CN2188253Y

CN2188253Y - Semiconductor laser arrangement

Info

Publication number: CN2188253Y
Application number: CN 94206746
Authority: CN
Inventors: 黄肇基
Original assignee: FANGCHU Co Ltd
Current assignee: FANGCHU Co Ltd
Priority date: 1994-05-24
Filing date: 1994-05-24
Publication date: 1995-01-25
Anticipated expiration: 2004-05-24

Abstract

The utility model relates to a semiconductor laser device, comprising a sleeve pipe, a cushion ring, a lens, a ring body, and a base. The cushion ring and the lens are inserted into the sleeve pipe; the base is provided with a wafer, a luminosity detector, and a circuit board connected with guide feet; the wafer and the monitor are respectively connected with the guide feet through a power cord. When the wafer emits the laser, a monitor signal returns to control circuit from the monitor, and the wafer obtains fixed light output power; when the wafer emits the laser, simultaneously, the laser is focused through the lens, and an aperture can be avoided.

Description

Semiconductor laser arrangement

The utility model relates to a kind of semicondcutor laser unit, refers to that especially a kind of the number of components is few, easy to assembly reliably, the halfbody laser aid of less trouble.

A kind of laser aid is arranged at present on the market; it uses mainly as the light source on the laser pen; its structure sees also the assembled sectional view of the existing laser aid of the exploded perspective view of existing laser aid of Figure 1A and Figure 1B; as shown in the figure; such laser aid is mainly by a sealed cap 1; one lens 2; one sleeve 3; one pedestal 4 is formed; this sealed cap 1 inside is one " protruding " shape hollow shape; in can being sticked in for lens 2; the convex surface of lens 2 is towards the place ahead; its terminal outside is provided with threaded portion 11; sleeve 3 is a hollow pipe shape; its front end inside is provided with the spiral shell mosquito portion 31 that can match with spiral shell mosquito portion 11; it is one discoid that pedestal 4 is; its face in sleeve 3 is provided with a wafer 41 and a luminosity monitor 42; pedestal 4 is provided with several outward extending lead foots 43; this lead foot 43 is used for connecting control circuit board 44; each is connected with a lead foot aforementioned wafer 41 by the power line (not shown) with luminosity monitor 42; pedestal 4 is provided with wafer 41 and is provided with a protective cap 45 with luminosity monitor 42; protective cap 45 top center are provided with an eyeglass 46; protective cap 45 and pedestal 4 through process mutual bonding after composite card place sleeve 3 inside; again through aforementioned sealed

cap

1 and 3 threaded portions 11 of sleeve; the distance back is fixed in external point glue between 31 adjustment lens 2 and the pedestal 4; but above-mentioned existing structure and compound mode have following disadvantage:

1. assembly is various, the manufacturing cost height.

2. assembly is many, and assembling is difficult for replacing.

3. lens 2 must be sticked in the sealed cap 1 and closely cooperate, otherwise easily get loose, yet the fragile structure of lens 2 easily breaks because of the application of force is improper.

4. protective cap 45 is tiny with the volume of eyeglass 46, and processing is difficulty very.

5. 4 bonding processing difficulties of protective cap 45 and pedestal, the defect rate height.

6. the user can cause structure to get loose by the sealed cap 1 of external rotating.

7. sealed cap 1 center is first-class footpath straight channel for the passage of lens 2 printing opacities, when laser touches conduit wall through lens 2 produce refraction, very easily produces aperture, and laser effect is reduced.

The purpose of this utility model is to provide a kind of semicondcutor laser unit.

The purpose of this utility model is to realize like this, a kind of semicondcutor laser unit promptly is provided, by a sleeve pipe, one packing ring, one lens, one ring body, one pedestal constitutes, sleeve pipe is a hollow tube, the sleeve pipe front end is one and expands outwardly the cone structure of a suitable angle by tube hub, inside pipe casing in this cone structure back is provided with a lens holding section, earlier packing ring is inserted in regular turn, lens are inserted in the lens holding section again, inside pipe casing behind the lens holding section is provided with a ring body holding section, in the confession ring body is placed in tightly, ring body is with packing ring, lens are pressed in the lens holding section, the internal surface of sleeve pipe end is provided with the threaded portion, the pedestal periphery then is provided with the threaded portion that can cooperate with it, be positioned at inside pipe casing on the pedestal and be provided with a wafer and a luminosity monitor, this wafer places one to be located on the platform also vertical with it on the pedestal, and the luminosity monitor is arranged on the pedestal, wafer and luminosity monitor are mutually 90 degree and are oppositely arranged the position, pedestal is provided with several outward extending lead foots and connects a control circuit board, and each is connected with a lead foot aforementioned wafer with power line with the luminosity monitor.

Advantage of the present utility model is to provide a kind of semicondcutor laser unit, and its member is encapsulated in the same packing, and not only assembling is easy, and wafer and circuit more easily weld, and protectiveness is good; Combination can not damage member with fixing simple and reliable between member; Assembly is simplified, and not only changes easily, and can reduce manufacturing cost; The member handling ease not only saves time, laborsaving, and improves rate of finished products; The sleeve pipe front end is provided with a cone structure, can avoid forming aperture, and laser effect is good.

Below in conjunction with accompanying drawing, describe embodiment of the present utility model in detail, wherein:

Figure 1A is the exploded perspective view of existing laser aid;

Figure 1B is the assembled sectional view of existing laser aid;

Fig. 2 is the exploded perspective view of embodiment of the present utility model;

Fig. 3 A is the assembled sectional view of an embodiment of the present utility model;

Fig. 3 B is the optically focused generalized section of an embodiment of the present utility model;

Fig. 4 A is a cutaway view in the combination of another embodiment of the utility model;

Fig. 4 B is the combination sectional view of another embodiment of the utility model;

Fig. 5 A is another enforcement illustration of control circuit board of the present utility model;

Fig. 5 B is for using the optically focused schematic diagram of the embodiment of circular circuit board among Fig. 4 A;

Fig. 6 A is a cutaway view in the combination of the another embodiment of the utility model;

Fig. 6 B is the combination sectional view of the another embodiment of the utility model.

See also Fig. 2, it is the exploded perspective view of the utility model embodiment, and Fig. 3 A is the assembled sectional view of the utility model one embodiment.

As shown in the figure, the utility model is mainly by a sleeve pipe 5, one packing ring 6, one lens 7, one ring body 8, one pedestal 9 constitutes, sleeve pipe 5 is a hollow tube, its front end is one and expands outwardly the cone structure 51 of a suitable angle by tube hub, be provided with a lens holding section 52 in the sleeve pipe 5 at these cone structure 51 backs, earlier packing ring 6 is inserted in regular turn, again lens 7 are inserted this lens holding section 52, these sleeve pipe 5 inside behind lens holding section 52 are provided with a ring body holding section 53, in confession ring body 8 is placed in tightly, ring body 8 can be with packing ring 6, lens 7 are pressed in the

lens holding section

52,6 on packing ring has the effect of buffering lens 7 pressures, be provided with threaded portion 54 in sleeve pipe 5 inwall ends, pedestal 9 peripheries are provided with the threaded portion 91 that can cooperate with it, two threaded portions 54, distance between integral basis seat 9 and the lens 7 that 91 cooperation is adjustable, and after pedestal 9 is locked on sleeve pipe 5, sealing in both terminal formed grooves 98 again, not only play fixation, with aforementioned 6 two-way cooperations of packing ring, can reach airtight effect, in addition, on pedestal 9, be positioned at sleeve pipe 5 inside and be provided with a wafer 93 and a luminosity monitor 94, as shown in the figure, wafer 93 places one to be arranged on the platform 96 also vertical with it on the pedestal 9, and luminosity monitor 94 is arranged on the pedestal 9, wafer 93 and luminosity monitor 94 are mutually the position that is oppositely arranged of 90 degree, be provided with several outward extending lead foots 92 in pedestal 9, lead foot 92 is (not shown for connecting control circuit board, can be with reference to the circuit board shown in Figure 1A 44), aforementioned wafer 93 respectively is connected with a lead foot 92 with power line 95 with luminosity monitor 94, shown in Fig. 3 B, when wafer 93 sends laser, just monitor signal by luminosity monitor 94 and feedback to control circuit, the optical output power that wafer 93 is fixed, when wafer 93 sends laser, laser just sees through lens 7 and finishes focusing, because sleeve pipe 5 front ends are provided with cone structure 51, so can avoid forming aperture.

See also shown in Fig. 4 A, it is a cutaway view in the combination of another embodiment of the utility model, and Fig. 4 B is the combination sectional view of another embodiment of the utility model.

As shown in the figure, luminosity monitor 94 is arranged on the

platform

96,93 of wafers are arranged on the luminosity monitor 94, are not limited to the set-up mode of the relative position of aforementioned one-tenth 90 degree.

See also Fig. 5 A, it is another enforcement illustration of the utility model control circuit, and Fig. 5 B is for using the embodiment optically focused schematic diagram of circular circuit board among Fig. 4 A.

Shown in Fig. 5 A, circular circuit board 55 is provided with several holes 551 and wears and weld for lead foot 92, this circle circuit board 55 is sticked in sleeve pipe 5 ends, between itself and the sleeve pipe 5 with a glue or riveted mode fixed processing, because circular circuit board 55 is combined as a whole with sleeve pipe 5, lead foot 92 length can shorten dramatically, and can avoid lead foot 92 bendings, fracture, or circuit board damage, the setting of this circular circuit board 55 is not only applicable to Fig. 3 A illustrated embodiment (its assembled sectional view is shown in Fig. 5 B), equally is applicable to the embodiment shown in Fig. 4 A yet.

See also Fig. 6 A, it is a cutaway view in the combination of the another embodiment of the utility model, and Fig. 6 B is the combination sectional view of the another embodiment of the utility model.

As shown in the figure, luminosity monitor 94 is placed in the semiconductor 97,93 front ends that place semiconductor 97 of wafer, promptly replace aforementioned platform 96 and circuit board with semiconductor 97, so design both can be saved material, reduced volume, simultaneously can reduce the lead foot number, the lead foot 99 that only need stay energized gets final product, and wafer 93, luminosity monitor 94 not only can be arranged at (shown in Fig. 6 A, 6B) on the same plane, also can be arranged to the relative positions that are mutually 90 degree as shown in Figure 3A simultaneously.

Claims

1, a kind of semicondcutor laser unit, by a sleeve pipe, one packing ring, one lens, one ring body, one pedestal constitutes, sleeve pipe is a hollow tube, it is characterized in that the sleeve pipe front end is one and expands outwardly the cone structure of a suitable angle by tube hub, inside pipe casing in this cone structure back is provided with a lens holding section, earlier packing ring is inserted in regular turn, lens are inserted in the lens holding section again, inside pipe casing behind the lens holding section is provided with a ring body holding section, in the confession ring body is placed in tightly, ring body is with packing ring, lens are pressed in the lens holding section, the internal surface of sleeve pipe end is provided with the threaded portion, the pedestal periphery then is provided with the threaded portion that can cooperate with it, be positioned at inside pipe casing on the pedestal and be provided with a wafer and a luminosity monitor, this wafer places one to be located on the platform also vertical with it on the pedestal, and the luminosity monitor is arranged on the pedestal, wafer and luminosity monitor are mutually 90 degree and are oppositely arranged the position, pedestal is provided with several outward extending lead foots and connects a control circuit board, and each is connected with a lead foot aforementioned wafer with power line with the luminosity monitor.

2, semicondcutor laser unit as claimed in claim 1 is characterized in that, the luminosity monitor is arranged on the platform, and wafer is arranged on the luminosity monitor.

3, semicondcutor laser unit as claimed in claim 1 is characterized in that, control circuit board is rounded, which is provided with several holes, and circular circuit board engages in tube ends.

4, semicondcutor laser unit as claimed in claim 3 is characterized in that, the luminosity monitor is arranged on the platform, and wafer is arranged on the luminosity prison device.

5, semicondcutor laser unit as claimed in claim 1 is characterized in that, platform and control circuit board also can be semiconductor.

6, semicondcutor laser unit as claimed in claim 5 is characterized in that, the luminosity monitor is arranged in the semiconductor, and wafer is arranged at semi-conductive front portion.

7, semicondcutor laser unit as claimed in claim 1 is characterized in that, pedestal is locked on sleeve pipe, and for formed groove injecting glue sealing between both ends.