CN218701039U - Mold cooling structure for manufacturing electronic product shell - Google Patents

Mold cooling structure for manufacturing electronic product shell Download PDF

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Publication number
CN218701039U
CN218701039U CN202222416468.1U CN202222416468U CN218701039U CN 218701039 U CN218701039 U CN 218701039U CN 202222416468 U CN202222416468 U CN 202222416468U CN 218701039 U CN218701039 U CN 218701039U
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mold
cooling
electronic product
cooling structure
arc
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CN202222416468.1U
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Chinese (zh)
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曾创奇
黎淦洪
陈碧涛
潘强
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Dongguan Aurora Precision Plastic Products Co ltd
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Dongguan Aurora Precision Plastic Products Co ltd
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Abstract

The utility model provides a pair of a mould cooling structure for making electronic product shell, contain the die holder, the template, mould benevolence, the template contains the upper padding plate, the lower bolster, upper padding plate bottom and lower bolster top all are provided with corresponding cooling runner, cooling runner contains a plurality of arc tube slots, the collecting groove, the defeated cold groove of arc, relative two arc tube slots close and form a runner after piecing together, be provided with defeated cold pipeline on the runner, defeated cold pipeline wherein one end is equipped with the solenoid valve, the lower bolster top is equipped with a plurality of temperature sensor, die holder one side is equipped with the controller. The temperature sensor through different positions department monitors the temperature of template different positions department, and the solenoid valve on the cold pipeline is failed to the difference controls the flow and the velocity of flow of defeated cold pipeline under the control of controller to the temperature to the different positions department of mould carries out local temperature regulation and control, in order to reduce the temperature difference of mould benevolence different positions department, guarantees the synchronous shaping in each position of product, improves product shaping effect.

Description

Mold cooling structure for manufacturing electronic product shell
Technical Field
The utility model relates to an injection mold field indicates a mould cooling structure for making electronic product shell especially.
Background
The shell of electronic product is the plastic part mostly, and injection mold need be used in the preparation of plastic part, through injecting molten resin into the die cavity, recycles the cooling system on the mould and cools off the die cavity to let the product cooling shaping. The cooling water route of current mould is generally for directly setting up on the mould, because the temperature of mould benevolence different positions department all differentiates, and present cooling system carries out unified cooling to the template, has aggravated the temperature difference of mould benevolence different positions, leads to the cooling shaping speed of different positions of product different, has influenced the shaping effect of product, leads to the product outward appearance face not pleasing to the eye.
Disclosure of Invention
The utility model aims to solve the problem that a mould cooling structure for making electronic product shell is provided, improves product shaping effect, ensures product outward appearance shaping quality.
Solve above-mentioned technical problem according to the utility model provides a pair of a mould cooling structure for making electronic product shell, contain the die holder, the template, mould benevolence, the template sets up in the die holder top, the template contains the upper padding plate that the amalgamation is connected, the lower bolster, mould benevolence sets up in the upper padding plate top, upper padding plate bottom and lower bolster top all are provided with corresponding cooling flow channel, cooling flow channel contains a plurality of arc tube slots that set up side by side, communicate respectively and set up in the collection groove at arc tube slot both ends, set up on upper padding plate and lower bolster lateral wall and with the arc defeated cold groove of collection groove intercommunication, form a runner after two relative arc tube slots amalgamation, be provided with the defeated cold pipeline that matches with a runner on the runner, defeated cold pipeline wherein one end is provided with the solenoid valve, the lower bolster top is provided with the temperature sensor who is located arc tube slot one side respectively, die holder one side is provided with the controller, the solenoid valve is connected with controller electricity, temperature sensor and controller data connection.
Preferably, the outer wall of the cold conveying pipeline is spirally provided with a heat conducting surface, and the wall surface of the arc-shaped pipe groove is a thread arc surface matched with the heat conducting surface.
Preferably, the surface of the heat-conducting surface is coated with a heat-conducting paint.
Preferably, the arc-shaped pipe groove is coated with heat-conducting silicone grease.
Preferably, the top of the upper padding plate is provided with a first die cavity matched with the die core, the die core is movably arranged on the first die cavity, two side walls of the first die cavity are provided with guide grooves, two side walls of the die core are provided with guide strips matched with the guide grooves, and the guide strips are movably arranged on the guide grooves.
Preferably, guide pillars are arranged on four sides of the bottom of the upper cushion plate, guide holes corresponding to the guide pillars are arranged on four sides of the top of the lower cushion plate, and the guide pillars are inserted into the guide holes.
Preferably, a second die cavity matched with the template is formed in the top of the die holder, the template is embedded in the second die cavity, die holder cooling channels communicated with the second die cavity penetrate through two side walls of the die holder, and the die holder cooling channels are arranged corresponding to the arc-shaped cold conveying grooves.
The utility model has the advantages that: the utility model provides a mould cooling structure for making electronic product shell, set up unique assembly structure, during the product shaping, the temperature sensor through different positions department monitors the temperature of the different positions department of template, the flow and the velocity of flow of the defeated cold pipeline of solenoid valve on the defeated cold pipeline of difference under the control of controller, thereby carry out local temperature regulation and control to the temperature of the different positions department of mould, in order to reduce the temperature difference of the different positions department of mould benevolence, guarantee the synchronous shaping in each position of product, improve product shaping effect, ensure that product appearance mask has better pleasing to the eye degree.
Drawings
Fig. 1 illustrates an exploded structure diagram of the present invention.
Fig. 2 illustrates a schematic cross-sectional structure of the present invention.
The reference numbers illustrate: the die holder cooling device comprises a die holder 10, a controller 11, a second die cavity 12, a die holder cooling channel 13, a die core 20, a guide bar 21, an upper backing plate 30, a first die cavity 300, a guide groove 301, a guide pillar 302, a lower backing plate 31, a guide hole 310, an arc-shaped pipe groove 40, a thread arc surface 400, a collecting groove 41, an arc-shaped cold conveying groove 42, a cold conveying pipeline 43, a heat conducting surface 430, an electromagnetic valve 44 and a temperature sensor 45.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present disclosure more apparent, the technical solutions of the embodiments of the present disclosure will be described clearly and completely with reference to the drawings of the embodiments of the present disclosure. It is to be understood that the described embodiments are only a few embodiments of the present disclosure, and not all embodiments.
All other embodiments, which can be derived by a person skilled in the art from the described embodiments of the disclosure without inventive effort, are within the scope of protection of the disclosure.
Refer to fig. 1-2.
The utility model provides a mould cooling structure for making electronic product shell, contain die holder 10, the template, mould benevolence 20, the template sets up in die holder 10 top, the template contains the upper padding plate 30 that the amalgamation is connected, lower bolster 31, mould benevolence 20 sets up in upper padding plate 30 top, upper padding plate 30 bottom and lower bolster 31 top all are provided with corresponding cooling runner, cooling runner contains a plurality of arc tube seat 40 that set up side by side, communicate respectively and set up in the mass flow groove 41 at arc tube seat 40 both ends, set up on upper padding plate 30 and lower bolster 31 lateral wall and with the defeated cold groove 42 of arc of mass flow groove 41 intercommunication, form a runner after two relative arc tube seat 40 amalgamation, be provided with the defeated cold pipeline 43 that matches with a runner on the runner, defeated cold pipeline 43 wherein one end is provided with solenoid valve 44, lower bolster 31 top is provided with the temperature sensor 45 who is located arc tube seat 40 one side respectively, die holder 10 one side is provided with controller 11, solenoid valve 44 is connected with controller 11 electricity, temperature sensor 45 and controller 11 data connection.
During specific assembly, the cooling structure can be arranged on the upper die and the lower die of the die respectively, and after the upper backing plate 30 and the lower backing plate 31 are spliced, the two arc-shaped cold conveying grooves 42 are spliced to form water inlet holes, so that the water inlet holes on the two sides are communicated with the cooling water channel. After the die is assembled, the die core 20 on the upper die side and the die core 20 on the lower die side are assembled to form a die cavity, when a product is formed, the temperatures of different positions of the die plate are monitored through the temperature sensors 45 at different positions, temperature data are sent to the controller 11, a standard temperature range is preset on the controller 11, the opening size of the port of the cooling pipeline 43 is regulated and controlled by the electromagnetic valves 44 on different cooling pipelines 43 under the control of the controller 11, the flow and the flow rate of cooling water of the different cooling pipelines 43 are controlled, and therefore local temperature regulation and control are carried out on the temperatures of different positions of the die, the temperature difference of different positions of the die core 20 is reduced, synchronous forming of all parts of the product is guaranteed, the product forming effect is improved, and the appearance of the product is guaranteed to have better attractiveness.
Based on above-mentioned embodiment, the outer wall of defeated cold pipeline 43 is the heliciform and is provided with heat-conducting surface 430, and arc tube seat 40 wall sets up to the screw thread cambered surface 400 who matches with heat-conducting surface 430, can increase defeated cold pipeline 43 and arc tube seat 40's contact surface, improves the heat conduction efficiency between defeated cold pipeline 43 and the template, improves temperature regulation and control speed, ensures that the different positions temperature of template is even, stable.
Based on the above embodiment, the surface of the heat conducting surface 430 is coated with the heat conducting coating, and the graphene heat conducting coating can be used, so that the heat conducting performance is good, the crack is avoided, and the coated surface is smooth and flat.
Based on the above embodiment, the arc-shaped pipe groove 40 is coated with the heat-conducting silicone grease, which has a good heat-conducting effect and a certain fluidity, so that the cold conveying pipeline 43 is ensured to be fully contacted with the arc-shaped pipe groove 40, and the heat-conducting efficiency is improved.
Based on the above embodiment, the top of the upper cushion plate 30 is provided with the first cavity 300 matching with the mold core 20, the mold core 20 is movably disposed on the first cavity 300, the two side walls of the first cavity 300 are both provided with the guide grooves 301, the two side walls of the mold core 20 are both provided with the guide bars 21 matching with the guide grooves 301, and the guide bars 21 are movably disposed on the guide grooves 301. The mold core 20 can be conveniently replaced by pushing the mold core 20 to enter or exit the first mold cavity 300 so as to be suitable for the production of different products, and the guide strips 21 can move along the guide grooves 301, so that the disassembly and assembly stability of the mold core 20 is improved, and the abrasion of the mold is reduced.
Based on the above embodiment, the guide posts 302 are disposed on four sides of the bottom of the upper cushion plate 30, the guide holes 310 corresponding to the guide posts 302 are disposed on four sides of the top of the lower cushion plate 31, and the guide posts 302 are inserted into the guide holes 310. During assembly, the guide posts 302 of the upper backing plate 30 are inserted into the corresponding guide holes 310 of the lower backing plate 31 to assemble the upper backing plate 30 and the lower backing plate 31, so as to improve the assembly stability of the upper backing plate 30 and the lower backing plate 31 and avoid deviation.
Based on the above embodiment, the top of the die holder 10 is provided with the second die cavity 12 matched with the die plate, the die plate is embedded in the second die cavity 12, the die holder cooling channel 13 communicated with the second die cavity 12 is arranged on both side walls of the die holder 10 in a penetrating manner, and the die holder cooling channel 13 is arranged corresponding to the arc-shaped cold conveying groove 42. The assembled templates are assembled into the second die cavity 12, the cooling water channel is communicated with the die holder cooling channel 13, the cooling water sequentially passes through the die holder cooling channel 13 and the arc-shaped cold conveying channel 42 to enter the collecting groove 41, and the cooling water is accumulated in the collecting groove 41 and then is output through the cold conveying channels 43, so that the templates are cooled.
The above embodiments are only for describing the preferred embodiments of the present invention, and are not intended to limit the scope of the present invention, and various modifications and improvements made by the technical solution of the present invention by those skilled in the art are all within the scope of the present invention as defined by the claims.

Claims (7)

1. The utility model provides a mould cooling structure for making electronic product shell, contains die holder, template, mould benevolence, the template set up in the die holder top, its characterized in that, the template contains upper padding plate, the lower bolster of jogged joint, mould benevolence set up in the upper padding plate top, upper padding plate bottom with the lower bolster top all is provided with corresponding cooling flow channel, cooling flow channel contain a plurality of arc tube seat that set up side by side, communicate respectively set up in the collection groove at arc tube seat both ends, set up in the upper padding plate with on the lower bolster lateral wall and with the arc cold-conveying groove of collection groove intercommunication, two relatively form the subchannel way after the arc tube seat is jogged, be provided with on the subchannel way with the cold-conveying pipeline that the subchannel matches, cold-conveying pipeline wherein one end is provided with the solenoid valve, the lower bolster top is provided with and is located respectively the temperature sensor of arc tube seat one side, die holder one side is provided with the controller electricity is connected, temperature sensor with controller data connection.
2. The mold cooling structure for manufacturing electronic product housings as claimed in claim 1, wherein the outer wall of the cooling duct has a spiral heat conducting surface, and the curved wall is a screw surface matching the heat conducting surface.
3. The cooling structure of mold for manufacturing housing of electronic product as claimed in claim 2, wherein the surface of said heat conducting surface is coated with heat conducting paint.
4. The cooling structure of a mold for manufacturing a housing of an electronic product as claimed in claim 3, wherein the arc-shaped tube slots are coated with heat conductive silicone grease.
5. The mold cooling structure as claimed in claim 1, wherein a first cavity matching with the mold core is disposed on the top of the upper plate, the mold core is movably disposed in the first cavity, guide grooves are disposed on two side walls of the first cavity, guide bars matching with the guide grooves are disposed on two side walls of the mold core, and the guide bars are movably disposed on the guide grooves.
6. The mold cooling structure for manufacturing electronic product housings as claimed in claim 5, wherein the four sides of the bottom of the upper plate are provided with guide posts, and the four sides of the top of the lower plate are provided with guide holes corresponding to the guide posts, and the guide posts are inserted into the guide holes.
7. The mold cooling structure for manufacturing electronic product housings as claimed in any one of claims 1 to 6, wherein the top of the mold base is provided with a second cavity matching with the mold plate, the mold plate is embedded in the second cavity, and both side walls of the mold base are provided with mold base cooling channels communicating with the second cavity, the mold base cooling channels are disposed corresponding to the arc-shaped cooling channels.
CN202222416468.1U 2022-09-13 2022-09-13 Mold cooling structure for manufacturing electronic product shell Active CN218701039U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202222416468.1U CN218701039U (en) 2022-09-13 2022-09-13 Mold cooling structure for manufacturing electronic product shell

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202222416468.1U CN218701039U (en) 2022-09-13 2022-09-13 Mold cooling structure for manufacturing electronic product shell

Publications (1)

Publication Number Publication Date
CN218701039U true CN218701039U (en) 2023-03-24

Family

ID=85633537

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202222416468.1U Active CN218701039U (en) 2022-09-13 2022-09-13 Mold cooling structure for manufacturing electronic product shell

Country Status (1)

Country Link
CN (1) CN218701039U (en)

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