CN218728279U

CN218728279U - Fixing device for adjusting stress-free state of super lens and chip and optical instrument

Info

Publication number: CN218728279U
Application number: CN202223093620.3U
Authority: CN
Inventors: 宁才祥; 龚永兴
Original assignee: Hangzhou Najing Technology Co ltd
Current assignee: Hangzhou Najing Technology Co ltd
Priority date: 2022-11-21
Filing date: 2022-11-21
Publication date: 2023-03-24
Anticipated expiration: 2032-11-21

Abstract

The utility model relates to a fixing device for adjusting super lens and chip not atress belongs to optical instrument technical field, and it includes super lens, chip, mounting and mainboard, mounting fixed mounting in on the mainboard, the mounting is equipped with the recess, the chip is arranged in the recess, super lens are located on the chip and with the chip butt, just highly being greater than of chip the degree of depth of recess, super lens fixed mounting in the mounting, chip fixed mounting in on the mainboard. The super lens and the chip ensure that the chip is not stressed and damaged while ensuring complete contact.

Description

Fixing device for adjusting stress-free state of super lens and chip and optical instrument

Technical Field

The application belongs to the field of optical instruments, and particularly relates to a fixing device for adjusting stress-free performance of a superlens and a chip and an optical instrument.

Background

In recent years, the technology of attaching superlenses (metalens) is widely used, and when the superlenses are used in combination with chips, the superlenses need to be in sufficient contact with the chips, otherwise, the imaging quality is affected.

However, the chip is very fragile and cannot be stressed after assembly, otherwise the chip can be damaged, so that the requirement is very high, and the contradictory requirements that the superlens and the chip are completely contacted in place and the chip cannot be stressed and damaged are met are very challenging for the structural design skill.

SUMMERY OF THE UTILITY MODEL

The application provides a fixing device and an optical instrument for adjusting the stress-free state of a super lens and a chip, and aims to at least solve the technical problems in the prior art.

An aspect of the embodiment of the application provides a fixing device for adjusting super lens and chip not atress, and it includes super lens, chip, mounting and mainboard, mounting fixed mounting in on the mainboard, the mounting is equipped with the recess, the chip is arranged in the recess, super lens locate on the chip and with the chip butt, just highly being greater than of chip the degree of depth of recess, super lens fixed mounting in the mounting, chip fixed mounting in on the mainboard.

In an implementation manner, at least one glue injection port is arranged in the fixing member.

In an implementation manner, the number of the glue injection ports is four, and the four glue injection ports are arranged along the circumferential direction of the superlens.

In an implementation manner, a limiting groove is formed in the fixing member, and when the superlens is mounted on the fixing member, the side wall of the superlens abuts against the inner wall of the limiting groove.

In an embodiment, four mounting holes are formed in the fixing member, and when the super lens is mounted on the fixing member, four corners of the super lens correspond to the four mounting holes one to one.

In one embodiment, there is a gap between the inner wall of the recess and the side wall of the chip.

In an embodiment, the fixing member has at least two positioning portions.

In an implementation manner, the two positioning portions are respectively disposed on two sides of the fixing member, and the positioning portions are fixedly connected with the main board through threads.

Another aspect of the embodiments of the present application provides an optical instrument, including an upper housing, a lower housing, and any one of the above-mentioned fixing devices.

In one embodiment, the fixing device is fixedly mounted to the lower housing.

Compared with the prior art, the method has the following advantages:

1. in the application, the super lens is arranged on the chip, the chip is fixed on the mainboard, and the super lens is fixed in the fixing piece, so that the positions of the chip and the super lens are fixed, and the problem that the centers of the super lens and the chip cannot be aligned in the prior art is solved; meanwhile, the height of the chip is greater than the depth of the groove, so that the chip is ensured to be in complete contact with the superlens, and the imaging effect and quality are not influenced by the chip which is stressed and damaged;

2. be equipped with mounting hole and spacing groove in the mounting in this application, four right-angle sides that the spacing groove has fixed super lens are in order to realize the location, and four right angles of super lens can be dodged in setting up of mounting hole, the installation of the super lens of being convenient for.

Drawings

FIG. 1 is a schematic view of the structure of a fixing device in the embodiment of the present application;

FIG. 2 isbase:Sub>A cross-sectional view taken along line A-A of FIG. 1;

FIG. 3 is a schematic diagram of an optical instrument according to an embodiment of the present application;

description of reference numerals:

1. a superlens; 2. a chip; 3. a fixing member; 31. a glue injection port; 32. a limiting groove; 33. mounting holes; 34. a positioning part; 4. a main board; 5. an upper housing; 6. a lower housing.

Detailed Description

The present application will now be described in further detail with reference to the accompanying drawings.

In the description of the present application, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplicity of description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be construed as limiting the present application.

Referring to fig. 1 and 2, the present application provides a fixing device for adjusting the stress of a superlens and a chip, which includes a superlens 1, a chip 2, a fixing member 3 and a main board 4, wherein the fixing member 3 is fixedly mounted on the main board 4, and the fixing manner includes, but is not limited to, screw mounting. The chip 2 is fixedly mounted on the motherboard 4 by means including, but not limited to, soldering.

In order to limit the position of the fixing member 3, at least two positioning portions 34 are disposed on the fixing member 3. Taking the number of the positioning portions 34 as two as an example, the two positioning portions 34 are respectively disposed at two ends of the fixing member, two first positioning holes are disposed on the main board, the positioning portion 3 is provided with two second positioning holes matched with the first positioning holes, and the bolt sequentially penetrates through the first positioning holes and the second positioning holes to realize the limiting and fixing of the fixing member 3.

Mounting 3 is equipped with the recess, and in chip 2 arranged the recess in, super lens 1 located on chip 2, and chip 2 is close to one side and chip 2 butt of mainboard 4, ensures super lens 1 and chip 2 full contact. Meanwhile, the height of the chip 2 is larger than the depth of the groove, so that the chip 2 is prevented from being stressed and damaged.

The superlens 1 is fixedly arranged in the fixing piece 3. For example, a limit groove 32 is provided in the fixture 3, and when the superlens 1 is mounted on the fixture 3, the side wall of the superlens 1 abuts against the inner wall of the limit groove 32. The four right-angle sides of the super lens are fixed by the arrangement of the limiting groove 32 so as to realize positioning and fixing.

In order to facilitate the installation of the super lens 1, four mounting holes 33 are arranged in the fixing member 3, the four mounting holes 33 are respectively arranged at four corners of the limiting groove 32, and when the super lens 1 is installed on the fixing member 3, the four corners of the super lens 1 correspond to the four mounting holes 33 one to one.

In order to further fix the superlens 1, at least one glue injection opening 31 is provided in the fixing member 3. For example, the number of the glue injection ports 31 is four, and the four glue injection ports 31 are provided along the circumferential direction of the superlens 1. For better glue injection effect, the four glue injection ports 31 can be circumferentially and uniformly arranged. Glue is injected into the super lens through the glue injection port so as to improve the stability of the super lens 1. Wherein, the mobility of the glue selected for use can not be too strong, prevents glue from flowing to the chip 2, and finally ensures that the glue is completely dried.

In order to prevent glue from flowing onto the chip 2, there is a gap between the inner wall of the recess and the side wall of the chip 2.

With reference to fig. 3, the present application also provides an optical instrument comprising an upper housing 5, a lower housing 6 and any one of the above-mentioned fixing means. The fixing means is fixedly mounted to the lower case 6 for stability of the fixing means. For example, the fixing means is screw-mounted to the lower case 6.

The above is only a specific embodiment of the present disclosure, but the scope of the present disclosure is not limited thereto, and any person skilled in the art can easily conceive of changes or substitutions within the technical scope of the present disclosure, and shall be covered by the scope of the present disclosure. Therefore, the protection scope of the present disclosure shall be subject to the protection scope of the claims.

Claims

1. The utility model provides a fixing device for adjusting super lens and chip not atress, its characterized in that, it includes super lens (1), chip (2), mounting (3) and mainboard (4), mounting (3) fixed mounting in on mainboard (4), mounting (3) are equipped with the recess, chip (2) are arranged in the recess, super lens (1) are located on chip (2) and with chip (2) butt, just the height of chip (2) is greater than the degree of depth of recess, super lens (1) fixed mounting in mounting (3), chip (2) fixed mounting in on mainboard (4).

2. A fixture for accommodating stress relief of a superlens and a die as recited in claim 1, wherein: at least one glue injection opening (31) is formed in the fixing piece (3).

3. A fixture for accommodating stress relief of a superlens and a die as recited in claim 2, wherein: the number of the glue injection ports (31) is four, and the four glue injection ports (31) are arranged along the circumferential direction of the superlens (1).

4. A fixture for accommodating stress relief of a superlens and a die as recited in claim 1, wherein: be equipped with spacing groove (32) in mounting (3), work as super lens (1) install in when mounting (3), the lateral wall of super lens (1) with the inner wall butt of spacing groove (32).

5. A fixture for accommodating the release of a superlens and a die from stress according to claim 1, wherein: be equipped with four mounting holes (33) in mounting (3), work as super lens (1) install in when mounting (3), four angles and four mounting holes (33) one-to-one of super lens (1).

6. A fixture for accommodating stress relief of a superlens and a die as recited in claim 1, wherein: and a gap is reserved between the inner wall of the groove and the side wall of the chip (2).

7. A fixture for accommodating the release of a superlens and a die from stress according to claim 1, wherein: the fixing member (3) has at least two positioning portions (34).

8. A fixture for accommodating the release of the superlens and the die from forces as recited in claim 7, wherein: the two positioning parts (34) are respectively arranged on two sides of the fixing part (3), and the positioning parts (34) are fixedly connected with the main board (4) in a threaded mode.

9. An optical instrument, characterized by: comprising an upper housing (5), a lower housing (6) and a fixation device according to any one of claims 1-7.

10. An optical instrument as claimed in claim 9, characterized in that: the fixing device is fixedly arranged on the lower shell (6).