CN218812164U

CN218812164U - Wafer pretreatment spraying system

Info

Publication number: CN218812164U
Application number: CN202223183330.8U
Authority: CN
Inventors: 李云华; 黄雷
Original assignee: Jiangsu Sizhi Semiconductor Technology Co ltd
Current assignee: Jiangsu Sizhi Semiconductor Technology Co ltd
Priority date: 2022-11-30
Filing date: 2022-11-30
Publication date: 2023-04-07
Anticipated expiration: 2032-11-30

Abstract

The utility model discloses a wafer pretreatment spraying system, which comprises a wafer pretreatment spraying system, the device comprises an NPP main tank, an NPP auxiliary tank, a spray head fixing frame, a fan-shaped spray nozzle, a circulating pump and a swing mechanism; an internal main pipeline and branch pipelines are arranged in the nozzle fixing frame; the inner main pipeline is connected with the main liquid supply pipeline through a connecting pipe; the main liquid supply pipeline is connected with the NPP auxiliary tank through a circulating pump; branch pipeline is provided with a nozzle mounting interface; the fan-shaped nozzle is arranged on the spray head fixing frame through the nozzle mounting interface; a plurality of rows of fan-shaped nozzles are arranged on the nozzle fixing frame, the fan-shaped nozzles in two adjacent rows are arranged on the spray head fixing frame in a crossed and staggered manner; the spray head fixing frame is connected with the swinging mechanism, the swinging of the swing mechanism is controlled. The utility model discloses a fan-shaped nozzle, alternately dislocation installation, cooperation wabbler mechanism swing back and forth makes the water smoke that acts on the wafer surface more even.

Description

Wafer pretreatment spraying system

Technical Field

The utility model relates to a wafer electroplating equipment technical field, concretely relates to wafer pretreatment spraying system.

Background

At present directly need spray to the wafer before the electroplating process to the wafer, prior art's spray set is mostly fixed structure, appears the work piece very easily when actually spraying and sprays inhomogeneous problem, leads to it to spray the effect relatively poor, can influence electroplating effect.

SUMMERY OF THE UTILITY MODEL

The to-be-solved technical problem of the utility model is to provide a wafer pretreatment spraying system improves the work piece and sprays the homogeneity.

In order to solve the technical problem, the utility model discloses take following technical scheme: a wafer pretreatment spraying system comprises an NPP main tank, an NPP auxiliary tank, a spray head fixing frame, a fan-shaped spray nozzle, a circulating pump and a swing mechanism;

is provided with a nozzle fixing frame an internal main and branch line; the inner main pipeline is connected with the main liquid supply pipeline through a connecting pipe; the main liquid supply pipeline is connected with the NPP auxiliary tank through a circulating pump; the branch pipeline is provided with a nozzle mounting interface; the fan-shaped nozzle is arranged on the spray head fixing frame through the nozzle mounting interface;

a plurality of rows of fan-shaped nozzles are arranged on the spray head fixing frame, and the fan-shaped nozzles in two adjacent rows are arranged on the spray head fixing frame in a crossed and staggered manner;

the nozzle fixing frame is connected with the swing mechanism, and the swing mechanism controls the swing of the nozzle fixing frame.

Furthermore, a hanger rack is arranged at the front end of the spray head fixing rack; the hanger frame comprises vertical plates on two sides, and sliding grooves are formed in two sides of each vertical plate; the movable support is connected with the sliding groove in a sliding way; the bottoms of the two movable supports are connected through a jacking plate; two ends of the jacking plate are connected with the bottom of the NPP main groove through a return spring; and a cam mechanism is arranged at the bottom of the NPP main groove.

Furthermore, a positioning slot is arranged on the inner side of the movable support.

Further, a guide groove is formed in the bottom of the NPP main groove; the lower end of the spray head fixing frame is connected with the guide groove in a sliding mode.

Further, a liquid outlet is formed in the bottom of the NPP main tank; the liquid outlet is connected with the filter through a circulating pipeline and a circulating pump II; the filter is connected with a circulating inlet on the NPP auxiliary tank through a circulating pipeline.

Further, the circulating pump is a high-pressure circulating pump.

Furthermore, the swing mechanism is a variable frequency swing mechanism.

The utility model has the advantages that:

1) The utility model discloses a NPP owner groove and NPP auxiliary tank, the welding is more firm, and life is longer.

2) The utility model discloses a nozzle adopts fan-shaped nozzle, and the installation adopts alternately dislocation installation, and cooperation wabbler mechanism swing back and forth makes the water smoke that acts on the wafer surface more even.

3) The utility model discloses wabbler mechanism adopts variable frequency wabbler mechanism, satisfies and decides frequently and the different technology demands of frequency conversion, uses more in a flexible way, and the function is abundanter.

4) The utility model discloses the circulating pump adopts high-pressure circulating pump, and adjustable circulation sprays pressure, satisfies different technology demands, and reaching that can be better is moist, and is clean, the purpose on interlock erosion wafer surface.

Drawings

The present invention will be further explained with reference to the drawings and examples.

Fig. 1 is a schematic structural diagram of embodiment 1 of the present invention.

FIG. 2 is a schematic view of the internal piping of the showerhead holder.

Fig. 3 is a schematic structural view of embodiment 2.

Fig. 4 is a schematic structural view of embodiment 3.

Detailed Description

The technical solution of the present invention will be described clearly and completely through the following detailed description.

Example 1

Referring to fig. 1 and fig. 2, a wafer pretreatment spraying system according to the present embodiment includes an NPP main tank 1, an NPP sub-tank 2, a nozzle fixing frame 3, a fan-shaped nozzle 4, a circulating pump 5, and a swing mechanism 6; the spray head fixing frame 3 and the fan-shaped nozzle 4 are arranged in the NPP main tank 1, the NPP auxiliary tank 2 is internally provided with spraying liquid medicine, and the spray head fixing frame 3 is connected with the swing mechanism 6 and is controlled to swing by the swing mechanism 6.

In the present embodiment, an internal main line 31 and a branch line 32 are provided in the head holder 3; the inner main pipeline 31 is connected with the main liquid supply pipeline 10 through a connecting pipe 33; the main liquid supply pipeline 10 is connected with the NPP auxiliary tank 2 through a circulating pump 5; the branch pipeline 32 is provided with a nozzle mounting interface; the fan-shaped nozzle 4 is arranged on the spray head fixing frame 3 through a nozzle mounting interface; the nozzle fixing frame 3 is provided with a plurality of rows of fan-shaped nozzles 4, and the fan-shaped nozzles 4 in two adjacent rows are arranged on the nozzle fixing frame 3 in a staggered mode.

The bottom of the NPP main groove 1 is provided with a guide groove 11; the lower end of the nozzle fixing frame 3 is connected with the guide groove 11 in a sliding way. In the process of controlling the spray head fixing frame 3 to swing by the swing mechanism 6, the spray head fixing frame 3 moves along the guide groove 11, and the swinging in the swinging process is avoided.

The wafer is placed in the NPP main tank 1 through a hanger, the liquid medicine in the NPP auxiliary tank 2 is pumped to the liquid supply main pipeline 10 by using a circulating pump, the liquid medicine reaches the fan-shaped nozzles 4 through the branch pipelines 32 in the nozzle fixing frame 3 and is sprayed out from the fan-shaped nozzles 4 at high pressure, and the water mist uniformly acts on the surface of the wafer to achieve the purposes of wetting, cleaning and biting the surface of the wafer.

The fan-shaped nozzles are adopted, the installation is carried out in a cross and staggered mode, and the swinging mechanism is matched to swing back and forth, so that the water mist acting on the surface of the wafer is more uniform.

The circulating pump adopts a high-pressure circulating pump, can adjust circulating spray pressure, meets different process requirements, and can better achieve the purposes of moistening, cleaning and biting the surface of the wafer.

The swing mechanism 6 in this embodiment includes a guide base 61, a guide rod 62, a guide rod fixing base 63, a guide rail 64, a connecting rod 65, an eccentric wheel 66 and a variable frequency motor 67; variable frequency motor 67 drive eccentric wheel 66 rotates, the last pivot of installing of eccentric wheel 66, the one end and the pivot of connecting rod 65 rotate to be connected, the other end rotates through pivot and guide arm fixing base 63 to be connected, fixed mounting guide arm 62 on the guide arm fixing base 63, the guide arm cooperates with guide holder 61, guide holder 61 is fixed in NPP owner groove 1 both sides, guide arm fixing base 63 both sides set up guide rail 64, along guide rail 64 activity, 3 fixed mounting of shower nozzle mount are on guide arm 62, therefore, the swing of 6 control shower nozzle mount 3 of wabbler mechanism, do directional movement on the horizontal direction, can let the contact of work piece and liquid medicine maximize.

Example 2

As shown in fig. 3, in the present embodiment, a rack is disposed at the front end of the nozzle holder 3; the hanger frame comprises vertical plates 71 on two sides, and sliding grooves are formed in two sides of each vertical plate 71; the movable bracket 72 is connected with the sliding groove in a sliding way; the movable support 72 is arranged on two sides, the inner side of the movable support 72 is provided with a positioning slot, and two sides of the hanger are inserted into the positioning slot. The bottoms are connected by a jacking plate 73; two ends of the jacking plate 73 are connected with the bottom of the NPP main groove 1 through a return spring 74; the bottom of the NPP main tank 1 is provided with a cam mechanism 75. The cam mechanism comprises a servo motor, the servo motor drives a cam to rotate, the cam rotates to push the jacking plate 73 upwards, the cam continues to rotate, the jacking plate 73 falls back, the reciprocating operation is carried out, and in the spraying process, the hanger frame longitudinally reciprocates to further enable the workpiece to be in maximum contact with the liquid medicine.

Example 3

As shown in fig. 4, the bottom of NPP main tank 1 in the present embodiment is provided with drain port 12; the liquid outlet 12 is connected with the filter 15 through a circulating pipeline 13 and a circulating pump II 14; the filter 15 is connected to the circulation inlet of the NPP sub-tank 2 via a circulation line 13. In the embodiment, the liquid medicine is sprayed from the nozzle, uniformly acts on the surface of the wafer and then enters the NPP main tank 1, and the liquid medicine in the NPP main tank 1 is recycled by the second circulating pump 14, filtered and pumped into the NPP auxiliary tank 2 for recycling.

The above description is only a preferred embodiment of the present invention, and is not intended to limit the present invention, and those skilled in the art can make various modifications or equivalent substitutions within the spirit and scope of the present invention, and such modifications or equivalent substitutions should also be considered as falling within the scope of the present invention.

Claims

1. Wafer pretreatment spraying system, its characterized in that: comprises an NPP main tank (1), an NPP auxiliary tank (2), a spray head fixing frame (3), a fan-shaped spray nozzle (4), a circulating pump (5) and a swinging mechanism (6);

an internal main pipeline (31) and a branch pipeline (32) are arranged in the nozzle fixing frame (3); the inner main pipeline (31) is connected with the main liquid supply pipeline (10) through a connecting pipe (33); the main liquid supply pipeline (10) is connected with the NPP auxiliary tank (2) through a circulating pump (5); the branch pipeline (32) is provided with a nozzle mounting interface; the fan-shaped nozzle (4) is arranged on the spray head fixing frame (3) through a nozzle mounting interface;

the spray head fixing frame (3) is provided with a plurality of rows of fan-shaped nozzles (4), and the fan-shaped nozzles (4) in two adjacent rows are arranged on the spray head fixing frame (3) in a crossed and staggered manner;

the spray head fixing frame (3) is connected with the swing mechanism (6) and is controlled to swing by the swing mechanism (6).

2. The wafer pretreatment spray system of claim 1, wherein: the front end of the spray head fixing frame (3) is provided with a hanger frame; the hanger frame comprises vertical plates (71) on two sides, and sliding grooves are formed in two sides of each vertical plate (71); the movable bracket (72) is connected with the sliding groove in a sliding way; the bottoms of the two side movable brackets (72) are connected through a jacking plate (73); two ends of the jacking plate (73) are connected with the bottom of the NPP main groove (1) through a return spring (74); the bottom of the NPP main groove (1) is provided with a cam mechanism (75).

3. The wafer pretreatment spray system of claim 2, wherein: the inner side of the movable support (72) is provided with a positioning slot.

4. The wafer pretreatment spray system of claim 1, wherein: the bottom of the NPP main groove (1) is provided with a guide groove (11); the lower end of the spray head fixing frame (3) is connected with the guide groove (11) in a sliding mode.

5. The wafer pretreatment spray system of claim 1, wherein: a liquid discharge port (12) is formed in the bottom of the NPP main tank (1); the liquid outlet (12) is connected with a filter (15) through a circulating pipeline (13) and a circulating pump II (14); the filter (15) is connected with a circulating inlet on the NPP auxiliary tank (2) through a circulating pipeline (13).

6. The wafer pretreatment spray system of claim 1, wherein: the circulating pump (5) is a high-pressure circulating pump.

7. The wafer pretreatment spray system of claim 1, wherein: the swing mechanism is a variable frequency swing mechanism.