CN218691156U - Pressure plate type hot melt adhesive melten gel system of appearing - Google Patents
Pressure plate type hot melt adhesive melten gel system of appearing Download PDFInfo
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- CN218691156U CN218691156U CN202223168808.XU CN202223168808U CN218691156U CN 218691156 U CN218691156 U CN 218691156U CN 202223168808 U CN202223168808 U CN 202223168808U CN 218691156 U CN218691156 U CN 218691156U
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- heat carrier
- melt adhesive
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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Abstract
The utility model discloses a pressure disk hot melt adhesive melten gel system of appearing, the gluey bucket that is equipped with solid state hot melt adhesive is directly placed on placing the position, then elevating system drive heat carrier makes down to change the fin of gluey coiled bottom portion impress on the solid state glue in gluing the bucket, the heating member of heat carrier heats solid state glue and makes it melt, liquid glue after melting gets into behind the heat carrier through the play gluey passageway of changing the coiled and is sucked to the article that need use the coating by the melt pump through the through-hole, the limit that can realize melting the limit suction to solid state melt adhesive through the cooperation of heat carrier and change the coiled in this embodiment, possible liquid glue after the melting in time to aspirate, and from the upper strata to lower floor suction on one side, can avoid melting whole barrel glue and melt and keep warm the operation, a structure is simple, and the energy consumption is lower.
Description
Technical Field
The utility model relates to a coating unit's technical field specifically is a pressure disk hot melt adhesive melten gel system of appearing.
Background
The hot melt adhesive is a plastic adhesive, is solid at normal temperature, changes physical form along with the temperature rise, and becomes liquid with certain viscosity; because of its high adhesion strength and high adhesion cooling speed, it is widely used in packaging, household electrical appliances, automobiles, textile and other industries.
The existing glue dissolving device heats and melts the whole barrel of hot melt adhesive firstly, under the action of a pressurizing device, the liquid hot melt adhesive after the whole melting is conveyed to a product needing spraying, the product adhesion can be completed after the product is cooled quickly, the mode needs to be carried out by suction after the hot melt adhesive is melted firstly, the whole barrel of hot melt adhesive needs to be heated continuously in the process of suction in order to avoid the solidification of the hot melt adhesive, the energy consumption is large, and the heating equipment is complex.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a pressure disk hot melt adhesive melten gel system of glue has solved among the prior art sol device and has all heated earlier through the hot melt adhesive with whole bucket and melt, need last to heat the hot melt adhesive of whole bucket in the in-process of suction in order to avoid the hot melt adhesive solidification, and its energy consumption is great, the more complicated problem of firing equipment.
In order to achieve the above object, the utility model provides a following technical scheme:
a pressure plate type hot melt adhesive discharging system comprises a machine base, a lifting mechanism, an adhesive melting assembly and a melt pump, wherein a placing position for placing an adhesive barrel is arranged on the machine base, the adhesive melting assembly is positioned right above the adhesive barrel, and the lifting mechanism is connected with the adhesive melting assembly and is used for driving the adhesive melting assembly to be pressed into the adhesive barrel or far away from the adhesive barrel;
it includes the heat carrier and changes the rubber plate to change the gluey subassembly, be equipped with the heating member in the heat carrier, be equipped with the intercommunicating pore on the heat carrier, the intercommunicating pore with melt pump suction side intercommunication, change the rubber plate with the coaxial intercommunication of the lower extreme of heat carrier, the bottom of changing the rubber plate is equipped with the fin, change the rubber plate still be equipped with the play gluey passageway of intercommunicating pore intercommunication.
Further, the periphery cover of heat carrier is equipped with high temperature resistant sealing member.
Further, elevating system includes cylinder, crossbeam and installation pole, the cylinder is equipped with two and vertical the arranging, two the cylinder is followed the radial of gluing the bucket is arranged glue the outside of bucket, the crossbeam is connected two the output of cylinder, the upper end of installation pole connect in the crossbeam, the lower extreme of installation pole connect in the heat carrier.
Furthermore, the pressure plate type hot melt adhesive glue discharging system further comprises motors, the number of the installation rods is two, a support is arranged between the two installation rods, the motors are arranged on the support, and the output ends of the motors are connected with the melt pump through couplers.
Further, the melt pump is connected with an exhaust valve, and the exhaust valve is connected with a glue receiving box.
Further, still be connected with pressure regulating valve on the melt pump, still installed the admission valve on the heat carrier, work as it finishes to follow to change gluey subassembly melten gel when withdrawing from in the gluey bucket, the admission valve is used for controlling change gluey dish bottom and air intercommunication.
Further, two the inboard of cylinder all is equipped with the guide rail, sliding connection has on the guide rail and connects the offset plate, connect the offset plate to be greater than at the projected area of horizontal plane the projected area of heat carrier, just connect the offset plate to follow the guide rail slides extremely the below of heat carrier.
Further, the placing position is provided with a fixing device for fixing the glue barrel.
Furthermore, fixing device includes fixed door and two valves, fixed door and two the valve encloses to close and forms a cylindrical tubbiness structure, two the valve is the arc and passes through hinged joint respectively in the both sides of fixed door, two connect through joint structure between the valve.
Furthermore, this pressure disc formula hot melt adhesive melten gel goes out gluey system still includes the electric cabinet, the electric cabinet is located one side of frame, be equipped with on the electric cabinet and control the screen.
The utility model provides a pressure disk hot melt adhesive melten gel goes out system of gluing, the gluey bucket that is equipped with solid-state hot melt adhesive is directly placed on placing the position, then elevating system drive heat carrier makes down to change the fin of gluing dish bottom impress to gluing the solid-state glue in the bucket, the heating-up member of heat carrier heats to solid-state glue and makes it melt, liquid glue after melting gets into to the heat carrier after the play gluey passageway of gluing the dish on by the melt pump suction to the article that need use the coating, glue in along with gluing the bucket is sucked, the liquid level descends, elevating system drives the heat carrier in step and descends to make the fin of changing the gluing dish bottom press all the time to melt it at solid-state, can realize melting the limit suction to solid-state glue through the cooperation of heat carrier and changing the gluey dish in this embodiment, accomplish to in time suck the liquid glue after the melting, and melt suction on one side from the upper strata to the lower floor, can avoid melting and glue and keep warm the operation to whole bucket, a structure is simple, and low energy consumption. In addition, because elevating system can keep having decurrent pressure to the heat carrier all the time for the suction of fuse-element pump to the glue solution is lighter.
Drawings
Fig. 1 is a schematic structural diagram of a pressure plate type hot melt adhesive discharge system in an embodiment of the present invention;
FIG. 2 is a schematic structural diagram of a glue melting assembly in an embodiment of the present invention;
fig. 3 is a schematic structural diagram of another view angle of the glue melting assembly in the embodiment of the present invention;
fig. 4 is a schematic structural diagram of a fixing device in an embodiment of the present invention.
In the figure: 1. a machine base; 2. a lifting mechanism; 3. a glue melting component; 4. a melt pump; 5. a motor; 6. a fixing device; 7. an electric cabinet; 8. a hose; 9. a glue barrel; 10. a guide rail; 201. a cylinder; 202. a cross beam; 203. mounting a rod; 204. a support; 205. a glue receiving disc; 31. a heat carrier; 311. a heating member; 312. a communicating hole; 313. a seal member; 32. melting a rubber plate; 321. a fin; 322. a glue outlet channel; 401. an exhaust valve; 402. a glue receiving box; 403. an intake valve; 404. a pressure regulating valve; 501. a coupling; 601. a fixed door; 602. a shutter; 603. a hinge; 604. a clamping structure; 701. and a control screen.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Please refer to fig. 1-4, an embodiment of the present invention provides a pressure plate type hot melt adhesive discharging system, which includes a machine base 1, a lifting mechanism 2, a melt adhesive component 3 and a melt pump 4, wherein the machine base 1 is provided with a placing position for placing an adhesive barrel 9, the melt adhesive component 3 is located right above the adhesive barrel 9, the lifting mechanism 2 is connected with the melt adhesive component 3 and is used for driving the melt adhesive component 3 to press into the adhesive barrel 9 or keep away from the adhesive barrel 9, the melt adhesive component 3 in this embodiment is matched with the adhesive barrel 9, thereby ensuring that the melt adhesive component 3 can be pressed into the adhesive barrel 9 for melt adhesive operation and suction; it includes heat carrier 31 and the gluey dish 32 to change gluey subassembly 3, is equipped with heating member 311 in the heat carrier 31, is equipped with the intercommunicating pore 312 on the heat carrier 31, and intercommunicating pore 312 and 4 suction sides of melt pump communicate, and melt pump 4 is told the external rubber tube 8 of side and is carried glue to scribble the first department of scribbling and scribble, changes the coaxial intercommunication of lower extreme of gluey dish 32 and heat carrier 31, and the bottom of changing gluey dish 32 is equipped with fin 321, changes gluey dish 32 and still is equipped with the play gluey passageway 322 that communicates with intercommunicating pore 312.
Specifically, the glue barrel 9 containing the solid hot melt adhesive is directly placed on the placement position, then the lifting mechanism 2 drives the heat carrier 31 to move downwards, so that the fins 321 at the bottom of the glue melting disc 32 are pressed into the solid glue in the glue barrel 9, the heating element 311 of the heat carrier 31 heats the solid glue to melt the solid glue, the melted liquid glue enters the heat carrier 31 through the glue outlet channel 322 of the glue melting disc 32 and is sucked to an article needing coating through the melt pump 4 via the through hole, the liquid level descends along with the suction of the glue in the glue barrel 9, the lifting mechanism 2 synchronously drives the heat carrier 31 to move downwards, so that the fins 321 at the bottom of the glue melting disc 32 are always pressed on the solid glue to melt the solid glue, the suction of the melted liquid glue can be realized through the cooperation of the heat carrier 31 and the glue melting disc 32 in the embodiment, the timely suction of the melted liquid glue can be realized, and the suction of the melted glue can be realized from the upper layer to the lower layer while melting, the whole glue can be prevented from being melted and subjected to heat preservation operation, the structure is simple, and the energy consumption is low. In addition, because elevating system 2 can keep the decurrent pressure to heat carrier 31 all the time for melt pump 4 is lighter to the suction of glue solution, and heating member 311 is the electric heating member.
Further, the periphery cover of heat carrier 31 is equipped with high temperature resistant sealing member 313, when heat carrier 31 impresses and glues in the bucket 9, sealing member 313 can with glue and form sealed effect between the 9 inner walls of bucket, guarantee that glue can only be followed the play of gluing dish 32 and glue passageway 322 and aspirate away, glue spatters outward when avoiding the suction, and simultaneously, sealing member 313 and the inside cooperation of gluing bucket 9, can scrape down in step glue on the bucket 9 inner wall gluing at elevating system 2 drive heat carrier 31 descending in-process, it remains to reduce the glue on the bucket 9 inner wall gluing, improve the utilization ratio of hot melt adhesive. Seal 313 may optionally be a fluoroelastomer O-ring.
The lifting mechanism 2 in this embodiment includes the cylinder 201, the crossbeam 202 and the installation rod 203, the cylinder 201 is equipped with two and vertical arrangements, two cylinders 201 are arranged in the outside of gluing bucket 9 along gluing bucket 9's radial, the crossbeam 202 is connected at the output of two cylinders 201, the upper end of installation rod 203 is connected in crossbeam 202, the lower extreme of installation rod 203 is connected in heat carrier 31, so, can drive installation rod 203 and the heat carrier 31 of being connected with it and go upward to leave gluing bucket 9 when the output piston rod of cylinder 201 stretches out, thereby be convenient for change the gluey bucket 9 that has already sucked, can drive installation rod 203 and heat carrier 31 and go downward and impress the solid-state glue of gluing bucket 9 and carry out hot melt and suction operation to it when the piston rod of cylinder 201 retracts, in the descending process of lifting mechanism 2 drive heat carrier 31, because the piston rod of cylinder 201 exerts a decurrent effort to installation rod 203 all the time, when guaranteeing that the fin 321 of melting glue dish 32 is contacted with solid-state glue always, more do benefit to the glue pump 4 on the heat carrier 31 and suck glue.
The pressure disk type hot melt adhesive melten gel of this embodiment goes out gluey system still includes motor 5, preferably gear motor 5 in this embodiment, installation pole 203 is equipped with two, be equipped with support 204 between two installation poles 203, motor 5 locates on support 204, through support 204 in order to realize the support to motor 5, guarantee the stability of melt pump 4 suction action, support 204 sets up and can go up and down along with the lift of installation pole 203 between installation pole 203, motor 5's output passes through shaft coupling 501 and is connected with melt pump 4, drive melt pump 4 through motor 5 in order to realize the suction action to the melten gel.
Further, the melt pump 4 is also connected with a pressure regulating valve 404, the heat carrier 31 is also provided with an air inlet valve 403, when the glue melting assembly finishes glue melting and exits from the glue barrel 9, the air inlet valve 403 is used for controlling the bottom of the glue melting disc 32 to be communicated with air, and the pumping output pressure of the melt pump 4 is regulated by regulating the pressure regulating valve 404 so as to match the coating speed of the subsequent coating process and enhance the adaptability of the melt pump; after a barrel of hot melt adhesive is melted and sucked, when the glue melting assembly needs to be withdrawn from the glue barrel 9, the air inlet valve 403 is opened to enable air to rapidly enter the bottom of the glue barrel 9, so that the glue melting assembly is smoothly withdrawn from the glue barrel 9, and the air inlet valve 403 is closed during normal glue melting operation to prevent glue from escaping, wherein the air inlet valve 403 is installed on the heat carrier 31 and communicated with the glue outlet channel 322 to form an air inlet passage, or a special channel is drilled on the heat carrier 31 and the glue melting disc 32 and communicated with the air inlet valve 403 to form an air inlet passage.
In this embodiment, the guide rails 10 are disposed on the inner sides of the two cylinders 201, the guide rails 10 are slidably connected to the glue receiving tray 205, the projection area of the glue receiving tray 205 on the horizontal plane is larger than the projection area of the heat carrier 31, and the glue receiving tray 205 can slide to the lower side of the heat carrier 31 along the guide rails, when the glue barrel 9 needs to be replaced, the lifting mechanism 2 drives the heat carrier 31 to move upwards to leave the glue barrel 9, then the glue receiving tray 205 is pushed into the lower side of the heat carrier 31, the glue dropping on the heat carrier 31 and the glue dissolving tray 32 is received through the glue receiving tray 205, environment pollution is avoided, the dropped glue can be reused, waste of resources is avoided, after the glue barrel 9 is replaced, the glue receiving tray 205 is withdrawn, and the lifting mechanism 2 drives the heat carrier 31 to move downwards to the glue barrel 9 to perform glue melting and suction operations.
The place position of frame 1 in this embodiment is equipped with fixing device 6 that is used for fixed gluey bucket 9, can realize fixing and fixing a position gluey bucket 9 placed through this gluey bucket 9 fixing device 6 to guarantee that heat carrier 31 can push into wherein better, avoid gluing bucket 9 and produce the removal in melten gel and suction process simultaneously. Specifically, fixing device 6 includes fixed door 601 and two valves 602, fixed door 601 and two valves 602 enclose to close and form a cylindrical tubbiness structure, cylindrical tubbiness structure is in order to match the shape of gluing bucket 9, two valves 602 are the arc and connect in the both sides of fixed door 601 through hinge 603 respectively, connect through clamping structure 604 between two valves 602, open clamping structure 604, then open valve 602 along fixed door 601, can take out gluey bucket 9 and place the new gluey bucket 9 of change, after the change finishes, close valve 602 along fixed door 601 again, it can to fix through clamping structure 604 joint.
The pressure plate type hot melt adhesive melten gel system of glue out in this embodiment still includes electric cabinet 7, and electric cabinet 7 is located one side of frame 1, is equipped with on electric cabinet 7 to control the screen, and cylinder 201, melt pump 4, admission valve 403, heating member 311 and motor 5 all are connected with this electric cabinet 7 electricity to can realize automated operation.
It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.
In the description of the present invention, it should be understood that the terms "upper", "lower", "left", "right", "top", "bottom", and the like indicate orientations or positional relationships based on orientations or positional relationships shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus should not be construed as limiting the present invention.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (10)
1. The utility model provides a pressure disk hot melt adhesive melten gel goes out gluey system which characterized in that: the glue melting device comprises a base, a lifting mechanism, a glue melting assembly and a melt pump, wherein a placing position for placing a glue barrel is arranged on the base, the glue melting assembly is positioned right above the glue barrel, and the lifting mechanism is connected with the glue melting assembly and is used for driving the glue melting assembly to be pressed into the glue barrel or to be far away from the glue barrel;
it includes the heat carrier and changes the rubber plate to change the gluey subassembly, be equipped with the heating member in the heat carrier, be equipped with the intercommunicating pore on the heat carrier, the intercommunicating pore with melt pump suction side intercommunication, change the rubber plate with the coaxial intercommunication of the lower extreme of heat carrier, the bottom of changing the rubber plate is equipped with the fin, change the rubber plate still be equipped with the play gluey passageway of intercommunicating pore intercommunication.
2. The pressure plate type hot melt adhesive glue discharging system according to claim 1, characterized in that: the periphery cover of heat carrier is equipped with high temperature resistant sealing member.
3. The pressure plate type hot melt adhesive glue discharging system according to claim 2, characterized in that: elevating system includes cylinder, crossbeam and installation pole, the cylinder is equipped with two and vertical the arranging, two the cylinder is followed glue the bucket radially arrange glue the outside of bucket, the crossbeam is connected two the output of cylinder, the upper end of installation pole connect in the crossbeam, the lower extreme of installation pole connect in the heat carrier.
4. The pressure plate type hot melt adhesive glue discharging system according to claim 3, characterized in that: the melt pump is characterized by further comprising two motors, a support is arranged between the two mounting rods, the motors are arranged on the support, and the output ends of the motors are connected with the melt pump through couplers.
5. The pressure plate type hot melt adhesive glue discharging system according to claim 4, characterized in that: the melt pump is connected with an exhaust valve, and the exhaust valve is connected with a glue receiving box.
6. The pressure plate type hot melt adhesive glue discharging system according to claim 5, characterized in that: still be connected with pressure regulating valve on the melt pump, still installed the admission valve on the heat carrier, work as it finishes to melt to glue the subassembly melten gel and follows when withdrawing from in the gluey bucket, the admission valve is used for control it communicates with the air to change the rubber plate bottom.
7. The pressure plate type hot melt adhesive glue discharging system according to claim 6, characterized in that: two the inboard of cylinder all is equipped with the guide rail, sliding connection has on the guide rail and connects the rubber tyer, connect the rubber tyer to be greater than at the projected area of horizontal plane the projected area of heat carrier, just connect the rubber tyer can follow the guide rail slides extremely the below of heat carrier.
8. The pressure plate type hot melt adhesive glue discharging system according to claim 7, characterized in that: the placing position is provided with a fixing device for fixing the glue barrel.
9. The pressure plate type hot melt adhesive glue discharging system according to claim 8, characterized in that: the fixing device comprises a fixing door and two valves, the fixing door and the two valves are enclosed to form a cylindrical barrel-shaped structure, the two valves are arc-shaped and are respectively connected to two sides of the fixing door through hinges, and the two valves are connected through a clamping structure.
10. The pressure-disk type hot melt adhesive dispensing system according to any one of claims 1 to 9, characterized in that: the electric cabinet is positioned on one side of the machine base, and a control screen is arranged on the electric cabinet.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN202223168808.XU CN218691156U (en) | 2022-11-28 | 2022-11-28 | Pressure plate type hot melt adhesive melten gel system of appearing |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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CN202223168808.XU CN218691156U (en) | 2022-11-28 | 2022-11-28 | Pressure plate type hot melt adhesive melten gel system of appearing |
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CN218691156U true CN218691156U (en) | 2023-03-24 |
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CN202223168808.XU Active CN218691156U (en) | 2022-11-28 | 2022-11-28 | Pressure plate type hot melt adhesive melten gel system of appearing |
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2022
- 2022-11-28 CN CN202223168808.XU patent/CN218691156U/en active Active
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