CN218834079U

CN218834079U - Dehumidifying device

Info

Publication number: CN218834079U
Application number: CN202223333312.3U
Authority: CN
Inventors: 刘玉霖; 梁柱; 王德明; 白忠伟; 马兴华; 谢永昌; 刘金明
Original assignee: Huaxia Tianxin Intelligent Internet Of Things Co ltd
Current assignee: Huaxia Tianxin Intelligent Internet Of Things Co ltd
Priority date: 2022-12-13
Filing date: 2022-12-13
Publication date: 2023-04-11
Anticipated expiration: 2032-12-13

Abstract

The utility model provides a dehumidifying device, which comprises a shell and a liquid accumulating tank arranged at the bottom of the shell, wherein the section of the liquid accumulating tank is of a V-shaped structure, and the bottom of the liquid accumulating tank is provided with a pipe joint; a bottom plate and a semiconductor refrigerating sheet arranged on the bottom plate are arranged on one side of the shell, and a liquid level sensor for measuring the water level amount in the liquid accumulation groove is arranged in the middle of the semiconductor refrigerating sheet; the other side of the shell is provided with a grating plate; a heat radiation fan is installed at the top of the shell, and a plug electrically connected with the semiconductor refrigeration sheet is installed on a side plate of the shell; the current situation that the ponding depth of the lowest position is low and water leakage is easy to happen due to the fact that the collecting box in the existing dehumidifying device is of a unilateral inclined structure and is of a semi-closed structure is improved.

Description

Dehumidifying device

Technical Field

The utility model relates to a dehumidification module field, concretely relates to dehydrating unit.

Background

The mining explosion-proof product has good internal sealing property due to the fact that the mining explosion-proof product meets the explosion-proof requirement, and the internal humidity and temperature of the mining explosion-proof product need to be reduced by a built-in dehumidifying device, so that damage to an electric element caused by internal condensate water is avoided; as disclosed in chinese patent CN112774411A, a dehumidifying apparatus, whose publication date is 2021.05.11, which describes that the dehumidifying apparatus includes a mounting plate for fixing with an explosion-proof device, a plurality of uniformly distributed cooling fins are fixedly mounted on the front surface of the mounting plate, a plurality of vertically and uniformly distributed liquid guiding fins contacting with the corresponding cooling fins are fixedly mounted on the front surface of the mounting plate, a collecting box having an opening at the top end and located under the plurality of liquid guiding fins is mounted on the front surface of the mounting plate, a water outlet is formed on the collecting box, the water outlet is used for communicating with an external water pipe, and an ampere-plug is mounted on the collecting box; wherein, the collecting box is the setting of one-way slope structure, and the delivery port is located one side extreme position department promptly, and the ponding height that causes the bottom collecting box is lower, and the install bin forms semi-enclosed construction with the mounting panel, causes the condition of leaking in extreme position department easily.

SUMMERY OF THE UTILITY MODEL

To the not enough that exists among the prior art, the utility model provides a dehydrating unit has solved among the current dehydrating unit collecting box and for unilateral slope structure and semi-enclosed construction, causes the lower problem of leaking easily of ponding degree of depth of lowest position department.

In order to achieve the above purpose, the utility model adopts the following technical proposal:

a dehumidification device comprises a shell and a liquid accumulation groove arranged at the bottom of the shell, wherein the section of the liquid accumulation groove is of a V-shaped structure, and a pipe joint is arranged at the bottom of the liquid accumulation groove; a bottom plate and a semiconductor refrigerating sheet arranged on the bottom plate are arranged on one side of the shell, and a liquid level sensor for measuring the water level amount in the liquid accumulation groove is arranged in the middle of the semiconductor refrigerating sheet; the other side of the shell is provided with a grating plate; and a heat radiation fan is installed at the top of the shell, and a plug electrically connected with the semiconductor refrigeration sheet is installed on a side plate of the shell.

Preferably, the shell is provided with a first bending part and a second bending part which are bent in opposite directions, the first bending part and the shell are enclosed to form a first clamping groove, and the second bending part and the shell are enclosed to form a second clamping groove; a first step part matched with the first clamping groove is arranged on the bottom plate, and a second step part matched with the second clamping groove is arranged on the bottom plate; and the first bending part and the second bending part are respectively provided with a plurality of fasteners for fastening the bottom plate.

Preferably, the semiconductor refrigeration piece includes the heating panel and the interval is installed two sets of contact refrigeration pieces on the heating panel, level sensor sets up in two sets of between the contact refrigeration piece.

Preferably, a bending plate is installed on the heat dissipation plate, and a transverse plate of the bending plate is provided with an installation hole for installing the liquid level sensor; the height of the transverse plate of the bending plate is lower than that of the lower edge of the heat dissipation plate.

Preferably, an asbestos plate for heat insulation is arranged between the bottom plate and the heat dissipation plate.

Preferably, the back of heating panel is equipped with from bottom to top and extends and follow a plurality of metallic channels of the length direction equipartition of heating panel, the metallic channel is used for spacingly contact refrigeration piece and level sensor's wire.

Preferably, the material of heating panel is the aluminum alloy, the material of bottom plate is copper.

Preferably, the top of the grid plate is provided with a third bending part, and the third bending part abuts against the top of the shell and locks the grid plate and the shell through a fastener.

Preferably, a plurality of first holes which are uniformly distributed along the length direction and longitudinally extend are formed in the grating plate.

Preferably, a plurality of second holes and third holes which are uniformly distributed along the height direction and transversely extend are respectively arranged on two side plates of the shell; the second holes and the third holes are longitudinally arranged in a staggered mode on the same projection plane in the height direction.

Compared with the prior art, the utility model discloses following beneficial effect has:

the shell and the grating plate are used for sealing the semiconductor refrigerating sheet, the cooling fan, the liquid level sensor and the liquid accumulation groove, so that internal devices can be coated, and the entering airflow can form convection to improve the condensing efficiency and the cooling efficiency;

simultaneously, set up the hydrops groove that is "V" shape structure in the shell bottom and collect the back to the comdenstion water, through the coupling that is located hydrops groove lowest position department outwards discharge to the drain, let the interior hydrops of hydrops groove in the liquid level height of lowest position department be greater than other positions from this, and both sides can improve the flowing back speed of hydrops to middle mobile mode, avoid causing the condition of leaking.

Drawings

Fig. 1 is a schematic structural diagram of an embodiment of the present invention;

fig. 2 is a schematic diagram of an explosive structure according to an embodiment of the present invention;

fig. 3 is a schematic structural view of a semiconductor refrigeration sheet in an embodiment of the present invention;

FIG. 4 is a schematic structural diagram of a bottom plate in an embodiment of the present invention;

FIG. 5 is a schematic structural view of a grid plate according to an embodiment of the present invention;

FIG. 6 is a schematic structural view of a bending plate according to an embodiment of the present invention;

in the figure, the position of the upper end of the main shaft,

the cooling device comprises a shell 1, a liquid accumulating groove 2, a pipe joint 3, a bottom plate 4, a semiconductor refrigerating piece 5, a liquid level sensor 6, a grating plate 7, a cooling fan 8, a plug 9, a first bending portion 10, a second bending portion 11, a first clamping groove 12, a second clamping groove 13, a first step portion 14, a second step portion 15, a cooling plate 16, a contact refrigerating piece 17, a bending plate 18, a mounting hole 19, an asbestos plate 20, a wire guide groove 21, a third bending portion 22, a first hole 23, a second hole 24 and a third hole 25.

Detailed Description

The present invention is further described with reference to the following drawings and specific embodiments so that those skilled in the art can better understand the present invention and can implement the present invention, but the embodiments are not to be construed as limiting the present invention.

As shown in fig. 1-6, the embodiment of the present invention provides a dehumidifier, which includes a housing 1 and a liquid accumulation tank 2 disposed at the bottom of the housing 1, wherein the section of the liquid accumulation tank 2 is a "V" shaped structure, a pipe joint 3 is mounted at the bottom of the liquid accumulation tank 2, first, the liquid accumulation tank 2 is disposed at the bottom of the housing 1 for collecting liquid accumulation, so as to maximize the depth of liquid accumulation at the lowest position in the middle, and flow between two sides to accelerate the liquid discharge speed, and the pipe joint 3 is used for centralized processing of liquid accumulation after being connected to an external liquid discharge device; meanwhile, a bottom plate 4 and a semiconductor refrigerating sheet 5 arranged on the bottom plate 4 are arranged on one side of the shell 1, and a liquid level sensor 6 used for measuring the water level in the liquid collecting tank 2 is arranged in the middle of the semiconductor refrigerating sheet 5; and, install grid plate 7 on the other side of shell 1, form enclosed construction through grid plate 7, bottom plate 4 and shell 1, can protect internal electric component, and can change the air current that flows into inside and lead the flow, improve mobility and condensation radiating efficiency.

Specifically, a plurality of second holes 24 and third holes 25 which are uniformly distributed along the height direction and extend transversely are respectively arranged on two side plates of the shell 1; and the second holes 24 and the third holes 25 are longitudinally arranged in a staggered manner on the same projection plane in the height direction, so that the air flow entering the shell 1 can contact the semiconductor refrigeration sheet 5 as much as possible after flowing, and the condensation heat dissipation efficiency is improved.

Meanwhile, a third bending part 22 is arranged at the top of the grid plate 7, the third bending part 22 abuts against the top of the shell 1 and locks the grid plate 7 and the shell 1 through a fastening piece, and the structural stability after the grid plate 7 and the shell 1 are fixedly connected can be higher after the third bending part 22 is positioned; and a plurality of first holes 23 which are uniformly distributed along the length direction and longitudinally extend are formed in the grating plate 7, and internal airflow rapidly flows through the first holes 23, the second holes 24 and the third holes 25, so that the contact amount of the airflow and the semiconductor refrigerating sheet 5 can be increased.

Specifically, a heat dissipation fan 8 is installed at the top of the housing 1, and the flow speed of the internal gas is increased by the heat dissipation fan 8, so that condensation and heat dissipation are accelerated. Meanwhile, a plug 9 electrically connected with the semiconductor refrigerating sheet 5 is installed on a side plate of the shell 1, and the plug 9 is an Anpu plug 9.

In order to improve the reliability of the limiting connection between the bottom plate 4 and the shell 1, a first bending part 10 and a second bending part 11 which are bent in opposite directions are arranged on the shell 1, the first bending part 10 and the shell 1 are enclosed to form a first clamping groove 12, and the second bending part 11 and the shell 1 are enclosed to form a second clamping groove 13; and be equipped with on the bottom plate 4 with first draw-in groove 12 complex first step portion 14, be equipped with on the bottom plate 4 with second draw-in groove 13 complex second step portion 15, through first draw-in groove 12 and first step portion 14 cooperation to and second draw-in groove 13 can reliably be spacing to whole bottom plate 4 after the cooperation of second step portion 15, simultaneously. The first bending portion 10 and the second bending portion 11 are provided with a plurality of fasteners for fastening the bottom plate 4, so that the bottom plate 4 is stably mounted on the housing 1 under the condition of limiting and positioning.

Specifically, semiconductor refrigeration piece 5 includes that heating panel 16 and interval are installed two sets of contact refrigeration pieces 17 on the heating panel 16, level sensor 6 sets up in two sets of between the contact refrigeration piece 17, two sets of contact refrigeration pieces 17 can adopt 4 x 1 distribution mode, improve the contact surface.

The heat dissipation plate 16 is provided with a bending plate 18, and a transverse plate of the bending plate 18 is provided with a mounting hole 19 for mounting the liquid level sensor 6; the diaphragm height of the board 18 of bending is less than the height of the lower limb of the heating panel 16 to let the level sensor 6 install and be located the corresponding department of 2 lowest positions in hydrops groove, thereby can measure the biggest hydrops position in whole hydrops groove 2, improve and measure the accuracy, can avoid causing the condition that exceeds the liquid level height through real-time supervision liquid level height and accelerate flowing back speed.

In order to insulate the heat dissipation plate 16 from the base plate 4, an asbestos plate 20 for heat insulation is provided between the heat dissipation plate 16 and the base plate 4, that is, the heat dissipation plate 16 can perform rapid condensation on the condensation side contacting with the refrigeration sheet 17, and the base plate 4 can perform heat dissipation and heat exchange inside the entire housing 1.

Specifically, the heat dissipation plate 16 is made of aluminum alloy, and the bottom plate 4 is made of copper, so that the heat exchange effect at the corresponding position can be improved.

In order to lay wire to internal contact refrigeration piece 17 and level sensor 6's wire, avoid causing the wire to arrange and carry out spacing protection the back of heating panel 16 is equipped with from bottom to top and extends and follows a plurality of metallic channels 21 of heating panel 16's length direction equipartition, metallic channel 21 is used for spacingly contact refrigeration piece 17 and level sensor 6's wire.

The contact cooling plate 17, the cooling fan 8, the liquid level sensor 6, the plug 9 and the like mentioned in the present embodiment are all of the type of the prior art.

In the description of the present invention, it is to be understood that the terms indicating orientation or positional relationship are based on the orientation or positional relationship shown in the drawings, and are only for convenience of description and simplification of description, and do not indicate or imply that the equipment or elements referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention.

In the present invention, unless otherwise expressly stated or limited, the terms "mounted," "connected," and "fixed" are to be construed broadly and may, for example, be fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meaning of the above terms in the present invention can be understood according to specific situations by those skilled in the art.

In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "inner", "outer", etc. indicate the position or positional relationship based on the position or positional relationship shown in the drawings, or the position or positional relationship that the products of the present invention are usually placed when in use, and are only for convenience of describing the present invention and simplifying the description, but do not indicate or imply that the device or element to which the term refers must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and the like are used merely to distinguish one description from another, and are not to be construed as indicating or implying relative importance.

Finally, although the present invention has been described in detail with reference to the preferred embodiments, it should be understood by those skilled in the art that the present invention can be modified or replaced by other means without departing from the spirit and scope of the present invention, which should be construed as limited only by the appended claims.

Claims

1. A dehumidification apparatus, comprising: the device comprises a shell (1) and a liquid accumulation tank (2) arranged at the bottom of the shell (1), wherein the section of the liquid accumulation tank (2) is of a V-shaped structure, and a pipe joint (3) is arranged at the bottom of the liquid accumulation tank (2);

a bottom plate (4) and a semiconductor refrigerating sheet (5) arranged on the bottom plate (4) are arranged on one side of the shell (1), and a liquid level sensor (6) used for measuring the water level amount in the liquid collecting tank (2) is arranged in the middle of the semiconductor refrigerating sheet (5);

a grating plate (7) is arranged on the other side of the shell (1);

radiator fan (8) are installed at shell (1) top, install on the curb plate of shell (1) with plug (9) that semiconductor refrigeration piece (5) electricity is connected.

2. A dehumidifying device as claimed in claim 1, wherein: a first bending part (10) and a second bending part (11) which are bent in opposite directions are arranged on the shell (1), the first bending part (10) and the shell (1) are enclosed to form a first clamping groove (12), and the second bending part (11) and the shell (1) are enclosed to form a second clamping groove (13);

a first step part (14) matched with the first clamping groove (12) is arranged on the bottom plate (4), and a second step part (15) matched with the second clamping groove (13) is arranged on the bottom plate (4);

the first bending part (10) and the second bending part (11) are provided with a plurality of fasteners for fastening the bottom plate (4).

3. A dehumidifying device as claimed in claim 1, wherein: semiconductor refrigeration piece (5) are including heating panel (16) and interval installation two sets of contact refrigeration piece (17) on heating panel (16), level sensor (6) set up in two sets of between contact refrigeration piece (17).

4. A dehumidifying device as claimed in claim 3, wherein: a bending plate (18) is arranged on the heat dissipation plate (16), and a transverse plate of the bending plate (18) is provided with a mounting hole (19) for mounting the liquid level sensor (6);

the transverse plate height of the bending plate (18) is lower than the height of the lower edge of the heat dissipation plate (16).

5. A dehumidifying device as claimed in claim 3 or 4, wherein: and an asbestos plate (20) for heat insulation is arranged between the bottom plate (4) and the heat dissipation plate (16).

6. A dehumidifying device as claimed in claim 3 or 4, wherein: the back of heating panel (16) is equipped with from bottom to top and extends and follows a plurality of wire casing (21) of the length direction equipartition of heating panel (16), wire casing (21) are used for spacingly contact refrigeration piece (17) and level sensor (6)'s wire.

7. A dehumidifying device as claimed in claim 4, wherein: the heat dissipation plate (16) is made of aluminum alloy, and the bottom plate (4) is made of copper.

8. A dehumidifying device as claimed in claim 1, wherein: grid plate (7) top is equipped with third bent portion (22), third bent portion (22) support and lean on shell (1) top to lock through the fastener grid plate (7) with shell (1).

9. A dehumidifying device as claimed in claim 8, wherein: a plurality of first holes (23) which are uniformly distributed along the length direction and longitudinally extend are formed in the grating plate (7).

10. A dehumidifying device as claimed in claim 1, wherein: a plurality of second holes (24) and third holes (25) which are uniformly distributed along the height direction and transversely extend are respectively arranged on two side plates of the shell (1);

the second holes (24) and the third holes (25) are longitudinally arranged in a staggered manner on the same projection plane in the height direction.