CN218735708U

CN218735708U - Charging and discharging power supply and formation grading equipment

Info

Publication number: CN218735708U
Application number: CN202222519951.2U
Authority: CN
Inventors: 刘斌
Original assignee: Sany Technology Equipment Co Ltd
Current assignee: Sany Technology Equipment Co Ltd
Priority date: 2022-09-22
Filing date: 2022-09-22
Publication date: 2023-03-24
Anticipated expiration: 2032-09-22

Abstract

The application relates to the technical field of formation and grading equipment, in particular to a charging and discharging power supply and formation and grading equipment. The charging and discharging power supply is applied to the battery formation and capacity grading process and comprises a box body and a first circuit board, wherein the first circuit board is positioned in the box body and is provided with a target area, and a plurality of first elements are at least arranged in the target area; the liquid cooling device comprises a liquid cooling row and a liquid supply pipeline for supplying and discharging liquid to the liquid cooling row, the liquid cooling row is positioned on at least one side of the target area, and the outer wall of the liquid cooling row is in contact with the second element on the first circuit board. According to the charging and discharging power supply, through the liquid cooling device, heat in the power supply box is effectively absorbed by flowing cooling liquid, and targeted and effective heat dissipation is performed on elements which are small in size and large in heat productivity on the first circuit board through the liquid cooling device, so that the heat dissipation performance of the power supply is improved, the effective service life of the power supply is prolonged, and the problem that the first circuit board of the charging and discharging power supply used for formation and partial capacity in the prior art is large in heat productivity and prone to causing overheating damage of the power supply is solved.

Description

Charging and discharging power supply and formation grading equipment

Technical Field

The application relates to the technical field of formation and grading equipment, in particular to a charging and discharging power supply and formation and grading equipment.

Background

The lithium battery is used as a power source of future electric vehicles and energy storage, and during the manufacturing process, the battery core needs to be subjected to chemical conversion and grading so as to ensure the quality of the final product power supply product. Wherein:

the formation refers to: lithium batteries, which are unpowered when assembled, must be activated by charging, and the first charge of a lithium battery is called 'formation' to activate the active material within the battery.

The capacity grading means that: and charging and discharging the battery, and detecting the discharge capacity when the battery is fully charged in a partial capacity mode to determine the capacity of the battery. Only cells with a capacity that meets or exceeds the design capacity will be acceptable. This process of screening out acceptable batteries by capacity testing is called capacity grading.

The formation and capacity grading equipment is equipment for performing formation or capacity grading operation on a lithium battery, and is provided with a charging and discharging power supply for charging and discharging the battery, and the power supply needs to adjust different parameters according to the batch and specification of the charging and discharging battery, so that the volume of a circuit board is large, a plurality of elements are arranged, a part of elements have large heat productivity, the power supply is easily damaged due to overheating, and the effective service life of the power supply is shortened.

SUMMERY OF THE UTILITY MODEL

In view of the above, an object of the present invention is to provide a charging/discharging power supply, which effectively dissipates heat of a component with a large heat value through a liquid cooling bar, improves heat dissipation performance of the power supply, prolongs effective service life of the power supply, and at least to some extent, solves the problem that the circuit board of the charging/discharging power supply used in the chemical composition capacity in the prior art has a large heat value and is easily damaged by overheating.

The first circuit board is provided with a target area, and the target area is at least provided with a plurality of first elements; the liquid cooling device comprises a liquid cooling row and a liquid supply pipeline for supplying liquid and draining liquid to the liquid cooling row, wherein the liquid cooling row is located on at least one side of the target area, and the outer wall of the liquid cooling row is in contact with the second element on the first circuit board.

In a possible embodiment, the liquid-cooled row extends along the extension direction of the target area, with a first side facing the target area, and the second element is adhered to a second side of the liquid-cooled row opposite to the first side; and/or a heat conducting sheet is arranged between the second element and the liquid cooling row.

In a possible embodiment, the first element comprises a capacitor, and the liquid cooling rows are arranged on both sides of the target area.

In a possible embodiment, two of said liquid-cooled rows on either side of the same target area are connected in series by a connecting tube.

In a possible embodiment, a plurality of liquid flow passages communicated with each other are arranged in the liquid cooling row, and the extending direction of at least part of the liquid flow passages is consistent with the arrangement direction of the first element.

In a possible implementation manner, the tank body is provided with a liquid inlet main joint and a liquid outlet main joint, and the liquid inlet main joint and the liquid outlet main joint are both located on the first side wall of the tank body and are connected with an external liquid cooling system.

In a possible implementation manner, at least two first circuit boards are arranged in the box body, a liquid inlet of each liquid cooling bar is connected with a liquid inlet header pipe in the liquid supply pipeline, and a liquid outlet of each liquid cooling bar is connected with a liquid outlet header pipe in the liquid supply pipeline.

In one possible embodiment, the liquid-cooled rows on at least two of the first circuit boards are arranged in series.

In a possible embodiment, the liquid supply line is detachably connected to the liquid cooling bank via a line connection; and/or the liquid inlet main pipe and the liquid outlet main pipe of the liquid supply pipeline are respectively detachably connected with the pipeline joint on the box body.

This application on the other hand provides a change composition partial volume equipment, including cabinet body frame, needle bed and as above any charge-discharge power supply, charge-discharge power supply with the needle bed all is located in cabinet body frame.

According to the charge-discharge power supply who is applied to formation partial volume field that this application provided, set up the liquid cooling device in its box, absorb the heat in the box through the coolant liquid that flows, and cool off the heat dissipation to first circuit board. The liquid cooling bar is positioned on at least one side of a target area with a plurality of first elements on the first circuit board, so that the heat of the target area can be effectively absorbed, the elements with high heat generation quantity in the target area can be effectively cooled, and the element area which is small in size, large in heat dissipation quantity and concentrated in arrangement on the first circuit board is used as the target area, so that the liquid cooling bar can pertinently and obviously cool and dissipate the area; simultaneously, the outer wall that the liquid cooling was arranged still contacts with the second component on the first circuit board, effectively cools down to the second component, and arranges the liquid supply pipeline for liquid cooling row confession liquid or flowing back also in the box, effectively absorbs the heat that first circuit board gived off. Therefore, the charging and discharging power supply can effectively cool and radiate the first circuit board with large volume and multiple elements, prevents the power supply from being damaged due to overheating to a certain extent, and effectively prolongs the normal operation of the formation and grading process.

Drawings

Fig. 1 is a schematic structural diagram of a liquid cooling bar and a first circuit board in an embodiment of the present application;

FIG. 2 is a schematic structural diagram of a liquid cooling bar in an embodiment of the present application;

fig. 3 is a schematic structural diagram of a charging and discharging power supply box in the embodiment of the present application.

In FIGS. 1-3:

1. a first circuit board; 2. liquid cooling and discharging; 3. a second element; 4. a heat conductive sheet; 5. a first element; 6. a relay; 7. an inductance; 8. a liquid inlet pipeline joint; 9. a liquid outlet pipe joint; 10. a serial pipeline joint; 11. a box body; 12. a liquid inlet main joint; 13. a liquid outlet main joint; 14. a liquid inlet header pipe; 15. a liquid outlet main pipe; 16. a connecting pipe; 17. a second circuit board; 21. a liquid flow passage.

Detailed Description

Embodiments of the present application are directed to provide a charging and discharging power supply, in which, through a liquid cooling device, a flowing cooling liquid is used to effectively absorb heat in a power supply box, and a liquid cooling bar is used to effectively dissipate heat of a small-sized component with a large heat dissipation amount on a first circuit board, so as to improve heat dissipation performance of the power supply, prolong effective service life of the power supply, and solve, to at least a certain extent, the problem that the first circuit board of the charging and discharging power supply used in the formation and partial capacitance in the prior art is large in heat dissipation amount and easily causes overheating damage of the power supply. Embodiments of the present application are also directed to a composition and partial capacity device including the above charging and discharging power supply.

The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only a part of the embodiments of the present application, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.

Referring to fig. 1-3, an embodiment of the present application provides a charging/discharging power supply, which can be applied to a chemical-chemical capacitance step to supply power for a chemical-chemical capacitance operation of a battery, and includes a case 11, where the case 11 includes a first circuit board 1 and a liquid cooling device, the first circuit board 1 has a plurality of components (generally referred to as components and devices) thereon and has a target area, the target area at least has a plurality of first components 5, the first components 5 can be components with large heat generation amount in the circuit board, a region where the first components 5 on the first circuit board 1 are intensively arranged can be used as the target area, and the first components 5 and other components with large heat generation amount can be intensively arranged and the intensively arranged region can be used as the target area. Of course, the size of the target area may be specifically set according to circumstances, and may be formed by a partial area of the first circuit board 1, or may be formed by the entire area of the first circuit board 1.

The liquid cooling device comprises a liquid cooling row 2 and a liquid supply pipeline which are positioned in the box body 11, the liquid supply pipeline is connected with a liquid supply system outside the box body 11 and supplies and discharges liquid for the liquid cooling row 2, and flowing cooling liquid continuously flows through the box body 11 of the power supply to effectively absorb heat in the box body 11. Wherein, liquid cooling row 2 is provided with at least one, is located 1 at least one side of target area of first circuit board, is close to a plurality of first components 5 in the target area, the effectual heat that absorbs first component 5 and distribute, certainly, one side that is close to the target area of liquid cooling row 2, for example first side, can also contact with the first component 5 that is close to liquid cooling row 2 in the target area, and effective and efficient dispels the heat to the big component of heat production. Simultaneously, the outer wall of liquid cooling row 2 still contacts with second component 3 on the first circuit board 1, so, liquid cooling row 2 not only can be provided with the target area of the big component of a plurality of heat productions of concentrating and effectively dispel the heat, can also be pertinence carry out effective heat dissipation to second component 3, make full use of liquid cooling row 2 effective heat absorption area, also pertinence carry out high-efficient heat dissipation to a plurality of components that small but calorific capacity is big on the first circuit board 1. The liquid supply pipelines for supplying and discharging liquid to the liquid cooling row 2 are also positioned in the box body 11 and are arranged in the box body 11, so that heat in the box body 11 can be absorbed, and overlarge heat in the closed power supply box body 11 (the power supply box is usually closed to prevent internal elements from being damped) is avoided. And the liquid cooling device is used for dissipating heat of the power supply in a liquid cooling mode, so that the influence of the ambient temperature on the heat dissipation effect is small, the heat dissipation performance of the power supply in a high-temperature environment is improved, and the tolerance of the power supply to the high-temperature environment is improved.

In combination with the above, it can be seen that, the charge and discharge power supply that this embodiment provided, utilize the liquid cooling device to carry out the liquid cooling to the power supply box, effectively absorb the heat in the closed box 11, and through setting up liquid cooling row 2, can pertinence carry out high-efficient heat dissipation to a plurality of components that small but calorific capacity is big on the first circuit board 1, effectively avoid bulky, the first circuit board 1 that the component is many damages because of the heat is too high, the heat dispersion of this kind of power has been improved, the tolerance of power to high temperature environment and the quality of use under high temperature environment have also been improved, the effective life of extension power, the problem that the first circuit board 1 calorific capacity of the charge and discharge power supply that the formation partial volume used among the prior art leads to the power supply overheat damage greatly to solution to at least a certain degree. Compare in dispelling the heat through fan to first circuit board 1, there is some components to have the leeward side, or the component is small and lead to little with the area of contact of air current, the slow scheduling problem dispels the heat, the charge and discharge power that this embodiment provided, its liquid cooling device heat dispersion is higher, can be effectual to the small component that nevertheless gives out heat greatly cool heat dissipation, and receive ambient temperature's influence low, still can effectively dispel the heat in high temperature environment.

In some embodiments, the first circuit board 1 is a power board, the second circuit board 17 is further disposed in the box 11, and the second circuit board is a control board, so that circuit components are divided into two circuit boards, and the thermal influence of the power board with large heat generation on the control board is reduced. The liquid cooling device is used for cooling and radiating the power plate in a targeted manner, so that the radiating efficiency can be improved, and the circuit elements can be prevented from being damaged due to overheating more comprehensively.

The liquid cooling row 2 is located at least on one side of the target area, and in some embodiments, the liquid cooling row 2 extends along the extension direction of the target area, for example, along the length or width direction of the first circuit board 1, so that the target area can be close to a cooling surface with a larger area on the liquid cooling row 2. For example, as shown in fig. 1, the liquid cooling bank 2 has a plate shape, the thickness direction of which coincides with the width direction of the first circuit board 1, the length direction of which coincides with the length direction of the first circuit board 1, and the first side plate surface faces the target area and is close to or in contact with the element adjacent to the first side plate surface in the target area. And the second element 3 is attached to the panel of the second side of the liquid-cooled row 2 opposite to the first side, i.e. the side facing away from the target area. So set up, can make full use of the cooling area of liquid cooling row 2, can make liquid cooling row 2 be close to or contact as much as possible can the component that generates heat, the high-efficient heat absorption improves the radiating efficiency of liquid cooling row 2 to first circuit board 1 remarkably.

The second element 3 can be bonded with the liquid cooling bar 2 through heat conducting glue to increase the heat conducting efficiency. The second element 3 can also be connected to the liquid cooling bar 2 by fasteners or can be welded to the liquid cooling bar 2.

In some embodiments, a heat conducting sheet 4 is further disposed between the second element 3 and the liquid cooling bar 2, the second element 3 is connected to the heat conducting sheet 4, and the heat conducting sheet 4 is connected to an outer wall of the liquid cooling bar 2, for example, the second side of the liquid cooling bar 2. In some embodiments, the second element 3 is an MOS tube, the MOS tube is in a thin plate shape, and is adhered to the outer wall of the liquid cooling bar 2, so that the contact area with the liquid cooling bar 2 is large, and heat dissipation is maximized.

The liquid cooling row 2 can be fastened on the first circuit board 1 by fasteners such as screws, or can be soldered on the first circuit board 1. In one embodiment, as shown in fig. 3, in the case 11, the length direction of the first circuit board 1 coincides with the length direction of the case 11, and the target area is located at one end of the first circuit board 1. Of course, in other embodiments, the target area may be located in the middle area of the first circuit board 1 or an area biased to one end.

In some embodiments, the first element 5 includes a capacitor, as shown in fig. 1, a plurality of capacitors are centrally disposed in the target area, the capacitor has a small volume and a cylindrical shape, the heat generation amount is high, and the heat dissipation is not easy, and the liquid cooling row 2 cools and dissipates the heat thereof, so that the heat dissipation effect is better than that achieved by using a fan.

In some embodiments, the liquid cooling rows 2 are disposed on both sides of the target area in the width direction or the length direction, that is, for the same target area, the two liquid cooling rows 2 are disposed on both sides of the target area, which is equivalent to clamping the components in the target area between the two liquid cooling rows 2, so that the components with large heat generation amount can be more efficiently dissipated. If the liquid cooling rows 2 extend along the length direction of the first circuit board 1, two liquid cooling rows 2 are arranged and distributed along the width direction of the first circuit board 1. For example, two liquid-cooled banks 2 are distributed on both sides of the first circuit board 1 in the width direction. So, the target area is between two liquid cooling rows 2, regional area is great, be convenient for set up the component, and the length direction of liquid cooling row 2 is unanimous with first circuit board 1 length direction, also be convenient for set up the length of liquid cooling row 2, be convenient for set up the length of liquid cooling row 2 according to the length of target area, also enable the length of liquid cooling row 2 to be greater than the length of target area, for example, the length of liquid cooling row 2 is unanimous with the length of first circuit board 1, the both sides of the width direction of first circuit board 1 all are provided with liquid cooling row 2, effectual all components to on the first circuit board 1 cool off the heat dissipation.

As shown in fig. 2, a plurality of liquid flow passages 21 are arranged in the liquid cooling bank 2, and at least a part of the plurality of liquid flow passages 21 extends in the same direction as the arrangement direction of the first elements 5. For example, part liquid runner 21 extends along the direction of height of liquid cooling row 2, and part liquid runner 21 extends along the length direction of liquid cooling row 2, so, a plurality of liquid runners 21 arrange in liquid cooling row 2, can prolong the length of time that the coolant liquid flows through, compare in liquid cooling row 2 and have a big appearance chamber, the coolant liquid that newly gets into liquid cooling row 2 and the coolant liquid that has been in liquid cooling row 2, can not quick large tracts of land mix, more do benefit to quick absorbed heat, cool off fast to first circuit board 1. The target area is also provided with a relay 6, as shown in fig. 1, the relay 6 is positioned at one side of the capacitor and is close to or in contact with the first side of the liquid cooling bar 2.

The first circuit board 1 is further provided with a third component, such as an inductor 7, wherein the inductor 7 has a relatively large volume, and in some embodiments, one end of the liquid cooling row 2 in the length direction is close to or in contact with the third component, such as the inductor 7, namely, the third component, such as the inductor 7, is located at one end of the liquid cooling row 2 in the length direction. It can also be said that the third component, such as the inductor 7, is located at one end of the target area and the end face of the liquid cold drain 2 is in close proximity or contact with the outer wall of the third component, such as the inductor 7. When the inductor 7 is provided with two, the liquid cooling rows 2 are also provided with two liquid cooling rows respectively arranged at two sides of the first circuit board 1, and the end face of one end of each liquid cooling row 2 is close to or in contact with the outer wall of one inductor 7.

The liquid supply pipeline comprises a liquid inlet pipe for supplying liquid to the liquid cooling discharge 2 and a liquid outlet pipe for supplying liquid to the liquid cooling discharge 2. When two liquid cooling rows 2 are arranged on the same first circuit board 1, the liquid supply pipeline further comprises a connecting pipe 16, and the two liquid cooling rows 2 on the same first circuit board 1 are connected in series through the connecting pipe 16, namely, are connected in series on the pipeline of the liquid cooling device. So, a liquid cooling row 2 links to each other with the feed liquor pipe, and another liquid cooling row 2 links to each other with the drain pipe, need not set up too much feed liquor and the pipeline branch of play liquid, avoids the pipeline too much and influences the part in the box 11 and arrange.

The wall of the tank 11 is provided with a pipe joint for connecting the liquid supply pipe to an external liquid cooling system. Whereas the inlet manifold 12 connected to the inlet pipe and the outlet manifold 13 connected to the outlet pipe are located on the same side wall, for example the first side wall, of the tank 11. The first side wall may be one side wall in the longitudinal direction of the case 11, or may be one side wall in the width direction. Therefore, the pipelines of the external liquid cooling system are arranged on one side of the box body 11, and the connection and disconnection operation of the box body 11 and the external liquid cooling system is easy to realize.

As shown in fig. 3, in some embodiments, at least two first circuit boards 1 are disposed in the box 11, at least two first circuit boards 1 are disposed side by side in the box 11, for example, arranged in a width direction, two liquid cooling rows 2 are disposed on each of the two first circuit boards 1, for example, two liquid cooling rows 2 are disposed on the first circuit board a, two liquid cooling rows 2 are disposed on the first circuit board B, each liquid cooling row 2 on the two first circuit boards 1 shares one inlet main pipe 14 and one outlet main pipe 15, two pipe joints, one inlet main joint 12 and one outlet main joint 13 are disposed on a wall of the box 11, so as to connect the liquid supply pipe and the external liquid cooling system.

In some embodiments, the two liquid-cooled banks 2 on the first circuit board 1 are arranged in series in the liquid-cooled apparatus. Specifically, one end of the inlet manifold 14 is connected to the inlet manifold 12 on the box 11, and the other end is connected to one liquid-cooled busbar 2 on the first circuit board a, and this liquid-cooled busbar 2 is connected to another liquid-cooled busbar 2 on the first circuit board a through the connecting pipe 16, and simultaneously, another liquid-cooled busbar 2 is connected to one liquid-cooled busbar 2 on the first circuit board B through the connecting pipe 16, and this liquid-cooled busbar 2 is also connected to another liquid-cooled busbar 2 on the first circuit board B through the connecting pipe 16, and simultaneously, this another liquid-cooled busbar 2 is connected to the outlet manifold 15. The other end of the liquid outlet main pipe 15 is connected with a liquid outlet main joint 13 on the box body 11. So set up, can simplify the structure of pipeline, make the succinct arranging of pipeline in box 11, avoid the pipeline to be mixed and disorderly.

In one embodiment, the liquid supply pipeline in the box 11 is detachably connected to the liquid cooling bar 2, for example, the liquid supply pipeline includes a liquid inlet main pipe 14, a liquid outlet main pipe 15 and a connecting pipe 16, and the liquid inlet main pipe 14, the liquid outlet main pipe 15 and the connecting pipe 16 are detachably connected to the liquid cooling bar 2 through pipeline joints. Specifically, the liquid inlet pipe joint 8, the liquid outlet pipe joint 9 and the serial pipe joint 10 are arranged at the pipe ends of the liquid inlet main pipe 14, the liquid outlet main pipe 15 and the connecting pipe 16 or on the liquid cooling bar 2, as shown in fig. 1, and each pipe joint is detachably connected with a corresponding pipe in the liquid supply pipe. So set up, even if realize being connected of liquid supply pipeline and liquid cooling row 2, also be convenient for realize the separation of first circuit board 1 and liquid supply pipeline, be convenient for realize arranging and fixed the setting of each part in box 11.

In one embodiment, the inlet manifold 14 and the outlet manifold 15 are detachably connected to the pipe joints of the tank 11. So set up, be convenient for realize supplying liquid pipeline and box 11 be connected and separation, also do benefit to and dismantle the supply liquid pipeline and change or operation such as maintenance or rearrangement.

The embodiment of the application also provides a component capacity equipment, which comprises the charging and discharging power supply of any one of the above embodiments, and also comprises a needle bed. This formation partial volume equipment uses the charge and discharge power supply of above-mentioned structure to become or partial volume to the lithium cell, because of this charge and discharge power supply heat dispersion is high, can avoid overheated and impaired, and receive ambient temperature's influence for a short time, has prolonged the effective life of power, has also prolonged the effective life of this formation partial volume equipment. The derivation process of the beneficial effect is consistent with the derivation process of the beneficial effect of the charging and discharging power supply, and details are not repeated here.

And because the charge-discharge power supply that this application provided has good heat dispersion, receives ambient temperature's influence for a short time, can put into the formation partial volume workshop, be close to the setting with the body or the needle bed of formation partial volume equipment, can reduce the operation cost of formation partial volume process.

For example, the chemical composition and content equipment comprises a cabinet frame, and the charging and discharging power supply and the needle bed are both positioned in the cabinet frame for chemical composition and content operation. So, compare in establishing the power at the external current formation partial volume equipment of cabinet, the formation partial volume equipment structure of this embodiment is clean and tidy, and integrated nature is high, has the transport of being convenient for and the beneficial nature of arranging, more can wholly place in the formation workshop, reduces the complexity that equipment arranged, reduces occupation space, reduces the operation cost to a certain extent.

The foregoing describes the general principles of the present application in conjunction with specific embodiments, however, it is noted that the advantages, effects, etc. mentioned in the present application are merely examples and are not limiting, and they should not be considered essential to the various embodiments of the present application. Furthermore, the foregoing disclosure of specific details is for the purpose of illustration and description and is not intended to be limiting, since the foregoing disclosure is not intended to be exhaustive or to limit the disclosure to the precise details disclosed.

The components, devices referred to in this application are meant as illustrative examples only and are not intended to require or imply that they must be connected, arranged, or configured in the manner shown in the drawings. These components, devices may be connected, arranged, configured in any manner, as will be appreciated by those skilled in the art. Words such as "including," "comprising," "having," and the like are open-ended words that mean "including, but not limited to," and are used interchangeably therewith. The words "or" and "as used herein mean, and are used interchangeably with, the word" and/or, "unless the context clearly dictates otherwise. The word "such as" is used herein to mean, and is used interchangeably with, the phrase "such as but not limited to".

It should also be noted that in the apparatus, devices of the present application, the components may be disassembled and/or reassembled. These decompositions and/or recombinations are to be considered as equivalents of the present application.

The previous description of the disclosed aspects is provided to enable any person skilled in the art to make or use the present application. Various modifications to these aspects will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other aspects without departing from the scope of the application. Thus, the present application is not intended to be limited to the aspects shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

It should be understood that the terms "first", "second" and "third" used in the description of the embodiments of the present application are only used for clearly illustrating the technical solutions and are not used for limiting the protection scope of the present application.

The foregoing description has been presented for purposes of illustration and description. Furthermore, the description is not intended to limit embodiments of the application to the form disclosed herein. While a number of example aspects and embodiments have been discussed above, those of skill in the art will recognize certain variations, modifications, alterations, additions and sub-combinations thereof.

The above description is only exemplary of the present application and should not be taken as limiting the present application, as any modifications, equivalents and the like that are within the spirit and principle of the present application should be included in the scope of the present application.

Claims

1. The utility model provides a charge-discharge power supply, is applied to the battery and becomes partial volume process, its characterized in that, including the box and be located in the box:

a first circuit board having a target area with at least a plurality of first components therein;

the liquid cooling device comprises a liquid cooling row and a liquid supply pipeline for supplying liquid and draining liquid to the liquid cooling row, wherein the liquid cooling row is located on at least one side of the target area, and the outer wall of the liquid cooling row is in contact with the second element on the first circuit board.

2. The charging and discharging power supply according to claim 1, wherein the liquid-cooled bar extends along an extension direction of the target area, a first side faces the target area, and the second element is connected to a second side of the liquid-cooled bar opposite to the first side;

and/or a heat conduction sheet is arranged between the second element and the liquid cooling row.

3. The charging and discharging power supply according to claim 1, wherein the first element comprises a capacitor, and the liquid cooling bar is disposed on both sides of the target area.

4. The charging and discharging power supply according to claim 3, wherein two said liquid-cooled rows on both sides of the same target area are connected in series by a connecting pipe.

5. The charging and discharging power supply according to claim 1, wherein a plurality of liquid flow passages are arranged in said liquid-cooled bank, and at least a portion of said liquid flow passages extend in a direction identical to the arrangement direction of said first element.

6. The charging and discharging power supply according to claim 1, wherein the box body is provided with a liquid inlet main joint and a liquid outlet main joint, and the liquid inlet main joint and the liquid outlet main joint are both positioned on the first side wall of the box body and are connected with an external liquid cooling system.

7. The charging and discharging power supply according to claim 1, wherein at least two first circuit boards are arranged in the box body, a liquid inlet of each liquid cooling bar is connected with a liquid inlet header pipe in the liquid supply pipeline, and a liquid outlet of each liquid cooling bar is connected with a liquid outlet header pipe in the liquid supply pipeline.

8. The charging and discharging power supply according to claim 7, wherein at least two of said liquid-cooled banks on said first circuit board are arranged in series.

9. The charge-discharge power supply according to claim 1, wherein the liquid supply line is detachably connected to the liquid cooling bar through a pipe joint;

and/or the liquid inlet main pipe and the liquid outlet main pipe of the liquid supply pipeline are respectively detachably connected with the pipeline joint on the box body.

10. A chemical component capacity equipment, which is characterized by comprising a cabinet body frame, a needle bed and the charge and discharge power supply according to any one of claims 1 to 9, wherein the charge and discharge power supply and the needle bed are both positioned in the cabinet body frame.