CN218788898U - Mounting structure and thermal management device - Google Patents
Mounting structure and thermal management device Download PDFInfo
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- CN218788898U CN218788898U CN202222571059.9U CN202222571059U CN218788898U CN 218788898 U CN218788898 U CN 218788898U CN 202222571059 U CN202222571059 U CN 202222571059U CN 218788898 U CN218788898 U CN 218788898U
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Abstract
The utility model relates to the technical field of heat dissipation equipment, in particular to a mounting structure for mounting a condenser and a heat dissipation fan which need to be hermetically connected, which comprises a bottom plate and a mounting plate, wherein the bottom plate is provided with a first through hole, and the condenser is used for being mounted at the first through hole on the bottom plate; the mounting plate comprises a panel and a side plate arranged at the edge of the panel, a second through hole is formed in the panel, and the cooling fan is arranged at the second through hole in the panel; wherein, the air current passes the condenser through the radiator fan of second through-hole department from first through-hole department, and sealed bounding wall is constituteed to a plurality of curb plates, and the setting up of sealed bounding wall makes the sealed effect between condenser and the radiator fan better, prevents to influence condenser and radiator fan's heat dissipation work because of the gap between condenser and the radiator fan.
Description
Technical Field
The utility model relates to a heat-radiating equipment technical field particularly, relates to a mounting structure and thermal management device.
Background
In the process of long-time operation, a large amount of heat is generated by battery packs, electric appliance cabinets, components and the like of some large-scale mobile equipment such as vehicles such as locomotives, subways, urban light rails, motor train units and the like, so that the ambient temperature of the equipment is increased, the stable operation of the equipment is influenced, and the ambient temperature of the equipment needs to be adjusted through a heat management device.
In prior art thermal management devices, a condenser and a heat dissipation fan are usually provided to cooperate with each other to continuously remove heat from the environment surrounding the device. When the condenser works, the heat dissipation fan promotes airflow to flow fast, and the airflow can pass through a gap between the condenser and the heat dissipation fan when passing through the condenser, so that the cooling effect efficiency of the condenser on air is low, and the heat dissipation effect of the condenser is further influenced.
SUMMERY OF THE UTILITY MODEL
The utility model aims at providing a mounting structure and thermal management device to solve at least one aspect among the above-mentioned technical problem.
In order to solve the above problem, the utility model provides a following technical scheme:
a mounting structure is used for mounting a condenser and a heat dissipation fan which need to be connected in a sealing mode and comprises a bottom plate and a mounting plate, wherein a first through hole is formed in the bottom plate, and the condenser is used for being mounted at the first through hole in the bottom plate;
the mounting plate comprises a panel and a side plate arranged at the edge of the panel, a second through hole is formed in the panel, and the cooling fan is arranged at the second through hole in the panel;
the side plates and the panel are vertically arranged, the side plates are connected end to form a sealed enclosing plate, the second penetrating port is located inside the sealed enclosing plate, and one end, far away from the panel, of the sealed enclosing plate is used for being connected with the bottom plate.
The utility model provides a pair of mounting structure compares in prior art, has but not be limited to following beneficial effect:
the condenser is used for installing first through hole department on the bottom plate, the air current of being convenient for passes the condenser from first through hole department, second through hole on the panel is used for installing radiator fan, the air current passes the radiator fan of condenser through second through hole department from first through hole department, sealed bounding wall is constituteed to a plurality of curb plates, the setting up of sealed bounding wall makes the sealed effect between condenser and the radiator fan better, prevent to influence condenser and radiator fan's radiating work because of the gap between condenser and the radiator fan.
Preferably, the mounting structure further comprises a connecting frame for supporting the mounting plate so that the mounting plate is located above the bottom plate, and the condenser is arranged between the bottom plate and the mounting plate.
Preferably, the connecting frame comprises a first frame and a second frame which are vertically connected, the first frame is used for being connected with the side plate, and the second frame is used for being connected with the bottom plate.
Preferably, the mounting structure further includes an auxiliary plate for being disposed at a side opposite to the connection frame to support the mounting plate.
Preferably, the auxiliary plate includes a first plate and a second plate vertically disposed, the first plate being adapted to be connected to the side plate, and the second plate being adapted to be connected to the bottom plate.
Preferably, the connecting frame and the auxiliary plate are used for supporting the side plates, so that the sealing enclosing plate is located above the bottom plate, a gap is formed between the lower end of the sealing enclosing plate and the bottom plate, when the condenser is installed in the gap, one side of the condenser is in sealing connection with the lower end of the sealing enclosing plate, and the other side of the condenser is in sealing connection with the bottom plate.
Preferably, the heat dissipation fan is arranged on the panel through the second through hole.
Preferably, the edge of cooling fan is provided with the installation ear, run through on the installation ear and be provided with first mounting hole, be provided with the second mounting hole on the panel, when cooling fan runs through the second runs through mouthful, the installation ear is located the surface of panel, cooling fan is used for passing through the screw first mounting hole with the second mounting hole is in order to be fixed in on the panel.
Another object of the present invention is to provide a heat management device, which includes the above-mentioned mounting structure.
Preferably, the heat management device further comprises a fixing plate, one end of the bottom plate of the mounting structure is connected with the fixing plate, and the fixing plate is provided with a screw hole and a screw.
The advantages of the thermal management device over the prior art are the same as the mounting structure described above and are not described in detail here.
Drawings
Fig. 1 is a schematic view of the overall structure of the present invention;
fig. 2 is a schematic view of the overall structure of the installation structure, the condenser and the cooling fan of the present invention;
fig. 3 is an exploded view of the mounting structure, the condenser and the cooling fan of the present invention;
FIG. 4 is a schematic view of the overall structure of the connecting frame of the present invention;
fig. 5 is a schematic view of the overall structure of the auxiliary plate of the present invention.
Description of reference numerals:
1, a bottom plate; 10 a first through opening; 2, mounting a plate; 21 a faceplate; 22 side plates; 23 a second through opening; 3, connecting frames; 31 a first shelf; 32 a second shelf; 4 an auxiliary plate; 41 a first plate; 42 a second plate; 43 connecting pieces; 5 fixing the plate; 6, a condenser; 7, a heat radiation fan; 70 mounting ears.
Detailed Description
Embodiments of the present application will be described in further detail below with reference to the drawings and examples. The following examples are intended to illustrate the present application but are not intended to limit the scope of the present application.
In the description of the present invention, it is to be understood that the terms "upper", "lower", "front", "rear", "left", "right", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the device or element referred to must have a specific orientation, be constructed in a specific orientation, and be operated, and thus, should not be construed as limiting the present invention.
In the coordinate system XYZ provided herein, the X-axis forward direction represents the right direction, the X-axis reverse direction represents the left direction, the Y-axis forward direction represents the rear direction, the Y-axis reverse direction represents the front direction, the Z-axis forward direction represents the lower direction, and the Z-axis reverse direction represents the upper direction; the Z, X, Y axes are meant only to facilitate description of the invention and to simplify description, and are not meant to indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and are therefore not to be construed as limiting the invention.
Referring to fig. 1 to 5, the mounting structure provided by the present invention is used for mounting a condenser 6 and a heat dissipation fan 7 which need to be hermetically connected, and includes a bottom plate 1 and a mounting plate 2, wherein the bottom plate 1 is provided with a first through hole 10, and the condenser 6 is used for being mounted at the first through hole 10 on the bottom plate 1;
referring to fig. 2-3, the mounting plate 2 includes a panel 21 and a side plate 22 disposed at an edge of the panel 21, a second through hole 23 is disposed on the panel 21, and the heat dissipation fan 7 is configured to be mounted at the second through hole 23 on the panel 21;
the side plates 22 are perpendicular to the panel 21, the side plates 22 are connected end to form a sealing enclosing plate, the second penetrating port 23 is located inside the sealing enclosing plate, and one end, far away from the panel 21, of the sealing enclosing plate is used for being connected with the bottom plate 1, so that the condenser 6 is connected with the heat dissipation fan 7 in a sealing mode.
In this embodiment, the condenser 6 is configured to be mounted on the first through hole 10 of the bottom plate 1, so that an airflow can conveniently pass through the condenser 6 from the first through hole 10, the second through hole 23 of the panel 21 is configured to mount the heat dissipation fan 7, the airflow passes through the condenser 6 from the first through hole 10 and passes through the heat dissipation fan 7 at the second through hole 23, the sealing enclosure is composed of a plurality of side plates 22, and the sealing enclosure is configured to enable a sealing effect between the condenser 6 and the heat dissipation fan 7 to be better, so as to prevent the heat dissipation work of the condenser 6 and the heat dissipation fan 7 from being affected by a gap between the condenser 6 and the heat dissipation fan 7.
Specifically, a plurality of the side plates 22 are connected end to form a sealing enclosure, the shape of the sealing enclosure can be triangular, rectangular, circular or various shapes of the combination of the triangular, rectangular, circular or various shapes, in this embodiment, the condenser 6 is in a rectangular structure, and the shape of the sealing enclosure is preferably rectangular in order to ensure ventilation.
The shape of the first through opening 10 may be triangular, rectangular, circular or various combinations thereof, in this embodiment, the condenser 6 has a rectangular structure, and in order to ensure ventilation, the shape of the first through opening 10 is preferably rectangular; the shape of the second through hole 23 may be triangular, rectangular, circular or a combination thereof, in this embodiment, the heat dissipation fan 7 has a circular structure, and in order to ensure ventilation, the shape of the second through hole 23 is preferably circular.
When the size of the first through opening 10 is smaller than the size of the condenser 6, the condenser 6 may be installed at the lower end of the bottom plate 1, or at the upper end of the bottom plate 1; when the size of the first through opening 10 is matched with the condenser 6, the condenser 6 is clamped with the first through opening 10, and the size of the first through opening 10 cannot be larger than that of the condenser 6.
When the size of the second through hole 23 is smaller than the size of the heat dissipation fan 7, the heat dissipation fan 7 may be installed at the lower end of the panel 21, or at the upper end of the panel 21; when the size of the second through hole 23 is matched with the heat dissipation fan 7, the heat dissipation fan 7 is clamped with the second through hole 23, and the size of the second through hole 23 cannot be larger than that of the heat dissipation fan 7.
In this embodiment, the air flow passes through the condenser 6 at the first through hole 10 and then passes through the heat dissipation fan 7 at the second through hole 23, so that the temperature is reduced, and the heat dissipation function is achieved, the side plate 22 is arranged to enable the condenser 6 and the heat dissipation fan 7 to be connected in a sealing manner, and the phenomenon that the work of the heat dissipation fan 7 of the condenser 6 is affected due to the gap between the condenser 6 and the heat dissipation fan 7 is prevented.
Referring to fig. 3 to 4, preferably, the mounting structure further includes a connection frame 3, the connection frame 3 is used for supporting the mounting plate 2 so that the mounting plate 2 is located above the bottom plate 1, and the condenser 6 is used for being mounted between the bottom plate 1 and the mounting plate 2.
Specifically, evenly be provided with a plurality of mounting holes on the bottom plate 1, condenser 6 is used for passing through bolt and nut cooperation in order to install in be close to on the bottom plate 1 one side of mounting panel 2, just condenser 6 is used for covering first through-hole 10.
In this embodiment, the condenser 6 is installed on the bottom plate 1 at a side close to the installation plate 2, when the heat dissipation fan 7 and the condenser 6 work in a matching manner, the air flow firstly passes through the first through hole 10 and then passes through the condenser 6, and the rectangular structure of the first through hole 10 is matched with the condenser 6, so that the air flow is fully cooled, and the cooling effect is further improved.
Preferably, the connection frame 3 includes a first frame 31 and a second frame 32 which are vertically connected, the first frame 31 is used for connecting with the side plate 22, and the second frame 32 is used for connecting with the bottom plate 1.
Specifically, the first frame 31 and the second frame 32 are vertically arranged, mounting angles are arranged on the first frame 31 and the second frame 32, mounting holes are arranged on the mounting angles, mounting holes are also arranged on the side plate 22 and the bottom plate 1, the mounting holes on the first frame 31 are aligned with the mounting holes on the side plate 22, the mounting holes on the second frame 32 are aligned with the mounting holes on the bottom plate 1, and the first frame 31 is connected with the side plate 22 and the second frame 32 is connected with the bottom plate 1 through the matching of bolts and nuts.
In other embodiments, the first frame 31 and the side plate 22 may be fixedly connected by welding, and the second frame 32 and the bottom plate 1 are detachably connected by bolts and nuts; or, the first frame 31 and the side plate 22 are detachably connected through bolts and nuts, and the second frame 32 and the bottom plate 1 are fixedly connected through welding.
In this embodiment, at least one of the first frame 31 and the side plate 22, and the second frame 32 and the bottom plate 1 is detachably connected, which is favorable for detaching the mounting plate 2 from the bottom plate 1, thereby facilitating the installation of the condenser 6.
Referring to fig. 3 and 5, the mounting structure preferably further includes an auxiliary plate 4, and the auxiliary plate 4 is configured to be disposed at a side opposite to the connection frame 3 to support the mounting plate 2.
Preferably, the auxiliary plate 4 comprises a first plate 41 and a second plate 42 which are vertically arranged, the first plate 41 is used for connecting with the side plate 22, and the second plate 42 is used for connecting with the bottom plate 1.
Specifically, the first plate 41 and the second plate 42 are vertically arranged, the first plate 41 is fixedly connected with the side plate 22 through a connecting piece 43, one end of the connecting piece 43 is connected with the side plate in a welding manner, the other end of the connecting piece 43 is provided with a mounting hole, the first plate 41 is also provided with a mounting hole, the mounting hole on the first plate 41 is aligned with the mounting hole on the connecting piece 43, and the first plate 41 is connected with the connecting piece 43 through matching of a bolt and a nut, or the first plate 41 is fixedly connected with the side plate 22 through welding, and the lower end of the second plate 42 is in contact with the bottom plate 1 and plays a supporting role.
In this embodiment, the first plate 41 is fixedly connected to the side plate 22, and the lower end of the second plate 42 contacts with the bottom plate 1 and plays a supporting role, so that the structure is favorable for supporting the mounting plate 2, and is convenient for disassembling the mounting plate 2, and further convenient for assembling the condenser 6.
Preferably, the connecting frame 3 and the auxiliary plate 4 are used for supporting the side plates 22, so that the sealed enclosure is located above the bottom plate 1, a gap is formed between the lower end of the sealed enclosure and the bottom plate 1, when the condenser 6 is installed in the gap, one side of the condenser 6 is in sealed connection with the lower end of the sealed enclosure, and the other side of the condenser 6 is in sealed connection with the bottom plate 1.
Specifically, the height of the second frame 32 is matched with the height of the second plate 42, after the connecting frame 3 and the auxiliary plate 4 are installed, a gap is formed between the lower end of the sealing enclosure and the bottom plate 1, the gap is matched with the condenser 6, the condenser 6 is installed in the gap, one side of the condenser 6 is hermetically connected with the lower end of the sealing enclosure, and the other side of the condenser 6 is hermetically connected with the bottom plate 1.
In this embodiment, when the condenser 6 is installed in the gap, one side of the condenser 6 is connected to the lower end of the sealing enclosure in a sealing manner, and the other side of the condenser 6 is connected to the bottom plate 1 in a sealing manner, so that the condenser 6 and the mounting plate 2 are connected in a sealing manner, and the air flow passing through the condenser 6 from the gap between the bottom plate 1 and the mounting plate 2 is prevented from causing the reduction of the refrigerating effect.
Preferably, the heat dissipation fan 7 is disposed on the panel 21 through the second through hole 23.
Specifically, when the heat dissipation fan 7 is installed in the second through hole 23, the heat dissipation fan 7 is integrally clamped in the second through hole 23, so that the heat dissipation fan 7 is aligned with the condenser 6.
Referring to fig. 3, preferably, an installation ear 70 is disposed at an edge of the heat dissipation fan 7, a first installation hole is disposed on the installation ear 70 in a penetrating manner, a second installation hole is disposed on the panel 21, when the heat dissipation fan 7 penetrates through the second through hole 23, the installation ear 70 is located on the surface of the panel 21, and the heat dissipation fan 7 is configured to pass through the first installation hole and the second installation hole through a screw to be fixed on the panel 21.
In this embodiment, the heat dissipation fan 7 is fastened to the panel 21 by a bolt and a nut, which is convenient for installation and detachment of the heat dissipation fan 7.
Another object of the present invention is to provide a heat management device, which includes the above-mentioned mounting structure.
Preferably, the thermal management device further comprises a fixing plate 5, one end of the bottom plate 1 of the mounting structure is connected with the fixing plate 5, and the fixing plate 5 is provided with screw holes and screws.
In this embodiment, the screws penetrate through the screw holes to fix the fixing plate 5 in the thermal management device, so as to fix the mounting structure in the thermal management device, and further facilitate mounting the condenser 6 and the heat dissipation fan 7, the condenser 6 and the heat dissipation fan 7 work, air flows into the condenser 6 and then flows through the heat dissipation fan 7, and the condenser 6 and the heat dissipation fan 7 are hermetically connected through the side plate 22, which is beneficial to preventing the air flow from penetrating through the gap between the bottom plate 1 and the mounting plate 2 through the condenser 6, and further beneficial to improving the cooling efficiency and enhancing the heat dissipation effect.
The advantages of the thermal management device over the prior art are the same as the mounting structure described above and are not described in detail here.
Although the present disclosure has been described above, the scope of the present disclosure is not limited thereto. Various changes and modifications may be made by those skilled in the art without departing from the spirit and scope of the disclosure, and these changes and modifications are intended to fall within the scope of the invention.
Claims (10)
1. A mounting structure is used for mounting a condenser (6) and a heat dissipation fan (7) which need to be connected in a sealing manner, and is characterized by comprising a bottom plate (1) and a mounting plate (2), wherein a first through opening (10) is formed in the bottom plate (1), and the condenser (6) is used for being mounted at the first through opening (10) on the bottom plate (1);
the mounting plate (2) comprises a panel (21) and a side plate (22) arranged at the edge of the panel (21), a second through hole (23) is formed in the panel (21), and the heat dissipation fan (7) is arranged at the second through hole (23) on the panel (21);
the side plates (22) are perpendicular to the panel (21), the side plates (22) are connected end to form a sealing enclosing plate, the second penetrating port (23) is located inside the sealing enclosing plate, and one end, far away from the panel (21), of the sealing enclosing plate is used for being connected with the bottom plate (1).
2. The mounting structure according to claim 1, further comprising a connection frame (3), the connection frame (3) being configured to support the mounting plate (2) such that the mounting plate (2) is located above the base plate (1), the condenser (6) being configured to be mounted between the base plate (1) and the mounting plate (2).
3. The mounting structure according to claim 2, wherein the connecting frame (3) comprises a first frame (31) and a second frame (32) connected vertically, the first frame (31) being adapted to be connected to the side plate (22), the second frame (32) being adapted to be connected to the bottom plate (1).
4. The mounting structure according to claim 3, further comprising an auxiliary plate (4), the auxiliary plate (4) being adapted to be disposed on a side opposite to the attachment frame (3) to support the mounting plate (2).
5. The mounting structure according to claim 4, wherein the auxiliary plate (4) comprises a first plate (41) and a second plate (42) arranged vertically, the first plate (41) being adapted to be connected to the side plate (22), the second plate (42) being adapted to be connected to the base plate (1).
6. The mounting structure according to claim 5, wherein the connecting frame (3) and the auxiliary plate (4) are used to support the side plates (22) such that the sealing enclosure is located above the bottom plate (1) with a space between the lower end of the sealing enclosure and the bottom plate (1), and when the condenser (6) is mounted in the space, one side of the condenser (6) is hermetically connected to the lower end of the sealing enclosure, and the other side of the condenser (6) is hermetically connected to the bottom plate (1).
7. The mounting structure according to claim 1, wherein the heat dissipation fan (7) is configured to be penetratingly disposed on the panel (21) through the second penetration opening (23).
8. The mounting structure according to claim 7, wherein a mounting ear (70) is provided at an edge of the heat dissipation fan (7), a first mounting hole is provided through the mounting ear (70), a second mounting hole is provided on the panel (21), when the heat dissipation fan (7) penetrates through the second penetration opening (23), the mounting ear (70) is located on a surface of the panel (21), and the heat dissipation fan (7) is configured to pass through the first mounting hole and the second mounting hole by screws to be fixed on the panel (21).
9. A thermal management device comprising the mounting structure of any one of claims 1 to 8.
10. The heat management device according to claim 9, further comprising a fixing plate (5), wherein one end of the base plate (1) of the mounting structure is connected with the fixing plate (5), and the fixing plate (5) is provided with screw holes and provided with screws.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222571059.9U CN218788898U (en) | 2022-09-27 | 2022-09-27 | Mounting structure and thermal management device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222571059.9U CN218788898U (en) | 2022-09-27 | 2022-09-27 | Mounting structure and thermal management device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN218788898U true CN218788898U (en) | 2023-04-04 |
Family
ID=86505043
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202222571059.9U Active CN218788898U (en) | 2022-09-27 | 2022-09-27 | Mounting structure and thermal management device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN218788898U (en) |
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2022
- 2022-09-27 CN CN202222571059.9U patent/CN218788898U/en active Active
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