CN218745868U - Eutectic welding fixture - Google Patents

Abstract

An eutectic welding fixture comprises a stop block, a plurality of pressing blocks and a support rod; the stop block comprises a first plate, a second plate and a third plate, the first plate and the second plate are opposite in the left-right direction, the third plate connects the rear ends of the first plate and the second plate in the front-back direction, the first plate is provided with a first hole, the second plate is provided with a second hole, and the second hole is opposite to the first hole; each pressing block comprises a plate body and a pressing head, each plate body is provided with a through hole, and each pressing block is symmetrical left and right and front and back; the supporting rod is used for passing through the first hole of the first plate, the second hole of the second plate and the through holes of the plate bodies of the pressing blocks in a clearance fit mode in the front-back direction and the up-down direction, so that the stopping block, the pressing blocks and the supporting rod form an assembly body.

Description

Eutectic welding fixture

Technical Field

The disclosure relates to the field of semiconductor lasers, in particular to an eutectic welding clamp.

Background

The eutectic welding technology completes the welding process through the characteristics of eutectic alloy, has the characteristics of high heat conductivity, fast heat transfer, small resistance, strong reliability and the like, and has been widely applied to the semiconductor industry, such as the bonding of a substrate and a tube shell, the bonding of a chip and the substrate and the like.

In the manufacturing process of semiconductor laser products, four factors of pressure, time, atmosphere and temperature are mainly involved. Eutectic soldering of COS (Chip-On-substrate) requires a jig to achieve pressure positioning thereof. Most of the traditional clamps have more component types, the machining precision of the clamps influences the pressure positioning precision of the COS, the comprehensive precision of the whole set of clamps is difficult to ensure, and the stability of the pressure of the COS is difficult to ensure; secondly, the pressure of each COS is unequal, and the eutectic welding quality of the COS is affected finally; meanwhile, the operation process is complicated, and the welding efficiency is influenced. Chinese patent application publication No. CN110961846A, published in 2020, 4, 7, discloses a COS welding jig for use in a semiconductor laser, which employs a reference carrier plate, a first positioning member for a tube shell, two reference positioning blocks, and a second positioning member for the tube shell to position the tube shell from below and around, wherein the reference positioning blocks, cantilever brackets, bolts, positioning rods, compression springs, and spring probes constitute cantilever spring probe assemblies that press corresponding COS in the tube shell, and a plurality of cantilever spring probe assemblies are fixed to the reference positioning blocks by respective bolts, so that there are many component parts of the cantilever spring probe assemblies that apply pressure to corresponding COS in the tube shell, and the comprehensive accuracy of the applied pressure is difficult to guarantee. In each cantilever spring probe assembly, the pressure that the spring probe applyed is that the bolt adjustment cantilever support moves down the distance and then the adjustment install the compressed degree of the pressure spring on the locating lever and realize, the accuracy of the adjustment of bolt will influence the precision and the stability of the pressure that the spring probe applyed, the pressure spring can produce pressure after long-time repeated elastic action and applys unstability and then precision and the stability of the pressure that later stage applyed are difficult to keep more durable. In addition, independent cantilever spring probe assemblies are adopted for each COS, but due to the adoption of the common reference positioning block, the pressure exerted on the reference positioning block by the pressure springs in the adjacent cantilever spring probe assemblies can be influenced mutually, and further the pressure exerted by the spring probes in each cantilever spring probe assembly is influenced.

SUMMERY OF THE UTILITY MODEL

In view of the problems in the background art, it is an object of the present disclosure to provide a eutectic bonding jig that can improve the accuracy of pressure applied by a member that applies pressure.

Another object of the present disclosure is to provide a eutectic bonding jig capable of improving stability of pressure applied by a member applying the pressure.

It is still another object of the present disclosure to provide an eutectic bonding jig capable of maintaining the accuracy of applied pressure more durable after repeated use of a member to which the pressure is applied for a long time.

Therefore, the eutectic welding fixture comprises a stop block, a plurality of pressing blocks and a support rod; the stop block comprises a first plate, a second plate and a third plate, the first plate and the second plate are opposite in the left-right direction, the third plate connects the rear ends of the first plate and the second plate in the front-back direction, the first plate, the second plate and the third plate enclose an accommodating space which is through in the up-down direction and is open forwards, the first plate is provided with a first hole through in the left-right direction, the second plate is provided with a second hole through in the left-right direction, and the second hole is opposite to the first hole in the left-right direction; each pressing block comprises a plate body and a pressing head, each plate body is provided with a through hole which penetrates through the plate body along the left-right direction, each pressing head protrudes downwards from the center of the bottom surface of the corresponding plate body, and each pressing block is symmetrical left and right and is symmetrical front and back; the supporting rod is used for passing through the first hole of the first plate, the second hole of the second plate and the through holes of the plate bodies of the pressing blocks in a clearance fit mode in the front-back direction and the up-down direction, so that the stop block, the pressing blocks and the supporting rod form an assembly body, in the assembly body, the plate bodies of the pressing blocks and the first plate and the second plate of the stop block are spaced in the left-right direction, the rear surface of each plate body and the third plate are spaced in the front-back direction, and each pressing block can float in the up-down direction relative to the supporting rod but cannot rotate around the supporting rod; the assembly is used for: before eutectic welding, the semiconductor laser is placed into a tube shell of the semiconductor laser once, so that the bottom surface of a first plate and the bottom surface of a second plate are supported on the bottom wall of the tube shell, the periphery formed by the first plate and the second plate close to the bottom is separated from the inner peripheral wall of the tube shell by a gap, each pressing block is not contacted with a support rod in the up-down direction and the front-back direction at a through hole, and is pressed on a position, which is arranged on a welding material and is corresponding to COS gold wires, of the tube shell by a pressing head only by the weight of each pressing block, and the bottom surface of a plate body of each pressing block is positioned above the top surface of the tube shell and is separated from the top surface of the tube shell; and the support rod does not need to be taken out in the eutectic welding process, and the assembly body is taken out of the tube shell once after the eutectic welding.

The beneficial effects of this disclosure are as follows: in the eutectic bonding jig of the present disclosure, each COS is pressed by only one compact and the pressure to which each COS is subjected is only from the self weight of the corresponding one compact, so that the pressure to which each COS is subjected can be accurately fixed, the precision of applying the pressure is improved, interference of the pressure application from other parts than the compact is avoided, the application of the pressure is simple as compared with the spring probe mentioned in the patent document of the background art, and the precision and stability of the pressure applied after the compact is repeatedly used for a long time are maintained more durable than the spring probe using the elasticity of the spring. Each briquetting bilateral symmetry and fore-and-aft symmetry, the pressure head can be with this face in the front and back direction and the central point of left and right sides direction can be on same vertical line with the focus of briquetting with the pressure head that avoids the position of COS gold wire contact each other of COS that corresponds, the briquetting forms the self-stabilizing structure in left and right sides direction and fore-and-aft direction from this (namely each briquetting self is steadily stood on corresponding COS), and then make the pressure evenly distributed of the pressure head that the COS that corresponds bore, improve COS eutectic welding's quality, and then improve the stability of COS eutectic welding's quality when a plurality of semiconductor laser's of the same structure tube adopts the same eutectic welding anchor clamps.

Drawings

Fig. 1 is a perspective view of an eutectic welding fixture assembled with a package according to the present disclosure.

Fig. 2 is a perspective view from another angle of fig. 1.

<xnotran> 3 1 . </xnotran>

Fig. 4 is an exploded view of fig. 1.

Fig. 5 is an exploded view from another angle of fig. 4.

Fig. 6 is a perspective view of a stop of a eutectic welding fixture according to the present disclosure.

Fig. 7 is a perspective view of another angle of fig. 6.

Fig. 8 is a perspective view of fig. 6 from yet another angle.

Fig. 9 is a plan view of one of the compacts of the eutectic bonding jig according to the present disclosure, viewed from the left-right direction.

Fig. 10 is a perspective view of fig. 9.

Fig. 11 is a perspective view of a strut of a eutectic welding fixture according to the present disclosure.

Fig. 12 is a perspective view of fig. 11 from another angle.

Fig. 13 is a schematic view of a stop, a plurality of compacts, and a leg in a eutectic bonding jig forming an assembly and prior to the assembly being lifted by the leg to be placed within a package of a semiconductor laser, with only one of the compacts shown for clarity.

Fig. 14 is a schematic view of an assembly of a stop, a plurality of compacts and a rod in a eutectic bonding jig after placement into a package of a semiconductor laser, wherein only one of the compacts is shown for clarity.

Wherein the reference numerals are as follows:

100 eutectic weld fixture 212 bottom surface

D1 left-right direction 213 rear surface

D2 Forward and aft 22 indenter

D3 Up-Down 221 first contact surface

1 second contact surface of stop 222

11 first plate 3 strut

111 first hole 31 rod body

12 second plate 32 stop

121 second hole 200 cartridge

13 third plate 200a bottom wall

2 inner peripheral wall of the press block 200b

21 plate body 200c top surface

211 through hole 300COS

Detailed Description

The accompanying drawings illustrate embodiments of the present disclosure and it is to be understood that the disclosed embodiments are merely examples of the disclosure, which can be embodied in various forms, and therefore, specific details disclosed herein are not to be interpreted as limiting, but merely as a basis for the claims and as a representative basis for teaching one skilled in the art to variously employ the present disclosure.

Referring to fig. 1 to 14, the eutectic bonding jig 100 includes a stopper 1, a plurality of compacts 2, and a support rod 3.

The stopper 1 includes a first plate 11, a second plate 12, and a third plate 13, the first plate 11 and the second plate 12 are opposed to each other in a left-right direction D1, the third plate 13 connects rear ends of the first plate 11 and the second plate 12 in a front-rear direction D2, the first plate 11, the second plate 12, and the third plate 13 enclose an accommodation space S which penetrates in a vertical direction D3 and is open forward, the first plate 11 is provided with a first hole 111 which penetrates in the left-right direction D1, the second plate 12 is provided with a second hole 121 which penetrates in the left-right direction D1, and the second hole 121 and the first hole 111 are opposed to each other in the left-right direction D1.

Each pressing block 2 includes a plate body 21 and pressing heads 22, each plate body 21 has a through hole 211 penetrating in the left-right direction D1, each pressing head 22 protrudes downward from the center of the bottom surface 212 of the corresponding plate body 21, and each pressing block 2 is left-right symmetrical and front-rear symmetrical.

The strut 3 is adapted to pass through the first hole 111 of the first plate 11, the second hole 121 of the second plate 12, and the through holes 211 of the plate bodies 21 of the plurality of press blocks 2 in a manner of clearance-fitting in the front-rear direction D2 and the up-down direction D3, so that the stopper 1, the plurality of press blocks 2, and the strut 3 form an assembly.

In the assembly, the plate bodies 21 of the plurality of compacts 2 and the first and second plates 11 and 12 of the stopper 1 are spaced apart from each other with a gap in the left-right direction D1, the rear surface 213 of each plate body 21 and the third plate 13 are spaced apart from each other with a gap in the front-rear direction D2, and each compact 2 is capable of floating in the up-down direction D3 relative to the strut 3 but is incapable of rotating around the strut 3.

The assembly is used for: before eutectic bonding, the semiconductor laser is placed in the package 200 at a time, so that the bottom surface of the first plate 11 and the bottom surface of the second plate 12 are supported on the bottom wall 200a of the package 200, the first plate 11 and the second plate 12 are spaced apart from the inner peripheral wall 200b of the package 200 by a gap between the outer periphery formed near the bottom and the inner peripheral wall 200b, each compact 2 is not in contact with the support rod 3 in the up-down direction D3 and the front-rear direction D2 at the through hole 211 and is pressed against the corresponding COS300 in the package 200 by its own weight via the indenter 22 at a position avoiding the COS gold wire, which is provided on the solder, and the bottom surface 212 of the plate body 21 of each compact 2 is located above the top surface 200c of the package 200 and spaced apart from the top surface 200c of the package 200; and the support rod 3 does not need to be taken out during eutectic welding and the assembly is taken out of the case 200 at one time after eutectic welding.

In the eutectic bonding jig 100 of the present disclosure, the arrangement of the bottom wall 200a, the inner peripheral wall 200b, and the COS300 of the package 200 of the semiconductor laser is fully utilized, and three kinds of members of the stopper 1, the plurality of compacts 2, and the rod 3 are employed, so that the positioning of the compact 2 for applying pressure in the assembly is realized with fewer members than those of the patent documents of the background art, and the fewer members can reduce the cumulative error and improve the accuracy of the pressure applied by the compact 2 in the assembly.

In the eutectic bonding jig 100 of the present disclosure, each COS300 is pressed by only one corresponding compact 2 and the pressure to which each COS300 is subjected comes only from the self weight of the corresponding compact 2, so that the pressure to which each COS300 is subjected can be accurately fixed, the precision of applying the pressure is improved, interference of the pressure application from other parts than the compact 2 is avoided, the application of the pressure is simple as compared with the spring probe mentioned in the patent document of the background art, and the precision and stability of the pressure applied after the compact 2 is repeatedly used for a long time are maintained more durable than the spring probe using the elasticity of the spring.

In the eutectic bonding jig 100 of the present disclosure, each of the compacts 2 is bilaterally symmetric and longitudinally symmetric, and the contact surface of the indenter 22 and the corresponding COS300, which avoids the COS gold wire, is located on the same vertical line with the center point of the compact 2 in the front-rear direction D1 and the left-right direction D2 by the contact surface, so that the compacts 2 form a self-stabilizing structure in the left-right direction D2 and the front-rear direction D1 (i.e., each of the compacts 2 stably stands on the corresponding COS), and thus the pressure of the indenter 22 borne by the corresponding COS300 is uniformly distributed, thereby improving the quality of the eutectic bonding of COS300, and further improving the stability of the quality of the eutectic bonding of COS300 when the cartridges 200 of a plurality of semiconductor lasers having the same structure adopt the same eutectic bonding jig 100.

In the eutectic bonding jig 100 of the present disclosure, the assembly is used to be once placed in the package 200 of the semiconductor laser before eutectic bonding, the support rod 3 does not need to be taken out during eutectic bonding, and the assembly is once taken out of the package 200 after eutectic bonding, which greatly simplifies the operation of the eutectic bonding jig 100 and improves the bonding work efficiency.

In the eutectic bonding jig 100 of the present disclosure, the layout of the bottom wall 200a, the inner peripheral wall 200b, and the COS300 of the package 200 of the semiconductor laser is fully utilized, and prior to eutectic bonding, the package 200 of the semiconductor laser is put in one go so that the bottom face of the first plate 11 and the bottom face of the second plate 12 are supported on the bottom wall 200a of the package 200, the first plate 11 and the second plate 12 are spaced apart with a gap between the outer periphery formed near the bottom and the inner peripheral wall 200b of the package 200, and the bottom surface 212 of the plate body 21 of each compact 2 is located above the top surface 200c of the package 200 and spaced apart from the top surface 200c of the package 200, so that putting in and taking out of the eutectic bonding jig 100 are facilitated.

In the foregoing description, the eutectic welding jig 100 is expressed in an open manner, that is, the eutectic welding jig 100 includes the stopper 1, the plurality of compacts 2, and the support rod 3. Of course, the eutectic welding jig 100 may also be expressed in a closed manner, that is, the eutectic welding jig 100 is composed of the stopper 1, the pressing blocks 2, and the supporting rod 3.

Since the package 200 of the semiconductor laser is once put in the package before eutectic bonding so that the first plate 11 and the second plate 12 are spaced apart by a gap between the outer periphery formed near the bottom and the inner peripheral wall 200b of the package 200 while enclosing the housing space S penetrating in the up-down direction D3 and opening forward based on the first plate 11, the second plate 12, and the third plate 13, that is, the first plate 11, the second plate 12, and the third plate 13 enclose the horizontal U-shape opening forward, the first plate 11 and the second plate 12 are used to form a clearance fit in the inner peripheral wall 200b of the package 200 at the front and rear sides opposed in the front-rear direction D2 of the outer periphery formed near the bottom and at the left and right sides opposed in the left-right direction D1. Such a clearance fit is based on the aforementioned spacing (i.e., non-contact), with a smaller clearance fit being better.

Further, the first plate 11, the second plate 12, and the third plate 13 are set in thickness to fit the available space adjacent to the inner circumferential wall 200b of the tube case 200. Specifically, as shown in fig. 4, the first plate 11 and the third plate 13 are relatively close in thickness, while the second plate 12 is much thicker than the first plate 11 and the third plate 13. The thicknesses of the first plate 11, the second plate 12 and the third plate 13 are determined by fully utilizing the available space at the adjacent position of the inner peripheral wall 200b of the tube shell 200, so that the structural stability of the whole assembly body is improved by fully supporting the corresponding part of the bottom wall 200a of the tube shell 200 after the tube shell 200 is assembled by the eutectic welding fixture 100, the structural strength of the stop block 1 is skillfully combined with the available space at the adjacent position of the inner peripheral wall 200b of the tube shell 200, and the structural strength of the stop block 1 is fully enhanced under the condition of fully utilizing the available space.

As shown in fig. 4 and 5, the compacts 2 are identical, that is, the compacts 2 have the same shape and material (i.e., the same weight), and the force applied to the COS300 is identical. Of course, the size of the corresponding compact may also be flexibly adjusted according to the special requirements of different pressures corresponding to the COS 300. Note that in fig. 4, the top surfaces of a total of 6 COS300 are at different heights, decreasing sequentially from left to right in the drawing and spaced apart from each other, but the present disclosure is not limited to the number and arrangement of fig. 4

The ram 22 may take any suitable shape. Specifically, as shown in fig. 10, each of the indenters 22 has a U-shape, and includes a first contact surface 221 and a second contact surface 222, the first contact surface 221 and the second contact surface 222 being flat and spaced apart from each other in the left-right direction D1, the first contact surface 221 and the second contact surface 222 being for pressing on a portion of the corresponding COS300 provided on the solder inside the package 200 that avoids the COS gold wire. The gravity of each compact 2 is distributed to both sides in the left-right direction D1 through the first contact surface 221 and the second contact surface 222 in combination with the left-right symmetry and the front-back symmetry of each compact 2, so that the first contact surface 221 and the second contact surface 222 apply symmetrical pressure to the center line in the left-right direction D1 between the two on the portion of the corresponding COS300 avoiding the COS gold wires, while the force applied by each of the first contact surface 221 and the second contact surface 222 is distributed in the front-back direction D1, and the two pressures applied by the first contact surface 221 and the second contact surface 222 apply symmetrical pressure to the center line in the front-back direction D2 between the two on the portion of the corresponding COS300 avoiding the COS gold wires, thereby improving the stability and uniformity of the corresponding COS300 under the bearing pressure and further improving the quality of the eutectic welding of the corresponding COS 300.

As described above, each pressing piece 2 cannot rotate around the rod 3, that is, the shape of the mutually opposing portions of the through hole 211 of the plate body 21 of each pressing piece 2 and the rod 3 in the front-rear direction D2 restricts each pressing piece 2 from rotating around the rod 3. The shape of the mutually opposing portions of the through hole 211 of the plate body 21 of each compact 2 and the strut 3 in the front-rear direction D2 may specifically take various forms as long as it is achieved that each compact 2 cannot rotate about the strut 3, and specifically, as shown in fig. 8 to 14, the corresponding faces of the first hole 111 of the first plate 11, the second hole 121 of the second plate 12, and the through hole 211 of the plate body 21 of each compact 2 in the front-rear direction D1 are vertical faces, and the corresponding faces of the strut 3 in the front-rear direction D1 are vertical faces. Further, the projections of the first hole 111 of the first plate 11, the second hole 121 of the second plate 12, and the through hole 211 of the plate body 21 of each pressing block 2 in the left-right direction D1 are rectangular, the supporting rod 3 includes a rod body 31, and the cross section of the rod body 31 has a rectangular shape.

As described above, each of the compacts 2 is capable of floating in the up-down direction D3 with respect to the stem 3, and in one embodiment, referring to fig. 13 and 14 in combination with fig. 4 and 5, when the assembly is once placed in the package 200 of the semiconductor laser before eutectic bonding, each of the compacts 2 is moved upward with respect to the stem 3 by being supported by the corresponding COS300 (i.e., in the state of fig. 13, the distance between the surface of each compact 2 that will contact the COS (specifically, the aforementioned first contact surface 221 and second contact surface 222) and the bottom surface of the first plate 11 and the bottom surface of the second plate 12 is smaller than the height of the corresponding COS300 in the package 200), so that the upper surface of the through hole 211 of each compact 2 is separated from the stem 3, the lower surface of the through hole 211 remains out of contact with the stem 3 despite the upward movement of each compact 2 with respect to the stem 3, the stem 3 remains out of contact with the stem 3, and the stem 3 is placed in the package 200 of the semiconductor laser before eutectic bonding while the stem 3 is placed in the upper surface of the stem 3 of the first plate 11 and the second stem 12 of the second plate 111 and the lower surface of the second stem 12 remains in contact with the upper stem 111, thus the gap of each compact 2 is larger than the size of the lower surface of the lower stem 111 of the upper stem 111 in the lower stem 111 of the second stem 111 of the upper stem 12 before eutectic bonding, and the second stem 12 of the upper stem 111 of the second stem 111 of the upper stem 3, and the second stem 12 of the lower stem 11, so that the assembly before eutectic bonding is still satisfies the size. The size of the through hole 211 of the plate body 21 of each compact 2 in the vertical direction D3 and the size of the first hole 111 of the first plate 11 and the second hole 121 of the second plate 12 in the vertical direction D3 can be flexibly determined as long as the size of each compact 2 in the vertical direction D3 can be satisfied such that each compact 2 can float in the vertical direction D3 with respect to the support rod 3 and each compact 2 does not contact the support rod 3 in the vertical direction D3 at the through hole 211 after the assembly is placed in the package 200 of the semiconductor laser at one time before eutectic bonding, that is, the surface of the through hole 211 of the plate body 21 of each compact 2 in the vertical direction D3 can be in any shape as long as the size in the vertical direction D3 satisfies the above-mentioned floating but does not contact the support rod 3. In addition, the order in which the bottom surface of the first plate 11 and the bottom surface of the second plate 12 contact the bottom wall 200a of the package 200 and the indenter 22 of each of the compacts 2 contact the COS can be flexibly set as long as each of the compacts 2 can float in the up-down direction D3 with respect to the rod 3 and each of the compacts 2 does not contact the rod 3 in the up-down direction D3 at the through hole 211 after the assembly is once put into the package 200 of the semiconductor laser before eutectic bonding.

In order to improve the operational reliability, as shown in fig. 1 to 5 and 11 to 14, the rod 3 includes a stopper 32, the stopper 32 is disposed at one end of the rod body 31 in the left-right direction D1, and the stopper 32 is used to prevent the rod 3 from coming out through the first hole 111 of the first plate 11, the second hole 121 of the second plate 12, and the through hole 211 of the plate body 21 of each pressing block 2. Of course, the bar 3 can also be made sufficiently long without the use of the stop 32. The stopper portion 32 is preferably used from the viewpoint of the use of the operating space for eutectic bonding.

The above detailed description describes exemplary embodiments, but is not intended to limit the combinations explicitly disclosed herein. Thus, unless otherwise specified, various features disclosed herein can be combined together to form a number of additional combinations that are not shown for the sake of brevity.

Claims (10)

1. An eutectic welding jig is characterized in that,

the eutectic welding clamp (100) comprises a stop block (1), a plurality of pressing blocks (2) and a support rod (3);

the stop block (1) comprises a first plate (11), a second plate (12) and a third plate (13), wherein the first plate (11) is opposite to the second plate (12) in the left-right direction (D1), the third plate (13) connects the rear ends of the first plate (11) and the second plate (12) in the front-back direction (D2), the first plate (11), the second plate (12) and the third plate (13) enclose an accommodating space (S) which penetrates through the first plate (11) in the up-down direction (D3) and is open forwards, the first plate (11) is provided with a first hole (111) penetrating through the first plate (D1) in the left-right direction (D1), the second plate (12) is provided with a second hole (121) penetrating through the second plate (D1) in the left-right direction (D1), and the second hole (121) is opposite to the first hole (111) in the left-right direction (D1);

each pressing block (2) comprises a plate body (21) and pressing heads (22), each plate body (21) is provided with a through hole (211) which penetrates through along the left-right direction (D1), each pressing head (22) protrudes downwards from the center of the bottom surface (212) of the corresponding plate body (21), and each pressing block (2) is symmetrical left and right and is symmetrical front and back;

the support rod (3) is used for penetrating through the first hole (111) of the first plate (11), the second hole (121) of the second plate (12) and the through holes (211) of the plate body (21) of the plurality of pressing blocks (2) in a clearance fit mode in the front-back direction (D2) and the up-down direction (D3), so that the stop block (1), the plurality of pressing blocks (2) and the support rod (3) form an assembly body,

in the assembly, the plate bodies (21) of the plurality of pressure blocks (2) and the first plate (11) and the second plate (12) of the stopper (1) are spaced apart from each other with a gap in the left-right direction (D1), the rear surface (213) of each plate body (21) and the third plate (13) are spaced apart from each other with a gap in the front-rear direction (D2), and each pressure block (2) is capable of floating in the up-down direction (D3) relative to the strut (3) but is incapable of rotating about the strut (3);

the assembly is used for: before eutectic soldering, the semiconductor laser is placed in a tube shell (200) at one time, so that the bottom surface of a first plate (11) and the bottom surface of a second plate (12) are supported on the bottom wall (200 a) of the tube shell (200), the first plate (11) and the second plate (12) are spaced from the inner peripheral wall (200 b) of the tube shell (200) by a gap between the periphery formed near the bottom and the inner peripheral wall (200 b), each briquetting (2) is not contacted with a support rod (3) in the up-down direction (D3) and the front-back direction (D2) of a through hole (211) and is pressed on the tube shell (200) by the weight of the briquetting (22) at the position where the COS of the corresponding COS (300) arranged on the welding material avoids the gold wire, and the bottom surface (212) of a plate body (21) of each briquetting (2) is positioned above the top surface (200 c) of the tube shell (200) and is spaced from the top surface (200 c) of the tube shell (200); and removing the assembly from the case (200) at a time after eutectic bonding without removing the support rod (3) during eutectic bonding.

2. The eutectic bonding fixture of claim 1,

the first plate (11) and the second plate (12) are used to form a clearance fit in the inner peripheral wall (200 b) of the tube case (200) at the front side and the rear side opposite to each other in the front-rear direction (D2) and the left side and the right side opposite to each other in the left-right direction (D1) of the outer periphery formed near the bottom.

3. The eutectic bonding fixture of claim 1,

the first plate (11), the second plate (12), and the third plate (13) are set in thickness to fit the available space adjacent to the inner peripheral wall (200 b) of the tube case (200).

4. The eutectic bonding fixture of claim 1,

each indenter (22) is U-shaped and includes a first contact surface (221) and a second contact surface (222), the first contact surface (221) and the second contact surface (222) are both flat surfaces and are spaced apart from each other in the left-right direction (D1), and the first contact surface (221) and the second contact surface (222) are used for pressing on a portion of the corresponding COS (300) disposed on the solder in the case (200) that avoids the COS gold wire.

5. The eutectic bonding fixture of claim 1,

corresponding surfaces of the first hole (111) of the first plate (11), the second hole (121) of the second plate (12) and the through hole (211) of the plate body (21) of each pressing block (2) in the front-rear direction (D2) are vertical surfaces;

the corresponding surface of the strut (3) in the front and rear direction (D2) is also a vertical surface.

6. The eutectic bonding fixture of claim 5,

projections of the first hole (111) of the first plate (11), the second hole (121) of the second plate (12) and the through hole (211) of the plate body (21) of each pressing block (2) in the left-right direction (D1) are rectangular;

the supporting rod (3) comprises a rod body (31), and the cross section of the rod body (31) is rectangular.

7. The eutectic bonding fixture of claim 1,

the size of the through hole (211) of the plate body (21) of each pressing block (2) in the vertical direction (D3) is larger than the size of the first hole (111) of the first plate (11) and the size of the second hole (121) of the second plate (12) in the vertical direction (D3).

8. The eutectic bonding fixture of claim 1,

the supporting rod (3) comprises a stopping portion (32), the stopping portion (32) is arranged at one end of the rod body (31) in the left-right direction (D1), and the stopping portion (32) is used for preventing the supporting rod (3) from being separated from a first hole (111) of the first plate (11), a second hole (121) of the second plate (12) and a through hole (211) of the plate body (21) of each pressing block (2).

9. The eutectic bonding fixture of claim 1,

the eutectic welding fixture (100) is composed of a stop block (1), a plurality of pressing blocks (2) and a support rod (3).

10. The eutectic bonding fixture of claim 1,

the plurality of pressing blocks (2) are all the same.

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