CN218728190U

CN218728190U - Photoelectric interconnection device

Info

Publication number: CN218728190U
Application number: CN202222765229.7U
Authority: CN
Inventors: 罗昊; 王国栋; 姚腾飞; 梁海斌; 曾刚
Original assignee: Shennan Circuit Co Ltd
Current assignee: Shennan Circuit Co Ltd
Priority date: 2022-10-20
Filing date: 2022-10-20
Publication date: 2023-03-24
Anticipated expiration: 2032-10-20

Abstract

The utility model relates to a photoelectric interconnection device, which comprises an optical fiber module, a light engine module and a PCB module; the optical fiber module is detachably embedded on the PCB module, and the optical engine module is detachably connected with the optical fiber module and the PCB module respectively. The embodiment of the utility model provides a photoelectricity interconnection device, with light path part, electric part and photoelectric conversion part respectively modularization independent design, form optic fibre module, PCB module and light engine module, and can dismantle the connection each other between the three modules, make when arbitrary one of them module appears damaging, only need change the module that damages, need not to change the whole photoelectricity interconnection device, realized dismantling the change in a flexible way, greatly reduced cost of maintenance; meanwhile, the optical fiber module, the optical engine module and the PCB module can be processed and produced simultaneously, so that the processing period is shortened, the processing difficulty is reduced, and the product percent of pass is improved.

Description

Photoelectric interconnection device

Technical Field

The utility model belongs to the technical field of the communication, especially, relate to a photoelectric interconnection device.

Background

Electrical and optical interconnections are two common ways of communicating. Electrical interconnection refers to the use of metal traces (typically copper) to make signal connections between the circuit board and the chip. Optical interconnection refers to the use of light-conducting media (such as optical fibers, optical waveguides, etc.) to achieve signal connection between a circuit board and a chip.

However, electrical interconnections have problems of signal delay, signal crosstalk, and rapid increase in power consumption at high frequency and high speed; the optical interconnection can realize the data transmission with low power consumption, high speed and complete signals between boards/in boards; therefore, the light guide medium and the light engine are integrated in the circuit board to form the photoelectric PCB, optical signals replace part of electric signals, transmission of high-speed electric signals is reduced, board-level photoelectric interconnection is achieved, and the problem that electric interconnection is used independently is solved. The optical engine is a core part of the photoelectric PCB to realize the interconversion of optical signals and electric signals.

The existing photoelectric PCB has various manufacturing methods, such as directly manufacturing a polymer optical waveguide on the PCB, or placing a prefabricated optical fiber flexible board inside the PCB, or directly laying an optical fiber in the PCB, and the like. In these methods, the light path is permanently fixed on the PCB, however, the light guide medium and the light engine are both fragile structures, and once the light guide medium or the light engine fails, the entire photoelectric PCB needs to be replaced, which results in high maintenance cost.

SUMMERY OF THE UTILITY MODEL

The utility model provides a photoelectricity interconnection device to reduce photoelectricity interconnection device's cost of maintenance.

The embodiment of the utility model provides a photoelectric interconnection device, which comprises an optical fiber module, a light engine module and a PCB module; the optical fiber module is detachably embedded on the PCB module, and the optical engine module is detachably connected with the optical fiber module and the PCB module respectively.

Optionally, the PCB module includes a PCB, and a switching chip and an electrical connector connected to the PCB, the optical fiber module is detachably embedded in the PCB, and the optical engine module is detachably connected to the electrical connector.

Optionally, the fiber optic module comprises a substrate, an optical fiber, a first optical connector and a second optical connector; a first mounting groove is formed in the first surface of the substrate, and the optical fiber is assembled in the first mounting groove; one end of the optical fiber is connected with the first optical connector, and the other end of the optical fiber is connected with the second optical connector; the second optical connector is detachably connected with the optical engine module, and the first optical connector is detachably connected with an outside module;

the PCB is characterized in that a second mounting groove is formed in the first surface of the PCB, when the substrate is arranged in the second mounting groove in an inverted and embedded mode, the first surface of the PCB is level with the second surface of the substrate, and the first surface of the substrate and the second surface of the substrate are two surfaces which are arranged oppositely.

Optionally, the optical fiber module further comprises a filling structure filled in the first mounting groove so that the optical fiber is fixed in the first mounting groove.

Optionally, a first mounting hole is formed in the PCB, a second mounting hole is formed in the substrate, and a fastener penetrates through the second mounting hole to be assembled in the first mounting hole, so that the substrate and the PCB are detachably connected.

Optionally, a first circuit and a second circuit are further disposed on the first surface of the PCB, and the first circuit and the second circuit are located on two sides of the second mounting groove;

and a third circuit is arranged on the second surface of the substrate, one end of the third circuit is connected with the first circuit in a welding manner, and the other end of the third circuit is connected with the second circuit in a welding manner.

Optionally, a fourth circuit and a fifth circuit are further disposed on the first surface of the PCB, and the fourth circuit and the fifth circuit are located on two sides of the second mounting groove;

the optical fiber module also comprises a pair of metal plug pins assembled on two opposite sides of the substrate and a connecting circuit used for connecting the pair of metal plug pins; the PCB is provided with a plug hole matched with the pair of metal plug pins, and the pair of metal plug pins are inserted in the plug hole to connect the fourth line and the fifth line.

Optionally, the light engine module comprises an electrical interface, a flexible circuit board and a photoelectric conversion module; two ends of the flexible circuit board are respectively connected with the electrical interface and the photoelectric conversion module; the electric interface is detachably connected with the electric connector, and the photoelectric conversion module is detachably connected with the optical fiber module.

Optionally, the light engine module further comprises a first rigid circuit board and a second rigid circuit board; one end of the flexible circuit board is connected with the first rigid circuit board, and the other end of the flexible circuit board is connected with the second rigid circuit board; the electrical interface is mounted on the first rigid circuit board, and the photoelectric conversion module is mounted on the second rigid circuit board.

Optionally, the photoelectric conversion module includes a photoelectric chip connected to the second rigid circuit board and a reflective coupling lens connected to the photoelectric chip.

The embodiment of the utility model provides a photoelectric interconnection device, with the independent design of light path part, electric part and photoelectric conversion part modularization respectively, form optical fiber module, PCB module and light engine module, and can dismantle the connection each other between the three modules, make when arbitrary one of them module appears damaging, only need change the module that damages, need not to change whole photoelectric interconnection device, realized nimble dismantlement and change, especially to optical fiber module and light engine module these vulnerable parts, conveniently dismantle the change alone, the reuse rate of PCB module has been improved, maintenance cost is greatly reduced; meanwhile, the optical fiber module, the optical engine module and the PCB module can be processed and produced simultaneously, so that the processing period is shortened, the processing difficulty is reduced, and the product percent of pass is improved.

Drawings

Fig. 1 is a reference diagram illustrating a usage status of an optoelectronic interconnection device according to an embodiment of the present invention;

fig. 2 is a schematic structural diagram of an optical fiber module according to an embodiment of the present invention;

fig. 3 is a schematic structural diagram of a part of a PCB module and an optical fiber module according to an embodiment of the present invention;

fig. 4 is a schematic structural diagram of a fiber optic module according to another embodiment of the present invention;

fig. 5 is a schematic structural diagram of an electrical connector and a light engine module according to an embodiment of the present invention;

fig. 6 is an exploded schematic view of a light engine module according to an embodiment of the present invention;

the reference numerals in the specification are as follows:

100. a fiber optic module; 110. a substrate; 111. a first mounting groove; 112. a second mounting hole; 120. an optical fiber; 130. a first optical connector; 140. a second optical connector; 150. a fastener; 160. a third line; 170. a metal pin; 200. a PCB module; 210. a PCB; 211. a second mounting groove; 212. a first mounting hole; 213. a first line; 214. a second line; 215. a fourth line; 216. a fifth line; 217. inserting holes; 220. a switching chip; 230. an electrical connector; 300. a light engine module; 310. an electrical interface; 320. a flexible circuit board; 330. a photoelectric conversion module; 331. a photoelectric chip; 332. a reflective coupling lens; 340. a first rigid circuit board; 350. a second rigid circuit board.

Detailed Description

In order to make the technical problem, technical solution and advantageous effects solved by the present invention more clearly understood, the following description is given in conjunction with the accompanying drawings and embodiments to illustrate the present invention in further detail. It should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the invention.

It will be understood that when an element is referred to as being "secured to" or "disposed on" another element, it can be directly on the other element or be indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or be indirectly connected to the other element.

It will be understood that the terms "length," "width," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like are used in an orientation or positional relationship indicated in the drawings for convenience in describing the invention and to simplify the description, and are not intended to indicate or imply that the device or element so referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus should not be construed as limiting the invention.

Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless specifically limited otherwise.

As shown in fig. 1 and fig. 3, an optoelectronic interconnection apparatus provided by an embodiment of the present invention includes an optical fiber module 100, a light engine module 300, and a PCB module 200; the optical fiber module 100 is detachably embedded on the PCB module 200, and the light engine module 300 is detachably connected to the optical fiber module 100 and the PCB module 200, respectively.

The embodiment of the utility model provides a photoelectric interconnection device, with the independent design of light path part, electric part and photoelectric conversion part modularization respectively, form optical fiber module 100, PCB module 200 and light engine module 300, and can dismantle the connection each other between the three modules, make when arbitrary one of them module appears damaging, only need change the module that damages, need not to change whole photoelectric interconnection device, realized nimble dismantlement and change, especially to optical fiber module 100 and light engine module 300 these vulnerable parts, conveniently dismantle it alone and change, the reuse rate of PCB module 200 is improved, maintenance cost is greatly reduced; meanwhile, the three modules of the optical fiber module 100, the optical engine module 300 and the PCB module 200 can be processed and produced simultaneously, so that the processing period is shortened, the processing difficulty is reduced, and the product percent of pass is improved.

In one embodiment, as shown in fig. 1, the PCB module 200 includes a PCB210, and a switch chip 220 and an electrical connector 230 connected to the PCB210, the optical fiber module 100 is detachably embedded on the PCB210, and the optical engine module 300 is detachably connected to the electrical connector 230. In this example, the optical fiber module 100 is embedded in the PCB210, so that the optical fiber module 100 is integrated into the PCB210, the overall structure of the PCB module 200 and the optical fiber module 100 is more compact, the occupied space is reduced, more assembly spaces are reserved for other devices, the heat dissipation space is reserved, and the heat dissipation effect of the optoelectronic interconnection device is ensured.

In one embodiment, as shown in fig. 3 and 4, the fiber optic module 100 includes a substrate 110, an optical fiber 120, a first optical connector 130, and a second optical connector 140; a first mounting groove 111 is provided on the first surface of the substrate 110, and the optical fiber 120 is fitted in the first mounting groove 111; one end of the optical fiber 120 is connected to the first optical connector 130, and the other end is connected to the second optical connector 140; the second optical connector 140 is detachably connected with the optical engine module 300, and the first optical connector 130 is used for detachably connecting with an external module; the first surface of the PCB210 is provided with a second mounting groove 211, when the substrate 110 is reversely inserted into the second mounting groove 211, the first surface of the PCB210 is flush with the second surface of the substrate 110, and the first surface of the substrate 110 and the second surface of the substrate 110 are two surfaces which are oppositely arranged.

In this example, the substrate 110 is embedded in the second mounting groove 211 in a reverse-buckled manner, that is, the first surface of the substrate 110 is attached to the bottom of the second mounting groove 211, and the second surface of the substrate 110 is flush with the first surface of the PCB 210; at this time, the substrate 110 is completely embedded inside the PCB210, so that the overall structure of the PCB module 200 and the fiber optic module 100 is more compact, the occupied space is reduced as much as possible, and the electrical interconnection on the PCB210 is prevented from being affected.

The substrate 110 is made of one or more materials selected from aluminum alloy, stainless steel, epoxy resin, and the like. In a preferred embodiment, the substrate 110 and the PCB210 are made of the same material, so that the thermal expansion coefficients of the two are the same.

The first optical connector 130 and the second optical connector 140 are optical fiber connectors, and have various forms such as FC, LC, MT, MPO, and the like. In optical modules, on-board optics, one form commonly used in the industry is referred to as "LENS" + "jumper", i.e., a reflective-faced coupling LENS + mating optical plug.

In one embodiment, the fiber optic module 100 further includes a filling structure that fills in the first mounting groove 111 such that the optical fibers 120 are fixed in the first mounting groove 111. In this example, the optical fiber 120 is fixed in the first mounting groove 111 by the filling structure, so that the stability of the optical fiber 120 assembled in the first mounting groove 111 is improved, and the protection of the optical fiber 120 is facilitated.

Wherein, the filling structure is epoxy resin, acrylic ester or silica gel.

As a preferred embodiment, the first installation groove 111 is filled with a filling structure, which is designed such that the optical fiber 120 located in the first installation groove 111 is sufficiently fixed, and the stability of the optical fiber 120 in the first installation groove 111 is guaranteed.

As a preferred embodiment, the first installation groove 111 is partially filled with a filling structure, so that the optical fiber 120 is partially fixed, thereby not only ensuring the stability of the optical fiber 120 in the first installation groove 111, but also saving materials and reducing cost.

In another embodiment, the optical fiber 120 is movably mounted in the first mounting groove 111, that is, the first mounting groove 111 is not filled with a filling structure, the optical fiber 120 can move in the first mounting groove 111, so that the optical fiber 120 can be adjusted as required, and when the optical fiber 120 is damaged, only the optical fiber 120 can be replaced independently without replacing the substrate 110, thereby reducing the maintenance cost.

In one embodiment, as shown in fig. 3 and 4, a first mounting hole 212 is formed on the PCB210, a second mounting hole 112 is formed on the substrate 110, and the fastener 150 is inserted into the first mounting hole 212 through the second mounting hole 112, so that the substrate 110 is detachably connected to the PCB 210. In this example, the fastening member 150 is engaged with the first mounting hole 212 after passing through the second mounting hole 112, so as to detachably connect the substrate 110 and the PCB210, and the structure is simple, the processing is convenient, and the assembly and disassembly are convenient. When the electrical interconnection on the PCB210 does not pass through the optical fiber module 100, the PCB210 and the substrate 110 may be fixed by the fixing method of the present example.

In a preferred embodiment, the fastening member 150 is a screw, the first mounting hole 212 is a threaded hole, and the screw passes through the second mounting hole 112 and then is threadedly coupled with the threaded hole, so that the substrate 110 is fixed on the PCB 210.

In an embodiment, as shown in fig. 3, the first surface of the PCB210 is further provided with a first line 213 and a second line 214, and the first line 213 and the second line 214 are located at two sides of the second mounting groove 211; the second surface of the substrate 110 is provided with a third wire 160, one end of the third wire 160 is connected to the first wire 213 by soldering, and the other end is connected to the second wire 214 by soldering. In this example, when the electrical interconnection on the PCB210 passes through the optical fiber module 100, the third circuit 160 is disposed on the second surface of the substrate 110, and the third circuit 160 is electrically connected to the first circuit 213 and the second circuit 214 by welding, so as to ensure the electrical interconnection on the PCB210 and prevent the optical fiber module 100 from affecting the electrical interconnection on the PCB 210.

In one embodiment, as shown in fig. 3, the PCB210 is further provided with a fourth wire 215 and a fifth wire 216 on the first surface, the fourth wire 215 and the fifth wire 216 being located at both sides of the second mounting groove 211; the optical fiber module 100 further includes a pair of metal pins 170 mounted on opposite sides of the substrate 110, and a connection line for connecting the pair of metal pins 170; the PCB210 is provided with a plug hole 217 matching with the pair of metal plug pins 170, and the pair of metal plug pins 170 are inserted into the plug hole 217 to connect the fourth line 215 and the fifth line. In this example, when the electrical interconnection on the PCB210 passes through the optical fiber module 100, a pair of metal plug pins 170 are disposed on two opposite sides of the substrate 110, and a connection line is disposed to connect the metal plug pins 170, and the pair of metal plug pins 170 are inserted into the plug holes 217 of the PCB210, so as to electrically connect the fourth circuit 215 and the fifth circuit 216, thereby ensuring the electrical interconnection on the PCB210 and preventing the optical fiber module 100 from affecting the electrical interconnection on the PCB 210.

In this embodiment, the fixing and connection of the fiber optic module 100 and the PCB210 can be achieved in one or more of the manners described above.

In one embodiment, as shown in fig. 1 and 5, the light engine module 300 includes an electrical interface 310, a flexible circuit board 320, and a photoelectric conversion module 330; two ends of the flexible circuit board 320 are respectively connected with the electrical interface 310 and the photoelectric conversion module 330; the electrical interface 310 is detachably connected to the electrical connector 230, and the photoelectric conversion module 330 is detachably connected to the fiber optic module 100. In this example, the electrical interface 310 is electrically connected to the electrical connector 230, the optical-to-electrical conversion module 330 is connected to the optical fiber module 100, the flexible circuit board 320 is electrically connected to the electrical interface 310 and the optical-to-electrical conversion module 330, and the optical-to-electrical conversion module 330 converts optical signals and electrical signals between the optical fiber module 100 and the PCB module 200, so as to implement optical-to-electrical interconnection in the optical-to-electrical interconnection apparatus. The flexible circuit board 320 has good flexibility, and can be bent as required, so that the position of the connector of the photoelectric conversion module 330 can be flexibly adjusted, and the alignment precision of optical coupling can be improved.

In one embodiment, as shown in fig. 5, the light engine module 300 further includes a first rigid circuit board 340 and a second rigid circuit board 350; one end of the flexible circuit board 320 is connected to the first rigid circuit board 340, and the other end is connected to the second rigid circuit board 350; the electrical interface 310 is mounted on a first rigid circuit board 340 and the photoelectric conversion module 330 is mounted on a second rigid circuit board 350. In this example, the electrical interface 310 is mounted on the first rigid circuit board 340, which facilitates the assembly of the electrical interface 310, making the connection of the electrical interface 310 with the electrical connector 230 more stable; the photoelectric conversion module 330 is mounted on the second rigid circuit board 350, which facilitates the assembly of the photoelectric conversion module 330, and makes the connection between the photoelectric conversion module 330 and the optical fiber module 100 more stable.

Wherein the electrical interface 310 is plugged with the electrical connector 230.

In the present embodiment, the electrical interface 310 includes gold fingers mounted on the first rigid circuit board 340. The gold finger is a common way of the existing electrical interface, and gold is electroplated on the copper surface of the edge of the circuit board to form a reliable and durable plug-in type electrical interface.

In one embodiment, as shown in fig. 6, the photoelectric conversion module 330 includes a photo chip 331 connected to the second rigid circuit board 350 and a reflective coupling lens 332 connected to the photo chip 331. In this example, the electrical signal sent by the switch chip 220 is transmitted to the optical-electrical chip 331 through the electrical connector 230, the electrical interface 310 and the flexible circuit board 320, and the optical-electrical chip 331 converts the electrical signal into an optical signal and transmits the optical signal to the optical fiber module 100 through the reflective coupling lens 332; the optical-electrical chip 331 can also convert the optical signal from the optical fiber module 100 into an electrical signal to be transmitted to the switch chip 220, thereby implementing optical-electrical interconnection. The reflective coupling lens 332 is a reflector structure with a collimating lens, and is matched with the flexible circuit board 320, so that the optical coupling difficulty is reduced, and the alignment precision of the optical coupling is ensured.

In one embodiment, as shown in FIG. 2, multiple sets of optical fibers 120 are disposed in the optical fiber 120 module, one end of each set of optical fibers 120 is connected to a second optical connector 140, and the other end of each set of optical fibers 120 is connected to the same first optical connector 130.

In one embodiment, as shown in fig. 1, there are 8 electrical connectors 230, and each electrical connector 230 is electrically connected to one light engine module 300; the optical fiber module 100 has two optical fiber modules 100, each optical fiber module 100 has 4 groups of optical fibers 120, and each second optical connector 140 is connected to one optical engine module 300.

In this example, the second optical connector 140 is a jumper optical connector and the first optical connector 130 is an MT optical connector.

The above description is only exemplary of the present invention and should not be taken as limiting the scope of the present invention, as any modifications, equivalents, improvements and the like made within the spirit and principles of the present invention are intended to be included within the scope of the present invention.

Claims

1. The photoelectric interconnection device is characterized by comprising an optical fiber module, a light engine module and a PCB module; the optical fiber module is detachably embedded on the PCB module, and the optical engine module is detachably connected with the optical fiber module and the PCB module respectively.

2. The optoelectronic interconnection device of claim 1, wherein the PCB module comprises a PCB, and a switching chip and an electrical connector connected to the PCB, the optical fiber module is detachably embedded on the PCB, and the optical engine module is detachably connected to the electrical connector.

3. The optoelectronic interconnect device of claim 2, wherein the fiber optic module comprises a substrate, an optical fiber, a first optical connector and a second optical connector; a first mounting groove is formed in the first surface of the substrate, and the optical fiber is assembled in the first mounting groove; one end of the optical fiber is connected with the first optical connector, and the other end of the optical fiber is connected with the second optical connector; the second optical connector is detachably connected with the optical engine module, and the first optical connector is detachably connected with an outside module;

4. The optoelectronic interconnection apparatus of claim 3, wherein the fiber optic module further comprises a filling structure that fills in the first mounting groove such that the optical fiber is secured in the first mounting groove.

5. The optoelectronic interconnection device of claim 3, wherein the PCB has a first mounting hole, the substrate has a second mounting hole, and a fastener is disposed in the first mounting hole through the second mounting hole, so that the substrate and the PCB are detachably connected.

6. The optoelectronic interconnection device according to claim 3 or 5, wherein the first surface of the PCB further comprises a first circuit and a second circuit, and the first circuit and the second circuit are located at two sides of the second mounting groove;

7. The optoelectronic interconnection device according to claim 3 or 5, wherein a fourth trace and a fifth trace are further disposed on the first surface of the PCB, and the fourth trace and the fifth trace are located at two sides of the second mounting groove;

8. The optoelectronic interconnect device of claim 2, wherein the light engine module comprises an electrical interface, a flexible circuit board, and a photoelectric conversion module; two ends of the flexible circuit board are respectively connected with the electrical interface and the photoelectric conversion module; the electric interface is detachably connected with the electric connector, and the photoelectric conversion module is detachably connected with the optical fiber module.

9. The optoelectronic interconnect device of claim 8, wherein the light engine module further comprises a first rigid circuit board and a second rigid circuit board; one end of the flexible circuit board is connected with the first rigid circuit board, and the other end of the flexible circuit board is connected with the second rigid circuit board; the electrical interface is mounted on the first rigid circuit board, and the photoelectric conversion module is mounted on the second rigid circuit board.

10. The optoelectronic interconnect device of claim 9, wherein the optoelectronic conversion module comprises an optoelectronic chip connected to the second rigid circuit board and a reflective coupling lens connected to the optoelectronic chip.