of type diaphragm and film, and its degree of automation is high, and can effectively improve the film and the compound efficiency of cross cutting from the type diaphragm.

According to some embodiments of this application first aspect's micrite paster rubberizing device, from type membrane cut hole module still including holding in the palm end membrane unreel roller and holding in the palm end membrane wind-up roll, hold in the palm end membrane unreel roller and be used for unreeling to first circular knife worker station and hold in the palm the basement membrane, follow the removal route of holding in the palm the basement membrane, hold in the palm end membrane wind-up roll and be located first circular knife worker station rear side, and be used for the porose useless support basement membrane of rolling adhesion.

According to the microcrystal paster rubberizing device of some embodiments of this application first aspect, glued membrane cross cutting module still including the first winding mechanism that gives up of wasting discharge, along the moving path of glued membrane, the first winding mechanism that gives up of wasting discharge is located second circular knife station rear side, and is used for the first edge of rolling useless.

According to some embodiments of the first aspect of the application, the microcrystalline patch rubberizing device further comprises a protective film unwinding mechanism and a second waste discharge winding mechanism, the protective film unwinding mechanism is arranged on the front side of the third circular knife station and used for discharging a second protective film along the moving path of the release film, the second protective film is attached to one side of the release film with a film, the third circular knife station can form the second protective film in a die-cutting mode to form a protective film and a third side fee which are consistent with the appearance of the release film, and the second waste discharge winding mechanism is used for winding the second side waste and the third side fee.

According to some embodiments of the first aspect of the application, the microcrystalline patch rubberizing device further comprises a third compound station, wherein the third compound station is arranged on the front side of the third circular knife station along a moving path of the release film, the second protective film and the carrier film, and is used for sequentially compounding the second protective film and the carrier film on one side of the release film with a film.

According to some embodiments of the first aspect of this application micrite paster rubberizing device, still including anti-adhesion mask unreel roller and anti-adhesion mask wind-up roll, anti-adhesion mask unreels the roller and is used for unreeling anti-adhesion mask to second circular knife worker station to make anti-adhesion mask be located the one side that deviates from the film from type mask, anti-adhesion mask wind-up roll is used for the rolling through the anti-adhesion mask behind the second circular knife worker station.

According to this application first aspect some embodiments's micrite paster rubberizing device, still including the compound station of second, along the moving path of glued membrane, the compound station of second sets up in the front side of second circular knife station, and is used for compounding glued membrane and the release film that is formed with the through-hole.

According to some embodiments of this application first aspect's micrite paster rubberizing device, still including basement membrane wind-up roll and basement membrane peeling means, the glued membrane unreels the membrane material that the roller emitted including compound basement membrane, glued membrane and first protection film in proper order, and the basement membrane is located the glued membrane be used for with from one side of type membrane laminating, along the removal route of glued membrane, basement membrane peeling means sets up in the front side of second compound station, and is used for peeling off the basement membrane from the glued membrane, and the basement membrane wind-up roll is used for the basement membrane that the rolling was peeled off.

According to this application first aspect some embodiments's micrite paster rubberizing device, still include first protection film wind-up roll and first protection film peeling mechanism, along the moving path of glued membrane, first protection film peeling mechanism sets up in the front side of second circular knife worker station, and is used for peeling off first protection film from the glued membrane, and first protection film wind-up roll is used for rolling the first protection film of peeling off.

According to some embodiments of the second aspect of the application, the microcrystalline patch production line comprises the microcrystalline patch gumming device of the first aspect.

The microcrystalline patch production line according to some embodiments of the second aspect of the present application has at least the following advantages:

the microcrystalline patch production line of this embodiment can effectively improve the production efficiency of microcrystalline patches and improve the productivity to meet the requirement of mass production by adopting the microcrystalline patch rubberizing device of the first aspect embodiment.

Additional aspects and advantages of the present application will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the present application.

Drawings

The above and/or additional aspects and advantages of the present application will become apparent and readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings of which:

fig. 1 is a schematic structural diagram of a microcrystalline patch adhesive device according to an embodiment of the present application;

fig. 2 is a schematic structural diagram of a composite product according to an embodiment of the present application.

Reference numerals:

a film unwinding roller 100; a guidance station 200; a base film wind-up roll 300; a second compound station 400; a first protective film take-up roll 500; a first circular-cutter station 610; backing film unwind roll 620; a backing film take-up roll 630; a first compounding station 640; a release film unwinding roller 650; a second circular-cutter station 710; a first waste discharge winding mechanism 720; a third circular cutter station 810; a carrier film unwinding mechanism 820; a composite take-up mechanism 830; a protective film unwinding mechanism 840; a second waste collection mechanism 850; a third compounding station 860; an anti-adhesive film unwind roll 910; an anti-sticking film wind-up roll 920; a release film 1100; a through hole 1110; a knife line 1120; film 1200.

Detailed Description

Reference will now be made in detail to the embodiments of the present application, examples of which are illustrated in the accompanying drawings, wherein like reference numerals refer to the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the drawings are exemplary only for the purpose of explaining the present application and are not to be construed as limiting the present application.

In the description of the present application, it is to be understood that the positional descriptions, such as the directions of up, down, left, right, front, rear, and the like, referred to as positional or positional relationships are based on the directions or positional relationships shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present application.

In the description of the present application, if there are first and second described only for the purpose of distinguishing technical features, it is not understood that relative importance is indicated or implied or that the number of indicated technical features or the precedence of the indicated technical features is implicitly indicated or implied.

In the description of the present application, unless otherwise expressly limited, terms such as set, mounted, connected and the like should be construed broadly, and those skilled in the art can reasonably determine the specific meaning of the terms in the present application by combining the detailed contents of the technical solutions.

A microcrystalline patch paste device according to an embodiment of the first aspect of the present application is described below with reference to fig. 1 and 2.

Referring to fig. 1 and 2, the microcrystalline patch rubberizing device of the present embodiment is used for implementing continuous and rapid die cutting and compounding of a release film 1100 and a film 1200 in a microcrystalline patch production process to obtain a composite product shown in fig. 2; the microcrystal paster rubberizing device of this embodiment is including glued membrane unreeling roller 100, from type membrane cutting hole module, glued membrane cross cutting module and from type membrane cutting module.

Wherein, unreel roller 650 and first circular knife worker station 610 from the type membrane including unreeling from the type membrane, unreel roller 650 from the type membrane and be used for unreeling from the type membrane to first circular knife worker station 610, first circular knife worker station 610 sets up on the removal route from the type membrane to be used for carrying out the cross cutting from the type membrane, in order to form through-hole 1110 and sword line 1120 from the type membrane die-cutting, and form the hole waste in the position that corresponds with through-hole 1110, wherein a plurality of through-holes 1110 are connected to sword line 1120.

The glue film unwinding roller 100 is used for unwinding the glue film; the adhesive film die-cutting module includes a second circular knife station 710, the second circular knife station 710 is disposed on a moving path of the adhesive film and the release film, and is used for die-cutting the adhesive film to form a film 1200 and a first edge waste on the adhesive film during the process that the adhesive film passes through the second circular knife station 710 along with the release film, and the die-cut film 1200 is attached to the release film and is located at a position of the release film corresponding to the through hole 1110.

Along the moving path of the release film, the release film slitting module is arranged at the rear side of the adhesive film die-cutting module and comprises a third circular knife station 810, a carrier film unreeling mechanism 820 and a composite product reeling mechanism 830; the carrier film unwinding mechanism 820 is used for unwinding the carrier film and attaching the carrier film to the side of the release film to which the film 1200 is attached, and the carrier film plays a role in supporting the bottom of the release film during die cutting and is also used for carrying the obtained composite product after die cutting; the third circular knife station 810 is disposed on a moving path of the release film and the carrier film, and is configured to perform die cutting on the release film to form a release film 1100 and a second edge waste, wherein the film 1200 is attached to the release film 1100 and forms a composite product with the release film 1100, the die-cut composite product is attached to the carrier film, and the composite product rolling mechanism 830 is configured to roll the carrier film to which the composite product is attached.

From the above description, it can be seen that the microcrystalline patch tape device of the present embodiment can release a strip-shaped release film through the release film unwinding roller 650, and achieve continuous fast die cutting of the release film through the first circular cutter station 610 and form the through holes 1110 on the release film, and at the same time, can release a strip-shaped adhesive film through the adhesive film unwinding roller 100, and perform die cutting on the adhesive film entering the station along with the release film through the second circular cutter station 710, so as to continuously and fast die cut the adhesive film and form the adhesive films 1200 corresponding to the through holes 1110 one by one, and further, with the help of the strip-shaped carrier film unwound from the carrier film unwinding mechanism 820, and make the carrier film enter the third circular cutter station 810 along with the release film and the release film 1200, when the release film is cut into the release film pieces 1100 at the third circular cutter station 810, a composite article composed of the adhesive film 1200 and the release film pieces 1100 can be obtained, and the carrier film can carry the composite article, and at the same time, the carrier film can be wound together with the carrier film through the carrier film winding mechanism; therefore, the microcrystal paster rubberizing device of this embodiment can realize from continuous quick cross cutting and compound of type membrane and film 1200, and its degree of automation is high, and can effectively improve film 1200 and the compound efficiency of cross cutting from type membrane 1100 material to adapt to the demand of little moxibustion piece mass production.

It can be understood that, in some embodiments of the present application, in order to achieve automatic discharge of hole waste formed after die cutting of the release film, and also in order to support the bottom of the release film during the die cutting process; from type membrane cutting hole module still including holding in the palm end membrane unwinding roller 620 and holding in the palm end membrane winding roller 630, hold in the palm end membrane unwinding roller 620 and be used for unreeling the support membrane to first circular knife worker station 610, along the removal route of holding in the palm the membrane, hold in the palm end membrane winding roller 630 and be located first circular knife worker station 610 rear side, and be used for the porose useless support membrane of rolling adhesion, and then make the hole useless that produces in first circular knife worker station 610 can be by holding in the palm the automatic area of membrane from and realize wasting discharge.

Referring to fig. 1, in an embodiment of the present application, the release film hole cutting module further includes a first compound station 640, the first compound station 640 is disposed at the right side of the first circular knife station 610, and the release film and the backing film discharged from the release film unwinding roll 650 and the backing film unwinding roll 620 will enter the first compound station 640 from the right side first, and the compounding of the backing film and the release film is completed at the first compound station 640, and then the compounded release film and backing film enter the first circular knife station 610 from the right side together, and the release film is located at one side close to the knife roll in the first circular knife station 610, so that the first circular knife station 610 can cut the release film into the through hole 1110 and the knife line 1120, and the hole waste corresponding to the through hole 1110 can be attached to the backing film. Meanwhile, it can be understood that, in some embodiments, referring to fig. 1, in order to improve the utilization ratio of space and to shorten the length of the entire microcrystalline die-attaching and gluing device, the first circular knife station 610 and the first compound station 640 are both configured as stations having four vertically arranged roll bodies, and in the direction from top to bottom, the first roll body of the first circular knife station 610 is configured as a knife roll, the release film and the backing film released from the release film unwinding roll 650 and the backing film unwinding roll 620 enter the first compound station 640 from the right side and complete compounding between the first roll body and the second roll body, and then penetrate between the first roll body and the second roll body of the first circular knife station 610 from the right side to complete die cutting (at this time, the release film is located above the backing film), then the backing film with Kong Fei attached and the release film peeling roll body pass through the first circular knife station 610 and the second roll body and the third roll body of the first compound station 640 from the left side and then wind up the backing film onto the backing film 630.

It is understood that, in order to complete the composition of the adhesive film and the release film before the die cutting of the adhesive film, in some embodiments of the present application, the microcrystalline patch tape bonding apparatus further includes a second composition station 400, along the moving path of the adhesive film, the second composition station 400 is disposed at the front side of the second circular cutting station 710 and is used for compositing the adhesive film with the release film formed with the through holes 1110, and the adhesive film will cover the through holes 1110 on the release film.

It can be understood that, similarly, in order to improve the utilization ratio of the space and shorten the length of the whole microcrystalline patch rubberizing device, in an embodiment of the present application, referring to fig. 1, specifically, the second compound station 400 is disposed on a side of the first circular cutting station 610 away from the first compound station 640, that is, on a left side of the first circular cutting station 610, and the second circular cutting station 710 is disposed on a side of the first compound station 640 away from the first circular cutting station 610, that is, on a right side of the first compound station 640; similarly, the second compound station 400 can be optionally configured as a station with four roller bodies, and the release film peeled from the backing film will pass around the upper side of the first roller body in the second compound station 400 and pass into the space between the first roller body and the second roller body in the second compound station 400 from the left side together with the adhesive film to complete the compounding (the release film is located above the adhesive film); the release film and the adhesive film after the lamination are sequentially passed between the third roller body and the fourth roller body of the first circular knife station 610 and the first lamination station 640 from the left side, and then enter the second circular knife station 710.

It can be understood that, in order to protect the adhesive film and prevent the adhesive film from adhering to itself, a base film and a first protective film are usually disposed on two sides of the adhesive film raw material, so that the film material discharged from the adhesive film unwinding roller 100 includes the base film, the adhesive film and the first protective film which are sequentially combined, and before the adhesive film is combined with the release film, the base film is located on one side of the adhesive film for being attached to the release film, so that the base film needs to be peeled off from the adhesive film before the adhesive film is combined with the release film; thus, in some embodiments of the present application, the microcrystalline patch gluing device further includes a bottom film winding roll 300 and a bottom film peeling mechanism, and along the moving path of the glue film, the bottom film peeling mechanism is disposed at the front side of the second compound station 400 and is configured to peel the bottom film from the glue film, and the bottom film winding roll 300 is configured to wind the peeled bottom film.

Referring to fig. 1, in an embodiment of the present application, specifically, a guide station 200 is further disposed on the left side of the second compound station 400, a base film peeling mechanism is disposed between the guide station 200 and the second compound station 400, after the film material discharged from the film unwinding roller 100 passes through the guide station 200, the base film is peeled from the upper surface of the film at the base film peeling mechanism, and then the base film is wound on the base film winding roller 300, and the film and the first protective film pass through between the first roller body and the second roller body of the second compound station 400 together with the release film, and the release film is compounded on the upper surface of the film.

It is understood that, in order to remove the first protective film before the die cutting of the adhesive film, in some embodiments of the present application, the micro-crystal patch rubberizing device further includes a first protective film take-up roll 500 and a first protective film peeling mechanism, the first protective film peeling mechanism is disposed at a front side of the second circular cutting station 710 along a moving path of the adhesive film and is used for peeling the first protective film from the adhesive film, and the first protective film take-up roll 500 is used for taking up the peeled first protective film.

Referring to fig. 1, in an embodiment of the present application, specifically, the first protective film peeling mechanism is disposed between the second compound station 400 and the first circular knife station 610, and after passing through the second compound station 400, the first protective film on the lower surface of the adhesive film is peeled off by the first protective film peeling mechanism, and then enters between the first circular knife station 610 and the third roller and the fourth roller of the first compound station 640, and the bottom film is wound on the first protective film winding roller 500.

It can be understood that, in order to realize the automatic discharge of the first edge waste formed after the die cutting of the adhesive film, in some embodiments of the present application, the adhesive film die cutting module further includes a first waste discharge winding mechanism 720, along the moving path of the adhesive film, the first waste discharge winding mechanism 720 is located at the rear side of the second circular knife station 710 and is configured to wind the first edge waste; since the second circular cutting station 710 is used for die-cutting the sheet-shaped film 1200 in the adhesive film, the first edge waste after die-cutting will present a belt shape with a hollow hole in the middle, so the first edge waste can be peeled from the release film by the peeling device, and then the first edge waste is directly rolled by the first waste rolling mechanism 720 for automatic waste rolling.

Referring to fig. 1, in an embodiment of the present application, the second circular knife station 710 is disposed at the right side of the first compound station 640, and the edge waste peeling mechanism is disposed at the right side of the second circular knife station 710, and specifically, the release film and the adhesive film that penetrate out from the right side of the first compound station 640 enter between the first roller body and the second roller body of the second circular knife station 710, and the second roller body of the second circular knife station 710 is a knife roller, so that the adhesive film attached to the lower surface of the release film can be cut to form the adhesive film 1200 and the first edge waste, and after the first edge waste attached to the release film penetrates out of the second circular knife station 710, the edge waste peeling mechanism will peel off the first edge waste and wind the first waste winding mechanism 720.

It can be understood that, for the one side that the protection composite has the film, in order to avoid subsequent handling to influence the film and deviate from the viscidity from type membrane one side, in some embodiments of this application, cut the module from type membrane still including protection film unwinding mechanism 840 and second row of useless rolling mechanism 850, along the moving path from type membrane, protection film unwinding mechanism 840 locates the front side of third circular knife station 810 and is used for letting out the second protection film, and make the second protection film adhere to the one side that has film 1200 from type membrane, third circular knife station 810 can form second protection film cross cutting with from the protection diaphragm and the third side cost that type diaphragm 1100 appearance is unanimous, the second row of useless rolling mechanism is used for rolling second side useless and third side cost. And, for making carrier film and second protection film compound on from the type membrane before cutting from the type membrane, so that third circular knife station 810 carries out the cross cutting to second protection film and from the type membrane together, in order to form simultaneously from type membrane and protection membrane piece, in some embodiments of this application, it still includes third compound station 860 to cut the module from the type membrane, and along the removal route from type membrane, second protection film and carrier film, third compound station 860 sets up in the front side of third circular knife station 810, and is used for compounding second protection film and carrier film in proper order in the one side that has film 1200 from type membrane adhesion.

Referring to fig. 1, in an embodiment of the present application, specifically, the third circular cutting station 810 is disposed on a side of the second circular cutting station 710 away from the first compound station 640, that is, on a right side of the second circular cutting station 710, and the third compound station 860 is disposed between the second circular cutting station 710 and the third circular cutting station 810, the film 1200 from which the first edge waste is removed is attached to the release film, and can enter the third compound station 860 together with the second protective film released by the protective film unwinding mechanism 840 and the carrier film released by the carrier film unwinding mechanism 820 for compounding, and the second protective film and the carrier film are sequentially attached to a side of the release film to which the film 1200 is attached, that is, a lower side of the release film after compounding; then, the release film, the film 1200, the second protective film and the carrier film enter between a first roller body and a second roller body of the third circular knife station 810 together, and the first roller body of the third circular knife station 810 is a knife roller, so that the release film positioned at the top is subjected to die cutting to form a release film 1100 and a second edge waste, meanwhile, the second protective film is subjected to die cutting to form a protective film and a third edge waste which are consistent with the shape of the release film 1100, the film 1200 is attached to the release film 1100 and forms a composite product to be obtained together with the release film 1100, and the protective film is attached to one side of the film 1200, which is far away from the release film 1100; finally, the composite, the second edge waste, the protective film, the third edge fee and the carrier film will pass out of the third circular cutting station 810 from the right side, and the second edge waste and the third edge fee will be wound up in the second waste winding mechanism 850, while the composite and the protective film will be supported and attached to the carrier film and wound up on the composite winding mechanism 830 along with the carrier film.

It can be understood that, in the process of die-cutting the adhesive film to form the adhesive film 1200 and the first edge waste at the second circular knife station 710, since the through hole 1110 is formed on the release film, the adhesive film covers the through hole 1110, and the die-cut adhesive film 1200 is located at the position of the release film corresponding to the through hole 1110, the adhesive film is easy to pass through the through hole 1110 and adhere to the roller body under the extrusion of the roller body at the second circular knife station 710, thereby affecting the die-cutting composite quality of the subsequent composite product; therefore, in order to solve the above problem, in some embodiments of the present application, the microcrystalline patch rubberizing device further includes an anti-adhesion film unwinding roller 910 and an anti-adhesion film winding roller 920, the anti-adhesion film unwinding roller 910 is configured to unwind the anti-adhesion film to the second circular cutting station 710, and the anti-adhesion film is located on a side of the anti-adhesion film away from the film 1200, and the anti-adhesion film winding roller 920 is configured to wind the anti-adhesion film passing through the second circular cutting station 710.

Referring to fig. 1, in an embodiment of the present application, specifically, along a moving path of the release film, a release film unwinding roll 910 is located at a front side of the second circular cutter station 710, and a release film winding roll 920 is disposed at a rear side of the third composite station 860; the release liner unwinding roller 910 is used for unwinding the release liner to the second circular cutting station 710, and the release liner is located on a side of the release liner departing from the film 1200, that is, on the upper side of the release liner; and the anti-sticking film take-up roll 920 is used for taking up the anti-sticking film which passes out of the third compound station 860 along with the release film.

The microcrystalline patch manufacturing line of the second aspect of the present application is described below.

The microcrystalline patch production line of the embodiment of the second aspect of the application comprises the microcrystalline patch rubberizing device of any embodiment of the first aspect. The microcrystalline patch production line of this embodiment can effectively improve the production efficiency of microcrystalline patches and improve the productivity to meet the requirement of mass production by adopting the microcrystalline patch rubberizing device of the first aspect embodiment.

While embodiments of the present application have been shown and described, it will be understood by those of ordinary skill in the art that: various changes, modifications, substitutions and alterations can be made to the embodiments without departing from the principles and spirit of the application, the scope of which is defined by the claims and their equivalents.

Claims (10)

1. A micrite paster rubberizing device which characterized in that includes:

the adhesive film unwinding roller is used for unwinding the adhesive film;

the release film hole cutting module comprises a release film unwinding roller and a first circular knife station, wherein the release film unwinding roller is used for unwinding a release film to the first circular knife station, the first circular knife station is used for die-cutting the release film to form a through hole, a knife line and Kong Fei, and the knife line is connected with a plurality of the through holes;

the adhesive film die-cutting module comprises a second circular knife station, the second circular knife station is arranged on a moving path of the adhesive film and the release film and is used for die-cutting the adhesive film so as to form an adhesive film and first edge waste on the adhesive film and enable the adhesive film to be attached to the position, corresponding to the through hole, of the release film;

the release film cutting module is arranged on the rear side of the adhesive film die cutting module and comprises a third circular knife station, a carrier film unwinding mechanism and a composite product winding mechanism, wherein the carrier film unwinding mechanism is used for unwinding a carrier film and enabling the carrier film to be attached to one side of the release film to which the film is attached, the third circular knife station is arranged on the moving path of the release film and the carrier film and is used for die cutting the release film to form a release film sheet and a second edge waste, and the film sheet is attached to the release film sheet and forms a composite product with the release film sheet; the composite product winding mechanism is used for winding the bearing film adhered with the composite product.

2. The microcrystal patch rubberizing device according to claim 1, wherein the release film hole-cutting module further comprises a bottom supporting film unwinding roller and a bottom supporting film winding roller, the bottom supporting film unwinding roller is used for unwinding the bottom supporting film to the first circular knife working station, and the bottom supporting film winding roller is located on the rear side of the first circular knife working station and is used for winding the bottom supporting film adhered with Kong Fei along the moving path of the bottom supporting film.

3. A microcrystal patch gumming device as claimed in claim 1, wherein the glue film die-cutting module further comprises a first waste discharging and winding mechanism, and the first waste discharging and winding mechanism is located at the rear side of the second circular knife station along the moving path of the glue film and is used for winding the first waste.

4. The microcrystal patch rubberizing device according to claim 1, wherein the release film slitting module further comprises a protective film unwinding mechanism and a second waste discharge winding mechanism, and the protective film unwinding mechanism is disposed on the front side of the third circular knife station and used for discharging a second protective film, so that the second protective film is attached to one side of the film attached to the release film, the third circular knife station can die-cut the second protective film to form a protective film and a third side fee which are consistent with the appearance of the release film, and the second waste discharge winding mechanism is used for winding the second side waste and the third side fee.

5. A microcrystal patch gluing device as claimed in claim 4, wherein the release film slitting module further comprises a third compound station, and the third compound station is disposed at the front side of the third circular knife station along the moving path of the release film, the second protection film and the carrier film and is used for sequentially compounding the second protection film and the carrier film on the side of the release film to which the film is adhered.

6. The microcrystal patch rubberizing device according to claim 1, further comprising an anti-sticking film unwinding roller and an anti-sticking film winding roller, wherein the anti-sticking film unwinding roller is used for unwinding the anti-sticking film to the second circular knife station and enabling the anti-sticking film to be located on one side of the release film, which is far away from the film, and the anti-sticking film winding roller is used for winding the anti-sticking film after passing through the second circular knife station.

7. The microcrystal patch rubberizing device according to claim 1, further comprising a second compound station, wherein the second compound station is disposed at a front side of the second circular knife station along a moving path of the glue film, and is configured to compound the glue film with a release film on which the through hole is formed.

8. The microcrystal patch rubberizing device according to claim 7, further comprising a bottom film winding roller and a bottom film stripping mechanism, wherein a film material discharged from the film unwinding roller comprises a bottom film, a film and a first protection film which are sequentially compounded, the bottom film is located on one side of the film for being attached to the release film, the bottom film stripping mechanism is arranged on the front side of the second compound station and used for stripping the bottom film from the film, and the bottom film winding roller is used for winding and stripping the bottom film.

9. The micro-crystal patch rubberizing device according to claim 8, further comprising a first protective film take-up roll and a first protective film peeling mechanism, wherein the first protective film peeling mechanism is disposed at a front side of the second circular cutting station along a moving path of the adhesive film and is configured to peel the first protective film from the adhesive film, and the first protective film take-up roll is configured to take up the peeled first protective film.

10. A microcrystalline patch production line characterized by comprising the microcrystalline patch gumming apparatus of any one of claims 1 to 9.

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