CN218800992U

CN218800992U - Simple polishing device

Info

Publication number: CN218800992U
Application number: CN202222679869.6U
Authority: CN
Inventors: 于金营; 胡楠; 刘子谦
Original assignee: Shenzhen National Research Institute of High Performance Medical Devices Co Ltd
Current assignee: Shenzhen National Research Institute of High Performance Medical Devices Co Ltd
Priority date: 2022-10-12
Filing date: 2022-10-12
Publication date: 2023-04-07
Anticipated expiration: 2032-10-12

Abstract

The embodiment of the utility model discloses a simple polishing device, which comprises a frame body, a clamping piece fixed on the frame body, a driving component clamped on the clamping piece, an accommodating piece with an accommodating cavity and a polishing matrix filled in the accommodating cavity; the drive assembly is used for suspending the workpiece and enabling the workpiece to extend into the containing cavity, and the drive assembly is further used for driving the workpiece to rotate so that the workpiece and the polishing matrix rotate relatively. According to the simple polishing device provided by the embodiment, the workpiece to be polished is connected with the driving component on the clamping piece, the polishing matrix is filled on the surface of the workpiece, then the driving component drives the workpiece to rotate, and the part of the workpiece embedded in the polishing matrix and the polishing matrix rub against each other, so that the polishing matrix polishes the workpiece. Compared with the prior art, the simple polishing device provided by the embodiment has the advantages of simple structure and convenience in operation, and can be applied to the environment with weak bearing capacity.

Description

Simple polishing device

Technical Field

The utility model relates to a machining equipment technical field especially relates to a simple and easy burnishing device.

Background

Ultrasonic surgery is to crush, separate and excise diseased tissues or organs of a human body by using an ultrasonic scalpel instead of a common scalpel so as to achieve the purpose of surgical treatment. The ultrasonic cutter head made of the titanium alloy material has high requirements on a polishing process due to the long, narrow and complex structure, and meanwhile, the surface roughness of the ultrasonic cutter head has an important influence on tissue adhesion.

In the prior art, polishing equipment is mainly a centrifugal polishing machine and a roller polishing machine, but the two types of equipment have larger weight and volume, have high requirements on bearing of use occasions, cannot be widely used, and are particularly applied to laboratories.

SUMMERY OF THE UTILITY MODEL

Based on this, there is a need for a simple polishing apparatus that can solve the above-mentioned problems.

A simple polishing device comprises a frame body, a clamping piece fixed on the frame body, a driving assembly clamped on the clamping piece, a containing piece with a containing cavity and a polishing matrix filled in the containing cavity; the drive assembly is configured to suspend a workpiece and extend the workpiece into the receiving cavity, and is further configured to rotate the workpiece such that the workpiece and the polishing substrate rotate relative to each other.

In some embodiments of the simple polishing apparatus, the driving assembly includes a rotating shaft for outputting a torque, and a first gear in transmission connection with the rotating shaft, the workpiece is connected with the first gear, and the workpiece is offset from an axis of the first gear, and the first gear is used for driving the workpiece to make a circular motion.

In some embodiments of the simple polishing apparatus, the workpiece is rotatably disposed on the first gear.

In some embodiments of the simple polishing apparatus, the driving assembly further includes a second gear rotating coaxially with the first gear and a third gear sleeved on the outer periphery of the workpiece, and the second gear is engaged with the third gear to drive the workpiece to rotate.

In some embodiments of the simplified polishing apparatus, the polishing substrate is polishing sand.

Further, the grain size of the polishing sand is 0.015-10 mm.

In some embodiments of the simple polishing apparatus, the polishing substrate is a mixture of polishing sand and polishing oil.

In some embodiments of the simple polishing apparatus, the ratio of the polishing sand to the tumbling oil is 20.

Further, the grain size of the polishing sand is 0.015-10 mm.

In some embodiments of the simple polishing apparatus, the workpiece has a polishing portion to be polished, the polishing portion is embedded in the polishing matrix, and the height of the polishing matrix is at least 1cm higher than the polishing portion.

Implement the embodiment of the utility model provides a, will have following beneficial effect:

according to the simple polishing device provided by the embodiment, the workpiece to be polished is connected with the driving component on the clamping piece, the polishing matrix is filled on the surface of the workpiece, then the driving component drives the workpiece to rotate, and the part of the workpiece embedded in the polishing matrix is rubbed with the polishing matrix, so that the polishing matrix polishes the workpiece. Compared with the prior art, the simple polishing device provided by the embodiment has the advantages of simple structure and convenience in operation, and can be applied to the environment with weak bearing capacity.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the description below are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.

Wherein:

fig. 1 is a schematic structural diagram of a simple polishing apparatus according to an embodiment.

Fig. 2 is a schematic view of a portion of the drive assembly and workpiece assembly of fig. 1.

Reference numerals:

10-workpiece, 12-polishing section;

100-simple polishing device;

110-a frame body;

120-a clamp;

130-drive assembly, 132-first gear, 134-second gear, 136-third gear;

140-receiving member, 140 a-receiving cavity;

150-polishing the substrate.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

In the description of the embodiments of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, which are only for convenience of describing the embodiments of the present invention and simplifying the description, but do not indicate or imply that the device or element referred to must have a specific orientation, be constructed in a specific orientation, and be operated, and thus, should not be construed as limiting the embodiments of the present invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.

In the description of the embodiments of the present invention, it should be noted that, unless explicitly stated or limited otherwise, the terms "mounted," "connected" and "connected" should be interpreted broadly, and may be, for example, fixedly connected, interchangeably connected, or integrally connected, mechanically connected, electrically connected, directly connected, indirectly connected through an intermediate medium, or connected between two elements. The specific meaning of the above terms in the embodiments of the present invention can be understood in specific cases by those skilled in the art.

Referring to fig. 1 and 2, an embodiment of the present invention provides a simple polishing apparatus 100, including a frame body 110, a clamping member 120 fixed on the frame body 110, a driving assembly 130 clamped on the clamping member 120, a receiving member 140 having a receiving cavity 140a, and a polishing substrate 150 filled in the receiving cavity 140 a; the driving assembly 130 is used for suspending the workpiece 10 and extending the workpiece 10 into the receiving cavity 140a, and the driving assembly 130 is also used for driving the workpiece 10 to rotate so that the workpiece 10 and the polishing substrate 150 rotate relatively.

According to the simple polishing apparatus 100 provided in the above embodiment, the workpiece 10 to be polished is connected to the driving unit 130 of the holding member 120, the polishing matrix 150 is filled on the surface of the workpiece 10, and then the driving unit 130 drives the workpiece 10 to rotate, and the portion of the workpiece 10 embedded in the polishing matrix 150 and the polishing matrix 150 rub against each other, so that the polishing matrix 150 polishes the workpiece 10.

Compared with the prior art, the simple polishing device 100 provided by the embodiment has a simple structure, is convenient to operate, and can be applied to an environment with weak bearing capacity.

Referring to fig. 1 and fig. 2, in an embodiment of the present invention, the driving assembly 130 includes a rotating shaft for outputting torque and a first gear 132 in transmission connection with the rotating shaft, the workpiece 10 is connected to the first gear 132, and the workpiece 10 deviates from the axis of the first gear 132, and the first gear 132 is used for driving the workpiece 10 to make a circular motion.

In this embodiment, after the driving assembly 130 drives the rotating shaft to rotate, the first gear 132 connected to the rotating shaft in a transmission manner rotates, and the first gear 132 drives the workpiece 10 fixedly connected thereto to move. Since the workpiece 10 is eccentrically disposed on the first gear 132, the workpiece 10 makes a circular motion around the axis of the first gear 132. Compare in the rotation of work piece 10, this work piece 10 can be in accomodating the intracavity 140a and rotate by a wide margin, contacts more polishing matrix 150, avoids the inhomogeneous phenomenon emergence that the problem influence polishing effect of local polishing matrix 150.

In one particular embodiment, the workpiece 10 is rotatably mounted on the first gear 132.

In this manner, when the first gear 132 drives the workpiece 10 to make a circular motion, since the workpiece 10 can rotate on the first gear 132, the workpiece 10 can be rotated by the polishing substrate 150. By adopting the simple polishing device 100 provided by the embodiment, the polishing degree of the workpiece 10 and the polishing substrate 150 can be improved, and the polishing effect can be further improved.

In order to achieve the effect that the workpiece 10 is rotatably provided on the first gear 132, the workpiece 10 may be restrained only in the axial direction, and the restraint in the circumferential direction of the workpiece 10 may be released.

Further, the driving assembly 130 further includes a rolling bearing, which is sleeved on the outer circumference of the workpiece 10 and fixed on the first gear 132.

In a more specific embodiment, as shown in fig. 2, the driving assembly 130 further includes a second gear 134 rotating coaxially with the first gear 132 and a third gear 136 sleeved on the outer periphery of the workpiece 10, wherein the second gear 134 is engaged with the third gear 136 to drive the workpiece 10 to rotate.

In this embodiment, after the driving assembly 130 drives the rotating shaft to rotate, the rotating shaft drives the first gear 132 to rotate, and the workpiece 10 eccentrically disposed on the first gear 132 makes a circular motion around the axis of the first gear 132. Meanwhile, the second gear 134 rotates coaxially with the first gear 132, and the second gear 134 rotates synchronously with the first gear 132, so as to drive the third gear 136 engaged with the second gear 134 to rotate. Since the third gear 136 is fixed to the outer periphery of the workpiece 10 and the workpiece 10 is rotatably disposed on the first gear 132, the workpiece 10 rotates about its own axis.

With the simple polishing apparatus 100 provided in the present embodiment, the workpiece 10 can rotate and revolve under the action of the driving assembly 130, where the revolution is around the axis of the first gear 132. In this manner, the friction rate of the workpiece 10 with the polishing substrate 150 and the polishing effect of the workpiece 10 can be further improved.

Further, the number of the first gears 132 is three, and the number of the second gears 134 and the third gears 136 is also three. One of the first gears 132 is connected to the rotating shaft and engaged with the other two first gears 132, and the two first gears 132 are provided with transmission shafts respectively connected to the two second gears 134.

By adopting the structure, three workpieces 10 can be polished simultaneously, and the polishing efficiency is improved.

Based on any of the above embodiments, a further embodiment of the present invention is provided, wherein the polishing substrate 150 is polishing sand.

The polishing sand is prepared by using high-quality corundum as a raw material and adopting a modern novel and unique process technology, has short grinding time, high efficiency and good benefit, and plays a role in protecting a precision tool.

In a specific embodiment, the grit has a particle size of 0.015mm to 10mm.

It is understood that, in the present embodiment, the polishing sands have a plurality of sand grains with different sizes, and for convenience of illustration, the large-sized polishing sands and the small-sized polishing sands can be directly understood. The polishing can be divided into two types, namely rough polishing and fine polishing, and the two types correspond to large-size polishing sand and small-size polishing sand respectively.

In this embodiment, the rotation speed of the rotating shaft in the driving assembly 130 is 200r/min to 2000r/min. During rough polishing, the rotating shaft can be set to have a larger rotating speed, such as 2000r/min; during fine polishing, the rotating shaft can be set to a lower rotating speed, such as 200r/min.

In one embodiment, the polishing matrix 150 is a mixture of vegetable polishing sand and a tumbling oil.

It will be appreciated that the composition of the burnishing oil will vary for workpieces 10 of different materials. The main function of the burnishing oil is to enhance the polishing effect and protect the surface of the workpiece 10.

In one specific embodiment, the ratio of polishing sand to tumbling oil is 20 to 40. By adopting the embodiment, the polishing effect can be effectively improved by the proportion of the polishing sand to the polishing oil.

In yet another specific embodiment, the polishing sand has a particle size of 0.015mm to 10mm.

Referring to fig. 1 and 2, in another embodiment of the present invention, a workpiece 10 has a polishing portion 12 to be polished, the polishing portion 12 is embedded in a polishing substrate 150, and the height of the polishing substrate 150 is at least 1cm higher than that of the polishing portion 12.

It will be appreciated that rubbing of the workpiece 10 within the polishing substrate 150 causes the polishing substrate 150 at the periphery of the workpiece 10 to move away from the workpiece 10. In this embodiment, the structure provided in this embodiment can prevent the polishing substrate 150 from being far away from the workpiece 10 and affecting the polishing effect.

It should be noted that the description of the height of the polishing substrate 150 and the polishing portion 12 in this embodiment is mainly used to embody the structural features, but not the method features.

In one embodiment, the simplified polishing apparatus 100 further includes an elevating assembly fixed to the frame 110 and adapted to drive the holder 120 to move closer to or away from the receptacle 140, thereby adjusting the depth of the workpiece 10 embedded in the polishing substrate 150.

In addition, the workpiece 10 has a certain amplitude during the movement, and in this embodiment, the diameter of the receiving member 140 should be larger than 40 times of the amplitude of the workpiece 10.

The above disclosure is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the scope of the invention, which is defined by the appended claims.

Claims

1. The simple polishing device is characterized by comprising a frame body, a clamping piece fixed on the frame body, a driving assembly clamped on the clamping piece, a receiving piece with a receiving cavity and a polishing matrix filled in the receiving cavity; the drive assembly is used for suspending a workpiece and extending the workpiece into the receiving cavity, and the drive assembly is also used for driving the workpiece to rotate so that the workpiece and the polishing matrix rotate relatively.

2. The simple polishing device as claimed in claim 1, wherein the driving assembly comprises a rotating shaft for outputting torque and a first gear in transmission connection with the rotating shaft, the workpiece is connected with the first gear, and the workpiece is offset from the axis of the first gear, and the first gear is used for driving the workpiece to make circular motion.

3. The simple polishing apparatus as set forth in claim 2, wherein the workpiece is rotatably disposed on the first gear.

4. The simple polishing device as claimed in claim 3, wherein the driving assembly further comprises a second gear rotating coaxially with the first gear and a third gear sleeved on the outer periphery of the workpiece, and the second gear is engaged with the third gear to drive the workpiece to rotate.

5. The simple polishing device as claimed in any one of claims 1 to 4, wherein the polishing substrate is polishing sand.

6. The simple polishing device as claimed in claim 5, wherein the grain size of the polishing sand is 0.015mm to 10mm.

7. The simple polishing device as set forth in any one of claims 1 to 4, wherein the polishing substrate is a mixture of polishing sand and polishing oil.

8. The simple polishing device according to claim 7, wherein the ratio of the polishing sand to the tumbling oil is 20.

9. The simple polishing device as claimed in claim 7, wherein the grain size of the polishing sand is 0.015mm to 10mm.

10. The simple polishing device according to any one of claims 1 to 4, wherein the workpiece has a polishing portion to be polished, the polishing portion is embedded in the polishing base, and the height of the polishing base is at least 1cm higher than that of the polishing portion.