CN218812197U - A stores pylon mechanism for electroplating of IC support plate - Google Patents

Abstract

The utility model discloses a stores pylon mechanism for electroplating of IC support plate, including link plate, support frame, adjusting screw, regulating plate and clamping unit, the support frame can be dismantled and connect in the link plate, the support frame is connected with the movable plate, the movable plate is equipped with the shifting chute, adjusting screw includes the linkage segment, locates the first screw thread section and the second screw thread section at linkage segment both ends respectively, the linkage segment rotates to be connected in the support frame, first screw thread section and second screw thread section are reverse screw thread, the regulating plate is equipped with two, two regulating plates respectively with first screw thread section and second screw thread section threaded connection, clamping unit includes two clamp arms, two clamp arms connect respectively in a movable plate, and every clamp arm all is connected with a plurality of compressing tightly pieces. The utility model discloses a set up a plurality of pieces that compress tightly, can compress tightly the both sides of IC support plate for the connection of IC support plate is more stable, takes place to drop when avoiding electroplating.

Description

A stores pylon mechanism for IC support plate is electroplated

Technical Field

The utility model belongs to IC support plate processing field, concretely relates to stores pylon mechanism for electroplating of IC support plate.

Background

The IC carrier can be called a printed circuit board or a printed circuit board, and is a flexible printed circuit board with high reliability and excellent performance, which is made of polyimide or polyester film as a base material.

In the process of manufacturing an IC carrier, the IC carrier is often required to be electroplated. When an IC carrier is electroplated, the IC carrier is generally mounted on an electroplating rack and then placed in an electroplating solution (electroplating solution) for electroplating.

The existing IC carrier plate hanging rack can only vertically hang an IC carrier plate for electroplating, and for a larger IC carrier plate, the ion concentration is different along with the different depths of electroplating liquid, so that the thickness of an electroplated product is not uniform.

SUMMERY OF THE UTILITY MODEL

The utility model aims to provide a stores pylon mechanism for IC support plate is electroplated through the adjustment to stores pylon mechanism for stores pylon mechanism can electroplate more evenly with the horizontal clamping of IC support plate.

In order to solve the above problems existing in the prior art, the utility model discloses the technical scheme who adopts is:

a hanging frame mechanism for electroplating an IC carrier plate comprises a hanging plate, a supporting frame, an adjusting screw rod, an adjusting plate and a clamping assembly.

The support frame can be dismantled and connect in the link plate, the support frame is connected with the movable plate, the movable plate is equipped with the shifting chute.

The adjusting screw comprises a connecting section, a first thread section and a second thread section, wherein the first thread section and the second thread section are respectively arranged at two ends of the connecting section, the connecting section is rotatably connected to the support frame, and the first thread section and the second thread section are reverse threads.

The adjusting plates are two and are in threaded connection with the first threaded section and the second threaded section respectively.

The clamping assembly comprises two clamping arms, the two clamping arms are connected to the moving plate, and each clamping arm is connected with a plurality of pressing pieces.

Through setting up a plurality of compressing tightly pieces, can compress tightly the both sides of IC support plate for the connection of IC support plate is more stable, takes place to drop when avoiding electroplating.

Because the plating layer is even in thickness in the electroplating process, the solution needs to be stirred, and the IC carrier plate can not fall off in the process of stirring the solution by arranging the pressing piece.

Further, the link plate is equipped with installation department and connecting portion, the installation department is used for joint support frame, connecting portion are used for connecting adjusting screw, the installation department is equipped with centre bore, horizontal hole and vertical hole, the axis of centre bore and the axis of horizontal hole are located same horizontal plane, and the axis of centre bore is located same vertical plane with the axis of vertical hole, the support frame is equipped with two connecting holes, and one of them connecting hole is connected with the centre bore, and another connecting hole is connected with horizontal hole or vertical hole, is connected with the support frame through setting up the installation department, through selecting different installation hole sites, can satisfy different user demands, and during electroplating, the connecting hole is connected with the horizontal hole, electroplates the horizontal clamping of IC carrier plate, and after the use is accomplished, when needing to wash the plating solution mechanism, the connecting hole is connected with vertical hole for the shifting chute is down, and the clamp arm also is vertical state simultaneously, conveniently discharges the hydrops in shifting chute and the clamp chute, the movable plate is connected in the lower part of support frame, the link plate is connected in the upper portion of support frame, connects the both ends of movable plate and link plate respectively in the support frame, and when electroplating, the link plate can not deepen deep into, the life of link plate, extension link plate.

Further, adjusting screw still includes twist grip, twist grip is equipped with two, two twist grip connect respectively in first screw thread section and second screw thread section, through setting up twist grip, make adjusting screw's rotation more convenient, twist grip and adjusting screw can be dismantled and be connected, also can be fixed, if be fixed connection, need pass connecting portion and regulating plate earlier with adjusting screw and then be connected twist grip and adjusting screw, adjusting screw can be connected through the bearing with connecting portion, make things convenient for adjusting screw's rotation, because adjusting screw includes two sections reverse screw threads, consequently when adjusting screw rotates, the regulating plate of connecting in two sections reverse screw threads can remove along opposite direction, be close to each other simultaneously or keep away from each other simultaneously, thereby can adjust the interval of two clamp arms of the same group, and then can adapt to the not IC support plate of equidimension, press from both sides tightly the back, through the auto-lock of screw thread, can avoid clamping arm's not hard up.

Further, press from both sides the arm including removal portion and clamping part, removal portion locates in the shifting chute, slides along the shifting chute, clamping part is equipped with the tight groove of clamp, the tight groove of clamp is used for the clamping IC support plate, because shifting chute and tight groove of clamp have hydrops relatively easily, can rotate through adjusting it for the hydrops in shifting chute and the tight groove of clamp can in time discharge, clamping part is connected with a plurality of pieces that compress tightly, during the use, compresses tightly the IC support plate in the tight groove of clamp through compressing tightly the piece, compresses tightly the piece through setting up, during the connection, makes the both sides edge of IC support plate all block in pressing from both sides tight inslot, then compresses tightly the IC support plate through compressing tightly the piece, can not only guarantee the plane degree of clamping, still makes the stability of clamping better.

Further, the adjusting plate is connected to the outer side of the clamping arm, and the clamping groove is located on the inner side of the clamping arm. The outer side of the clamping arm is one side where the two clamping arms are far away from each other, the inner side of the clamping arm is one side where the two clamping arms are close to each other, the pressing piece comprises a screw rod, the end portion of the screw rod is connected with a pressing piece, the screw rod is in threaded connection with the clamping arms, the contact area between the pressing piece and the IC carrier plate is increased through the pressing piece, the pressing effect is better, the pressing piece can be connected in a threaded mode, and other modes can be adopted as long as enough pressure can be provided to press the IC carrier plate.

The utility model has the advantages that: through setting up a plurality of compressing tightly pieces, not only change the vertical electroplating of original into horizontal electroplating, make the connection of IC carrier plate more stable moreover, take place to drop when avoiding electroplating.

Drawings

Fig. 1 is a schematic structural diagram of the present invention.

Fig. 2 is a partially enlarged view of a portion a in fig. 1.

Fig. 3 is a front view of the present invention.

Fig. 4 is a schematic structural view of the supporting frame in fig. 3.

Fig. 5 is a schematic structural view of the middle adjusting screw of the present invention.

1-hanging a plate; 11-a mounting portion; 111-a central hole; 112-horizontal hole; 113-vertical holes; 12-a connecting part; 2-a support frame; 3-adjusting the screw rod; 31-a first thread segment; 32-a connecting segment; 33-a second thread segment; 34-a turning handle; 4-adjusting plate; 5-a clamping arm; 51-a clamping groove; 6, moving a board; 7-a pressing member.

Detailed Description

The present invention will be further explained with reference to the accompanying drawings and reference numerals.

In order to make the aforementioned objects, features and advantages of the present invention more clearly understood, the present invention will be described in detail with reference to the accompanying drawings and specific embodiments. It should be noted that the embodiments and features of the embodiments of the present application may be combined with each other without conflict.

The terms "first," "second," "third," and the like are used solely to distinguish one from another and are not to be construed as indicating or implying relative importance.

In the description of the present invention, it should also be noted that, unless otherwise explicitly specified or limited, the terms "disposed," "mounted," "connected," and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.

The following detailed description of the embodiments of the present invention will be made with reference to the accompanying drawings. It is to be understood that the description of the embodiments herein is for purposes of illustration and explanation only and is not intended to limit the invention.

Example 1:

as shown in fig. 1, 2 and 5, a rack mechanism for electroplating an IC carrier comprises a hanging plate 1, a supporting frame 2, an adjusting screw 3, an adjusting plate 4 and a clamping assembly.

The support frame 2 is detachably connected to the hanging plate 1, the support frame 2 is connected with a moving plate 6, and the moving plate 6 is provided with a moving groove.

The adjusting screw rod 3 comprises a connecting section 32, and a first thread section 31 and a second thread section 33 which are respectively arranged at two ends of the connecting section 32, wherein the connecting section 32 is rotatably connected to the support frame 2, and the first thread section 31 and the second thread section 33 are reverse threads.

The number of the adjusting plates 4 is two, and the two adjusting plates 4 are respectively in threaded connection with the first threaded section 31 and the second threaded section 33.

The clamping assembly comprises two clamping arms 5, the two clamping arms are connected to a moving plate 6, and each clamping arm 5 is connected with a plurality of pressing pieces 7.

Through setting up a plurality of compressing tightly pieces 7, can compress tightly the both sides of IC carrier plate for the connection of IC carrier plate is more stable, takes place to drop when avoiding electroplating.

Because the plating layer is even in thickness in the electroplating process, the solution needs to be stirred, and the IC carrier plate can not fall off in the process of stirring the solution by arranging the pressing piece 7.

Example 2:

on the basis of embodiment 1, as shown in fig. 3 and 4, the hanging plate 1 is provided with an installation part 11 and a connection part 12, the installation part 11 is used for connecting the support frame 2, and the connection part 12 is used for connecting the adjusting screw rod 3.

The mounting portion 11 is provided with a central hole 111, a horizontal hole 112 and a vertical hole 113, wherein the axis of the central hole 111 and the axis of the horizontal hole 112 are located in the same horizontal plane, and the axis of the central hole 111 and the axis of the vertical hole 113 are located in the same vertical plane.

The support frame 2 is provided with two connecting holes, one of which is connected with the central hole 111, and the other is connected with the horizontal hole 112 or the vertical hole 113.

Through setting up installation department 11 and being connected with support frame 2, through selecting different installation hole site (horizontal hole 112 or vertical hole 113), can satisfy different user demands, during the electroplating, the connecting hole is connected with the horizontal hole, electroplate the horizontal clamping of IC carrier plate, after the use is accomplished, when needing to wash stores pylon mechanism, connecting hole and vertical jogged joint for the shifting chute is down, presss from both sides tight arm 5 simultaneously and also is vertical state, the hydrops in convenient discharge shifting chute and the clamping groove 51.

The movable plate 6 is connected to the lower portion of the support frame 2, the hanging plate 1 is connected to the upper portion of the support frame 2, the movable plate 6 and the hanging plate 1 are respectively connected to two ends of the support frame 2, the hanging plate 1 cannot penetrate into electroplating liquid during electroplating, and the service life of the hanging plate 1 is prolonged.

During installation, the hanging plate 1 is connected with the support frame 2 through bolts, when the IC carrier plate is required to be in a horizontal state, the central hole 111 and the horizontal hole 112 are respectively connected with the two connecting holes through bolts, the clamping arm 5 and the hanging plate 1 are in a spatial vertical relation at the moment, namely, when the hanging plate 1 is in a vertical state, the clamping arm 5 is in a horizontal state, and at the moment, the IC carrier plate is also in a horizontal state during electroplating.

Example 3:

on the basis of the embodiment 2, the adjusting screw 3 further comprises two rotating handles 34, and the two rotating handles 34 are respectively connected to the first threaded section 31 and the second threaded section 33.

Through setting up twist grip 34 for adjusting screw 3's rotation is more convenient, and twist grip 34 can be dismantled with adjusting screw 3 and be connected, also can be fixed, if fixed connection, needs to be connected twist grip 34 with adjusting screw 34 after passing connecting portion 12 and regulating plate 4 earlier.

Adjusting screw 3 and connecting portion 12 can be connected through the bearing, make things convenient for adjusting screw's rotation, because adjusting screw 3 includes two sections reverse screw threads, consequently when adjusting screw 3 rotates, connect in two sections reverse screw thread adjusting plate 4 can remove along opposite direction, be close to each other simultaneously or keep away from each other simultaneously, thereby can adjust the interval of two tight arms 5 of clamp of the same group, and then can adapt to the not IC support plate of equidimension, press from both sides tightly the back, through the auto-lock of screw thread, can avoid pressing from both sides the not hard up of tight arm 5.

Example 4:

on the basis of embodiment 3, the clamping arm 5 includes a moving portion and a clamping portion, the moving portion is disposed in the moving slot and slides along the moving slot, the clamping portion is provided with a clamping slot 51, the clamping slot 51 is used for clamping the IC carrier, and since the moving slot and the clamping slot 51 are relatively easy to have effusion, the effusion in the moving slot and the clamping slot 51 can be timely discharged by adjusting the effusion.

The clamping part is connected with a plurality of pressing pieces 7, and when in use, the IC carrier plate is pressed in the clamping groove 51 through the pressing pieces 7.

Through setting up compressing tightly 7, during the connection, make the both sides edge of IC support plate all block in pressing from both sides tight groove 51, then compress tightly the IC support plate through compressing tightly 7, can not only guarantee the plane degree of clamping, still make the stability of clamping better.

The adjustment plate 4 is attached to the outer side of the clamp arm 5 and the clamp groove 51 is located on the inner side of the clamp arm 5. The outer side here refers to the side of the two clamping arms 5 facing away from each other, and the inner side here refers to the side of the two clamping arms 5 facing towards each other.

The pressing piece 7 comprises a screw rod, the end part of the screw rod is connected with a pressing piece, and the contact area between the pressing piece 7 and the IC carrier plate is increased by arranging the pressing piece, so that the pressing effect is better.

The pressing member 7 may be connected by a screw, or may be connected by other methods as long as it can provide enough pressure to press the IC carrier.

The specific working principle is as follows:

during installation, the adjusting screw 3 is rotated firstly, the two clamping arms 5 are driven to approach to each other to a certain distance through the adjusting plate 4, then the IC carrier plate is placed on the clamping grooves 51 of the two clamping arms 5, and then the two sides of the IC carrier plate are pressed in the clamping grooves 51 by the pressing piece 7, so that the IC carrier plate is installed.

When the IC carrier plate electroplating device is used, the lifting control hanging frame mechanism of the lifting appliance descends, the IC carrier plate is immersed into electroplating liquid for electroplating, after the electroplating is finished, the hanging frame mechanism is lifted, then the pressing piece 7 is loosened, and the IC carrier plate is taken down.

During cleaning, the hanger mechanism is put down for cleaning through the lifting appliance, and then the mounting hole position is adjusted, so that the moving groove faces downwards, the opening end of the clamping groove 51 faces downwards vertically, and accumulated water is conveniently discharged.

The present invention is not limited to the above-mentioned optional embodiments, and any other products in various forms can be obtained by anyone under the teaching of the present invention, and any changes in the shape or structure thereof, all the technical solutions falling within the scope of the present invention, are within the protection scope of the present invention.

Claims (9)

1. The utility model provides a stores pylon mechanism for electroplating of IC support plate which characterized in that: comprises a hanging plate (1), a supporting frame (2), an adjusting screw rod (3), an adjusting plate (4) and a clamping assembly;

the support frame (2) is detachably connected to the hanging plate (1), the support frame (2) is connected with a moving plate (6), and the moving plate (6) is provided with a moving groove;

the adjusting screw rod (3) comprises a connecting section (32), and a first thread section (31) and a second thread section (33) which are respectively arranged at two ends of the connecting section (32), the connecting section (32) is rotatably connected to the support frame (2), and the first thread section (31) and the second thread section (33) are reverse threads;

the two adjusting plates (4) are respectively in threaded connection with the first threaded section (31) and the second threaded section (33);

the clamping assembly comprises two clamping arms (5), the two clamping arms are connected to the moving plate (6), and each clamping arm (5) is connected with a plurality of pressing pieces (7).

2. The rack mechanism of claim 1, wherein: the hanging plate (1) is provided with an installation part (11) and a connecting part (12), the installation part (11) is used for connecting the supporting frame (2), and the connecting part (12) is used for connecting the adjusting screw rod (3).

3. The rack mechanism of claim 2, wherein: the installation portion (11) is provided with a center hole (111), a horizontal hole (112) and a vertical hole (113), the axis of the center hole (111) and the axis of the horizontal hole (112) are located in the same horizontal plane, and the axis of the center hole (111) and the axis of the vertical hole (113) are located in the same vertical plane.

4. The rack mechanism of claim 3, wherein: the support frame (2) is provided with two connecting holes, wherein one connecting hole is connected with the central hole (111), and the other connecting hole is connected with the horizontal hole (112) or the vertical hole (113).

5. The rack mechanism of claim 1, wherein: adjusting screw (3) still include twist grip (34), twist grip (34) are equipped with two, and two twist grip (34) are connected respectively in first screw thread section (31) and second screw thread section (33).

6. The rack mechanism of claim 1, wherein: the clamping arm (5) comprises a moving part and a clamping part, the moving part is arranged in the moving groove, and the clamping part is provided with a clamping groove (51).

7. The rack mechanism of claim 6, wherein: the clamping part is connected with a plurality of pressing pieces (7).

8. The hanging rack mechanism for electroplating an IC carrier according to claim 6, wherein: the adjusting plate (4) is connected to the outer side of the clamping arm (5), and the clamping groove (51) is located on the inner side of the clamping arm (5).

9. The hanging rack mechanism for IC carrier plating according to claim 1, wherein: the pressing piece (7) comprises a screw rod, the screw rod is in threaded connection with the clamping arm (5), and the end part of the screw rod is connected with a pressing piece.

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