CN218764057U - PTC semiconductor refrigerating device for battery manufacturing - Google Patents
PTC semiconductor refrigerating device for battery manufacturing Download PDFInfo
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- CN218764057U CN218764057U CN202222806333.6U CN202222806333U CN218764057U CN 218764057 U CN218764057 U CN 218764057U CN 202222806333 U CN202222806333 U CN 202222806333U CN 218764057 U CN218764057 U CN 218764057U
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Abstract
The utility model discloses a PTC semiconductor refrigerating plant for in battery manufacturing, including an at least liquid reserve tank, this liquid reserve tank is used for holding liquid, liquid reserve tank wherein one end is equipped with the circulating pump, and this circulating pump is used for being carried by cooling liquid in the liquid reserve tank to needing cooling arrangement, and this liquid reserve tank is connected with needing cooling arrangement through a return tube, is equipped with an at least main PTC semiconductor refrigeration piece on this liquid reserve tank, and this main PTC semiconductor refrigeration piece is used for cooling off the liquid in the liquid reserve tank, and this main PTC semiconductor refrigeration piece is connected with a control unit, and this control unit is used for regulating and controlling main PTC semiconductor refrigeration piece, circulating pump or other electron device that refrigerating plant need cooling arrangement, the utility model discloses control is simple and convenient, and the structure is more small and exquisite simple, has reduced the assembly degree of difficulty, also makes routine maintenance more simple and convenient.
Description
Technical Field
The utility model relates to a refrigeration plant's technical field refers in particular to a battery and is used for in making after processes such as drying, stewing, partial volume or formation, carries out refrigerated PTC semiconductor refrigerating plant to the battery.
Background
In the production process of batteries (such as lithium batteries, sodium batteries and the like), the batteries are often required to be heated, dried, kept stand, classified or formed so as to ensure the performance of the batteries in the subsequent use process; however, after the battery is heated in different processes, the battery has a certain temperature, and the battery needs to be left to stand for a certain period of time, and then is taken and placed after being cooled, so as to be transferred to the next process.
Disclosure of Invention
An object of the utility model is to overcome the weak point among the prior art and provide a PTC semiconductor refrigerating plant for in battery manufacturing, its advantage lies in cooling off the liquid in the liquid storage tank through main PTC semiconductor refrigeration piece, with the help of the refrigerated liquid, cools off the product that needs among the cooling arrangement to accelerated the cool time of product, shortened whole battery production cycle from the process greatly.
In order to achieve the above purpose, the utility model adopts the following technical scheme:
the utility model provides a PTC semiconductor refrigerating plant for in battery manufacturing, includes an at least liquid reserve tank, this liquid reserve tank is used for holding liquid, wherein one end of liquid reserve tank is equipped with the circulating pump, this circulating pump is used for being carried by cooling liquid in the liquid reserve tank to needing cooling arrangement, this liquid reserve tank is connected with needing cooling arrangement through a return tube, be equipped with at least one main PTC semiconductor refrigeration piece on this liquid reserve tank, this main PTC semiconductor refrigeration piece is used for cooling off the liquid in the liquid reserve tank, this main PTC semiconductor refrigeration piece is connected with a control unit, this control unit is used for regulating and control main PTC semiconductor refrigeration piece, circulating pump or other electron device of refrigerating plant/needing cooling arrangement.
The liquid storage tank is provided with at least one liquid adding port, and the liquid adding port is connected with an external water source.
The liquid storage tank is provided with at least one exhaust port, and the exhaust port is used for balancing air pressure in the liquid storage tank and balancing volume change caused by expansion with heat and contraction with cold of liquid.
The liquid storage tank is also provided with a liquid level sensor which is used for controlling the water level in the liquid storage tank in a matching way with the control unit.
The liquid storage tank is provided with a temperature control meter which is used for regulating and controlling the temperature of liquid in the liquid storage tank in cooperation with the control unit.
The liquid storage tank is connected with the circulating pump through a liquid outlet pipe, the circulating pump is communicated with equipment needing cooling through a transmission pipe, and a first valve body is arranged on the transmission pipe and used for controlling the on-off of a pipeline of the transmission pipe.
The transmission pipe is also provided with a pressure gauge which is used for detecting the air pressure in the transmission pipe.
The circulating pump is provided with a safety valve which is used for preventing the air pressure of the transmission pipe from exceeding a specified value.
The backflow pipe is provided with at least one choke valve which is used for controlling the on-off of the pipeline of the backflow pipe.
The main PTC semiconductor refrigerating piece is provided with a heat radiating part which is used for transmitting/partially offsetting the heat of the main PTC semiconductor refrigerating piece to the outside.
Compared with the prior art, the beneficial effects of the utility model are as follows:
1. set up PTC semiconductor refrigeration piece in the liquid reserve tank, cool off through the liquid of PTC semiconductor refrigeration piece in to the liquid reserve tank, the liquid that deuterogamies the circulating pump will be refrigerated is carried to needs cooling arrangement through the drain pipe, with the help of the liquid that is refrigerated, cools off the product in needing cooling arrangement to the cooling time of product has been accelerated, has shortened whole battery production cycle from the process greatly, and control is simple and convenient.
2. The arrangement of the main PTC semiconductor refrigerating sheet simplifies the structure of the refrigerating device, so that the structure of the refrigerating device is smaller and simpler, the assembly difficulty is reduced, and when a refrigerating fault occurs, only the single main PTC semiconductor refrigerating sheet needs to be overhauled, so that the daily maintenance is simpler and more convenient; meanwhile, the traditional refrigerant refrigeration can affect the environment, and the refrigeration of the main PTC semiconductor refrigeration piece is more environment-friendly.
3. The setting of relief valve can effectively avoid the utility model discloses the pipeline surpasss the atmospheric pressure specified value, guarantees the utility model discloses a safe in utilization of pipeline.
4. The air outlet of the liquid storage tank is arranged, so that the air pressure in the liquid storage tank can be effectively balanced, the volume change caused by expansion with heat and contraction with cold of the liquid can be balanced, and the normal use of the liquid storage tank is ensured.
5. The arrangement of the heat dissipation part can effectively ensure that the main PTC semiconductor refrigerating sheet works normally and effectively supplies cold to liquid in the liquid storage tank.
Drawings
Fig. 1 is a schematic view of the structural principle of the present invention.
Fig. 2 is a schematic structural diagram of another embodiment of the present invention.
Fig. 3 is a schematic structural diagram of one embodiment of the present invention for providing a heat dissipation portion.
Fig. 4 is a schematic structural diagram of another embodiment of the present invention in which a heat dissipation portion is provided.
Fig. 5 is a schematic structural diagram of a third embodiment of the present invention in which a heat dissipation portion is provided.
The reference numbers indicate:
1-a liquid storage tank; 11-a liquid filling port; 12-an exhaust port; 13-a liquid level sensor; 14-temperature control meter; 15-a choke valve; 16-a liquid outlet pipe; 17-a first valve body; 18-pressure gauge; 19-a transfer pipe; 2-a circulating pump; 21-a safety valve; 3-a return pipe; 4-main PTC semiconductor refrigerating sheet; 5-a heat dissipation part; 51-a pipe; 52-a fan; 53-pair of PTC semiconductor refrigeration pieces; 54-a heat sink; k-equipment needing cooling.
Detailed Description
The invention is further described below with reference to the drawings in the specification:
as shown in fig. 1-5, the present invention relates to a PTC semiconductor refrigeration device for battery manufacturing, including at least one liquid storage tank 1, the liquid storage tank 1 is used for containing liquid, one end of the liquid storage tank 1 is provided with a circulation pump 2, the circulation pump 2 is used for conveying the cooled liquid in the liquid storage tank 1 to a device K to be cooled, the liquid storage tank 1 is connected with the device K to be cooled through a return pipe 3, the liquid storage tank 1 is provided with at least one main PTC semiconductor refrigeration piece 4, the main PTC semiconductor refrigeration piece 4 is used for cooling the liquid in the liquid storage tank 1, the main PTC semiconductor refrigeration piece 4 is connected with a control unit (not shown), the control unit is used for regulating and controlling the main PTC semiconductor refrigeration piece 4, the circulation pump 2 or other electronic devices of the refrigeration device/device K to be cooled; the main PTC semiconductor refrigeration piece 4 is tightly attached to the bottom surface/side surface of the liquid storage tank 1; the main PTC semiconductor refrigerating sheet 4 is bonded on the bottom surface/side surface of the liquid storage tank 1 through glue; or at least 2 screw holes are formed in the main PTC semiconductor refrigeration piece 4 and are fixedly locked on the bottom surface/side surface of the liquid storage box 1 by matching with screws; or, a buckle structure is arranged on one surface of the main PTC semiconductor refrigeration sheet 4, a concave structure is arranged on the bottom surface/side surface of the liquid storage tank 1, and the buckle structure and the concave structure are mutually clamped and fixed to realize connection of the two; or, through the connecting piece (not shown) to lock the edge of the main PTC semiconductor refrigeration piece 4, the main PTC semiconductor refrigeration piece 4 is fixed on the bottom/side of the liquid storage tank 1, the connection mode of the main PTC semiconductor refrigeration piece 4 and the liquid storage tank 1 can be configured according to the actual structure design requirement of the utility model and the assembly and maintenance cost control requirement, and the configuration is not self-limited herein; in addition, the equipment K needing cooling is generally equipment in the processes of drying, standing, capacity grading, formation and the like in the battery production process.
As shown in fig. 1-5, at least one liquid filling port 11 is disposed on the liquid storage tank 1, the liquid filling port 11 is connected to an external water source, and the liquid storage tank 1 is connected to the external water source through the liquid filling port 11, so as to convey the external water source into the liquid storage tank 1, thereby adding water or replenishing water to the liquid storage tank 1.
As shown in fig. 1-5, the liquid storage tank 1 is provided with at least one exhaust port 12, and the exhaust port 12 can balance the air pressure in the liquid storage tank 1 and the volume change caused by expansion with heat and contraction with cold of the liquid in the liquid storage tank 1 during the cooling process of the liquid in the liquid storage tank 1 by the main PTC semiconductor refrigeration sheet 4, thereby ensuring the normal use of the liquid storage tank 1.
As shown in fig. 1-5, a liquid level sensor 13 is further disposed on the liquid storage tank 1, the liquid level sensor 13 is used to cooperate with the control unit to control the water level in the liquid storage tank 1, specifically, the liquid level sensor 13 detects the liquid level height of the liquid storage tank 1 and feeds back a detection signal of the liquid level height to the control unit, and the control unit controls the on-off of the external water source at the liquid filling port 11 according to the received liquid level height signal; when the liquid level in the liquid storage tank 1 reaches the set maximum liquid level, the control unit sends an instruction to shut off a pipeline of an external water source and pause the water adding from the liquid adding port 11 to the liquid storage tank 1; when the liquid level height in the liquid storage tank 1 reaches the liquid level set minimum value, the control unit can send an instruction to conduct a pipeline of an external water source, water is added into the liquid storage tank 1 through the liquid adding port 11, or the work of each main PTC semiconductor refrigerating piece 4 is suspended.
As shown in fig. 1-5, a temperature control meter 14 is disposed on the liquid storage tank 1, and the temperature control meter 14 is used for cooperating with the control unit to regulate and control the temperature of the liquid in the liquid storage tank 1; specifically, the temperature control meter 14 is connected to the liquid storage tank 1 through at least one temperature sensing line (not shown), detects the temperature of the liquid on the surface of the liquid storage tank 1 or in the liquid storage tank 1 through the temperature sensing line, converts the detected temperature data into a signal, and feeds the signal back to the control unit, and the control unit controls the refrigeration state of the main PTC semiconductor refrigeration piece 4 according to the detected temperature signal.
As shown in fig. 1-5, the liquid storage tank 1 is connected to the circulating pump 2 through a liquid outlet pipe 16, the circulating pump 2 is connected to the equipment K to be cooled through a transmission pipe 19, wherein the circulating pump 2 preferably adopts a boiler pump or other water pumps, and the type of the circulating pump 2 is selected and can be configured according to the practical use requirement of the present invention, which is not limited herein; the delivery pipe 19 is provided with a first valve 17, and the first valve 17 is used for controlling the on-off of the pipeline of the delivery pipe 19.
As shown in fig. 1-5, a pressure gauge 18 is further disposed on the transmission pipe 19, the pressure gauge 18 is used for detecting the air pressure in the transmission pipe 19, and a worker can know the real-time air pressure condition of the pipeline according to the air pressure data displayed by the pressure gauge 18.
As shown in fig. 1-5, the circulation pump 2 department is equipped with a relief valve 21, and this relief valve 21 is as an automatic valve for prevent that the atmospheric pressure of transmission pipe 19 from exceeding the specified value, work as the utility model discloses a when system atmospheric pressure exceeded the specified value, relief valve 21 opened, will the utility model provides a partly gas/fluid is discharged outside atmosphere/pipeline 51, makes the utility model discloses an atmospheric pressure is no longer than the allowable value, thereby guarantees the utility model discloses do not take place the accident because of atmospheric pressure is too high, it is right the utility model discloses play the safety protection effect.
As shown in fig. 1-5, the return pipe 3 is provided with at least one choke valve 15, and the choke valve 15 is used for controlling the on-off of the pipeline of the return pipe 3; wherein, this choke valve 15 preferably adopts the motorised valve, and the motorised valve is high temperature resistant, resistant chemical corrosion, wear-resisting durable, the water hammer impact resistant, and is effectual with big pipe diameter gas, comparatively is applicable to the utility model discloses, however, it explains that this choke valve 15 still can adopt other valves that can realize equal effect, like the valve of pneumatic valve, hydraulic valve or other types, this choke valve 15 chooses the type for use, can according to the utility model discloses an in-service use needs dispose, does not self-limit here.
As shown in fig. 2, the PTC semiconductor refrigeration device for battery manufacturing disclosed in the present invention can connect more than two sets of the present invention in parallel as required to improve the efficiency of supplying cold source to the cooling equipment K, and can start and stop any set of the present invention, and only open any one or more sets of the present invention in different conditions required by the cooling condition; simultaneously, can also be in the condition that breaks down of arbitrary group, only to normal function the utility model discloses open to ensure to need the normal cooling of cooling arrangement K, thereby guaranteed that battery manufacturing process normally goes on.
As shown in fig. 3-5, the PTC semiconductor refrigeration device for battery manufacturing disclosed in the present invention has a heat dissipation portion 5 on the main PTC semiconductor refrigeration sheet 4, the heat dissipation portion 5 is used to dissipate/partially offset the heat of the main PTC semiconductor refrigeration sheet 4 to the outside, and the heat dissipation portion 5 can effectively dissipate/partially offset the heat of the cold surface of the main PTC semiconductor refrigeration sheet 4 to the outside, so as to ensure the normal refrigeration of the main PTC semiconductor refrigeration sheet; it should be noted that, due to the structural characteristics of the PTC semiconductor heating sheet, in the working process, one side of the PTC semiconductor heating sheet generates heat, the other side of the PTC semiconductor heating sheet refrigerates, and the heat dissipation portion 5 is arranged, so that the main PTC semiconductor refrigerating sheet 4 can be effectively ensured to work normally, and the main PTC semiconductor refrigerating sheet 4 can be ensured to effectively supply cold to the liquid in the liquid storage tank 1.
As shown in fig. 3, the heat dissipation part 5 is a pipe 51 disposed on the other side of the main PTC semiconductor chilling plates 4, the pipe 51 is used for supplying water, the heat dissipation part 5 can be connected to an external water source, or one end of the heat dissipation part 5 is connected to the transmission pipe 19, the other end is connected to the return pipe 3, water with temperature in the water storage tank 1 flows through each main PTC semiconductor chilling plate 4 through the heat dissipation part 5 under the action of the circulation pump 2, and the heat on the hot side of the main PTC semiconductor chilling plates 4 is dissipated/partially offset to the outside.
Or, as shown in fig. 4, the heat dissipating portion 5 includes at least one heat sink 54 disposed on the main PTC semiconductor cooling plate 4 and at least one fan 52 disposed at the heat sink 54, the heat sink 54 is used for dissipating heat generated by the hot surface of the main PTC semiconductor cooling plate 4 during operation, the fan 52 accelerates the heat dissipation of the hot surface of the main PTC semiconductor cooling plate 4 and the heat on the heat sink 54 to the outside, wherein the heat sink 54 can be fixed on the main PTC semiconductor cooling plate 4 by screws or fixed on the main PTC semiconductor cooling plate 4 by matching with a mounting bracket (not shown), and the connection mode of the heat sink 54 can be configured according to the structural design and cost control requirements of the present invention, and is not limited herein.
As shown in fig. 5, the heat dissipating unit 5 is at least one pair of PTC semiconductor cooling fins 53, the cooling surfaces of the pair of PTC semiconductor cooling fins 53 are bonded to the heating surface of the main PTC semiconductor cooling fin 4, and the heat of the heating surface of the main PTC semiconductor cooling fin 4 is offset by the cooling surfaces of the pair of PTC semiconductor cooling fins 53, it should be noted that the area of the pair of PTC semiconductor cooling fins 53 is smaller than the area of the main PTC semiconductor cooling fin 4, and when two or more pair of PTC semiconductor cooling fins 53 are stacked for use, the area of the stacked pair of PTC semiconductor cooling fins 53 is smaller than the area of the stacked pair of PTC semiconductor cooling fins 53 to form a pagoda structure, and each pair of PTC semiconductor cooling fins 53 is electrically connected to the control unit, and each pair of PTC semiconductor cooling fins 53 is controlled by the control unit; it should be noted that the connection mode between the sub PTC semiconductor refrigeration pieces 53 and the main PTC semiconductor refrigeration piece 4, or the connection mode between the sub PTC semiconductor refrigeration pieces 53, may be glue, screw locking, snap connection, or connection with a matching connector, and the specific connection mode may refer to the connection mode between the main PTC semiconductor refrigeration piece 4 and the liquid storage tank 1, which is not described herein again.
It should be noted that, when the present invention is connected in parallel, each group of the present invention can be configured by using any one or more structures of the heat dissipation portion 5, and the specific structure of the heat dissipation portion 5 is not limited herein.
Furthermore, the aforesaid control unit, generally the control module who needs cooling equipment, or the utility model discloses the control module who establishes, or the control module of other equipment again, this control unit still at least with liquid level inductor 13, temperature-sensing meter 14, choke valve 15, first valve body 17 and/or 2 electric connections of circulating pump, regulate and control each aforesaid device through the control unit.
When the water-cooling type liquid storage tank is used for the first time, the first valve body 17 and the choke valve 15 are kept in an open state, the control unit firstly injects an external water source into the liquid storage tank 1 through the liquid adding port 11, detects the liquid level height of liquid in the liquid storage tank 1 by matching with the liquid level sensor 13, converts detected liquid level real-time data into signals and feeds the signals back to the control unit, starts the main PTC semiconductor refrigerating sheet 4 to refrigerate water in the liquid storage tank 1 while injecting water, monitors the temperature of the liquid in the liquid storage tank 1 in real time by matching with the temperature control meter 14, and converts the detected liquid temperature data into signals and feeds the signals back to the control unit in real time; when the liquid level height reaches the maximum set value, the control unit suspends the water injection at the liquid adding port 11; when the water temperature in the liquid storage tank 1 reaches a set temperature value, the control unit starts the circulating pump 2, liquid in the liquid storage tank 1 is conveyed to the equipment K needing cooling through the liquid outlet pipe 16 and the conveying pipe 19, at the moment, the temperature of the liquid is conducted to provide the equipment K needing cooling with the required coldness for cooling the battery, and meanwhile, the liquid flows back to the liquid storage tank 1 through the return pipe 3 after passing through the equipment K needing cooling for recycling.
It should be noted that, when the water temperature in the liquid storage tank 1 reaches a set temperature value, the control unit suspends the operation of the main PTC semiconductor refrigeration sheet 4 to save the power consumption; when the water temperature is higher than the preset allowable temperature value, the control unit restarts the main PTC semiconductor chilling plate 4, so that the temperature of the liquid in the liquid storage tank 1 is kept within the range of the preset temperature value.
It should be noted that, in the description of the present invention, the terms "upper", "lower", "inner", "outer", "front", "rear", "both ends", "one end", "the other end", etc. indicate the directions or positional relationships based on the directions or positional relationships shown in the drawings, which are only for the convenience of describing the present invention and simplifying the description, but not for indicating or implying that the device or element referred to must have a specific direction, be constructed and operated in a specific direction, and therefore, should not be construed as limiting the present invention; furthermore, the terms "first," "second," and the like are used for descriptive purposes only and are not to be construed as indicating or implying relative importance; unless expressly stated or limited otherwise, the terms "mounted," "provided," "connected," and the like are to be construed broadly, such as "connected," and may be fixedly connected, removably connected, or integrally connected; can be mechanically or electrically connected; the two elements can be directly connected or indirectly connected through an intermediate medium, and the two elements can be communicated with each other, so that the specific meaning of the terms in the invention can be understood by those skilled in the art according to specific situations; in addition, the parts used in the present invention can be customized according to the description of the specification and the drawings, and are not repeated herein.
It is right only to go up the preferred embodiment of the utility model discloses a it is not right the scope of the utility model is injectd, so under the prerequisite that does not deviate from the design spirit of the utility model, ordinary engineering technical personnel in the field are right the structure, the equivalent change or the decoration that characteristic and principle were done all should fall into the utility model discloses in the protection range of the application for a patent.
Claims (10)
1. A PTC semiconductor refrigeration device for use in battery manufacturing, comprising at least one reservoir for holding a liquid, characterized in that: the liquid storage tank is provided with a circulating pump at one end and is used for conveying cooling liquid in the liquid storage tank to cooling equipment needing cooling, the liquid storage tank is connected with the cooling equipment needing cooling through a return pipe, at least one main PTC semiconductor refrigerating piece is arranged on the liquid storage tank and is used for cooling the liquid in the liquid storage tank, the main PTC semiconductor refrigerating piece is connected with a control unit, and the control unit is used for regulating and controlling the main PTC semiconductor refrigerating piece, the circulating pump or other electronic devices of the cooling equipment needing cooling.
2. A PTC semiconductor refrigeration device for use in battery manufacture according to claim 1, wherein: the liquid storage tank is provided with at least one liquid feeding port which is connected with an external water source.
3. A PTC semiconductor refrigeration device for use in battery manufacture according to claim 1, wherein: the liquid storage tank is provided with at least one exhaust port, and the exhaust port is used for balancing air pressure in the liquid storage tank and balancing volume change caused by expansion with heat and contraction with cold of liquid.
4. A PTC semiconductor refrigeration device for use in battery manufacture according to claim 1, wherein: the liquid storage tank is further provided with a liquid level sensor which is used for controlling the water level in the liquid storage tank in a matched mode with the control unit.
5. A PTC semiconductor refrigeration device for use in battery manufacture according to claim 1, wherein: the liquid storage tank is provided with a temperature control meter which is used for regulating and controlling the temperature of liquid in the liquid storage tank in cooperation with the control unit.
6. A PTC semiconductor refrigeration device for use in battery manufacture according to claim 1, wherein: the liquid storage tank is connected with the circulating pump through a liquid outlet pipe, the circulating pump is communicated with equipment needing cooling through a transmission pipe, and a first valve body is arranged on the transmission pipe and used for controlling the on-off of a pipeline of the transmission pipe.
7. A PTC semiconductor refrigeration device used in battery manufacturing according to claim 6, wherein: the transmission pipe is also provided with a pressure gauge which is used for detecting the air pressure in the transmission pipe.
8. A PTC semiconductor refrigeration device used in battery manufacturing according to claim 6, wherein: the circulating pump is provided with a safety valve which is used for preventing the air pressure of the transmission pipe from exceeding a specified value.
9. A PTC semiconductor refrigeration device for use in battery manufacture according to claim 1, wherein: the backflow pipe is provided with at least one choke valve which is used for controlling the on-off of a pipeline of the backflow pipe.
10. A PTC semiconductor refrigeration device used in battery fabrication according to claim 1, wherein: the main PTC semiconductor refrigeration piece is provided with a heat dissipation part which is used for dissipating/partially offsetting the heat of the main PTC semiconductor refrigeration piece to the outside.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222806333.6U CN218764057U (en) | 2022-10-24 | 2022-10-24 | PTC semiconductor refrigerating device for battery manufacturing |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222806333.6U CN218764057U (en) | 2022-10-24 | 2022-10-24 | PTC semiconductor refrigerating device for battery manufacturing |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN218764057U true CN218764057U (en) | 2023-03-28 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202222806333.6U Active CN218764057U (en) | 2022-10-24 | 2022-10-24 | PTC semiconductor refrigerating device for battery manufacturing |
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| Country | Link |
|---|---|
| CN (1) | CN218764057U (en) |
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2022
- 2022-10-24 CN CN202222806333.6U patent/CN218764057U/en active Active
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