CN218785473U - Electrostatic sand-planting sponge sand - Google Patents
Electrostatic sand-planting sponge sand Download PDFInfo
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- CN218785473U CN218785473U CN202222993448.0U CN202222993448U CN218785473U CN 218785473 U CN218785473 U CN 218785473U CN 202222993448 U CN202222993448 U CN 202222993448U CN 218785473 U CN218785473 U CN 218785473U
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02A—TECHNOLOGIES FOR ADAPTATION TO CLIMATE CHANGE
- Y02A40/00—Adaptation technologies in agriculture, forestry, livestock or agroalimentary production
- Y02A40/10—Adaptation technologies in agriculture, forestry, livestock or agroalimentary production in agriculture
- Y02A40/22—Improving land use; Improving water use or availability; Controlling erosion
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Abstract
The utility model relates to a sponge sand technical field just discloses an static sand planting sponge sand, including the sponge layer, the top fixed mounting of sponge layer has the viscose layer, the top fixed mounting of viscose layer has the base plate layer, the top fixed mounting of base plate layer has the primer layer, sand grain has been laid at the top of primer layer, the top fixed mounting of primer layer has the compound glue film, the inside fixed mounting of base plate layer has reinforcing mechanism; the reinforcing mechanism is including reinforcing rod and anchor post, the both ends at the reinforcing rod are installed to the anchor post, the reinforcing rod is inlayed in the inside on base plate layer. This sand sponge sand is planted to static through fixed mounting on the base plate layer has multiunit strengthening mechanism, and wherein the anchor strut has one end to extend to the primer layer, and one end extends to the sponge layer, deuterogamies the anchor head, and in case primer layer and viscose layer solidification, strengthening mechanism will strengthen the connection performance between sand grain layer and the sponge layer.
Description
Technical Field
The utility model relates to a sponge sand technical field specifically is a sand sponge sand is planted to static.
Background
The sand grains of the electrostatic sand planting are absorbed by the electrostatic field force, and the shapes of the sand grains are different. However, it is generally considered that the action point of the electric field force acts on the gravity center of the sand grains, so that the large heads of the sand grains face inwards, the small heads of the sand grains face outwards, the large heads are firmly adhered to the belt base by the glue, and the sand paper abrasive cloth is sharpened with the outward pointed heads.
In order to perform electrostatic sand planting on the sponge, the connectivity between the sponge and sand grains needs to be considered, and at present, the sand grain layer is glued on the sponge, so that the connection between the sponge and the sand grains is not firm enough, and the sand grains and the sponge are easy to separate when the sponge sand is used, so that the polishing effect of the sponge sand is poor.
SUMMERY OF THE UTILITY MODEL
Technical problem to be solved
Not enough to prior art, the utility model provides a sand sponge sand is planted to static possesses firm in connection's advantage, has solved sand grain layer and has glued on the sponge, leads to connecting firm problem inadequately between the two.
(II) technical scheme
For the purpose of realizing above-mentioned firm in connection, the utility model provides a following technical scheme: the electrostatic sand-planting sponge sand comprises a sponge layer, wherein a viscose layer is fixedly mounted at the top of the sponge layer, a substrate layer is fixedly mounted at the top of the viscose layer, a bottom glue layer is fixedly mounted at the top of the substrate layer, sand grains are laid at the top of the bottom glue layer, a composite glue layer is fixedly mounted at the top of the bottom glue layer, and a reinforcing mechanism is fixedly mounted inside the substrate layer;
the reinforcing mechanism is including reinforcing rod and anchor post, the both ends at the reinforcing rod are installed to the anchor post, the reinforcing rod is inlayed in the inside on base plate layer.
Preferably, the top of the sand grains extends to the outside of the size coat, and a space exists between the bottom of the sand grains and the substrate layer.
Preferably, one end of the reinforcing rod extends to the bottom glue layer, and the other end of the reinforcing rod extends to the inner part of the sponge layer.
Preferably, the substrate layer and the reinforcing mechanism are integrally formed.
Preferably, the thickness of the primer layer is greater than that of the compound adhesive layer.
(III) advantageous effects
Compared with the prior art, the utility model provides a sand sponge sand is planted to static possesses following beneficial effect:
this sand sponge sand is planted to static through fixed mounting on the base plate layer has multiunit strengthening mechanism, and wherein anchor strut one end extends to the primer layer, and one end extends to the sponge layer, deuterogamies the anchor head, and in case primer layer and viscose layer solidification, strengthening mechanism will strengthen the connection performance between sand grain layer and the sponge layer.
Drawings
FIG. 1 is a schematic view of the present invention;
fig. 2 is the structural schematic diagram of the reinforcing mechanism of the present invention.
In the figure: 1-sponge layer, 2-viscose layer, 3-substrate layer, 4-primer layer, 5-sand, 6-compound glue layer, 7-reinforcing mechanism, 71-reinforcing rod and 72-reinforcing head.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Please refer to fig. 1, an electrostatic sand-planting sponge sand, comprising a sponge layer 1, a viscose layer 2 is fixedly mounted at the top of the sponge layer 1, a substrate layer 3 is fixedly mounted at the top of the viscose layer 2, a primer layer 4 is fixedly mounted at the top of the substrate layer 3, sand grains 5 are laid at the top of the primer layer 4, a gap exists between the bottom of the sand grains 5 and the substrate layer 3, a complex glue layer 6 is fixedly mounted at the top of the primer layer 4, the top of the sand grains 5 extends to the outer side of the complex glue layer 6, the thickness of the primer layer 4 is greater than that of the complex glue layer 6, and the complex glue layer 6 also covers the sand grains 5, so that a sand grain layer can be formed between the primer layer 4 and the complex glue layer 6. The inside fixed mounting on base plate layer 3 has strengthening mechanism 7, and base plate layer 3 and strengthening mechanism 7 integrated into one piece adopt viscose layer 2 to bond sponge layer 1, consequently all be full of glue in the inside of the 5 millimeters thickness at sponge layer 1 top, then bond together with reinforcement head 72, strengthen the connection performance.
The reinforcing mechanism 7 comprises a reinforcing rod 71 and a reinforcing head 72, the reinforcing head 72 is installed at two ends of the reinforcing rod 71, the reinforcing rod 71 is embedded inside the substrate layer 3, one end of the reinforcing rod 71 extends to the bottom glue layer 4, and the other end of the reinforcing rod extends to the inside of the sponge layer 1.
The working principle is as follows: when using, through fixed mounting has multiunit strengthening mechanism 7 on base plate layer 3, wherein reinforcement bar 71 one end extends to primer layer 4, one end extends to the sponge layer 1, deuterogamies and adds the bonding tool 72, in case primer layer 4 and the solidification of viscose layer 2, strengthening mechanism 7 will strengthen the connection performance between sand grain layer and the sponge layer 1.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (5)
1. The utility model provides an electrostatic sand-planting sponge sand, includes sponge layer (1), its characterized in that: the top of the sponge layer (1) is fixedly provided with a viscose layer (2), the top of the viscose layer (2) is fixedly provided with a substrate layer (3), the top of the substrate layer (3) is fixedly provided with a bottom glue layer (4), the top of the bottom glue layer (4) is paved with sand grains (5), the top of the bottom glue layer (4) is fixedly provided with a composite glue layer (6), and the interior of the substrate layer (3) is fixedly provided with a reinforcing mechanism (7);
reinforcing mechanism (7) are including reinforcing rod (71) and reinforcement head (72), reinforcing head (72) are installed at the both ends of reinforcing rod (71), reinforcing rod (71) are inlayed in the inside on base plate layer (3).
2. The electrostatic sand-planting sponge sand as claimed in claim 1, wherein: the tops of the sand grains (5) extend to the outer side of the compound glue layer (6), and a space exists between the bottoms of the sand grains (5) and the substrate layer (3).
3. The electrostatic sand-planting sponge sand as claimed in claim 1, wherein: one end of the reinforcing rod (71) extends to the bottom glue layer (4), and the other end of the reinforcing rod extends to the interior of the sponge layer (1).
4. The electrostatic sand-planting sponge sand as claimed in claim 1, wherein: the substrate layer (3) and the reinforcing mechanism (7) are integrally formed.
5. The electrostatic sand-planting sponge sand as claimed in claim 1, wherein: the thickness of the bottom glue layer (4) is larger than that of the compound glue layer (6).
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202222993448.0U CN218785473U (en) | 2022-11-10 | 2022-11-10 | Electrostatic sand-planting sponge sand |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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CN202222993448.0U CN218785473U (en) | 2022-11-10 | 2022-11-10 | Electrostatic sand-planting sponge sand |
Publications (1)
Publication Number | Publication Date |
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CN218785473U true CN218785473U (en) | 2023-04-04 |
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CN202222993448.0U Active CN218785473U (en) | 2022-11-10 | 2022-11-10 | Electrostatic sand-planting sponge sand |
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CN (1) | CN218785473U (en) |
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2022
- 2022-11-10 CN CN202222993448.0U patent/CN218785473U/en active Active
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