CN218798820U

CN218798820U - Wire bonding device for integrated circuit

Info

Publication number: CN218798820U
Application number: CN202223108534.5U
Authority: CN
Inventors: 盛文金
Original assignee: Wuhan Shengwenxin Microelectronics Technology Co ltd
Current assignee: Wuhan Shengwenxin Microelectronics Technology Co ltd
Priority date: 2022-11-23
Filing date: 2022-11-23
Publication date: 2023-04-07
Anticipated expiration: 2032-11-23

Abstract

The utility model discloses an integrated circuit bonding wire device, including frame and U type frame, two perpendicular limits of U type frame are installed respectively in frame top both sides center department, and the inside level of frame rotates and have the conveyer belt, the inside both ends level of conveyer belt is equipped with the round roller, and is equipped with integrated circuit bonding wire structure on the horizontal limit of U type frame, frame one side end rotates there is the round gear, and round gear and one of them round roller tip pass through pivot fixed connection, be equipped with the intermittent type slewing mechanism that is used for intermittent type to rotate the round gear on the U type frame. The utility model discloses a setting up of round gear and rack can make welding mechanism in the removal, can also drive the conveyer belt and rotate for can go on in step to integrated circuit pay-off and bonding wire, thereby can make every bonding wire one with regard to pay-off one, accomplish the work incessant in succession of pay-off and bonding wire, and then improved the availability factor of this equipment.

Description

Wire bonding device for integrated circuit

Technical Field

The utility model relates to a bonding wire technical field especially relates to an integrated circuit bonding wire device.

Background

An integrated circuit is a microelectronic device or component. The elements such as transistor, resistor, capacitor and inductor, etc. and wiring required in a circuit are interconnected by a certain process, and made on one or several small semiconductor wafers or medium substrates, and then packaged in a tube shell to form a microstructure with required circuit function.

The existing wire bonding device generally conveys an integrated circuit to a designated position through a conveying mechanism and then bonds the integrated circuit through a wire bonding mechanism, and the working mode ensures that the integrated circuit and the conveying and bonding wires are in different linkage synchronization and need to be distributed for operation, so that the wire bonding efficiency of the integrated circuit is reduced, and therefore, the integrated circuit wire bonding device needs to be redesigned urgently to solve the problem of low wire bonding efficiency.

SUMMERY OF THE UTILITY MODEL

The utility model aims at solving the defects existing in the prior art and providing an integrated circuit bonding wire device.

In order to realize the purpose, the utility model adopts the following technical scheme:

an integrated circuit wire bonding apparatus, comprising:

a frame;

the U-shaped frame, two perpendicular limits of U-shaped frame are installed respectively in frame top both sides center department, and the inside level of frame rotates and has the conveyer belt, the inside both ends level of conveyer belt is equipped with the round roller, and is equipped with integrated circuit bonding wire structure on the horizontal limit of U-shaped frame, frame one side end rotates has the round gear, and round gear and one of them round roller tip pass through pivot fixed connection, be equipped with the intermittent type slewing mechanism that is used for intermittent type to rotate the round gear on the U-shaped frame.

As a further technical scheme of the utility model, integrated circuit bonding wire structure includes: the connecting plate is horizontally arranged below the transverse edge of the U-shaped frame, the top of the transverse edge of the U-shaped frame is vertically provided with an air cylinder, and an output shaft of the air cylinder is arranged at the center of the top of the connecting plate.

As a further technical scheme of the utility model, the welding wire mechanism is vertical to be installed in linkage plate bottom center department, and linkage plate one end center department installs the flange.

As a further technical solution of the present invention, the intermittent rotation mechanism includes: l template, rack and the frid that shifts, L template level sets up in U type frame one side, and L template long limit one side level has seted up the second spout.

As a further technical scheme of the utility model, one of them perpendicular limit of U type frame is vertical has been seted up and has been erected the groove, and the flange top is passed and is erected the groove and slide inside the second spout.

As a further technical scheme of the utility model, the rack is vertical to be installed in L template minor face tip, and rack part has the tooth, rack and circular gear intermeshing.

As a further technical scheme of the utility model, the frid that shifts has two and central symmetry to set up, and two frids that shift all install in one of them perpendicular limit one side of U type frame, the projection that shifts is installed on the long limit of L template, and shifts the projection and shift frid looks adaptation.

The beneficial effects of the utility model are that:

1. this integrated circuit bonding wire device, setting up through round gear and rack can make welding mechanism move the time, can also drive the conveyer belt and rotate, make and go on in step to integrated circuit pay-off and bonding wire, at first place integrated circuit in the conveyer belt top, drive the linkage plate through the cylinder and remove, the linkage plate removes and can drive bonding wire mechanism and flange and reciprocate, the flange removes and can drive L template and remove, L template removes and can drive the rack and remove, the rack removes and can drive round gear and rotate, round gear can drive round roller and conveyer belt and rotate, thereby can make every bonding wire just pay-off one, accomplish incessant pay-off and bonding wire's continuous work, and then the availability factor of this equipment has been improved.

2. The integrated circuit wire welding device can change the position of a rack through the arrangement of the displacement groove plate and the displacement convex column, so that the rack can drive a circular gear to rotate in one direction when reciprocating up and down once, thereby ensuring stable feeding of an integrated circuit, the displacement convex column can be driven to move when the L-shaped plate moves, the displacement convex column can drive the L-shaped plate to move when the displacement convex column touches the displacement groove plate below the displacement convex column, the L-shaped plate can drive the rack to move, the rack can further be prevented from being meshed with the circular gear when the rack moves up along with a connecting plate, the reverse rotation of the circular gear is avoided, in addition, the rack can be contacted with the displacement groove plate above the rack when the L-shaped plate moves up after being displaced, the rack can continue to rotate the circular gear when descending, further, the linkage of a conveying belt and a wire welding mechanism is ensured, and the feeding stability of the integrated circuit is also improved.

Drawings

Fig. 1 is a schematic structural diagram of a wire bonding apparatus for an integrated circuit according to the present invention;

fig. 2 is a schematic structural diagram of a wire bonding apparatus for an integrated circuit according to the present invention;

fig. 3 is a schematic structural diagram of a wire bonding apparatus for an integrated circuit according to the present invention;

fig. 4 is a schematic structural diagram of a wire bonding apparatus for an integrated circuit according to the present invention.

In the figure: 1. a frame; 2. a conveyor belt; 3. a U-shaped frame; 4. a cylinder; 5. a circular gear; 6. a rack; 7. a shift groove plate; 8. a vertical slot; 11. a connection plate; 12. a wire bonding mechanism; 13. an L-shaped plate; 14. a round roller; 15. a second chute; 16. a convex plate; 17. a position-changing convex column.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments.

It should be noted that, in the present application, the embodiments and features of the embodiments may be combined with each other without conflict. The present invention will be described in detail below with reference to the accompanying drawings in conjunction with embodiments.

Referring to fig. 1-4, an apparatus for bonding wires to an integrated circuit includes: frame 1 and U type frame 3, two vertical limits of U type frame 3 are installed respectively in frame 1 top both sides center department, and the inside level of frame 1 rotates there is conveyer belt 2, the inside both ends level of conveyer belt 2 is equipped with round roller 14, and be equipped with integrated circuit bonding wire structure on 3 horizontal limits of U type frame, frame 1 one side tip rotates there is round gear 5, and round gear 5 and one of them round roller 14 tip pass through pivot fixed connection, be equipped with the intermittent type slewing mechanism who is used for intermittent type to rotate round gear 5 on the U type frame 3, through the setting of this equipment, can make the transport and the bonding wire to integrated circuit go on in step, the condition of having avoided the independent operation of distribution operation to reduce efficiency takes place.

Referring to fig. 1 and 2, in a preferred embodiment, a wire bond structure for an integrated circuit includes: linking up board 11 and bonding wire mechanism 12, linking up board 11 level sets up in 3 horizontal limit belows on U type frame, and 3 horizontal limit tops of U type frame are vertical installs cylinder 4, the output shaft of cylinder 4 is installed in 11 top centers of linking up board, bonding wire mechanism 12 is vertical installs in 11 bottom centers of linking up board, and 11 one end centers of linking up board department installs flange 16, setting through integrated circuit bonding wire structure, can carry out the bonding wire to integrated circuit, and bonding wire mechanism 12 is ripe prior art, this document does not make any improvement to it, consequently, this document is not being repeated repeatedly.

Referring to fig. 2-4, in a preferred embodiment, the intermittent rotation mechanism includes: the L-shaped plate 13, the rack 6 and the shifted groove plate 7 are horizontally arranged on one side of the U-shaped frame 3, the second sliding groove 15 is horizontally formed in one side of the long edge of the L-shaped plate 13, the integrated circuit is conveyed and the welding wires are synchronously conveyed through the intermittent rotating mechanism, the working efficiency is guaranteed, when the second sliding groove passes through the rack 6 and the circular gear 5 and is not meshed, the connecting plate 11 can further drive the welding wire mechanism 12 to weld the wires downwards, and the smooth process of the work is guaranteed.

Referring to fig. 1, in a preferred embodiment, one of the vertical edges of the U-shaped frame 3 is vertically provided with a vertical slot 8, and the top end of a convex plate 16 passes through the vertical slot 8 and slides inside a second sliding slot 15, and is used for connecting the L-shaped plates 13, so as to conveniently move along with the connecting plates 11, and through the arrangement of the second sliding slot 15, when the L-shaped plates 13 are displaced, the convex plate 16 does not obstruct the displacement of the L-shaped plates 13.

Referring to fig. 4 and 3, in a preferred embodiment, a rack 6 is vertically installed at the end of the short side of an L-shaped plate 13, and the rack 6 is partially toothed, the rack 6 and a circular gear 5 are engaged with each other, two deflection groove plates 7 are arranged in central symmetry, and the two deflection groove plates 7 are both installed on one vertical side of the U-shaped frame 3, a deflection convex column 17 is installed on the long side of the L-shaped plate 13, and the deflection convex column 17 is matched with the deflection groove plates 7, and only one rotation can be performed on the circular gear 6 in the process of reciprocating up and down of the rack 6 once through the arrangement of the deflection groove plates 7 and the deflection convex columns 17.

From the above description, it can be seen that the above-mentioned embodiments of the present invention achieve the following technical effects: the integrated circuit is firstly placed on the top of a conveying belt 2, a connecting plate 11 is driven to move through an air cylinder 4, the connecting plate 11 can drive a welding wire mechanism 12 and a convex plate 16 to move up and down, the convex plate 16 can drive an L-shaped plate 13 to move, the L-shaped plate 13 can drive a rack 6 to move, the rack 6 can drive a circular gear 5 to rotate, the circular gear 5 can drive a circular roller 14 and the conveying belt 2 to rotate, so that one welding wire can be fed for each welding wire, continuous and uninterrupted feeding and welding wire work is completed, in addition, when the L-shaped plate 13 moves, the shifting convex column 17 can be driven to move, when the shifting convex column 17 touches a shifting groove plate 7 below, the shifting convex column 17 can drive the L-shaped plate 13 to move, the L-shaped plate 13 can drive the rack 6 to move up along with the connecting plate 11, the rack 6 cannot be meshed with the circular gear 5, the situation that the circular gear 5 rotates reversely is avoided, in addition, when the L-shaped plate 13 shifts, the rack 6 can continue to rotate along with the circular gear 5, the conveying belt and the stability of the integrated circuit 12 and the conveying belt is improved.

The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims

1. An integrated circuit wire bonding apparatus, comprising:

a frame (1);

u type frame (3), two perpendicular limits of U type frame (3) are installed respectively in frame (1) top both sides center department, and frame (1) inside level rotates and has conveyer belt (2), the inside both ends level of conveyer belt (2) is equipped with round roller (14), and is equipped with integrated circuit bonding wire structure on the horizontal limit of U type frame (3), frame (1) one side tip rotates has round gear (5), and round gear (5) and one of them round roller (14) tip through pivot fixed connection, be equipped with the intermittent type slewing mechanism who is used for intermittent type to rotate round gear (5) on U type frame (3).

2. The apparatus of claim 1 wherein the wire bonding structure comprises: linking up fishplate bar (11) and bonding wire mechanism (12), linking up fishplate bar (11) level sets up in the horizontal limit below of U type frame (3), and the horizontal limit top of U type frame (3) is vertical installs cylinder (4), the output shaft of cylinder (4) is installed in linking up fishplate bar (11) top center department.

3. The device for bonding wires to an integrated circuit according to claim 2, wherein the bonding mechanism (12) is vertically mounted at the center of the bottom of the connecting plate (11), and a convex plate (16) is mounted at the center of one end of the connecting plate (11).

4. The apparatus according to claim 3, wherein said intermittent rotation mechanism comprises: l template (13), rack (6) and frid (7) shift, L template (13) level sets up in U type frame (3) one side, and L template (13) long limit one side level has seted up second spout (15).

5. The device for bonding wires to an integrated circuit according to claim 4, wherein one of the vertical sides of the U-shaped frame (3) is vertically provided with a vertical slot (8), and the top end of the protruding plate (16) passes through the vertical slot (8) and slides inside the second sliding slot (15).

6. An IC bonding device according to claim 5, characterized in that the rack (6) is vertically mounted at the end of the short side of the L-shaped plate (13), and the rack (6) is partially toothed, and the rack (6) and the circular gear (5) are meshed with each other.

7. The device for bonding wires to integrated circuits according to claim 6, wherein two of the displacement slot plates (7) are arranged in a central symmetry manner, and the two displacement slot plates (7) are both installed on one side of one of the vertical edges of the U-shaped frame (3), and the long edge of the L-shaped plate (13) is installed with a displacement convex column (17), and the displacement convex column (17) is matched with the displacement slot plates (7).