CN218730800U

CN218730800U - High-precision positioning device suitable for ball mounting of BGA chip

Info

Publication number: CN218730800U
Application number: CN202222980817.2U
Authority: CN
Inventors: 张勇
Original assignee: Individual
Current assignee: Individual
Priority date: 2022-11-09
Filing date: 2022-11-09
Publication date: 2023-03-24
Anticipated expiration: 2032-11-09

Abstract

The utility model discloses a high accuracy positioner suitable for BGA chip plants ball belongs to chip and plants ball technical field, including base and the adjustable shelf of setting on the base, the base is provided with the baffle for cuboid structure and upper surface, the activity is provided with the adjustable shelf on the baffle, the clamp groove has been seted up on the adjustable shelf, the inside of pressing from both sides the groove is provided with many telescopic links, be connected with splint on the telescopic link, the butt has the mount on the splint, the mount includes apron, mould and bottom plate, set up the draw-in groove of mutually supporting with the mould on the bottom plate, the inside of draw-in groove is provided with the adjustment tank between two parties, the inside activity of adjustment tank is provided with the fixture block, the array is provided with a plurality of supports on the bottom face of base, be provided with the push rod of being connected with the adjustable shelf on the base. This high accuracy positioner suitable for BGA chip plants ball, simple structure, reasonable in design has fine practicality.

Description

High-precision positioning device suitable for ball mounting of BGA chip

Technical Field

The utility model relates to a chip plants the ball technical field, especially relates to a high accuracy positioner suitable for BGA chip plants ball.

Background

The chip is planted the ball and is mainly added the tin ball on the pad of BGA chip, because the particularity of BGA chip, the BGA chip that has gone through welding process once can't carry out reuse, if want the chip to reuse, must carry out the chip and plant the ball earlier, resumes the solderability of BGA chip, just can. Placing solder balls in the ball planting process of the chip is a necessary, accurate and high-difficulty link, the designed high-precision positioning device well solves the problem, the success rate of ball planting of the chip is improved, the ball planting efficiency is shortened to fifteen minutes from the original one hour, and the win-win situation of the ball planting success rate and the ball planting efficiency is realized; the chip ball-planting assembly can use coplanar welding, so that the reliability, safety and stability of the chip are greatly improved.

Need fix a position the chip at the chip ball planting in-process to guarantee to plant the precision of ball, need plant the ball operation to the chip of equidimension not, the tin ball of equidimension not at the in-process of planting the ball, and plant the in-process of ball at the chip, need remain stable, no person can lead to planting the ball effect not good or even failure, for this reason, provide a high accuracy positioner who is applicable to BGA chip ball planting.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a high accuracy positioner suitable for BGA chip plants ball to solve the problem that proposes in the above-mentioned background art.

In order to achieve the above object, the utility model provides a following technical scheme: the utility model provides a high accuracy positioner suitable for BGA chip plants ball, includes base and the adjustable shelf of setting on the base, the base is provided with the baffle for cuboid structure and upper surface, the activity is provided with the adjustable shelf on the baffle, the clamp groove has been seted up on the adjustable shelf, the inside of pressing from both sides the groove is provided with many telescopic links, be connected with splint on the telescopic link, the butt has the mount on the splint, the mount includes apron, mould and bottom plate, set up the draw-in groove of mutually supporting with the mould on the bottom plate, the inside of draw-in groove is provided with the adjustment tank between two parties, the inside activity of adjustment tank is provided with the fixture block.

Preferably, a plurality of supports are arranged on the bottom end face of the base in an array mode, a push rod connected with the movable frame is arranged on the base, and a side plate is arranged at one end, far away from the movable frame, of the push rod.

Preferably, the side of adjustable shelf is provided with the lug, the activity is provided with the lifter on the lug, install the roof on the lifter.

Preferably, the clamping plate is provided with a slide way, a screw rod is arranged inside the slide way, a pressing plate is movably arranged on the screw rod, and a rubber pad is arranged on the pressing plate.

Preferably, the cover plate is provided with a fixing hole, and the bottom plate is provided with a clamping hole matched with the fixing hole.

Preferably, the inside of adjustment tank is provided with the fixed block, the activity is provided with the threaded rod of mutually supporting with the fixture block on the fixed block, one side of threaded rod is provided with the regulation pole.

The utility model has the advantages as follows:

1. this high accuracy positioner suitable for BGA chip plants ball through the adjustable shelf that sets up on the base and can remove, is convenient for drive splint through the telescopic link that sets up in pressing from both sides inslot portion when using and removes to it is fixed to carry out the centre gripping to the mount, thereby promotes the stability of the device in the use.

2. This high accuracy positioner suitable for BGA chip plants ball through setting up draw-in groove and adjustment tank on the bottom plate, is convenient for install fixedly the mould of different grade type at the in-process that uses, sets up the fixture block in the adjustment tank inside through the activity simultaneously to it is fixed to install the chip that needs plant the ball when using, and the operating personnel of being convenient for fix a position in the use.

Drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings needed to be used in the description of the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings without creative efforts.

Fig. 1 is a schematic structural view of the present invention;

FIG. 2 is a schematic view of the base structure of the present invention;

FIG. 3 is a schematic view of the fixing frame of the present invention;

fig. 4 is a schematic view of the bottom plate structure of the present invention.

In the figure: 1. a base; 10. a clamping groove; 100. a slideway; 101. a support; 102. a baffle plate; 103. a bump; 104. a lifting rod; 105. a top plate; 106. a movable frame; 107. a side plate; 108. a push rod; 109. a splint; 111. a screw; 112. pressing a plate; 113. a telescopic rod; 12. a fixed mount; 120. a fixing hole; 121. a cover plate; 122. a mold; 123. a base plate; 124. adjusting a rod; 125. a fixed block; 126. a threaded rod; 127. a clamping block; 128. a card slot; 129. and (4) adjusting the groove.

Detailed Description

The present invention will be described in detail with reference to the drawings in the embodiments of the present invention, but the scope of the present invention is not limited to the following embodiments, and all the simple equivalent changes and modifications made by the claims and the contents of the specification of the present invention still belong to the scope covered by the present invention.

Referring to fig. 1 to 4, the high-precision positioning device suitable for Ball Grid Array (BGA) chip ball mounting comprises a base 1 and a movable frame 106 arranged on the base 1, wherein the base 1 is of a rectangular parallelepiped structure, a baffle plate 102 is arranged on the upper surface of the base 1, the movable frame 106 is movably arranged on the baffle plate 102, a clamping groove 10 is formed in the movable frame 106, a plurality of telescopic rods 113 are arranged inside the clamping groove 10, a clamping plate 109 is connected to the telescopic rods 113, a fixed frame 12 is abutted to the clamping plate 109, and the movable frame 106 is movably arranged on the base 1, so that the telescopic rods 113 arranged inside the clamping groove 10 drive the clamping plate 109 to move when in use, the fixed frame 12 is clamped and fixed, and the stability of the device in use is improved, the fixing frame 12 comprises a cover plate 121, a mold 122 (the mold 122 can replace different templates according to chips required to be planted with balls, so that an operator can conveniently disassemble and assemble the fixing frame when the fixing frame is used) and a bottom plate 123, a clamping groove 128 matched with the mold 122 is formed in the bottom plate 123, an adjusting groove 129 is formed in the clamping groove 128 in the middle, a clamping block 127 is movably arranged in the adjusting groove 129, a clamping strip of an L-shaped structure is arranged on the clamping block 127, the chips required to be planted with balls are clamped through the clamping strip, the clamping groove 128 and the adjusting groove 129 are formed in the bottom plate 123, the molds 122 of different types can be conveniently and fixedly installed in the using process, and meanwhile, the clamping block 127 movably arranged in the adjusting groove 129 is used for conveniently and fixedly installing the chips required to be planted with balls when the fixing frame is used, so that the practicability of the fixing frame is improved.

Specifically, a plurality of supports 101 are arranged on the bottom end face of the base 1 in an array mode, a push rod 108 connected with the movable frame 106 is arranged on the base 1, a side plate 107 is arranged at one end, far away from the movable frame 106, of the push rod 108, the push rod 108 arranged on the side plate 107 drives the movable frame 106 to move, the position of the movable frame 106 can be conveniently adjusted in the using process, and therefore the stability of the device in the using process is guaranteed.

Specifically, the side of adjustable shelf 106 is provided with lug 103, the activity is provided with lifter 104 on the lug 103, install roof 105 on the lifter 104, the bottom of roof 105 is provided with firing equipment, is convenient for plant the ball operation to the chip in the use.

Specifically, slide 100 has been seted up on splint 109, the inside of slide 100 is provided with screw rod 111, the activity is provided with clamp plate 112 on the screw rod 111, be provided with the rubber pad on the clamp plate 112, splint 109's inside is provided with the lead screw motor (can choose for use but not limited to brushless motor) that mutually supports with screw rod 111, adjusts clamp plate 112's position through the rotation of screw rod 111, the use of the operating personnel of being convenient for.

Specifically, the cover plate 121 is provided with a fixing hole 120, the bottom plate 123 is provided with a clamping hole matched with the fixing hole 120, and the fixing hole 120 arranged on the cover plate 121 is matched with the clamping hole, so that the cover plate 121 can be conveniently installed and fixed in use.

Specifically, a fixing block 125 is disposed inside the adjusting groove 129, a threaded rod 126 which is matched with the fixing block 127 is movably disposed on the fixing block 125, an adjusting rod 124 is disposed on one side of the threaded rod 126, and the threaded rod 126 is driven to rotate through the movable adjusting rod 124, so that the position of the fixing block 127 is adjusted.

The working principle is as follows: this high accuracy positioner suitable for BGA chip plants ball, before using, the separation sets up apron 121 and mould 122 on bottom plate 123, through movable adjusting rod 124, thereby adjust the position of fixture block 127 in adjustment tank 129 inside, make the chip of required plant ball fix on bottom plate 123, place required mould 122 of using on bottom plate 123, fixed orifices 120 through the apron 121 and external fixed pin mutually support, thereby it is fixed with the device, the mount 12 that will place the chip is placed in the inside of pressing from both sides groove 10, it removes to drive splint 109 through telescopic link 113, thereby carry out the centre gripping to mount 12, fix mount 12 through the clamp plate 112 that sets up in slide 100 inside, it removes to drive adjustable shelf 106 through the push rod 108 that sets up on curb plate 107, make mount 12 remove under roof 105, plant the ball operation to the chip through the equipment that sets up in roof 105 bottom.

It is apparent that those skilled in the art can make various changes and modifications to the embodiments of the present invention without departing from the spirit and scope of the embodiments of the present invention. Thus, if such modifications and variations of the embodiments of the present invention fall within the scope of the claims of the present invention and their equivalents, the present invention is also intended to include such modifications and variations.

Claims

1. The utility model provides a high accuracy positioner suitable for BGA chip plants ball, includes base (1) and adjustable shelf (106) of setting on base (1), its characterized in that, base (1) is provided with baffle (102) for cuboid structure and upper surface, the activity is provided with adjustable shelf (106) on baffle (102), it presss from both sides groove (10) to have seted up on adjustable shelf (106), the inside that presss from both sides groove (10) is provided with many telescopic links (113), be connected with splint (109) on telescopic link (113), the butt has mount (12) on splint (109), mount (12) are including apron (121), mould (122) and bottom plate (123), set up on bottom plate (123) draw-in groove (128) of mutually supporting with mould (122), the inside of draw-in groove (128) is provided with adjustment tank (129) between two parties, the inside activity of adjustment tank (129) is provided with fixture block (127).

2. The high-precision positioning device suitable for Ball Grid Array (BGA) chip ball mounting is characterized in that a plurality of support seats (101) are arranged on the bottom end face of the base (1) in an array mode, a push rod (108) connected with a movable frame (106) is arranged on the base (1), and a side plate (107) is arranged at one end, far away from the movable frame (106), of the push rod (108).

3. The high-precision positioning device for Ball Grid Array (BGA) chip ball mounting according to claim 1, wherein a bump (103) is disposed beside the movable frame (106), a lifting rod (104) is movably disposed on the bump (103), and a top plate (105) is mounted on the lifting rod (104).

4. The high-precision positioning device suitable for Ball Grid Array (BGA) chip ball mounting according to claim 1, wherein a slide (100) is formed on the clamping plate (109), a screw (111) is arranged inside the slide (100), a pressing plate (112) is movably arranged on the screw (111), and a rubber pad is arranged on the pressing plate (112).

5. The high-precision positioning device for Ball Grid Array (BGA) chip ball mounting of claim 1, wherein the cover plate (121) is formed with a fixing hole (120), and the base plate (123) is formed with a locking hole for cooperating with the fixing hole (120).

6. The high-precision positioning device suitable for Ball Grid Array (BGA) chip ball mounting is characterized in that a fixing block (125) is arranged inside the adjusting groove (129), a threaded rod (126) matched with the fixing block (127) is movably arranged on the fixing block (125), and an adjusting rod (124) is arranged on one side of the threaded rod (126).