CN218778881U - Gum film for metal dome sheet - Google Patents

Abstract

The utility model discloses a back adhesive film for a dome sheet, which comprises a back adhesive layer, a positioning layer adhered to the first surface of the back adhesive layer, a limiting layer adhered to the second surface of the back adhesive layer, and a film covering layer adhered to the other surface of the limiting layer; the film coating layer is release paper which can be torn off from the limiting layer; the limiting layer is provided with a plurality of first through holes for positioning the sticking positions of the metal dome sheets to be installed on the gum layer, and the first through holes enable the limiting layer not to interfere with the metal dome sheets when the limiting layer is separated from the gum layer; the back glue layer is used for bonding the metal dome sheet with the circuit board to be provided with the metal dome sheet. Tearing off the film covering layer, enabling the metal dome sheet to penetrate through the first through hole in the limiting layer and be reversely pasted on the back glue layer, tearing off the limiting layer, pasting the back glue film with the circuit board, and tearing off the positioning layer, so that the metal dome sheet can be installed, and the metal dome sheet is simple to use and convenient to operate; and the whole circuit board can be pressed to mount all metal dome sheets at one time, the metal dome sheet bonding effect is good, and the production efficiency is high.

Description

Gum film for metal dome sheet

Technical Field

The utility model relates to a metal dome installation technical field especially relates to a metal dome is with gum membrane.

Background

The snap dome is a simple electronic key, has the advantages of low height, small volume and low price, and is widely applied to the electronic industry. The metal dome is applied to a large number of key PCBA (Printed Circuit Board Assembly) products, the metal dome is mounted on a PCB (Printed Circuit Board) Circuit Board through welding or pasting, and when the metal dome is pressed, the metal dome is conducted with a Circuit on the PCB Circuit Board, so that the electrical function of the metal dome is realized.

Some metal dome sheets made of special materials and small-size metal dome sheets cannot be mounted on the PCB by using a welding process, and the metal dome sheets can only be adhered to action positions by using transparent adhesive tapes. However, the dome body is not easy to install because of its small volume. In addition, as the circuit board is smaller and the number of the special-shaped circuit boards is larger, the standard back glue mode is not suitable for a small or special-shaped board, and the snap dome needs to be installed manually. The operation is inconvenient and the production efficiency is low by manually installing the metal dome sheets, and the metal dome sheets are difficult to be positioned in a standard way by manually installing the metal dome sheets, so that the qualification rate of products is influenced.

The above disclosure of the background art is only used for assisting understanding of the conception and technical solution of the present invention, and does not necessarily belong to the prior art of the present patent application, nor does it necessarily give technical teaching; the above background should not be used to assess the novelty and inventive aspects of the present application in the absence of express evidence that the above disclosure is published prior to the filing date of the present patent application.

SUMMERY OF THE UTILITY MODEL

The utility model aims at providing a metal dome is gum membrane for piece, simple to use, convenient operation can be applied to the PCB board of various shapes, realizes the whole once-through installation of PCB board and has whole metal dome, and production efficiency is high.

In order to achieve the above purpose, the utility model adopts the following technical scheme:

a back adhesive film for a metal dome comprises a back adhesive layer, a positioning layer adhered to a first surface of the back adhesive layer, a limiting layer adhered to a second surface of the back adhesive layer, and a film coating layer adhered to the other surface of the limiting layer;

the laminating layer is release paper which can be torn off from the limiting layer;

the limiting layer is provided with a plurality of first through holes, the first through holes are configured to position the sticking positions of the dome sheets to be installed on the gum layer, and the first through holes enable the limiting layer not to interfere with the dome sheets when the limiting layer is separated from the gum layer;

the back glue layer is configured to enable the metal dome to be bonded with a circuit board to which the metal dome is to be mounted.

Further, in keeping with any one or a combination of the preceding technical solutions, a plurality of vent holes are provided on the back adhesive layer.

Further, in accordance with any one or combination of the preceding claims, the area of the backing layer is at least not smaller than the area of one PCBA board.

Further, in accordance with any one or a combination of the foregoing technical solutions, the back adhesive layer includes a plurality of back adhesive units that are separately disposed and have a shape corresponding to the shape of the PCBA board on which the snap dome is to be mounted.

Further, in accordance with any one or a combination of multiple technical solutions described above, a plurality of positioning holes are disposed on the positioning layer, and the positioning holes are configured to position the adhesive-backed film when aligned with a PCBA board on which the snap dome is to be mounted.

Further, in accordance with any one or a combination of multiple technical solutions described above, the back adhesive layer is provided with a plurality of second through holes, and the second through holes are configured to allow the positioning holes on the PCBA board and other components to be mounted to pass through except the snap pieces.

Further, in view of any one or a combination of the foregoing technical solutions, the stopper layer is a PE film.

Further, in accordance with any one or a combination of the preceding claims, the coating layer is an electrostatic adsorption film.

Further, in accordance with any one or a combination of multiple technical solutions, the area of the positioning layer is not smaller than the area of the back adhesive layer and the area of the limiting layer;

the area of the film coating layer is not smaller than that of the positioning layer.

Further, according to any one or a combination of multiple technical schemes, a first tear strip is arranged on one side of the limiting layer; and/or the presence of a gas in the gas,

and a second tearing strip is arranged on one side of the positioning layer.

The utility model provides a beneficial effect that technical scheme brought as follows:

a. the utility model discloses during the application, tear the tectorial membrane layer, make the card piece pass the first through-hole on the spacing layer and reverse paste in the gum layer, tear the spacing layer, paste the gum membrane that will paste the card piece with the PCB board, tear the locating layer, can realize the mounting process of card piece, simple to use, convenient operation, and use the utility model provides a card piece is with the gum membrane, can realize that the whole PCB board is pressed and once installs whole card piece, whole board is pressed evenly makes the card piece paste effectually, and production efficiency is high;

b. the shape of the back adhesive layer can be set according to the shape of the PCB, and the back adhesive layer is provided with a positioning hole for the PCB and a second through hole for other components to be installed to pass through except the metal dome, so that the back adhesive film for the metal dome is suitable for the PCB with various shapes, is not influenced by the installation position and/or the space size of the metal dome, and has good universality;

c. the back glue layer 3 comprises a plurality of separately arranged back glue layers with the shapes corresponding to the shapes of the PCBs to be provided with the snap dome, so that the snap dome installation of a plurality of PCBs can be completed at one time, the production efficiency is high, and the requirement of mass production can be met;

d. the plurality of air holes are formed in the back adhesive layer, so that air between the back adhesive layer and the PCB can be discharged in time in the process of pressing the snap dome, and the service life of the snap dome is prolonged;

e. the positioning layer 4 is provided with a plurality of positioning holes, so that the standard positioning of the mounting position of the snap dome is realized, and the qualification rate of snap dome mounting is improved;

f. the utility model provides a dome is glued membrane with back of body, wherein laminating layer and location layer can reuse, practices thrift the cost.

Drawings

In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments described in the present application, and other drawings can be obtained by those skilled in the art without creative efforts.

Fig. 1 is a schematic front view of a snap dome in the prior art;

FIG. 2 is a schematic top view of a prior art snap dome;

fig. 3 is an exploded schematic view of a structure of a dome adhesive film according to an exemplary embodiment of the present invention;

fig. 4 is a schematic view of a state that the dome sheet passes through the limiting layer and is adhered to the back adhesive layer according to an exemplary embodiment of the present invention;

fig. 5 is a schematic view illustrating alignment of an adhesive-backed film of a bonded dome sheet and a positioning tool according to an exemplary embodiment of the present invention;

fig. 6 is a schematic diagram of the adhesive-backed film for adhering the snap dome and the PCBA substrate on the press-fitting tool according to an exemplary embodiment of the present invention.

Wherein the reference numerals include: 1-a film covering layer, 2-a limiting layer, 21-a first through hole, 22-a first tearing strip, 3-a back glue layer, 31-an air vent, 32-a second through hole, 4-a positioning layer, 41-a positioning hole, 42-a second tearing strip, 5-a dome sheet, 6-a PCBA substrate, 7-a positioning tool, 71-a positioning column, 8-a press mounting tool, 81-a pressing rod, 82-a pressing plate and 83-a foam layer.

Detailed Description

In order to make the technical solution of the present invention better understood, the technical solution of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts shall belong to the protection scope of the present invention.

It should be noted that the terms "first," "second," and the like in the description and claims of the present invention and in the drawings described above are used for distinguishing between similar elements and not necessarily for describing a particular sequential or chronological order. It is to be understood that the data so used is interchangeable under appropriate circumstances such that the embodiments of the invention described herein are capable of operation in other sequences than those illustrated or described herein. Furthermore, the terms "comprises," "comprising," and "having," and any variations thereof, are intended to cover a non-exclusive inclusion, such that a process, method, apparatus, article, or device that comprises a list of steps or elements is not necessarily limited to those steps or elements expressly listed, but may include other steps or elements not expressly listed or inherent to such process, method, article, or device.

In an embodiment of the present invention, referring to fig. 3, a back adhesive film for a dome sheet is provided, which includes a back adhesive layer 3, a positioning layer 4 adhered to a first surface of the back adhesive layer 3, a limiting layer 2 adhered to a second surface of the back adhesive layer 3, and a film coating layer 1 adhered to another surface of the limiting layer 2; the film coating layer 1 is release paper which can be torn off from the limiting layer 2; the limiting layer 2 is provided with a plurality of first through holes 21, the first through holes 21 are configured to position the sticking positions of the dome sheets to be installed on the back adhesive layer 3, and the first through holes 21 enable the limiting layer 2 not to interfere with the dome sheets when being separated from the back adhesive layer 3; the adhesive backing layer 3 is configured to bond the dome sheet to a circuit board to which the dome sheet is to be mounted. Preferably, the area of the positioning layer 4 is not less than the area of the back adhesive layer 3 and the area of the limiting layer 2; the area of the coating layer 1 is not smaller than that of the positioning layer 4. Preferably, the coating layer 1 is an electrostatic adsorption film, because the coating layer 1 is torn from the limiting layer 2, which may cause static electricity to the product, the electrostatic adsorption film adopted in the coating layer 1 can eliminate the static electricity. Preferably, the limiting layer 2 is a PE film and has a hard hardness, so that the dome film for dome sheets of the present invention has a sheet-like structure. The utility model provides a metal dome is with gum membrane is applicable to the circuit board of various shapes to do not receive metal dome mounted position and/or the influence of space size, the commonality is good.

In the present embodiment, it is preferable that the through hole 21 has an outer shape corresponding to an outer shape of the snap dome to be mounted, and a size slightly larger than that of the snap dome. For example, fig. 1 and 2 illustrate a common round metal dome 5, the through hole 21 is correspondingly configured to be round and has a diameter larger than the outer diameter of the metal dome 5, and optionally, the diameter of the through hole 21 is configured to be larger than the outer diameter of the metal dome 5 by 1mm, 2mm, 3mm, or other suitable size.

In an embodiment of the present invention, referring to fig. 3, a plurality of air holes 31 are provided on the back glue layer 3, so that during pressing the dome sheet, air between the back glue layer 3 and the PCBA board can be discharged in time, thereby prolonging the service life of the dome sheet.

In an embodiment of the present invention, referring to fig. 3 and 5, the area of the back glue layer 3 is at least not smaller than the area of one PCBA board, and preferably, the back glue layer 3 comprises a plurality of back glue units which are separately arranged and the shape of which corresponds to the shape of the PCBA board on which the snap pieces are to be mounted. The back glue layer 3 is provided with a plurality of second through holes 32, and the second through holes 32 are configured to allow the positioning holes on the PCBA board and other components to be mounted except the snap pieces to pass through. Can realize a plurality of PCBA board makeup installation metal dome, once accomplish the metal dome installation of a plurality of PCBA boards promptly, production efficiency is high.

In an embodiment of the present invention, a plurality of positioning holes 41 are further disposed on the positioning layer 4, the positioning holes 41 are configured to position the adhesive-backed film when aligning with the PCBA board to which the metal dome is to be mounted, so that the metal dome stuck on the adhesive-backed film corresponds to the position of the metal dome to be mounted on the PCBA board. The standard positioning of the mounting position of the snap dome is realized, and the qualification rate of the snap dome mounting is improved.

In an embodiment of the present invention, referring to fig. 3, a first tearing strip 22 is disposed on one side of the limiting layer 2, so as to facilitate tearing the limiting layer 2 off from the back adhesive layer 3; and/or one side of the positioning layer 4 is provided with a second tearing strip 42, so that the positioning layer 4 is conveniently torn off from the back glue layer 3.

The utility model provides a metal dome is with application mode of back of body glued membrane does: firstly tearing off the film coating layer 1 from the limiting layer 2. Referring to fig. 3 and 4, a metal dome to be mounted is reversely placed in the middle of the first through hole 21 on the limiting layer 2 (the surface opposite to the surface where the metal dome and the PCBA substrate are adhered), and the metal dome is pressed to be tightly adhered to the back adhesive layer 3, wherein fig. 4 illustrates a state that the metal dome 5 penetrates through the limiting layer 2 and is adhered to the back adhesive layer 3. And tearing off the limiting layer 2 from the back glue layer 3 for later use. Referring to fig. 5 and 6, a plurality of PCBA substrates 6 to be provided with snap pieces are placed on a positioning tool fixture 7, and positioning columns 71 corresponding to the positioning holes 41 are arranged on the positioning tool fixture 7. The mounting surface of the snap dome is made to face the mounting surface of the PCBA substrate 6, the gum film which is torn off the film covering layer 1 and the limiting layer 2 and is adhered with the snap dome is placed on the PCBA substrate 6, and the positioning hole 41 correspondingly penetrates through the positioning column 71. The positioning tool jig 7 is placed on a press-fitting tool 8, the press-fitting tool 8 comprises a pressing rod 81 and a pressing plate 82, and the pressing rod 81 is configured to drive the pressing plate 82 to descend or ascend. And pressing the pressing rod 81 to drive the pressing plate 82 to descend to apply pressure to the dome sheet and the gum film, so that the gum layer 3 is pasted on the PCBA substrate 6. Preferably, a foam surface layer 83 is arranged below the pressing plate 82 to prevent the dome sheet back adhesive film from being damaged by pressing. And loosening the pressure lever 81, driving the pressure plate 82 to rise, tearing off the film coating layer 1 from the back adhesive layer 3, and further completing the installation of the dome sheet.

It should be noted that, in this document, relational terms such as first and second, and the like are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising a … …" does not exclude the presence of another identical element in a process, method, article, or apparatus that comprises the element.

The foregoing is directed to embodiments of the present application and it is noted that numerous modifications and adaptations may be made by those skilled in the art without departing from the principles of the present application and are intended to be within the scope of the present application.

Claims (10)

1. The back adhesive film for the metal dome is characterized by comprising a back adhesive layer (3), a positioning layer (4) adhered to the first surface of the back adhesive layer (3), a limiting layer (2) adhered to the second surface of the back adhesive layer (3) and a film coating layer (1) adhered to the other surface of the limiting layer (2);

the film coating layer (1) is release paper which can be torn off from the limiting layer (2);

the limiting layer (2) is provided with a plurality of first through holes (21), the first through holes (21) are configured to position the sticking positions of the dome sheets to be installed on the gum layer (3), and the first through holes (21) enable the limiting layer (2) not to interfere with the dome sheets when being separated from the gum layer (3);

the back glue layer (3) is configured to enable the metal dome to be bonded with a circuit board to which the metal dome is to be mounted.

2. The adhesive backing film for metal dome sheets according to claim 1, wherein a plurality of air holes (31) are arranged on the adhesive backing layer (3).

3. Dome sheet gum film for metal dome sheets according to claim 1, characterised in that the area of the gum layer (3) is at least not smaller than the area of one PCBA board.

4. The metal dome adhesive film for the metal dome sheet as claimed in claim 1, wherein the adhesive dome layer (3) comprises a plurality of adhesive dome units which are separately arranged and have the shape corresponding to the shape of a PCBA board on which the metal dome sheet is to be mounted.

5. Metal dome adhesive backing film according to claim 1, wherein a number of positioning holes (41) are provided on the positioning layer (4), said positioning holes (41) being configured to position the adhesive backing film when aligned with a PCBA board to which the metal dome is to be mounted.

6. The adhesive-backed film for metal dome sheets according to claim 5, wherein a plurality of second through holes (32) are provided on the adhesive-backed layer (3), and the second through holes (32) are configured to pass through positioning holes on a PCBA board and other components to be mounted except for the metal dome sheets.

7. The adhesive-backed film for dome sheets according to claim 1, wherein the limiting layer (2) is a PE film.

8. The adhesive-backed film for dome sheets according to claim 1, wherein the coating layer (1) is an electrostatic adsorption film.

9. The adhesive backing film for dome sheets according to claim 1, wherein the area of the positioning layer (4) is not less than the area of the adhesive backing layer (3) and the area of the limiting layer (2);

the area of the coating layer (1) is not less than that of the positioning layer (4).

10. The adhesive backing film for metal dome sheets as claimed in claim 1, wherein a first tear strip (22) is provided on one side of the limiting layer (2); and/or the presence of a gas in the atmosphere,

and a second tearing strip (42) is arranged on one side of the positioning layer (4).

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