CN218804432U - Flexible high-heat-conductivity refrigerating cooling mat - Google Patents
Flexible high-heat-conductivity refrigerating cooling mat Download PDFInfo
- Publication number
- CN218804432U CN218804432U CN202221431736.0U CN202221431736U CN218804432U CN 218804432 U CN218804432 U CN 218804432U CN 202221431736 U CN202221431736 U CN 202221431736U CN 218804432 U CN218804432 U CN 218804432U
- Authority
- CN
- China
- Prior art keywords
- heat
- flexible
- adhesive
- layer
- cooling mat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The utility model belongs to the cool pad field, concretely relates to flexible high heat conduction refrigeration cool pad. The cooling mat comprises a flexible bending-resistant high-heat-dissipation composite fabric, an adhesive layer, a semiconductor refrigeration sheet and a heat dissipation assembly thereof, and a high-efficiency heat transfer element. One end of the high-efficiency heat transfer element is bonded with one surface of the flexible bending-resistant high-heat-dissipation composite fabric through the adhesive layer, the other end of the high-efficiency heat transfer element is bonded with the semiconductor refrigeration sheet through the adhesive layer, the other surface of the semiconductor refrigeration sheet is bonded with one surface of the radiator through the adhesive layer, and the other surface of the radiator is mechanically connected with the fan, so that the flexible high-heat-conduction refrigeration cooling mat is obtained. The utility model discloses a cold pad of flexible high heat conduction refrigeration not only possesses good heat conductivility but also has fine flexibility. The cooling mat has the advantages of simple production process, energy conservation, environmental protection, strong applicability and large-scale production.
Description
Technical Field
The utility model relates to a cool pad field, in particular to flexible high heat conduction refrigeration cool pad.
Background
With the rapid development of social science and technology, more scenes are needed for people to sit in a closed environment for a long time. Particularly in summer, the buttocks and the back of a person are in contact with the seat for a long time, air cannot flow through the contact surface, and the temperature of the cushion and the backrest is sharply increased, so that the skin of the person feels stuffy and hard to endure. Skin diseases such as pressure sores and eczema can also occur after long-term sitting, and diseases such as poor blood circulation of lower limbs, cervical spondylosis, cardiovascular and cerebrovascular hidden troubles and the like can also occur seriously. The current commonly used flexible materials comprise bamboo, hemp, grass, leather, plastics and the like, and the materials have very small heat conductivity coefficient which is basically between 0.05 and 0.5W/m.K, poor heat conductivity and poor air permeability. In order to relieve the rapid rise of the temperature of the cushion and the backrest after sedentary sitting, people usually choose to reduce the temperature of the air conditioner, so that the waste of energy is increased, and therefore a high-thermal-conductivity flexible material is required to respond to the call of energy conservation and emission reduction in China.
In the current market, partial products radiate heat through a low specific heat capacity material and a phase change material, and the contact area of the low specific heat capacity material and a human body can quickly reach the temperature of the surface of the human body, so that people can not feel cool. The phase-change material has the defects of small heat conductivity coefficient, small density and small heat storage capacity per unit volume. And the phase-change material needs to use a sealed container in the using process due to solid-liquid transformation or sublimation (polyalcohol) and the like, so that not only is the heat transfer resistance increased, but also the cost of the phase-change heat absorption device is greatly increased.
Typically, the average designer attempts to add a ventilation function to the seat to address the above-mentioned problems. The fan is arranged in the seat to enable air to flow upwards from the lower part of the cushion to increase the air circulation between the buttocks and the cushion, so that the problem of damp and hot for long-time sitting at high temperature is solved. A utility model patent (CN 215398317U) entitled "a ventilated cushion" discloses "a ventilated cushion, the cushion body comprises a cushion surface layer, an air bag layer, a comfortable layer and a cushion bottom layer which are sequentially arranged; the power assembly initiates the infusion of air into the comfort layer and the exit of air from all directions of the comfort layer. The ventilation cushion with the structure can achieve the effect that the air outlet at each position of the cushion is uniform when no person sits on the cushion, but once the person sits on the cushion to press the air bag and the buttocks of the human body block the air outlet, the air outlet distribution of the cushion becomes very nonuniform, the position pressed by the buttocks has extremely large wind resistance, and the air circulation is less; the wind resistance of the uncompressed position is small, and the wind outlet is large. The result is that the temperature difference of each position of the human body is large, and the human body feels uncomfortable.
At present, products in the market are subjected to heat conduction and heat dissipation through metal materials, particularly copper and aluminum, although the heat conductivity coefficient of copper is 398W/(m.K), the application of copper is limited by high density, high specific heat capacity, easy oxidation, hard texture and the like, and the heat conductivity coefficient of aluminum is 237W/(m.K), so that the requirements of the existing products on heat conduction and heat dissipation are difficult to meet.
The heat conductivity coefficient of the rolled expanded graphite is 200-700W/(m.K), and the heat conductivity coefficient of the artificially synthesized graphite, such as the graphite prepared by a pi film calcining method, can reach 900-1800W/(m.K), and shows excellent performance in the aspect of thermodynamics.
However, the graphite material is mainly prepared by a method of directly rolling treated graphite and methods of high polymer carbonization, graphitization and the like, and the single graphite sheet heat dissipation material has low tensile strength, is fragile, has more particles and dust, and is difficult to meet the use scene of repeated rolling, curling and stretching in daily life.
The utility model provides an "use novel cold pad of heat conduction graphite paper" utility model patent (CN 208798966U) discloses "use novel cold pad of heat conduction graphite paper, including cold pad, the cold pad upper surface is the comfortable layer that can contact with human skin, and cold inside one or two radiator core standing grooves of being provided with of filling up, has placed built-in radiator core in the standing groove, and built-in radiator core surface area is less than cold pad surface area, and two radiator core standing groove parallel arrangement have placed a built-in radiator core in every standing groove, radiator core and radiating strip adopt heat conduction graphite paper processing to make. Can quickly dissipate the heat transferred by the human body to the contact cool cushion (mat) area, so that the contact area is always kept lower than the temperature of the surface of the human body. The cooling mat of this kind of structure uses single graphite flake as heat conduction heat dissipation layer, does not do the flexible resistant crooked processing to the graphite flake, and in the in-service use, through human relapse roll the back, the graphite flake can fracture, makes its heat conduction heat-sinking capability worsen.
Therefore, a flexible bending-resistant high-heat-dissipation composite fabric with high durability, good flexibility, high heat conductivity coefficient, low density and small specific heat capacity is needed to solve the defects in the prior art.
SUMMERY OF THE UTILITY MODEL
The utility model aims at providing a flexible high heat conduction refrigeration cooling mat contains flexible resistant crooked high heat dissipation composite fabric, gluing agent, semiconductor refrigeration piece and radiator unit to and high-efficient heat transfer element, can automatic continuous production, can curl and store, convenient to use, the heat conduction radiating effect is excellent, has fine flexibility again, and application scope is wide, has solved the not enough of prior art.
The technical scheme of the utility model is that:
a flexible high-heat-conductivity refrigerating cooling mat is characterized by comprising a flexible bending-resistant high-heat-dissipation composite fabric, an adhesive, a semiconductor refrigerating sheet, a heat dissipation assembly of the semiconductor refrigerating sheet and a high-efficiency heat transfer element, wherein the flexible bending-resistant high-heat-dissipation composite fabric is made of a heat-conducting material;
the semiconductor refrigerating sheet and the radiating assembly thereof comprise a semiconductor refrigerating sheet, a radiator and a fan;
the flexible bending-resistant high-heat-dissipation composite fabric comprises a heat conduction material layer, an adhesive and a flexible protective layer;
the heat conducting material layer is adhered to the surface of one side of the flexible protective layer through an adhesive, or the surfaces of the two sides of the heat conducting material layer are respectively adhered to the flexible protective layer through a layer of adhesive;
the total thickness of the heat conducting material layer is between 20 and 500 mu m;
the heat conducting material layer is any one of the following structures: not more than five layers of graphite material or not more than seven layers of composite material combined by metal layer and graphite material, wherein the metal layer is copper or aluminum, and the thickness of the metal layer is 4-50 μm;
one end of the high-efficiency heat transfer element is bonded with one surface of the flexible bending-resistant high-heat-dissipation composite fabric through an adhesive, the other end of the high-efficiency heat transfer element is bonded with the semiconductor refrigeration sheet through the adhesive, the other surface of the semiconductor refrigeration sheet is bonded with one surface of the radiator through the adhesive, and the other surface of the radiator is mechanically connected with the fan.
Preferably, the graphite material has a thickness of between 20 and 500 μm.
Preferably, the heat conducting material layer is provided with through holes, and the porosity is 1% -50%.
Preferably, when the heat conducting material layer is compounded by more than two layers, the layers are connected by an adhesive;
preferably, the thickness of the adhesive layer is 5um-100um;
preferably, the thickness of the flexible protective layer is 5-300 μm.
Preferably, the flexible protective layer is provided with through holes, and the porosity is 1% -50%.
The utility model has the advantages of that:
(1) Utilize the technical scheme of the utility model, with the heat conduction material layer pass through the gluing agent with the flexible protective layer is connected, the flexible resistant crooked high heat dissipation composite fabric who has ventilation function of preparation, because the flexible protective layer has characteristics that the compliance is good, tensile strength is higher, can effectively protect the graphite material not breaking occur under the condition that receives the bending repeatedly. Compared with metal materials, the material has better heat-conducting property and excellent flexibility; compared with graphite materials, the material has better flexibility, bending resistance and stripping resistance; compared with the common fabric, the fabric has extremely high heat-conducting property.
(2) The utility model discloses a cold pad of flexible high heat conduction refrigeration all has the through-hole on its heat conduction material layer, gluing agent and the flexible protective layer, and the through-hole on heat conduction material layer link up with the through-hole of gluing agent. The structure can increase the air circulation of the high-heat-dissipation composite fabric, is beneficial to discharging moisture generated by human body due to sweating, and reduces stuffiness. Use the fan right the compound surface fabric of high heat dissipation carries out forced draft, and foretell through-hole can lead human skin department with the air current, cools down to it, because the utility model discloses a compound surface fabric of high heat dissipation has used the graphite flake of high heat conduction, and its soaking effect is fabulous, can effectively solve the inhomogeneous problem of temperature everywhere of conventional ventilation cushion. The graphite material can radiate absorbed human body heat to the environment through heat radiation and natural air convection, thereby maintaining a temperature lower than that of a human body and ensuring that a contact part of the human body does not generate high temperature.
(3) The method can prepare different composite materials from graphite materials and flexible protective layer composite materials according to different requirements, and selects the graphite materials with different thicknesses according to actual requirements. And the production process for compounding the graphite material and the flexible protective layer is simple, energy-saving and environment-friendly, has strong applicability and can be produced in a large scale.
Drawings
FIG. 1 is a schematic structural view of a flexible high thermal conductivity cooling mat according to the present invention;
fig. 2 is a schematic structural view of a flexible bending-resistant high-heat-dissipation composite fabric in embodiment 1 of the present invention;
fig. 3 is a schematic structural view of a flexible bending-resistant high-heat-dissipation composite fabric in embodiment 2 of the present invention;
fig. 4 is a schematic structural view of a flexible bending-resistant high-heat-dissipation composite fabric in embodiment 3 of the present invention.
Detailed Description
The present invention will be further described with reference to the following examples.
Example 1
As shown in fig. 1, a flexible high thermal conductivity cooling mat comprises a flexible bending-resistant high heat dissipation composite fabric 11, an adhesive, a semiconductor refrigeration sheet and a heat dissipation assembly thereof, and a high-efficiency heat transfer element 12;
the semiconductor refrigerating sheet and the radiating assembly thereof comprise a semiconductor refrigerating sheet 13, a radiator 14 and a fan 15;
as shown in fig. 2, the flexible bending-resistant high-heat-dissipation composite fabric comprises a heat-conducting material layer 21, an adhesive 22 and a flexible protective layer 23;
the heat conducting material layer 21 is adhered to the surface of one side of the flexible protective layer through an adhesive 22, or the surfaces of the two sides of the heat conducting material layer 21 are respectively adhered to the flexible protective layer 23 through a layer of adhesive 22;
the heat conducting material layer is a layer of graphite material, and the thickness of the heat conducting material layer is between 20 and 500 mu m;
one end of the high-efficiency heat transfer element 12 is bonded with one surface of the flexible bending-resistant high-heat-dissipation composite fabric 11 through an adhesive layer, the other end of the high-efficiency heat transfer element 12 is bonded with the semiconductor refrigeration sheet 13 through an adhesive, the other surface of the semiconductor refrigeration sheet 13 is bonded with one surface of the radiator 14 through an adhesive, and the other surface of the radiator 14 is mechanically connected with the fan 15.
Preferably, the heat conducting material layer is provided with through holes, and the porosity is 1% -50%.
Preferably, the thickness of the adhesive is 5um-100um;
preferably, the thickness of the flexible protective layer is 5-300 μm.
Preferably, the flexible protective layer is provided with through holes, and the porosity is 1% -50%.
Example 2
As shown in fig. 1, a flexible high thermal conductivity cooling mat comprises a flexible bending-resistant high heat dissipation composite fabric 11, an adhesive, a semiconductor refrigeration sheet and a heat dissipation assembly thereof, and a high-efficiency heat transfer element 12;
the semiconductor refrigerating sheet and the radiating assembly thereof comprise a semiconductor refrigerating sheet 13, a radiator 14 and a fan 15;
as shown in fig. 3, the flexible bending-resistant high-heat-dissipation composite fabric comprises a heat-conducting material layer 31, an adhesive 32 and a flexible protective layer 33;
the heat conducting material layer 31 is adhered to the surface of one side of the flexible protective layer 33 through an adhesive 32, or the surfaces of the two sides of the heat conducting material layer 31 are respectively adhered to the flexible protective layer 33 through a layer of adhesive 32;
the heat conducting material layer is two layers of graphite materials, and the total thickness of the heat conducting material layer is between 20 and 500 mu m;
one end of the high-efficiency heat transfer element 12 is bonded with one surface of the flexible bending-resistant high-heat-dissipation composite fabric 11 through an adhesive, the other end of the high-efficiency heat transfer element 12 is bonded with the semiconductor refrigeration sheet 13 through an adhesive, the other surface of the semiconductor refrigeration sheet 13 is bonded with one surface of the radiator 14 through an adhesive, and the other surface of the radiator 14 is mechanically connected with the fan 15.
Preferably, the graphite material has a thickness of between 20 and 500 μm.
Preferably, the heat conducting material layer is provided with through holes, and the porosity is 1% -50%.
Preferably, when the heat conducting material layer is compounded by more than two layers, the layers are connected by an adhesive;
preferably, the thickness of the adhesive is 5um-100um;
preferably, the thickness of the flexible protective layer is 5-300 μm.
Preferably, the flexible protective layer is provided with through holes, and the porosity is 1% -50%.
Example 3
As shown in fig. 1, a flexible high thermal conductivity cooling mat comprises a flexible bending-resistant high heat dissipation composite fabric 11, an adhesive, a semiconductor refrigeration sheet and a heat dissipation assembly thereof, and a high-efficiency heat transfer element 12;
the semiconductor refrigerating sheet and the radiating component thereof comprise a semiconductor refrigerating sheet 13, a radiator 14 and a fan 15;
as shown in fig. 4, the flexible bending-resistant high-heat-dissipation composite fabric comprises a heat-conducting material layer, an adhesive 42 and a flexible protective layer 43;
the heat conducting material layer is adhered to the surface of one side of the flexible protective layer 43 through an adhesive 42, or the surfaces of the two sides of the heat conducting material layer are respectively adhered to the flexible protective layer 43 through a layer of adhesive 42;
the heat conducting material layer comprises two layers of graphite materials 41 and a metal layer 44, and the total thickness of the heat conducting material layer is between 20 and 500 um; wherein the metal layer is copper or aluminum, and the thickness of the metal layer is 10um-20um;
one end of the high-efficiency heat transfer element 12 is bonded with one surface of the flexible bending-resistant high-heat-dissipation composite fabric 11 through an adhesive, the other end of the high-efficiency heat transfer element 12 is bonded with the semiconductor refrigeration sheet 13 through an adhesive, the other surface of the semiconductor refrigeration sheet 13 is bonded with one surface of the radiator 14 through an adhesive, and the other surface of the radiator 14 is mechanically connected with the fan 15.
Preferably, the graphite material has a thickness of between 20 and 500 μm.
Preferably, the heat conducting material layer is provided with through holes, and the porosity is 1% -50%.
Preferably, when the heat conducting material layer is compounded by more than two layers, the layers are connected by an adhesive;
preferably, the thickness of the adhesive is 5um-100um;
preferably, the thickness of the flexible protective layer is 5-300 μm.
Preferably, the flexible protective layer is provided with through holes, and the porosity is 1% -50%.
It should be finally noted that the above embodiments are only used to illustrate the technical solutions of the present invention, but not to limit the scope of the present invention, and although the present invention is described in detail with reference to the preferred embodiments, it should be understood by those skilled in the art that the technical solutions of the present invention can be modified or replaced equivalently without departing from the spirit and scope of the technical solutions of the present invention.
Claims (7)
1. The utility model provides a high heat conduction refrigeration cooling mat of flexibility which characterized in that: the flexible high-heat-conduction cooling mat comprises a flexible bending-resistant high-heat-dissipation composite fabric, an adhesive, a semiconductor refrigeration sheet and a heat dissipation assembly thereof, and a high-efficiency heat transfer element; the semiconductor refrigerating sheet and the radiating assembly thereof comprise a semiconductor refrigerating sheet, a radiator and a fan;
the flexible bending-resistant high-heat-dissipation composite fabric comprises a heat conduction material layer, an adhesive and a flexible protective layer;
the heat conducting material layer is adhered to the surface of one side of the flexible protective layer through an adhesive, or the surfaces of the two sides of the heat conducting material layer are respectively adhered to the flexible protective layer through a layer of adhesive;
the total thickness of the heat conducting material layer is between 20 and 500 mu m;
the heat conducting material layer is any one of the following structures: no more than five layers of graphite material; or a composite material with not more than seven layers, which is formed by combining a metal layer and a graphite material, wherein the metal layer is copper or aluminum and the thickness of the metal layer is 4-50 mu m;
one end of the high-efficiency heat transfer element is bonded with one surface of the flexible bending-resistant high-heat-dissipation composite fabric through an adhesive, the other end of the high-efficiency heat transfer element is bonded with the semiconductor refrigeration sheet through the adhesive, the other surface of the semiconductor refrigeration sheet is bonded with one surface of the radiator through the adhesive, and the other surface of the radiator is mechanically connected with the fan.
2. A flexible high thermal conductivity cooling mat according to claim 1, wherein said graphite material has a thickness of between 20-500 μm.
3. The flexible high thermal conductivity cooling mat according to claim 1, characterized in that said thermal conductivity material layer is provided with through holes with a porosity of 1% -50%.
4. A flexible high thermal conductivity cooling mat according to claim 1, wherein: when the heat conducting material layer is compounded by more than two layers, the layers are connected by adhesive.
5. A flexible high thermal conductivity cold pad according to claim 1, wherein the thickness of said adhesive is 5 μm-100 μm.
6. A flexible high thermal conductivity cooling mat according to claim 1, wherein said flexible protective layer has a thickness of 5-300 μm.
7. The cooling mat as claimed in claim 1, wherein the flexible protective layer has through holes with a porosity of 1-50%.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221431736.0U CN218804432U (en) | 2022-06-09 | 2022-06-09 | Flexible high-heat-conductivity refrigerating cooling mat |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221431736.0U CN218804432U (en) | 2022-06-09 | 2022-06-09 | Flexible high-heat-conductivity refrigerating cooling mat |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN218804432U true CN218804432U (en) | 2023-04-07 |
Family
ID=87047112
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202221431736.0U Active CN218804432U (en) | 2022-06-09 | 2022-06-09 | Flexible high-heat-conductivity refrigerating cooling mat |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN218804432U (en) |
-
2022
- 2022-06-09 CN CN202221431736.0U patent/CN218804432U/en active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| EP1635757B1 (en) | Self-powered steady-state skin-cooling support surfaces | |
| CN218804432U (en) | Flexible high-heat-conductivity refrigerating cooling mat | |
| CN218804431U (en) | Cooling mat made of flexible bending-resistant high-heat-dissipation composite fabric | |
| CN217598005U (en) | Flexible bending-resistant high-heat-dissipation composite fabric | |
| CN114953615A (en) | Flexible bending-resistant high-heat-dissipation composite fabric | |
| CN213128827U (en) | Cooling and heating dual-purpose cushion | |
| CN213108511U (en) | All-weather multifunctional fabric for clothing | |
| CN201108218Y (en) | Tourmaline summer cool mattress | |
| CN221511518U (en) | Dual-purpose gel pillow for refrigeration and heat storage | |
| CN203073849U (en) | Refrigerating and heating mattress using heat pipe as heat exchange element | |
| CN207783407U (en) | A kind of head-mounted display apparatus | |
| CN206518369U (en) | Support mat structure | |
| CN207707638U (en) | Cold pad and cold pad suit | |
| CN2257670Y (en) | Health cushion | |
| CN217592414U (en) | Composite material heat conduction strip and pillow core or mattress with heat conduction strip | |
| CN220442148U (en) | Knapsack | |
| CN201285198Y (en) | Module with heat insulation and heat preservation effect | |
| CN212815384U (en) | Sofa heated by warm air | |
| CN213075167U (en) | Gel and latex composite pad | |
| CN215936836U (en) | Waist support cushion inner core | |
| CN213089919U (en) | Dual-density floor heating system | |
| CN108260993A (en) | A kind of multifunctional cold and warm health mat | |
| CN217455755U (en) | Cooling and warming dual-purpose cushion | |
| CN219940141U (en) | Cooling elastic pad | |
| CN215502311U (en) | Pillowcase with increased heat dissipation |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |