CN218786355U

CN218786355U - Wafer storage mechanism

Info

Publication number: CN218786355U
Application number: CN202222819602.2U
Authority: CN
Inventors: 杨阳; 董海杰; 杨振华; 管家辉
Original assignee: Wuxi Shangji Automation Co Ltd
Current assignee: Hoyuan Green Energy Co ltd
Priority date: 2022-10-25
Filing date: 2022-10-25
Publication date: 2023-04-04
Anticipated expiration: 2032-10-25

Abstract

The utility model discloses a wafer storage mechanism, belong to the machining field, a wafer storage mechanism, including multidirectional regulation support, the multidirectional regulation support is gone up fixedly connected with sucking disc support, the first negative pressure adsorption piece of upside fixedly connected with of sucking disc support, be provided with the second joint on the first negative pressure adsorption piece, the downside fixedly connected with second negative pressure adsorption piece of first negative pressure adsorption piece, be equipped with first joint on the second negative pressure adsorption piece, multidirectional regulation support is including the frame, Y axle traveling cylinder is installed to the front side of frame, the output fixedly connected with of Y axle traveling cylinder sways the cylinder, the output fixedly connected with of swaying the cylinder sways the arm, and it links to each other with the sucking disc support to sway the arm, it can realize, when keeping low cost, reduce the dust volume of adhesion when taking on the wafer that washs the completion, reduce the device and cause secondary pollution to the wafer that washs the completion.

Description

Wafer storage mechanism

Technical Field

The utility model relates to a machining field, more specifically say, relate to a wafer receiving mechanism.

Background

The wafer refers to a silicon wafer used for manufacturing a silicon semiconductor integrated circuit; various circuit element structures can be processed and manufactured on a silicon wafer to form an integrated circuit product with a specific electrical function, in the processing process, the grinding of the wafer is an important step, grinding equipment is needed to grind the wafer, cleaning equipment is needed to clean dust generated when the wafer is ground after the grinding is finished, and the wafer is moved to the next step after the cleaning is finished;

the wafer storage mechanism comprises a grinding device, a cleaning device, a storage and taking device and a taking device, wherein the wafer is moved from the grinding device to the cleaning device and moved from the cleaning device to the next process, the storage and taking device is used for moving the wafer, a plurality of factories can use the same storage and taking device to complete the two moving processes for reducing cost, however, when the storage and taking device moves the wafer from the grinding device to the cleaning device, dust generated during grinding of the wafer can be adhered to the storage and taking device, when the storage and taking device takes the cleaned wafer again, the dust adhered to the storage and taking device can be adhered to the wafer again, secondary pollution is caused to the wafer, and therefore the wafer storage mechanism is provided.

SUMMERY OF THE UTILITY MODEL

1. Technical problem to be solved

To the problem that exists among the prior art, the utility model aims to provide a wafer receiving mechanism, it can realize, when keeping the low-cost, reduces the dust volume of adhesion when taking on the wafer that washs the completion, reduces the device and causes secondary pollution to the wafer that washs the completion.

2. Technical scheme

In order to solve the above problems, the utility model adopts the following technical proposal.

The utility model provides a wafer storage mechanism, includes the multidirectional support of adjusting, fixedly connected with sucking disc support on the multidirectional support of adjusting, the first negative pressure of upside fixedly connected with of sucking disc support adsorbs the piece, be provided with the second on the first negative pressure adsorbs the piece and connects, the downside fixedly connected with second negative pressure that first negative pressure adsorbed the piece adsorbs the piece, the second negative pressure adsorbs and is equipped with first joint on the piece.

Further, multidirectional regulation support is including the frame, Y axle moving cylinder is installed to the front side of frame, the output fixedly connected with who sways the cylinder of Y axle moving cylinder sways the cylinder, the output fixedly connected with who sways the cylinder sways the arm, just it links to each other with the sucking disc support to sway the arm.

Furthermore, the front side of the rack is fixedly connected with a circulating linear guide rail, and the Y-axis moving cylinder is connected with the swinging cylinder.

Further, a hydraulic buffer is arranged on the swing cylinder.

Further, first negative pressure adsorbs the piece including the plate body that links to each other with the sucking disc support, the upside fixedly connected with casing of plate body, two negative pressure chambeies have been seted up to the inside of casing, the equal fixedly connected with gasket of opening part of plate body one end is kept away from in the negative pressure chamber, go back two air cocks of fixedly connected with on the plate body, two the air cock is linked together with two negative pressure chambeies respectively, and two the air cock all connects the intercommunication with the second.

Further, the inside in negative pressure chamber still is equipped with the push cylinder, the one end and the gas nozzle of push cylinder meet, the other end and the gasket of push cylinder offset.

3. Advantageous effects

Compared with the prior art, the utility model has the advantages of:

(1) This scheme adsorbs the piece through the second negative pressure and takes the wafer that the grinding was accomplished, adsorbs the piece through first negative pressure and takes the wafer that the washing was accomplished, and the dust adhesion of adhesion is again on the wafer of washing completion when can avoiding the second negative pressure to adsorb the piece and take the wafer that the grinding was accomplished, and the reducing mechanism causes secondary pollution to the wafer that washs the completion, and need not set up second platform equipment and take the wafer, and the cost is lower.

Drawings

Fig. 1 is a front view of the structure of the present invention;

FIG. 2 is a side view of the structure of the present invention;

fig. 3 is a top view of the structure of the present invention;

fig. 4 is the first negative pressure adsorption piece of the present invention, which is a schematic view of the sectioning structure.

The reference numbers in the figures illustrate:

1. a frame; 2. a circulating linear guide rail; 3. a Y-axis moving cylinder; 4. a hydraulic buffer; 5. a swing cylinder; 6. a swing arm; 7. a first negative pressure adsorption member; 8. a second negative pressure adsorption member; 9. a first joint; 10. a second joint; 11. a suction cup holder; 71. a plate body; 72. a housing; 73. a negative pressure chamber; 74. a gasket; 75. an air faucet; 76. and a pushing cylinder.

Detailed Description

The technical solution in the embodiment of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiment of the present invention; obviously, the described embodiments are only a part of the embodiments of the present invention, and not all embodiments, and all other embodiments obtained by those skilled in the art without making creative efforts based on the embodiments of the present invention belong to the protection scope of the present invention.

Example (b):

referring to fig. 1-4, a wafer accommodating mechanism includes a multi-directional adjusting bracket, a suction cup bracket 11 is fixedly connected to the multi-directional adjusting bracket, a first negative pressure adsorption member 7 is fixedly connected to the upper side of the suction cup bracket 11, a second joint 10 is arranged on the first negative pressure adsorption member 7, a second negative pressure adsorption member 8 is fixedly connected to the lower side of the first negative pressure adsorption member 7, a first joint 9 is assembled on the second negative pressure adsorption member 8, and both the first joint 9 and the second joint 10 can be used for connecting a vacuum generator to realize vacuum adsorption;

at the moment, the suction cup support 11 can be driven to move by starting the multidirectional adjusting support, the position of the suction cup support 11 is adjusted, the suction cup support 11 is made to move to the upper side of a ground wafer, the wafer is adsorbed and taken by the second negative pressure adsorbing part 8, then the wafer is moved to cleaning equipment by starting the multidirectional adjusting support, the wafer is cleaned by the cleaning equipment, then the wafer is taken from the lower side of the wafer by the first negative pressure adsorbing part 7, and the wafer is conveniently taken by other equipment from the upper side of the wafer;

simultaneously, adsorb 8 through the second negative pressure and take the wafer that the grinding was accomplished, adsorb 7 through first negative pressure and take the wafer that the washing was accomplished, the dust adhesion once more on the wafer that the washing was accomplished when can avoiding the wafer that the grinding was accomplished of taking of second negative pressure adsorption piece 8, the reduction gear causes secondary pollution to the wafer that the washing was accomplished.

Referring to fig. 1-3, the multi-directional adjusting bracket includes a frame 1, a Y-axis moving cylinder 3 is installed at the front side of the frame 1, a swing cylinder 5 is fixedly connected to an output end of the Y-axis moving cylinder 3 for driving the swing cylinder 5 to move vertically, a swing arm 6 is fixedly connected to an output end of the swing cylinder 5 for driving the swing arm 6 to swing left and right, and the swing arm 6 is connected to a suction cup bracket 11, at this time, the heights of the first negative pressure adsorbing member 7 and the second negative pressure adsorbing member 8 can be adjusted by starting the Y-axis moving cylinder 3, and after the adjustment is completed, the horizontal positions of the first negative pressure adsorbing member 7 and the second negative pressure adsorbing member 8 can be adjusted by starting the swing cylinder 5, thereby adjusting the positions of the first negative pressure adsorbing member 7 and the second negative pressure adsorbing member 8.

Specifically, as shown in fig. 1 and 3, a circulating linear guide rail 2 is fixedly connected to the front side of the frame 1, the Y-axis moving cylinder 3 is connected to the swing cylinder 5, and at this time, the swing cylinder 5 can only vertically move by guiding the swing cylinder 5 by the Y-axis moving cylinder 3, and the swing cylinder 5 is reinforced by the Y-axis moving cylinder 3 and the swing cylinder 5, so as to improve the stability thereof.

Referring to fig. 1-2, in order to reduce damage caused by the excessively fast movement of the rocking cylinder 5, the rocking cylinder 5 is provided with a hydraulic buffer 4.

As shown in fig. 3-4, the first negative pressure absorbing member 7 includes a plate body 71 connected to the suction cup support 11, a casing 72 is fixedly connected to an upper side of the plate body 71, two negative pressure cavities 73 are formed inside the casing 72, a gasket 74 is fixedly connected to an opening of the negative pressure cavity 73, which is away from one end of the plate body 71, and is used for sealing the opening of the negative pressure cavity 73, two air nozzles 75 are also fixedly connected to the plate body 71, the two air nozzles 75 are respectively communicated with the two negative pressure cavities 73, and the two air nozzles 75 are both communicated with the second connector 10, at this time, when the gasket 74 and the wafer are attached, air inside the negative pressure cavity 73 can be extracted through the second connector 10 and the air nozzles 75, so as to reduce the air pressure thereof, and generate negative pressure to absorb the gasket 74, thereby making a central region of the gasket 74 concave, and at this time, negative pressure is generated between the gasket 74 and the wafer, thereby completing the absorption;

meanwhile, in order to more conveniently detach the wafer, the pushing cylinder 76 is further assembled inside the negative pressure cavity 73, one end of the pushing cylinder 76 is connected with the air nozzle 75, the other end of the pushing cylinder 76 abuts against the gasket 74, at the moment, gas is transmitted to the pushing cylinder 76 through the air nozzle 75, the pushing cylinder 76 can be started to push the gasket 74, and negative pressure between the gasket 74 and the wafer is eliminated.

When in use: can drive sucking disc support 11 through starting multidirectional regulation support and remove, adjust sucking disc support 11's position, make sucking disc support 11 remove to the wafer upside that the grinding was accomplished, adsorb 8 through the second negative pressure and adsorb the wafer and take, then remove the wafer to cleaning equipment through starting multidirectional regulation support on, wash the wafer through cleaning equipment, then the downside of following the wafer through first negative pressure adsorbs 7 and takes the wafer, make things convenient for all the other equipment to take the wafer from the upside of wafer, and need not set up second platform equipment and take the wafer, the cost is lower.

The above description is only the preferred embodiment of the present invention; the scope of the present invention is not limited thereto. Any person skilled in the art should also be able to cover the technical scope of the present invention by replacing or changing the technical solution and the improvement concept of the present invention with equivalents and modifications within the technical scope of the present invention.

Claims

1. The utility model provides a wafer receiving mechanism, includes multidirectional regulation support, its characterized in that: fixedly connected with sucking disc support (11) on the multidirectional regulation support, the first negative pressure of upside fixedly connected with of sucking disc support (11) adsorbs piece (7), be provided with second joint (10) on first negative pressure adsorbs piece (7), the downside fixedly connected with second negative pressure that first negative pressure adsorbed piece (7) adsorbs piece (8), the second negative pressure adsorbs and is equipped with first joint (9) on piece (8).

2. The wafer receiving mechanism of claim 1, wherein: the multidirectional regulation support is including frame (1), Y axle removal cylinder (3) are installed to the front side of frame (1), the output fixedly connected with who Y axle removed cylinder (3) sways cylinder (5), the output fixedly connected with who sways cylinder (5) sways arm (6), just it links to each other with sucking disc support (11) to sway arm (6).

3. The wafer receiving mechanism of claim 2, wherein: the front side of the rack (1) is fixedly connected with a circulating linear guide rail (2), and the Y-axis moving cylinder (3) is connected with the swing cylinder (5).

4. The wafer receiving mechanism of claim 2, wherein: and a hydraulic buffer (4) is assembled on the swing cylinder (5).

5. The wafer receiving mechanism of claim 1, wherein: first negative pressure adsorbs piece (7) including plate body (71) that link to each other with sucking disc support (11), upside fixedly connected with casing (72) of plate body (71), two negative pressure chamber (73) have been seted up to the inside of casing (72), the equal fixedly connected with gasket (74) of opening part of plate body (71) one end is kept away from in negative pressure chamber (73), go back two air cock (75) of fixedly connected with on plate body (71), two air cock (75) are linked together with two negative pressure chamber (73) respectively, and two air cock (75) all communicate with second joint (10).

6. The wafer receiving mechanism of claim 5, wherein: the inside of negative pressure chamber (73) still is equipped with and promotes cylinder (76), the one end and the air cock (75) of promoting cylinder (76) meet, the other end and the gasket (74) of promoting cylinder (76) offset.