CN218727795U

CN218727795U - Integrated circuit testing die for SMT packaged products

Info

Publication number: CN218727795U
Application number: CN202222385402.0U
Authority: CN
Inventors: 胡斌
Original assignee: Shenzhen Rich Source Technology Co ltd
Current assignee: Shenzhen Rich Source Technology Co ltd
Priority date: 2022-09-07
Filing date: 2022-09-07
Publication date: 2023-03-24
Anticipated expiration: 2032-09-07

Abstract

The utility model discloses an integrated circuit test die for SMT encapsulation product relates to integrated circuit technical field. The utility model provides an integrated circuit test die for SMT encapsulates product, includes the testboard, the positive fixed mounting of testboard has control panel, the last fixed surface of testboard installs places board, portable tester and two adjusting device, and two adjusting device are located the both sides of placing the board respectively. Utilize electric putter to pass through the connecting rod and drive two centre gripping frameworks of homonymy and carry out synchronous motion for two sets of centre gripping frameworks placed in opposite directions can carry out the motion in opposite directions or from each other, and the biax motor that deuterogamies makes two centre gripping claws in the same drive box carry out the motion in opposite directions or from each other through the lead screw, makes this test mold can carry out the suitability according to the width and the thickness of the integrated circuit that awaits measuring and adjusts, but make the integrated circuit of this test mold centre gripping multiple specification, thereby the practicality of this test mold has been improved.

Description

Integrated circuit testing die for SMT packaged products

Technical Field

The utility model relates to an integrated circuit technical field specifically is an integrated circuit test mould for SMT encapsulates product.

Background

SMT is an abbreviation for surface mounting technology, the most popular technique and process in the electronic assembly industry. Electronic circuit surface assembly techniques, known as surface mount or surface mount techniques. The surface-mounted component without pins or short leads is mounted on the surface of a printed circuit board or other substrates and is welded and assembled by methods such as reflow soldering or dip soldering.

Through retrieving chinese patent, utility model with publication number cn202122174999.x discloses an integrated circuit test mould for SMT encapsulates product, compares with prior art, the beneficial effects of the utility model include:

the utility model discloses a draw the piece, the kelly, a spring, the stopper, L type piece, the common cooperation of fixed frame and rubber pad, avoid the manual work to fix the integrated circuit board and lead to the integrated circuit board to be damaged by sweat stain and dust, have convenient fixed advantage, through first motor, the second motor, the gear, the pinion rack, the gag lever post, the ball, the slider, the supporting shoe, first stable piece, the stable piece of second, the common cooperation of screw rod and tester, carry out automatically regulated to the position of test, have the advantage of convenient regulation, nevertheless it still has following drawback in the in-service use:

the utility model has the advantages that through the arrangement of the pull block, the clamping rod, the spring, the limiting block and the L-shaped block, the fixing frame can clamp the circuit board, but the clamping mode can cause the situation that the clamping specifications are not matched when the clamping mode is used for integrated circuits with different sizes;

therefore, the utility model with publication number cn202122174999.X cannot meet the requirements in practical use, so there is a strong need in the market for improved technology to solve the above problems.

SUMMERY OF THE UTILITY MODEL

The utility model provides an integrated circuit test die for SMT encapsulation product to solve the problem in the background art.

In order to achieve the above object, the utility model provides a following technical scheme: the integrated circuit testing die for the SMT packaged product comprises a testing table, wherein a control panel is fixedly arranged on the front surface of the testing table, a placing plate, a movable tester and two adjusting devices are fixedly arranged on the upper surface of the testing table, the two adjusting devices are respectively positioned on two sides of the placing plate, and the inner sides of the adjusting devices are movably connected with a clamping framework;

adjusting device includes the U shaped strip, the last fixed surface that branch and testboard were passed through to the bottom of U shaped strip is connected, the outside fixed mounting of U shaped strip has electric putter, electric putter's expansion end fixedly connected with connecting rod, the other end of connecting rod extend to the inboard of U shaped strip and with centre gripping framework fixed connection.

Furthermore, the control panel is electrically connected with the movable tester, the adjusting device and the clamping framework respectively, and a display is arranged on the front side of the control panel.

Furthermore, the centre gripping framework includes the drive plate, the inner wall fixed mounting of drive plate has double-shaft motor, double-shaft motor's output shaft fixed mounting has two lead screws, the other end of lead screw is connected with the inner wall rotation of drive plate.

Furthermore, the surface of the lead screw is in threaded connection with a nut sleeve, one side of the nut sleeve is fixedly connected with a limiting block, two sliding rails are fixedly mounted on the inner wall of the driving plate, and the limiting block is connected with the inner walls of the sliding rails in a sliding manner.

Furthermore, the other side of the nut sleeve is fixedly connected with a clamping jaw, the other end of the clamping jaw extends to the outer side of the drive plate, and an anti-skid pad is arranged at the end of the clamping jaw.

Compared with the prior art, the utility model provides an integrated circuit test mould for SMT encapsulates product possesses following beneficial effect:

this an integrated circuit test mould for SMT encapsulates product, through setting up adjusting device and centre gripping framework, utilize electric putter to drive two centre gripping frameworks of homonymy through the connecting rod and carry out synchronous motion, make two sets of centre gripping frameworks placed in opposite directions can carry out the motion in opposite directions or leave mutually, the biax motor that deuterogamies makes two centre gripping claws in the same drive box carry out the motion in opposite directions or leave mutually through the lead screw, make this test mould can carry out the suitability according to the width and the thickness of the integrated circuit that awaits measuring and adjust, but make this test mould centre gripping integrated circuit of multiple specification, thereby this test mould's practicality has been improved.

Drawings

Fig. 1 is a schematic structural view of the present invention;

FIG. 2 is a schematic view of the structure of the adjusting device of the present invention;

fig. 3 is a front sectional view of the driving box structure of the present invention.

In the figure: 1. a test bench; 2. a control panel; 3. placing the plate; 4. a mobile tester; 5. an adjustment device; 6. a clamping framework; 7. u-shaped strips; 8. a strut; 9. an electric push rod; 10. a connecting rod; 11. a drive cartridge; 12. a double-shaft motor; 13. a screw rod; 14. a nut sleeve; 15. a gripper jaw.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Please refer to fig. 1-3, the utility model discloses an integrated circuit test mould for SMT encapsulates product, including testboard 1, the positive fixed mounting of testboard 1 has control panel 2, the last fixed surface of testboard 1 installs places board 3, portable tester 4 and two adjusting device 5, and two adjusting device 5 are located the both sides of placing board 3 respectively, adjusting device 5's inboard swing joint has clamping framework 6, control panel 2 respectively with portable tester 4, adjusting device 5 and clamping framework 6 electric connection, control panel 2's front is provided with the display.

Adjusting device 5 includes U type strip 7, the last fixed surface that branch 8 and testboard 1 were passed through to the bottom of U type strip 7 is connected, the outside fixed mounting of U type strip 7 has electric putter 9, electric putter 9's expansion end fixedly connected with connecting rod 10, the other end of connecting rod 10 extend to the inboard of U type strip 7 and with 6 fixed connection of centre gripping framework.

The clamping framework 6 comprises a drive plate 11, a double-shaft motor 12 is fixedly mounted on the inner wall of the drive plate 11, two lead screws 13 are fixedly mounted on an output shaft of the double-shaft motor 12, the other ends of the lead screws 13 are rotatably connected with the inner wall of the drive plate 11, a nut sleeve 14 is in threaded connection with the surface of each lead screw 13, a limiting block is fixedly connected to one side of each nut sleeve 14, two sliding rails are fixedly mounted on the inner wall of the drive plate 11, the limiting blocks are slidably connected with the inner walls of the sliding rails, and a clamping claw 15 is fixedly connected to the other side of each nut sleeve 14.

Specifically, the other end of the clamping claw 15 extends to the outer side of the driving plate 11, and a non-slip pad is arranged at the end of the clamping claw 15.

In this embodiment, the non-slip pad is used to make the clamping claw 15 elastically contact with the ic to be tested, so that the ic is not damaged while the clamping stability is ensured.

When the test fixture is used, an integrated circuit to be tested is placed on the placing plate 3, then the adjusting device 5 and the clamping framework 6 are started according to the integrated circuit, the electric push rod 9 drives the connecting rod 10 to slide in the horizontal direction, the connecting rod 10 drives the two driving plates 11 on the same side to be gradually lapped with the side face of the integrated circuit to be tested, then the double-shaft motor 12 is started, the double-shaft motor 12 drives the screw rod 13 to rotate, the screw rod 13 drives the nut sleeve 14 to move in the axial direction, and the nut sleeve 14 drives the clamping claw 15 to move in the vertical direction;

and two lead screws 13 in the same drive plate 11 are two lead screws 13 with different thread directions, so that two clamping claws 15 in the same drive plate 11 move oppositely or away from each other, and the clamping claws 15 can effectively clamp the integrated circuit to be tested.

To sum up, this an integrated circuit test mold for SMT encapsulates product, through setting up adjusting device 5 and centre gripping framework 6, utilize electric putter 9 to drive two centre gripping frameworks 6 of homonymy through connecting rod 10 and carry out synchronous motion, make two sets of centre gripping frameworks 6 placed in opposite directions can carry out motion in opposite directions or from each other, deuterogamy biax motor 12 makes two gripper jaws 15 in the same drive box carry out motion in opposite directions or from each other through lead screw 13, make this test mold can carry out the suitability according to the width and the thickness of the integrated circuit that awaits measuring and adjust, make this test mold can the integrated circuit of multiple specification of centre gripping, thereby the practicality of this test mold has been improved.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims

1. An integrated circuit test die for SMT packaged products, comprising a test station (1), characterized in that: the front side of the test board (1) is fixedly provided with a control panel (2), the upper surface of the test board (1) is fixedly provided with a placing plate (3), a movable tester (4) and two adjusting devices (5), the two adjusting devices (5) are respectively positioned at two sides of the placing plate (3), and the inner sides of the adjusting devices (5) are movably connected with a clamping framework (6);

adjusting device (5) include U type strip (7), the upper surface fixed connection of branch (8) and testboard (1) is passed through to the bottom of U type strip (7), the outside fixed mounting of U type strip (7) has electric putter (9), the movable end fixedly connected with connecting rod (10) of electric putter (9), the other end of connecting rod (10) extend to the inboard of U type strip (7) and with centre gripping framework (6) fixed connection.

2. An integrated circuit test die for SMT packaged products according to claim 1, wherein: the control panel (2) is electrically connected with the movable tester (4), the adjusting device (5) and the clamping framework (6) respectively, and a display is arranged on the front side of the control panel (2).

3. An integrated circuit test die for SMT packaged products according to claim 1, wherein: the clamping framework (6) comprises a drive plate (11), a double-shaft motor (12) is fixedly mounted on the inner wall of the drive plate (11), two lead screws (13) are fixedly mounted on an output shaft of the double-shaft motor (12), and the other ends of the lead screws (13) are rotatably connected with the inner wall of the drive plate (11).

4. An integrated circuit test die for SMT packaged products according to claim 3, wherein: the surface of the screw rod (13) is in threaded connection with a nut sleeve (14), one side of the nut sleeve (14) is fixedly connected with a limiting block, two sliding rails are fixedly mounted on the inner wall of the driving plate (11), and the limiting block is connected with the inner walls of the sliding rails in a sliding mode.

5. An integrated circuit test die for SMT packaged products according to claim 4, wherein: the other side of the nut sleeve (14) is fixedly connected with a clamping claw (15), the other end of the clamping claw (15) extends to the outer side of the driving plate (11), and an anti-skid pad is arranged at the end head of the clamping claw (15).