CN218723847U - Detection apparatus for semiconductor wafer thickness - Google Patents
Detection apparatus for semiconductor wafer thickness Download PDFInfo
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- CN218723847U CN218723847U CN202222877849.XU CN202222877849U CN218723847U CN 218723847 U CN218723847 U CN 218723847U CN 202222877849 U CN202222877849 U CN 202222877849U CN 218723847 U CN218723847 U CN 218723847U
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Abstract
The utility model relates to a semiconductor detection technical field specifically is a detection device of semiconductor wafer thickness, the on-line screen storage device comprises a base, be provided with on the base and examine test table, it detects the bench and is connected with the detection post to examine, sliding connection has the detector on the detection post, the detector includes the casing, the inside circuit board of casing, be provided with processing module and battery on the circuit board, the back of circuit board is provided with the movable grid of capacitive grating sensor, be provided with the display on the casing, be connected electrically between display and the circuit board, the front end that detects the post is provided with the fixed grid of capacitive grating sensor, and movable grid and fixed grid constitute the capacitive grating sensor, the front end of fixed grid is provided with one deck plastics sticker, the bottom of casing is provided with the clamp plate, carry out thickness detection through the mode with the capacitive grating sensor to semiconductor wafer, and with numerical value display and display on, make the device compare in the detection mode of reading with the eye nowadays more swiftly, it is accurate, and more conveniently observe measuring result.
Description
Technical Field
The utility model relates to a semiconductor detects technical field, specifically is a detection device of semiconductor wafer thickness.
Background
As is well known, a semiconductor refers to a material having a conductivity between a conductor and an insulator at normal temperature, and is widely used in the fields of integrated circuits, consumer electronics, communication systems, photovoltaic power generation, lighting, high-power conversion, and the like.
The present invention relates to a semiconductor wafer thickness detecting device, and more particularly to a semiconductor wafer thickness detecting device, which is a small object requiring a detector to detect whether the thickness of the detector reaches a predetermined thickness after production, and is used for detecting the thickness of the semiconductor wafer, but the present invention, such as the detecting device of patent application No. CN202123291375.2, requires visual inspection of the scale and reading, which makes the detection accuracy relatively low and the observation inconvenient, and cannot directly obtain the thickness value, so that the present invention still has a liftable space.
SUMMERY OF THE UTILITY MODEL
Technical problem to be solved
Not enough to prior art, the utility model provides a detection device of semiconductor wafer thickness, it has the precision higher, observe convenient more direct effect.
(II) technical scheme
In order to achieve the above object, the utility model provides a following technical scheme: the utility model provides a detection apparatus for semiconductor wafer thickness, includes the base, be provided with on the base and examine test table, it is connected with the detection post to examine test table, sliding connection has the detector on the detection post, the detector includes the casing, the inside circuit board of casing, be provided with processing module and battery on the circuit board, the back of circuit board is provided with the movable grid of holding grid sensor, be provided with the display on the casing, the electricity is connected between display and the circuit board, the front end that detects the post is provided with the fixed grid of holding grid sensor to movable grid and fixed grid constitute the holding grid sensor, the front end of fixed grid is provided with one deck plastics sticker, the bottom of casing is provided with the clamp plate to extend forward.
Further, it is provided with the dust layer to examine test bench, the dust layer includes the several dust excluder, several even interval arrangement between the dust excluder to the top of every dust excluder all is the setting of flushing.
Preferably, the top of detecting the post is provided with the handle, both ends all are provided with the operation panel about the casing.
Furthermore, the battery on the circuit board is a button dry battery, and a corresponding detachable structure is arranged between the shell and the circuit board.
Furthermore, the circuit board is provided with a plurality of keys which respectively extend out of the shell, and the keys are respectively arranged at the front end, the left end and the right end of the shell.
Preferably, the bottom end of the base is provided with a layer of non-slip mat.
(III) advantageous effects
Compared with the prior art, the utility model provides a detection device of semiconductor wafer thickness possesses following beneficial effect:
this detection device of semiconductor wafer thickness detects semiconductor wafer through the mode with the capacitive grating sensor to with numerical value display and display on, make the device compare in the detection mode of reading with the eye nowadays more swift, accurate, and more conveniently observe the measuring result.
Drawings
Fig. 1 is a schematic front view of the present invention;
FIG. 2 is a partial internal view of the present invention;
fig. 3 is a schematic partial left-view structural diagram of the detection column of the present invention;
fig. 4 is a schematic diagram of the present invention at a point a shown in fig. 1.
In the figure: 1. a base; 2. a detection table; 3. a detection column; 4. a housing; 5. a circuit board; 6. a processing module; 7. a battery; 8. moving the grid; 9. a display; 10. fixing a grid; 11. plastic stickers; 12. pressing a plate; 13. a dust-proof layer; 14. a dust-proof strip; 15. a handle; 16. an operation panel; 17. pressing a key; 18. a non-slip mat.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Please refer to fig. 1-4, the utility model discloses a detection apparatus for semiconductor wafer thickness, including base 1, base 1's bottom is provided with one deck slipmat 18, can increase frictional force, increase the stability when using, be provided with on base 1 and detect platform 2, it is provided with dust proof layer 13 on the platform 2 to detect, dust proof layer 13 includes several dust strip 14, even interval arrangement between the several dust strip 14, and the top of every dust strip 14 all is flush the setting, compare in former planar detection platform 2 through dust proof layer 13, be more difficult to the deposition, can fall into the clearance through the clearance between the dust strip 14 because of some dust, it prevents that dust from influencing measurement accuracy to reduce the surface dust by a wide margin, but dust proof layer 13 also needs regularly to clear up, it is under the general condition of setting of dust proof layer 13 still to explain, can not let semiconductor wafer fall into the clearance, if semiconductor wafer's size is too little, detachable dust proof layer 13 uses.
The detection platform 2 is connected with a detection column 3, the top end of the detection column 3 is provided with a handle 15, the device can be moved conveniently,
the connecting column is fixedly connected with the rear part of the detection table 2, the detection column 3 is connected with a detector in a sliding way, the detector comprises a shell 4, the left end and the right end of the top of the shell 4 are both provided with an operating board 16, the operating board 16 is a thin plate, when the monitor is operated, the operating board 16 is pinched by hands to drive the detector to move up and down, an internal circuit board 5 of the shell 4 is provided with a processing module 6 and a battery 7, the circuit board 5 is provided with a plurality of keys 17 which respectively extend out of the shell 4, the plurality of keys 17 are respectively arranged at the front end, the left end and the right end of the shell 4 and respectively correspond to the opening, closing and zeroing of the detector, the back of the circuit board 5 is provided with a movable grid 8 of a grid sensor, the shell 4 is provided with a display 9, the display 9 is electrically connected with the circuit board 5, the front end of the detection column 3 is provided with a fixed grid 10 of a capacitive grid sensor, the movable grid 8 and the fixed grid 10 form the capacitive grid sensor, the capacitive grid sensor passes through the capacitive grid sensor, so that when the detector moves, the processing module 6 can obtain the movement amount according to the induction of signals and display the movement amount through the display 9, the front end of the fixed grid 10 is provided with a layer of plastic sticker 11, the plastic sticker 11 can keep the fixed grid 10 and improve the attractiveness, the battery 7 on the circuit board 5 is a button dry battery 7, a corresponding detachable structure is arranged between the shell 4 and the circuit board 5, the battery 7 can be conveniently replaced, the bottom end of the shell 4 is provided with a pressing plate 12 and extends forwards, and the pressing plate 12 presses a semiconductor wafer when in use.
In summary, in the device for detecting the thickness of the semiconductor wafer, during detection, the device is placed at a flat and proper position, the key 17 for controlling opening is pressed, the detector is moved to the bottom end through the operation panel 16, then whether the indication number of the display 9 is 0 is observed, if not, the zero key 17 needs to be pressed, the detector is moved upwards, the semiconductor wafer is placed on the dust-proof layer 13, then the detector is moved downwards slowly until the pressing plate 12 falls on the semiconductor wafer, then the reading of the display 9 at the moment is observed and recorded, if the most accurate detection result needs to be obtained, the semiconductor wafer can be moved upwards, the detector is moved downwards, the semiconductor wafer is detected again, the accurate value is obtained, finally, the detector is moved upwards, the semiconductor wafer is moved away, the detector is moved to the bottom end, and finally the close key is pressed.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (6)
1. A semiconductor wafer thickness detection device is characterized in that: including base (1), be provided with on base (1) and detect platform (2), it detects post (3) to be connected with on detecting platform (2), sliding connection has the detector on detecting post (3), the detector includes casing (4), inside circuit board (5) of casing (4), be provided with processing module (6) and battery (7) on circuit board (5), the back of circuit board (5) is provided with movable grid (8) of appearance bars sensor, be provided with display (9) on casing (4), the electricity is connected between display (9) and circuit board (5), the front end that detects post (3) is provided with fixed grid (10) of appearance bars sensor to movable grid (8) and fixed grid (10) constitute the appearance bars sensor, the front end of fixed grid (10) is provided with one deck plastics sticker (11), the bottom of casing (4) is provided with clamp plate (12) to extend forward.
2. The apparatus for detecting the thickness of a semiconductor wafer as claimed in claim 1, wherein: it is provided with dust layer (13) to detect on platform (2), dust layer (13) include several dust excluder (14), several even interval arrangement between dust excluder (14) to the top of every dust excluder (14) all is the setting of flushing.
3. The apparatus for detecting the thickness of a semiconductor wafer as claimed in claim 1, wherein: the top of detecting post (3) is provided with handle (15), both ends all are provided with operation panel (16) about casing (4).
4. A device for detecting the thickness of a semiconductor wafer as defined in claim 1, wherein: the battery (7) on the circuit board (5) is a button dry battery (7), and a corresponding detachable structure is arranged between the shell (4) and the circuit board (5).
5. The apparatus for detecting the thickness of a semiconductor wafer as claimed in claim 1, wherein: the circuit board (5) is provided with a plurality of keys (17) which respectively extend out of the shell (4), and the keys (17) are respectively arranged at the front end, the left end and the right end of the shell (4).
6. The apparatus for detecting the thickness of a semiconductor wafer as claimed in claim 1, wherein: the bottom end of the base (1) is provided with a layer of non-slip mat (18).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222877849.XU CN218723847U (en) | 2022-10-31 | 2022-10-31 | Detection apparatus for semiconductor wafer thickness |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222877849.XU CN218723847U (en) | 2022-10-31 | 2022-10-31 | Detection apparatus for semiconductor wafer thickness |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN218723847U true CN218723847U (en) | 2023-03-24 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202222877849.XU Active CN218723847U (en) | 2022-10-31 | 2022-10-31 | Detection apparatus for semiconductor wafer thickness |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN218723847U (en) |
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2022
- 2022-10-31 CN CN202222877849.XU patent/CN218723847U/en active Active
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