CN218830216U - Optical drive, camera module and electronic equipment - Google Patents

Abstract

The present disclosure relates to an optical drive, a camera module and an electronic apparatus, the optical drive including: a base; the cover body is buckled on the base, and an accommodating space is formed between the cover body and the base; the adapter is fixed on the base; a chip mounting seat installed in the accommodating space and configured to move in a focusing direction relative to the base; a chip assembly including a circuit board mounted on the chip mounting socket and a chip body mounted on the circuit board; and a spring assembly conductively connected between the chip assembly and the interposer. Replace the conducting wire through the spring subassembly, can avoid chip subassembly motion in-process, lens module inner line is mixed and disorderly and make the problem of electrically conductive inefficacy to the spring subassembly can also play the effect of supporting and reseing to the chip mount pad, need not to set up extra and supports and the subassembly that resets, can simplify lens module inner structure and reduce volume and weight.

Description

Optical drive, camera module and electronic equipment

Technical Field

The present disclosure relates to the field of electronic imaging, and in particular, to an optical driver, an imaging module, and an electronic apparatus.

Background

In the field of electronic device imaging, in order to improve imaging quality, an optical device in an imaging module is usually movable, for example, focusing or optical anti-shake is performed, and in the process of focusing, light passing through a lens can be refracted onto a photosensitive chip according to imaging requirements by adjusting the distance between the photosensitive chip and the lens, and the photosensitive chip is connected with a circuit board through a conductive wire to transmit an electrical signal. Due to the design, on one hand, in the process that the photosensitive chip moves along with the chip mounting seat, the conducting wires connected to the chip are disordered, and further the risk of circuit failure exists; on the other hand, need additionally set up supporting mechanism and reset structure for the chip mount pad, inner structure is complicated, and volume and weight are big, and the motion is unstable.

SUMMERY OF THE UTILITY MODEL

An object of the present disclosure is to provide an optical drive, a camera module, and an electronic apparatus to at least partially solve the problems in the related art.

To achieve the above object, the present disclosure provides an optical drive including: a base; the cover body is buckled on the base, and an accommodating space is formed between the cover body and the base; the adapter is fixed on the base; the chip mounting seat is mounted in the accommodating space and is configured to move along a focusing direction relative to the base; a chip assembly including a circuit board mounted on the chip mount pad and a chip body mounted on the circuit board; and the spring assembly is electrically connected between the chip assembly and the adapter.

Optionally, the reed assembly comprises: a plurality of first reeds connected to the adaptor; a plurality of second reeds connected to the circuit board; and a plurality of spring wires respectively connected between the corresponding first spring plate and the second spring plate.

Optionally, the plurality of first reeds, the plurality of second reeds and the plurality of spring wires are symmetrically distributed on two sides of the chip assembly, or the plurality of first reeds, the plurality of second reeds and the plurality of spring wires are symmetrically distributed on positions, close to four corners, of the chip assembly.

Optionally, the spring wire is resilient.

Optionally, the spring wire is configured to: under the initial state, the elastic force is used for driving the chip assembly to drive the chip mounting seat to tightly push the cover body.

Optionally, the spring wire is configured to extend along a tortuous path.

Optionally, the optical driver further includes a power generation device for driving the chip mounting base to move along the focusing direction relative to the base, wherein the power generation device includes a coil fixed on the chip mounting base and a magnet mounted on the base, and the coil and the magnet cooperate to generate a magnetic force.

Optionally, the number of the power generation devices is two, and the power generation devices are symmetrically distributed on two sides of the chip assembly, or the number of the power generation devices is four, and the power generation devices are symmetrically distributed around the chip assembly.

Optionally, the power generation device further includes a magnetic yoke distributed around the magnet and the coil, wherein the magnetic yoke is fixed on the base, or the magnetic yoke is a part of the base.

Optionally, a position of the chip mounting base corresponding to the chip component is configured to be a metal material.

According to a second aspect of the present disclosure, there is provided a camera module comprising an optical device and the optical drive described above.

According to a third aspect of the present disclosure, an electronic device is provided, which includes the camera module.

Through above-mentioned technical scheme, use the spring subassembly to replace traditional conducting wire, can avoid the chip subassembly motion in-process, lens module internal line is mixed and disorderly and leads to the problem of the easy trouble of circuit to the spring subassembly can also play the effect of supporting and reseing to the chip mount pad, need not to set up extra support and reset assembly, can simplify lens module inner structure and reduce volume and weight.

Additional features and advantages of the present disclosure will be set forth in the detailed description which follows.

Drawings

The accompanying drawings, which are included to provide a further understanding of the disclosure and are incorporated in and constitute a part of this specification, illustrate embodiments of the disclosure and together with the description serve to explain the disclosure, but do not constitute a limitation of the disclosure. In the drawings:

FIG. 1 is an exploded view of an optical drive according to an exemplary illustration of the present disclosure;

FIG. 2 is a partial schematic view of an optical drive according to an exemplary illustration of the present disclosure;

FIG. 3 is an enlarged view of portion A of FIG. 1;

FIG. 4 is an exploded view of an optical drive according to an exemplary illustration of the present disclosure;

FIG. 5 is a partial schematic view of an optical drive according to an exemplary illustration of the present disclosure;

FIG. 6 is an enlarged view of portion B of FIG. 4;

fig. 7 is a schematic diagram of a camera module according to an exemplary illustration of the present disclosure.

Description of the reference numerals

10-a base; 20-a cover body; 30-an adaptor; 40-a chip mount; 50-a chip assembly; 51-a circuit board; 52-chip body; 60-an optical device; 70-a spring assembly; 71-a first reed; 72-a second reed; 73-spring wire; 80-a power generation device; 81-coil; 82-a magnet; 83-yoke.

Detailed Description

The following detailed description of specific embodiments of the present disclosure is provided in connection with the accompanying drawings. It should be understood that the detailed description and specific examples, while indicating the present disclosure, are given by way of illustration and explanation only, not limitation.

In the present disclosure, unless otherwise stated, the use of the directional terms "inside and outside" should be understood based on the application environment of the relevant component, which may be defined based on the actual use direction of the relevant component, or may be based on the self-profile of the component. For example: the chip mounting seat is arranged in the accommodating space, namely the chip mounting seat is arranged in the accommodating space formed by the base and the cover body; the yoke distributed on the "outer periphery" of the magnet and the coil means that the yoke is distributed on the circumferential direction of the magnet and the coil, that is, the coil and the magnet are located in the accommodating space formed by the yoke or arranged adjacent to the yoke.

In addition, in the present disclosure, the terms "first", "second", and the like are used for distinguishing one element from another, without order or importance. When the following description refers to the accompanying drawings, like numbers in different drawings represent the same or similar elements unless otherwise indicated.

Referring to fig. 1 to 6, the present disclosure provides a lens module including: the electronic device comprises a base 10, a cover body 20 buckled on the base 10 and forming a containing space with the base 10, an adapter 30 fixed on the base 10, a chip mounting seat 40 installed in the containing space, a chip assembly 50 installed on the chip mounting seat 40, and a spring assembly 70 conductively connected between the chip assembly 50 and the adapter 30, wherein the chip mounting seat 40 is configured to move along a focusing direction relative to the base 10, and the chip assembly 50 comprises a circuit board 51 installed on the chip mounting seat 40 and a chip body 52 installed on the circuit board 51. In the embodiment of the present disclosure, a mounting hole of an optical device 60 to be mentioned later may be formed on the cover body 20, the optical device 60 may be a lens, the lens is mounted in the mounting hole and can transmit light to the chip body 52, the chip body 52 transmits the obtained optical information to the circuit board 51 connected thereto, and the circuit board 51 transmits the optical signal to the adaptor 30 through the reed assembly 70. It should be explained that the adaptor 30 may be an FPC (Flexible Printed Circuit Board) or a PCB (Printed Circuit Board) mounted on the base 10, or a spring formed by bending or pressing, and the disclosure does not limit the specific structure of the adaptor 30 as long as it satisfies that one end can electrically connect the Circuit Board 51 and receive the optical signal of the Circuit Board 51, and the other end is used for externally connecting the main control Board of the camera module and transmitting the optical signal to the main control Board of the camera module, so as to facilitate the operation of the user. The adapter 30 may be welded directly to the base 10 or may be embedded in the base 10 (with the spring member 70 attached to the outer flange).

The present disclosure is not limited to the type of the chip body 52, and may be, for example, a sensor chip or a display chip.

Here, it should be noted that the focusing direction refers to a direction corresponding to an arrow Z in fig. 1, which is perpendicular to a plane in which the chip assembly 50 is located, and the explanation thereof will not be repeated below.

Through above-mentioned technical scheme, use spring assembly 70 to replace traditional conducting wire, can avoid chip assembly 50 along with the chip mount pad 40 focusing motion in-process, the mixed and disorderly unordered problem that makes the circuit break down easily of lens module internal conductor to spring assembly 70 can also play the effect of supporting and restoring to the throne to chip mount pad 40, need not to set up extraordinarily and support and reset assembly, can simplify lens module inner structure and reduce its volume and weight.

Referring to fig. 2-3, 5-6, in an embodiment of the present disclosure, the reed assembly 70 may include: a plurality of first reeds 71 connected to the adaptor 30; a plurality of second reeds 72 connected to the circuit board 51; and a plurality of spring wires 73 respectively connected between the corresponding first spring plates 71 and second spring plates 72. Since the circuit board 51 is fixed on the chip mounting base 40 and the adaptor 30 is fixed on the base 10, it is equivalent to that the first spring plate 71 and the second spring plate 72 are respectively fixed on the base 10 and the chip mounting base 40 and are connected through the spring wire 73 to form a supporting and resetting function. And the spring wires 73 have conductivity to transmit the electrical signal on the chip assembly 50 to the adaptor 30, and the spring wires 73 transmit the electrical signal independently without interfering with each other. In an embodiment of the present disclosure, the spring wire 73 may be integrally formed with the first spring plate 71 and the second spring plate 72. Furthermore, in other embodiments, the spring wire 73 can be welded to the first spring plate 71 and the second spring plate 72.

In the embodiment of the present disclosure, the first spring plate 71 and the second spring plate 72 may be directly welded on the chip assembly 50 or the interposer 30 corresponding thereto, or in some other embodiments, the first spring plate 71 and the second spring plate 72 may have mounting holes, and the interposer 30 or the chip assembly 50 corresponding thereto may have protruding pillars corresponding to the mounting holes, and the protruding pillars extend into the mounting holes first during assembly and then are welded, and how to fix the first spring plate 71 and the second spring plate 72 on the interposer 30 or the chip assembly 50 is not limited in the present disclosure.

In order to balance the supporting force and the restoring force of the spring assembly 70 on the chip mounting base 40 and avoid the problems of torsion, deviation and the like of the chip mounting base 40 due to uneven stress, referring to fig. 2, in some embodiments, a plurality of first springs 71, a plurality of second springs 72 and a plurality of wires 73 may be symmetrically distributed on two sides of the chip assembly 50, and at this time, the other two sides of the chip assembly 50 may be used for arranging a power generation device 80 to be described later. Alternatively, referring to fig. 5, in other embodiments, the plurality of first springs 71, the plurality of second springs 72, and the plurality of spring wires 73 may be symmetrically distributed at positions near four corners of the chip assembly 50, and in this case, positions of four sides of the chip assembly 50 may be used to arrange the power generation device 80 to be described later, and the power generation device 80 will not be described herein.

In order to allow the spring assembly 70 to perform a restoring function when the chip mounting base 40 and the base 10 move relatively, in the embodiment of the present disclosure, the spring wire 73 may have elasticity. By such design, when the chip mounting seat 40 and the base 10 move relatively, the spring wire 73 connected therebetween is deformed to generate a restoring elastic force, so as to drive the chip mounting seat 40 to restore. The present disclosure does not limit the material of the spring wire 73 as long as it satisfies elasticity and conductivity.

Further, in order that the chip mount 40 may abut against the cover 20 in the initial state, in the embodiment of the present disclosure, the spring wire 73 may be configured to: in the initial state, there is an elastic force for driving the chip assembly 50 to drive the chip mounting base 40 to push against the cover 20, in this case, the focusing movement direction of the chip mounting base 40 is a direction away from the cover 20. In addition, in some other embodiments, when the focusing movement direction of the chip mounting base 40 needs to include two movements close to and far from the cover 20, the spring wire 73 can maintain a balanced state (without elastic force) in the initial state, that is, the reset elastic force can be generated no matter which direction the movement is toward.

Referring to fig. 3 and 6, in order to avoid the problem of the spring wire 73 being broken due to stress concentration on the spring wire 73, in an embodiment of the present disclosure, the spring wire 73 may be configured to extend along a meandering path. With this arrangement, the length of the spring wire 73 can be increased, so that the stress on the spring wire 73 can be dispersed, and the concentration of the stress can be avoided. In addition, in other embodiments, the spring wire 73 may be increased in strength by increasing its diameter or changing its material.

The present disclosure does not limit the meandering extension path of the spring wire 73, for example, fig. 3 and 6 provide two different extension paths, respectively, or in other embodiments, the extension path may be irregular, jagged, etc., as long as the extension path can increase the extension length of the spring wire 73.

Referring to fig. 1 and 4, in the embodiment of the present disclosure, in order to provide a driving force for a focusing movement, the lens module may further include a power generation device 80 for driving the chip mount 40 to move in a focusing direction with respect to the base 10, wherein the power generation device 80 may include a coil 81 fixed on the chip mount 40 and a magnet 82 mounted on the base 10. When the magnetic field generating device is used, the coil 81 is electrified to generate a magnetic field, the magnetic field of the coil 81 can be matched with the magnet 82 to generate magnetic force, and the direction and the magnitude of the driving magnetic force can be adjusted by controlling the magnitude and the direction of current in the coil 81. In addition, in some other embodiments, the motor may also drive the screw rod structure to implement the focusing movement of the chip mounting base 40, specifically, the motor and the screw rod are installed on the base 10, the chip mounting base 40 is provided with a threaded hole and is matched with the screw rod, the extending direction of the screw rod is consistent with the focusing direction, and the movement of the chip mounting base 40 along the focusing direction can be implemented only by driving the motor to rotate forward and backward during use.

Further, in order to balance the stress on the chip mounting base 40 and avoid the deflection occurring during the focusing movement from affecting the imaging effect, referring to fig. 1, in some embodiments, the number of the power generation devices 80 may be two, and the power generation devices are symmetrically distributed on two sides of the chip assembly 50, and at this time, the other two sides of the chip assembly 50 are used for arranging the spring assembly 70. In addition, referring to fig. 4, in other embodiments, the number of the power generation devices 80 may be four, and the power generation devices are symmetrically distributed around the chip assembly 50, and in this case, the spring assemblies 70 may be distributed at positions near four corners of the chip assembly 50.

In order to increase the driving force of the power generation device 80, referring to fig. 1 and 4, in the embodiment of the present disclosure, the power generation device 80 may further include a yoke 83 distributed on the outer circumference of the magnet 82 and the coil 81, wherein the yoke 83 may be fixed on the base 10, or the yoke 83 may be a part of the base 10. Since the yoke 83 has a magnetic flux function, disposing it near the magnet 82 can improve the utilization of the magnetic field of the magnet 82, thereby improving the driving force. In addition, in some other embodiments, the driving force may also be increased by increasing the current value in the coil 81 or replacing the magnet 82 with stronger magnetism, which is not limited by the present disclosure.

In order to avoid the lens module failure caused by the overheating temperature of the chip assembly 50, in the embodiment of the disclosure, the position of the chip mounting base 40 corresponding to the chip assembly 50 is configured with a metal material. The metal material can dissipate heat generated by the chip assembly 50 quickly, and local overheating is avoided. Furthermore, in some other embodiments, a cooling device, such as a cooling pipeline, may be disposed in the chip mounting seat 40.

Referring to fig. 7, according to a second aspect of the present disclosure, there is provided a camera module including an optical device 60 and the optical drive, which has all the advantages of the optical drive and will not be described herein again.

According to a third aspect of the present disclosure, an electronic device is provided, which includes the above-mentioned camera module, and the electronic device has all the advantages of the above-mentioned camera module, which are not described herein again.

The preferred embodiments of the present disclosure are described in detail with reference to the accompanying drawings, however, the present disclosure is not limited to the specific details of the above embodiments, and various simple modifications may be made to the technical solution of the present disclosure within the technical idea of the present disclosure, and these simple modifications all belong to the protection scope of the present disclosure.

It should be noted that, in the foregoing embodiments, various features described in the above embodiments may be combined in any suitable manner, and in order to avoid unnecessary repetition, various combinations that are possible in the present disclosure are not described again.

In addition, any combination of various embodiments of the present disclosure may be made, and the same should be considered as the disclosure of the present disclosure, as long as it does not depart from the spirit of the present disclosure.

Claims (12)

1. An optical drive, comprising:

a base;

the cover body is buckled on the base, and an accommodating space is formed between the cover body and the base;

the adapter is fixed on the base;

the chip mounting seat is mounted in the accommodating space and is configured to move along a focusing direction relative to the base;

a chip assembly including a circuit board mounted on the chip mounting socket and a chip body mounted on the circuit board; and

and the reed assembly is in conductive connection between the chip assembly and the adapter.

2. The optical drive of claim 1, wherein the reed assembly comprises:

a plurality of first reeds connected to the adaptor;

a plurality of second reeds connected to the circuit board; and

and the spring wires are respectively connected between the corresponding first reed and the second reed.

3. The optical driver as claimed in claim 2, wherein the plurality of first springs, the plurality of second springs and the plurality of wires are symmetrically disposed on two sides of the chip assembly, or the plurality of first springs, the plurality of second springs and the plurality of wires are symmetrically disposed at positions near four corners of the chip assembly.

4. The optical driver of claim 2, wherein the spring wire is elastic.

5. The optical driver of claim 4, wherein the spring wire is configured to: under the initial state, the elastic force is used for driving the chip assembly to drive the chip mounting seat to tightly push the cover body.

6. The optical drive of claim 2, wherein the spring wire is configured to extend along a meandering path.

7. The optical driver of claim 1, further comprising a power generating device for driving the chip mounting base to move in a focusing direction relative to the base, wherein the power generating device comprises a coil fixed on the chip mounting base and a magnet mounted on the base, and the coil and the magnet cooperate to generate a magnetic force.

8. The optical drive according to claim 7, wherein the number of the power generation means is two and is symmetrically distributed on both sides of the chip assembly, or the number of the power generation means is four and is symmetrically distributed on the periphery of the chip assembly.

9. The optical drive of claim 7, wherein the power generation device further comprises a yoke disposed around the magnet and the coil, wherein the yoke is fixed to the base or is a part of the base.

10. The optical drive of claim 1, wherein a position of the chip mounting base corresponding to the chip assembly is configured to be a metal material.

11. A camera module comprising an optical device and an optical drive according to any of claims 1-10.

12. An electronic apparatus comprising the camera module of claim 11.

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