CN218723709U - Mounting platform for step appearance - Google Patents
Mounting platform for step appearance Download PDFInfo
- Publication number
- CN218723709U CN218723709U CN202222517712.3U CN202222517712U CN218723709U CN 218723709 U CN218723709 U CN 218723709U CN 202222517712 U CN202222517712 U CN 202222517712U CN 218723709 U CN218723709 U CN 218723709U
- Authority
- CN
- China
- Prior art keywords
- hole
- mounting
- source
- stage
- carrier
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Landscapes
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Abstract
The utility model relates to the technical field of sheet mounting of a step instrument, in particular to a sheet mounting platform for the step instrument, which comprises a sheet source and a sheet mounting platform arranged on a base of the step instrument; the side edge of the film source is provided with a first straight edge; the top of the chip mounting carrier is provided with a blind hole, and the blind hole is provided with a second straight edge matched with the first straight edge. The utility model discloses add the mounting microscope carrier on the base of step appearance, set up the blind hole that has the second straight flange at mounting microscope carrier top to set up the first straight flange with second straight flange looks adaptation at the side of piece source simultaneously, and then when the piece source is in the blind hole of putting into the mounting microscope carrier, utilize first straight flange and the mutual butt of second straight flange, make the piece source position of placing at every turn all fixed, and then guarantee that every piece source measuring point position is all in the same position.
Description
Technical Field
The utility model relates to a mounting technical field of step appearance especially relates to a mounting microscope carrier for step appearance.
Background
The step meter is also called a film thickness meter or a segment difference analyzer, is a contact type precision measuring instrument, and mainly uses a movable probe to measure micro-size even nano-scale micro-size. The LED chip needs to monitor the etching thickness or whether the evaporation film can meet the process requirements in the process of manufacturing. Therefore, after each batch of the film source is processed, the film source needs to be placed on a film loading platform of the step gauge to measure the thickness by using the movable probe. However, no positioning measure exists between the current wafer loading platform and the wafer source, so that the wafer source position placed on the wafer loading platform is not fixed every time, and further the point positions measured by each wafer source are all at different positions, so that an operator needs to measure the wafer position by using a large-amplitude mobile probe, and the mode cannot ensure that the wafer source is measured in a uniform area, and the large-amplitude mobile probe greatly influences the working efficiency.
SUMMERY OF THE UTILITY MODEL
The utility model discloses the technical problem that will solve is: the wafer loading platform for the step profiler can realize the positioning of the wafer source and the wafer loading platform and ensure that the point positions measured by each wafer source are at the same position.
In order to solve the technical problem, the utility model discloses a technical scheme be: a wafer loading platform for a step instrument comprises a wafer source and a wafer loading platform arranged on a base of the step instrument; the side edge of the film source is provided with a first straight edge;
the top of the chip mounting carrier is provided with a blind hole, and the blind hole is provided with a second straight edge matched with the first straight edge.
Further, the blind hole comprises a plurality of coaxially arranged hole grooves, the diameters of the hole grooves are gradually reduced towards the bottom of the chip mounting carrier, and each hole groove is provided with a second straight edge.
Further, the chip mounting carrier is provided with chip taking notches, and the chip taking notches are communicated with the hole grooves.
Further, the depth of the hole groove is 0.4mm to 0.6mm.
Further, the mounting carrier for the step profiler further comprises a locking assembly; the locking assembly comprises a positioning column and a fastening screw; the positioning column is arranged between the base of the step instrument and the chip mounting platform, a positioning hole is formed in the chip mounting platform, and the fastening screw penetrates through the positioning hole to be in threaded connection with the positioning column.
The beneficial effects of the utility model reside in that: set up the mounting microscope carrier on the base of step appearance, set up the blind hole that has the second straight flange at mounting microscope carrier top to simultaneously set up the first straight flange with second straight flange looks adaptation at the side of piece source, and then the piece source utilizes first straight flange and the mutual butt of second straight flange when putting into the blind hole of mounting microscope carrier, makes the piece source position of placing at every turn all fixed, and then guarantees that every piece source measuring position all is in the same position.
Drawings
FIG. 1 is a schematic cross-sectional view of a mounting stage of a stage mounting stage for a step profiler according to an embodiment of the present invention;
fig. 2 is a schematic top view of a mounting platform for a step profiler according to an embodiment of the present invention;
FIG. 3 is a schematic view of a sheet source structure of a sheet loading platform for a step profiler according to an embodiment of the present invention;
FIG. 4 is a schematic view of an assembly structure of a loading platform for a step profiler according to an embodiment of the present invention;
description of reference numerals:
1. film source; 11. a first straight side;
2. mounting a wafer carrier; 21. blind holes; 211. a second straight side; 22. taking a chip notch; 23. positioning holes;
3. and a positioning column.
Detailed Description
In order to explain the technical content, the objects and the effects of the present invention in detail, the following description is made with reference to the accompanying drawings in combination with the embodiments.
Referring to fig. 1 to 3, the present invention relates to a wafer loading platform for a step profiler, which comprises a wafer source 1 and a wafer loading platform 2 arranged on a base of the step profiler; a first straight edge 11 is arranged on the side edge of the film source 1;
the top of the chip mounting carrier 2 is provided with a blind hole 21, and the blind hole 21 is provided with a second straight edge 211 matched with the first straight edge 11.
From the above description, the beneficial effects of the present invention are: add mounting microscope carrier 2 on the base of step appearance, set up the blind hole 21 that has second straight flange 211 at mounting microscope carrier 2 top, and set up the first straight flange 11 with second straight flange 211 looks adaptation at the side of piece source 1 simultaneously, and then when piece source 1 was putting into mounting microscope carrier 2's blind hole 21, utilize first straight flange 11 and second straight flange 211 mutual butt, make the piece source 1 position of placing at every turn all fixed, and then guarantee that every piece source 1 measuring point position all is in the same position.
Referring to fig. 1 and fig. 2, further, the blind hole 21 includes a plurality of coaxially disposed hole slots, and the diameter of the hole slots gradually decreases toward the bottom of the die-bonding carrier 2, and each of the hole slots is provided with a second straight edge 211.
As is apparent from the above description, it is possible to place the sheet source 1 in the hole grooves of the corresponding sizes according to the different sizes thereof, thereby improving the flexibility of the die bonding stage 2.
Referring to fig. 1 and fig. 2, further, the chip mounting carrier 2 is provided with a chip taking notch 22, and the chip taking notch 22 is communicated with each of the hole slots.
As can be seen from the above description, the sheet source 1 can be easily taken out from the hole groove through the sheet taking notch 22 during the sheet taking process.
Further, the depth of the hole groove is 0.4mm to 0.6mm.
From the above description, the depth of the hole groove is 0.4mm to 0.6mm, which is similar to the thickness of the sheet source 1, and can provide stability of the sheet source 1 in the hole groove.
Referring to fig. 2 and 4, further, a locking assembly is further included; the locking assembly comprises a positioning column 3 and a fastening screw; the positioning column 3 is arranged between the base of the step instrument and the chip mounting carrier 2, a positioning hole 23 is formed in the chip mounting carrier 2, and the fastening screw penetrates through the positioning hole 23 to be in threaded connection with the positioning column 3.
As can be seen from the above description, the chip mounting carrier 2 is screwed with the positioning column 3 through the fastening screw passing through the positioning hole 23, so that the abnormal height measurement caused by the shaking of the chip mounting carrier 2 can be prevented.
The utility model relates to a step appearance is with application scene of mounting microscope carrier: when the thickness of a plurality of film sources 1 needs to be measured, a film loading platform 2 is additionally arranged on a base of the step gauge, a blind hole 21 with a second straight edge 211 is formed in the top of the film loading platform 2, meanwhile, a first straight edge 11 matched with the second straight edge 211 is arranged on the side edge of the film source 1, and when the film source 1 is placed in the blind hole 21 of the film loading platform 2, the first straight edge 11 and the second straight edge 211 are abutted to each other, so that the position of the film source 1 placed at each time is fixed, and the point positions measured by each film source 1 are guaranteed to be at the same position.
Example one
A wafer loading carrier for a step profiler is shown in figures 1 to 3 and comprises a wafer source 1 and a wafer loading carrier 2 arranged on a base of the step profiler; a first straight edge 11 is arranged on the side edge of the film source 1; the top of the chip mounting carrier 2 is provided with a blind hole 21, and the blind hole 21 is provided with a second straight edge 211 matched with the first straight edge 11. The chip mounting carrier 2 is provided with chip taking notches 22, and the chip taking notches 22 are communicated with the hole grooves. The depth of the hole groove is 0.4mm to 0.6mm, and preferably, the depth of the hole groove is 0.5mm in the present embodiment.
The working principle is as follows: when the thickness of a plurality of film sources 1 needs to be measured, when the film sources 1 are placed in the blind holes 21 of the loading platform 2, the first straight edge 11 and the second straight edge 211 are mutually abutted, so that the positions of the film sources 1 placed at each time are fixed, and the point positions measured by each film source 1 are ensured to be at the same position.
Example two
A structure defining the blind hole 21 is further developed on the basis of the first embodiment:
referring to fig. 1 and 2, the blind hole 21 includes a plurality of coaxially disposed hole slots, and the diameter of the hole slots gradually decreases toward the bottom of the die-bonding carrier 2, and each of the hole slots is provided with a second straight edge 211.
Specifically, the number of the hole slots is three, and the three sizes are 6 inches, 4 inches and 2 inches respectively.
EXAMPLE III
On the basis of the first embodiment, a structure for limiting the installation of the chip loading platform 2 on the step gauge base is further developed:
referring to fig. 2 and 4, the positioning column 3 is disposed between the base of the step meter and the die-bonding stage 2, the die-bonding stage 2 is provided with a positioning hole 23, and the fastening screw passes through the positioning hole 23 and is in threaded connection with the positioning column 3.
The above mentioned is only the embodiment of the present invention, and the patent scope of the present invention is not limited thereby, and all the equivalent transformations made by the contents of the specification and the drawings, or the direct or indirect application in the related technical field, are included in the patent protection scope of the present invention.
Claims (5)
1. The utility model provides a step appearance is with mounting microscope carrier which characterized in that: the device comprises a film source and a film loading platform arranged on a base of the step instrument; the side edge of the film source is provided with a first straight edge;
the top of the chip mounting carrier is provided with a blind hole, and the blind hole is provided with a second straight edge matched with the first straight edge.
2. The stage mounting carrier for a stage profiler as set forth in claim 1, characterized in that: the blind hole comprises a plurality of coaxially arranged hole grooves, the diameters of the hole grooves are gradually reduced towards the bottom direction of the chip mounting carrier, and each hole groove is provided with a second straight edge.
3. The stage mounting carrier for a stage profiler as set forth in claim 2, characterized in that: the chip loading platform is provided with chip taking notches which are communicated with the hole grooves.
4. The stage mounting carrier for a stage profiler as set forth in claim 2, characterized in that: the depth of the hole groove is 0.4mm to 0.6mm.
5. The stage mounting carrier for a stage profiler as set forth in claim 1, characterized in that: the locking assembly is also included; the locking assembly comprises a positioning column and a fastening screw; the positioning column is arranged between the base of the step instrument and the chip mounting platform, a positioning hole is formed in the chip mounting platform, and the fastening screw penetrates through the positioning hole to be in threaded connection with the positioning column.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222517712.3U CN218723709U (en) | 2022-09-22 | 2022-09-22 | Mounting platform for step appearance |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222517712.3U CN218723709U (en) | 2022-09-22 | 2022-09-22 | Mounting platform for step appearance |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN218723709U true CN218723709U (en) | 2023-03-24 |
Family
ID=85635345
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202222517712.3U Active CN218723709U (en) | 2022-09-22 | 2022-09-22 | Mounting platform for step appearance |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN218723709U (en) |
-
2022
- 2022-09-22 CN CN202222517712.3U patent/CN218723709U/en active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN218723709U (en) | Mounting platform for step appearance | |
| CN1847784A (en) | Device pin coplanarity measuring method | |
| CN103480582A (en) | Height screening fixture | |
| CN108300973B (en) | Loading jig and evaporation plating machine | |
| CN216525901U (en) | Test fixture for CLGA (chip-on-chip) packaged chip | |
| US20130215434A1 (en) | Light emitting devices and packages and related methods with electrode marks on leads | |
| TW202015499A (en) | Back drilling method of circuit board | |
| CN110896593B (en) | Method for manufacturing circuit board and drilling machine | |
| CN211940575U (en) | Novel compression permanent deformation anchor clamps | |
| CN203177789U (en) | A verticality buzzing measuring instrument | |
| CN212030448U (en) | High-precision electronic scale flatness detector | |
| CN207648367U (en) | Locating support and measuring system for measuring part by process | |
| CN220794103U (en) | External diameter rapid measurement comparison device | |
| CN212082266U (en) | Jig for product detection experiment | |
| CN212340138U (en) | Combined multi-hole distance measuring tool | |
| CN219415986U (en) | Screw hole detection jig for medical main board | |
| CN103928381A (en) | Auxiliary tool for measuring silicon wafer contact angle | |
| CN217786894U (en) | Sapphire product spectral measurement location frock | |
| CN211234354U (en) | PCB surface copper film thickness standard piece | |
| CN211651496U (en) | Flatness detection device for metal shell of electronic component | |
| CN220121804U (en) | Adjusting jig for square flat pin-free mounting type packaging product | |
| CN218600473U (en) | Jig tool | |
| CN210514444U (en) | Multi-performance detection device for microchannel plate | |
| CN213067381U (en) | Size measuring device for metal panel machining | |
| CN219810967U (en) | Test carrier of antistatic test machine |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |