CN218730430U - SMD ultracapacitor system - Google Patents
SMD ultracapacitor system Download PDFInfo
- Publication number
- CN218730430U CN218730430U CN202222909198.8U CN202222909198U CN218730430U CN 218730430 U CN218730430 U CN 218730430U CN 202222909198 U CN202222909198 U CN 202222909198U CN 218730430 U CN218730430 U CN 218730430U
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- pin
- button
- circuit board
- ultracapacitor system
- heat dissipation
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
- Y02E60/13—Energy storage using capacitors
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- Electric Double-Layer Capacitors Or The Like (AREA)
Abstract
The utility model relates to a supercapacitor technical field specifically is a SMD ultracapacitor system, including button ultracapacitor system body, the positive pole extraction piece and the negative pole extraction piece of welding on button ultracapacitor system body, the cover is located the heat dissipation shell on the button ultracapacitor system body, be provided with L shape positive pole pin on the positive pole extraction piece, be provided with L shape negative pole pin on the negative pole extraction piece, when button ultracapacitor system body is connected with the circuit board through L shape positive pole pin and L shape negative pole pin, form heat dissipation channel between button ultracapacitor system body and the circuit board; the utility model discloses the installation effectiveness is high, and the radiating effect is good, and life is longer.
Description
Technical Field
The utility model relates to a ultracapacitor system technical field specifically is a SMD ultracapacitor system.
Background
The button type super capacitor is one of the patch type super capacitors, is a novel energy storage device, has the advantages of good high-power charging and discharging performance, high energy conversion efficiency, good temperature characteristic, long cycle service life, environmental protection and the like, and is widely applied to the fields of industrial electronics, transportation, intelligent three-meter meters, UPS, electric toys, tax control machines and the like.
However, the pin end of the existing button type super capacitor lead-out piece is of a vertical structure, when the super capacitor is welded on a circuit board, a pin is firstly inserted into a welding hole on the circuit board, and then the pin end of the super capacitor lead-out piece is fixed on the circuit board by soldering tin, and because the welding hole on the circuit board is extremely small, the pin is difficult to insert into the welding hole, so that the installation efficiency of the super capacitor is low; in addition, because the existing super capacitor paste is directly pasted on the circuit board, the super capacitor and the circuit board generate heat seriously in the using process, and the existing super capacitor lacks a heat dissipation structure, so that the service life of the existing super capacitor is short.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to foretell not enough, provide an installation effectiveness height, the radiating effect is good, the longer SMD ultracapacitor system of life.
In order to achieve the above purpose, the utility model adopts the following technical scheme:
the utility model provides a SMD ultracapacitor system, includes button ultracapacitor system body, the positive pole that welds on button ultracapacitor system body draws forth piece and negative pole and draws forth the piece, and the cover is located heat dissipation shell on the button ultracapacitor system body, be provided with the anodal pin of L shape on the anodal piece of drawing forth, be provided with L shape negative pole pin on the negative pole is drawn forth, when button ultracapacitor system body passes through the anodal pin of L shape and L shape negative pole pin and is connected with the circuit board, form heat dissipation channel between button ultracapacitor system body and the circuit board.
Further, the heat dissipation shell is made of heat conduction materials, and a plurality of heat dissipation fins are arranged on the heat dissipation shell.
Further, the bottom of the transverse part of the L-shaped anode pin is provided with an anode through hole, and the bottom of the transverse part of the L-shaped cathode pin is provided with a cathode through hole.
Further, the maximum aperture of the positive through hole and the maximum aperture of the negative through hole are both smaller than the minimum diameter of a welding spot on the circuit board.
Further, when the button-type super capacitor body is connected with the circuit board through the L-shaped positive electrode pin and the L-shaped negative electrode pin, the distance between the button-type super capacitor body and the circuit board is not less than 5mm.
Further, the L-shaped positive electrode pin and the positive electrode lead-out piece are integrally formed, and the negative electrode lead-out piece and the L-shaped negative electrode pin are integrally formed.
The utility model has the advantages that:
in practical application, the L-shaped positive electrode pin and the L-shaped negative electrode pin are aligned with welding points on a circuit board for welding or bonding, so that the button type super capacitor body can be connected with the circuit board through the positive electrode lead-out piece and the negative electrode lead-out piece; when the button-type supercapacitor body is connected with the circuit board through the L-shaped positive electrode pin and the L-shaped negative electrode pin, the button-type supercapacitor body can be radiated through the radiating channel, so that the button-type supercapacitor body does not need to be in direct contact with the circuit board when in use, the radiating areas of the button-type supercapacitor body and the circuit board are increased, in addition, the button-type supercapacitor body is radiated through the radiating shell, the radiating effect of the button-type supercapacitor body is better, and the service life is longer; the utility model discloses the installation effectiveness is high, and the radiating effect is good, and life is longer.
Drawings
Fig. 1 is a schematic view of the overall structure of the present invention;
fig. 2 is a front view of the present invention;
fig. 3 is a top view of the present invention;
reference numerals: a button-type supercapacitor body 1; a positive electrode lead-out sheet 2; an L-shaped positive electrode pin 21; a positive electrode through hole 211; a negative electrode lead-out sheet 3; an L-shaped negative electrode pin 31; a negative electrode through hole 311; a heat dissipation housing 4; and heat radiating fins 41.
Detailed Description
As shown in fig. 1, fig. 2 and fig. 3, a surface mount type supercapacitor comprises a button type supercapacitor body 1, a positive electrode lead-out piece 2 and a negative electrode lead-out piece 3 welded on the button type supercapacitor body 1, and a heat dissipation shell 4 sleeved on the button type supercapacitor body 1, wherein an L-shaped positive electrode pin 21 is arranged on the positive electrode lead-out piece 2, an L-shaped negative electrode pin 31 is arranged on the negative electrode lead-out piece 3, and when the button type supercapacitor body 1 is connected with a circuit board through the L-shaped positive electrode pin 21 and the L-shaped negative electrode pin 31, a heat dissipation channel is formed between the button type supercapacitor body 1 and the circuit board.
When the button type super capacitor is used, the L-shaped positive electrode pin 21 and the L-shaped negative electrode pin 31 are aligned with welding points on a circuit board for welding or bonding, and then the button type super capacitor body 1 can be connected with the circuit board through the positive electrode lead-out piece 2 and the negative electrode lead-out piece 3; when the button type super capacitor body 1 is connected with the circuit board through the L-shaped positive electrode pin 21 and the L-shaped negative electrode pin 31, the heat can be dissipated to the button type super capacitor body 1 through the heat dissipation channel, so that the button type super capacitor body 1 does not need to be in direct contact with the circuit board when in use, the heat dissipation areas of the button type super capacitor body 1 and the circuit board are increased, in addition, the heat is dissipated to the button type super capacitor body 1 through the heat dissipation shell 4, the heat dissipation effect of the button type super capacitor body 1 is better, and the service life is longer; the utility model discloses the installation effectiveness is high, and the radiating effect is good, and life is longer.
As shown in fig. 1, 2 and 3, the heat dissipation housing 4 is made of a heat conductive material, and a plurality of heat dissipation fins 41 are disposed on the heat dissipation housing 4; in this embodiment, the heat dissipation shell 4 made of heat conducting material can rapidly guide out the heat of the button type supercapacitor body 1 during operation, and the heat dissipation area of the heat dissipation shell 4 is increased through the plurality of heat dissipation fins 41, so that the heat dissipation effect is better.
As shown in fig. 1, 2 and 3, the bottom of the transverse portion of the L-shaped positive pin 21 is provided with a positive through hole 211, and the bottom of the transverse portion of the L-shaped negative pin 31 is provided with a negative through hole 311; in this embodiment, the positive through hole 211 and the negative through hole 311 can be used for soldering, so as to firmly solder or adhere the L-shaped positive pin 21 and the L-shaped negative pin 31 to the solder points of the circuit board.
As shown in fig. 1, 2 and 3, the maximum aperture of each of the positive through hole 211 and the negative through hole is smaller than the minimum diameter of a solder joint on the circuit board; in this embodiment, when the maximum apertures of the positive through hole 211 and the negative through hole are smaller than the minimum diameter of the solder joint on the circuit board, the L-shaped positive pin 21 and the L-shaped negative pin 31 can be fully contacted with the solder joint on the circuit board.
As shown in fig. 1, fig. 2 and fig. 3, when the button-type supercapacitor body 1 is connected with the circuit board through the L-shaped positive pin 21 and the L-shaped negative pin 31, the distance between the button-type supercapacitor body 1 and the circuit board is not less than 5mm; in this embodiment, when the distance between the button-type supercapacitor body 1 and the circuit board is not less than 5mm, the heat dissipation effect of the button-type supercapacitor body 1 is better.
As shown in fig. 1, 2 and 3, the L-shaped positive electrode lead 21 is integrally formed with the positive electrode tab 2, and the negative electrode tab 3 is integrally formed with the L-shaped negative electrode lead 31; in this embodiment, the L-shaped positive electrode lead 21 and the positive electrode lead 2 are integrally formed, and the negative electrode lead 3 and the L-shaped negative electrode lead 31 are integrally formed, so that the production costs of the L-shaped positive electrode lead 21 and the positive electrode lead 2, and the production costs of the negative electrode lead 3 and the L-shaped negative electrode lead 31 are reduced.
The specific embodiments described herein are merely illustrative of the spirit of the invention. Various modifications, additions and substitutions for the specific embodiments described herein will be apparent to those skilled in the art without departing from the scope and spirit of the invention as defined in the accompanying claims.
Claims (6)
1. The utility model provides a SMD ultracapacitor system which characterized in that: draw piece (3) including button ultracapacitor system body (1), welding anodal on button ultracapacitor system body (1) and draw piece (2) and negative pole, the cover is located heat dissipation shell (4) on button ultracapacitor system body (1), anodal drawing is provided with L shape anodal pin (21) on piece (2), the negative pole is drawn and is provided with L shape negative pole pin (31) on piece (3), when button ultracapacitor system body (1) is connected with the circuit board through L shape anodal pin (21) and L shape negative pole pin (31), form heat dissipation channel between button ultracapacitor system body (1) and the circuit board.
2. The surface mount type supercapacitor according to claim 1, wherein: the heat dissipation shell (4) is made of heat conduction materials, and a plurality of heat dissipation fins (41) are arranged on the heat dissipation shell (4).
3. The surface mount type supercapacitor according to claim 1, wherein: the bottom of the transverse part of the L-shaped positive electrode pin (21) is provided with a positive electrode through hole (211), and the bottom of the transverse part of the L-shaped negative electrode pin (31) is provided with a negative electrode through hole (311).
4. The patch type supercapacitor according to claim 3, wherein: the maximum aperture of the positive through hole (211) and the maximum aperture of the negative through hole are both smaller than the minimum diameter of a welding spot on the circuit board.
5. The patch type supercapacitor according to claim 1, wherein: when the button type super capacitor body (1) is connected with the circuit board through the L-shaped positive electrode pin (21) and the L-shaped negative electrode pin (31), the distance between the button type super capacitor body (1) and the circuit board is not less than 5mm.
6. The patch type supercapacitor according to claim 1, wherein: the L-shaped positive electrode pin (21) and the positive electrode lead-out piece (2) are integrally formed, and the negative electrode lead-out piece (3) and the L-shaped negative electrode pin (31) are integrally formed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222909198.8U CN218730430U (en) | 2022-11-02 | 2022-11-02 | SMD ultracapacitor system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222909198.8U CN218730430U (en) | 2022-11-02 | 2022-11-02 | SMD ultracapacitor system |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN218730430U true CN218730430U (en) | 2023-03-24 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202222909198.8U Active CN218730430U (en) | 2022-11-02 | 2022-11-02 | SMD ultracapacitor system |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN218730430U (en) |
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2022
- 2022-11-02 CN CN202222909198.8U patent/CN218730430U/en active Active
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