CN218787545U - Air-cooled heat dissipation type semiconductor lighting module - Google Patents
Air-cooled heat dissipation type semiconductor lighting module Download PDFInfo
- Publication number
- CN218787545U CN218787545U CN202221943991.3U CN202221943991U CN218787545U CN 218787545 U CN218787545 U CN 218787545U CN 202221943991 U CN202221943991 U CN 202221943991U CN 218787545 U CN218787545 U CN 218787545U
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- heat dissipation
- air
- type semiconductor
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- lighting module
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- 230000017525 heat dissipation Effects 0.000 title claims abstract description 24
- 239000004065 semiconductor Substances 0.000 title claims abstract description 19
- 239000002184 metal Substances 0.000 claims abstract description 24
- 238000001816 cooling Methods 0.000 claims abstract description 14
- 238000010438 heat treatment Methods 0.000 claims abstract description 6
- 239000003292 glue Substances 0.000 claims description 3
- 238000009825 accumulation Methods 0.000 abstract description 2
- 230000000694 effects Effects 0.000 abstract description 2
- 238000000034 method Methods 0.000 description 5
- 230000009471 action Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 238000004026 adhesive bonding Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 230000003014 reinforcing effect Effects 0.000 description 1
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- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
Abstract
The utility model provides an air-cooled heat dissipation type semiconductor lighting module, including the module mount pad, be equipped with the cooling heat dissipation chamber in the module mount pad, and the bottom installs the electronic plate, the bottom of electronic plate is provided with the semiconductor module, and upper portion is equipped with the heating panel through heat conduction sticker, and spaced running through on the upper and lower chamber wall in cooling heat dissipation chamber is equipped with a plurality of wind holes, installs the metal tuber pipe in the wind hole, has a plurality of louvres along week division on the pipe wall of metal tuber pipe. The utility model discloses a mode of cold and hot air convection heat transfer reduces LED's heat accumulation, and the radiating efficiency is high, and the radiating effect is good to reduce calorific capacity, reduced LED's light decay effectively, make the LED street lamp really accomplish long-life.
Description
Technical Field
The utility model relates to the field of lighting, specifically be an air-cooled heat dissipation type semiconductor lighting module.
Background
With the progress of the LED technology in recent years, the LED lighting device will be an optimal lighting method because of its advantages of low power consumption, long service life, high brightness, environmental protection, etc., and is a necessary trend in development to replace the traditional street lamp.
Semiconductor lighting module is the illuminating part in the present LED street lamp body, semiconductor lighting module's luminous efficacy can only reach about 30%, and most energy conversion has become heat energy, if these heats can not in time distribute out, will cause semiconductor lighting module's temperature to rise, temperature rise will lead to the light intensity to reduce, luminous efficacy reduces, can accelerate LED's light decay simultaneously, seriously influence LED's normal life, and the long-time work of semiconductor lighting module has been unable to be satisfied to the heat dissipation mode of traditional dress radiator additional.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide an air-cooled heat dissipation type semiconductor lighting module to solve the problem that proposes in the above-mentioned background art.
In order to solve the technical problem, the utility model provides a following technical scheme: the utility model provides an air-cooled heat dissipation type semiconductor lighting module, includes the module mount pad, be equipped with the cooling heat dissipation chamber in the module mount pad, and the bottom installs the electronic plate, the bottom of electronic plate is provided with the semiconductor module, and upper portion is equipped with the heating panel through heat conduction gluing subsides, spaced running through on the upper and lower chamber wall in cooling heat dissipation chamber is equipped with a plurality of wind holes, install the metal tuber pipe in the wind hole, it has a plurality of louvres to open along week on the pipe wall of metal tuber pipe.
And a heat-conducting metal piece is fixedly connected to an air opening at the bottom end of the metal air pipe, and the bottom end of the heat-conducting metal piece is embedded into the heat dissipation plate.
And cooling sheets are arranged between the metal air pipes.
Compared with the prior art, the utility model discloses the beneficial effect who reaches is: the utility model discloses a mode of cold and hot air convection heat transfer reduces LED's heat accumulation, and the radiating efficiency is high, and the radiating effect is good to reduce calorific capacity, reduced LED's light decay effectively, make the LED street lamp really accomplish long-life.
Drawings
The accompanying drawings are included to provide a further understanding of the invention, and are incorporated in and constitute a part of this specification. In the drawings:
fig. 1 is a schematic structural diagram of embodiment 1 of the present invention;
fig. 2 is a schematic structural diagram of embodiment 2 of the present invention;
in the figure: 1, a module mounting seat; 2 cooling the heat dissipation cavity; 3 an electronic board; 4 a semiconductor module; 5, heat-conducting glue; 6 heat dissipation plate; 7, air holes; 8, a metal air pipe; 9 heat dissipation holes; 10 a heat-conducting metal piece; 11 cooling the flakes.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts all belong to the protection scope of the present invention.
Referring to fig. 1-2, the present invention provides a technical solution: the utility model provides an air-cooled heat dissipation type semiconductor lighting module, includes module mount pad 1, be equipped with cooling heat dissipation chamber 2 in the module mount pad 1, and the bottom installs electronic plate 3, the bottom of electronic plate 3 is provided with semiconductor module 4, and upper portion is equipped with heating panel 6 through 5 pastes of heat conducting glue, spaced running through on the upper and lower chamber wall in cooling heat dissipation chamber 2 is equipped with a plurality of wind holes 7, install metal tuber pipe 8 in the wind hole 7, it has a plurality of louvres 9 to open along week on the pipe wall of metal tuber pipe 8.
The rigid coupling of 8 bottom wind vents of metal tuber pipe department has heat conduction metalwork 10, the bottom embedding of heat conduction metalwork 10 on the heating panel 6, increase and the area of contact of heating panel 6, and then improved the efficiency of heat exchange, then the radiating efficiency improves greatly.
And cooling sheets 11 are arranged between the metal air pipes 8, and the cooling sheets 11 can absorb heat, so that the heat dissipation efficiency is increased.
A magnet ring is arranged on the inner side wall of the air hole 7, so that the metal air pipe 8 can be inserted into the air hole 7 and adsorbed in the air hole 7 through the magnet ring; or the inner side wall of the air hole 7 is provided with threads, the outer side wall of the metal air pipe 8 is provided with external threads, and the metal air pipe 8 is screwed into the air inlet hole 7 in a threaded connection mode.
The utility model discloses a convection current of the inside and outside air of louvre 9 reinforcing on the metal tuber pipe 8 and then has improved the efficiency of heat exchange, then has improved the radiating efficiency greatly.
It is noted that relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.
Finally, it should be noted that: although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications may be made to the embodiments described above, or equivalents may be substituted for elements thereof. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (3)
1. The utility model provides an air-cooled heat dissipation type semiconductor lighting module which characterized in that: including module mount pad (1), be equipped with cooling heat dissipation chamber (2) in module mount pad (1), and the bottom installs electronic plate (3), the bottom of electronic plate (3) is provided with semiconductor module (4), and upper portion pastes through heat conduction glue (5) and is equipped with heating panel (6), spaced running through is equipped with a plurality of wind holes (7) on the upper and lower chamber wall in cooling heat dissipation chamber (2), install metal tuber pipe (8) in wind hole (7), it has a plurality of louvres (9) to open along week on the pipe wall of metal tuber pipe (8).
2. The air-cooled heat dissipation type semiconductor lighting module according to claim 1, wherein: and a heat-conducting metal piece (10) is fixedly connected to an air opening at the bottom end of the metal air pipe (8), and the bottom end of the heat-conducting metal piece (10) is embedded into the heat-radiating plate (6).
3. The air-cooled heat dissipation type semiconductor lighting module according to claim 1, wherein: and cooling sheets (11) are arranged between the metal air pipes (8).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221943991.3U CN218787545U (en) | 2022-07-26 | 2022-07-26 | Air-cooled heat dissipation type semiconductor lighting module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221943991.3U CN218787545U (en) | 2022-07-26 | 2022-07-26 | Air-cooled heat dissipation type semiconductor lighting module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN218787545U true CN218787545U (en) | 2023-04-04 |
Family
ID=86504973
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202221943991.3U Expired - Fee Related CN218787545U (en) | 2022-07-26 | 2022-07-26 | Air-cooled heat dissipation type semiconductor lighting module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN218787545U (en) |
-
2022
- 2022-07-26 CN CN202221943991.3U patent/CN218787545U/en not_active Expired - Fee Related
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| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20230404 |