CN218679760U

CN218679760U - Heat dissipation system, heat dissipation chassis and robot

Info

Publication number: CN218679760U
Application number: CN202222879138.6U
Authority: CN
Inventors: 朱冬; 方向明; 张建; 唐国梅; 宋雯
Original assignee: Seven Teng Robot Co ltd
Current assignee: Seven Teng Robot Co ltd
Priority date: 2022-10-31
Filing date: 2022-10-31
Publication date: 2023-03-21
Anticipated expiration: 2032-10-31

Abstract

The application relates to a heat dissipation system, a heat dissipation chassis and a robot, and relates to the technical field of robots, wherein the heat dissipation system comprises a first heat dissipation assembly, a semiconductor refrigeration piece and a fan, the first heat dissipation assembly is arranged in an external environment, a heating end of the semiconductor refrigeration piece is in heat transfer connection with the first heat dissipation assembly, a refrigeration end of the semiconductor refrigeration piece is arranged close to a heating element, and air generated by the fan flows through the refrigeration end of the semiconductor refrigeration piece; the heat dissipation chassis comprises a cabin body and a cover plate, the cover plate covers an opening of the cabin body, the heat dissipation chassis also comprises the heat dissipation system, the first heat dissipation assembly is fixed on the outer wall of the cover plate and/or the cabin body, and the semiconductor refrigeration piece and the fan are positioned in a cavity formed by the cabin body and the cover plate; the robot comprises a power supply and the heat dissipation chassis. This application has the effect of piling up in order to reduce local heat to the inside cooling of robot.

Description

Heat dissipation system, heat dissipation chassis and robot

Technical Field

The application relates to the technical field of robots, in particular to a heat dissipation system, a heat dissipation chassis and a robot.

Background

With the continuous progress of science and technology, the robot gradually enters into the production life of people to replace people to do some simple work with stronger repeatability, such as patrol.

The related technology is seen in a patent with application number CN202020893818.1, and discloses an explosion-proof inspection vehicle which comprises a chassis, crawler wheels, an upper cover, a battery, a driving motor, a wireless charger, a gas probe and the like.

Aiming at the related technology, a plurality of heating elements such as motors, batteries and the like exist in the robot in the operation process, the internal temperature is high in the operation process, the highest temperature can reach about 70 ℃, and faults such as high temperature runaway of partial elements, abnormal battery charging and discharging and the like are easily caused under the high-temperature condition.

SUMMERY OF THE UTILITY MODEL

In order to improve the problem that the normal work of components is influenced because of inside heat piles up in the present robot operation process, this application provides a cooling system, heat dissipation chassis and robot.

In a first aspect, the present application provides a heat dissipation system, which adopts the following technical solution:

the utility model provides a heat dissipation system, includes first radiator unit, semiconductor refrigeration piece and fan, and during external environment was located to first radiator unit, the heating end and the first radiator unit heat transfer connection of semiconductor refrigeration piece, the refrigeration end of semiconductor refrigeration piece was close to heating element and is set up, and the wind that the fan produced flows the refrigeration end through semiconductor refrigeration piece.

In a second aspect, the present application provides a heat dissipation chassis, which adopts the following technical scheme:

a heat dissipation chassis comprises a cabin body and a cover plate, wherein the cover plate covers an opening of the cabin body, the heat dissipation chassis further comprises the heat dissipation system, a first heat dissipation assembly is fixed on the outer wall of the cover plate and/or the cabin body, and a semiconductor refrigeration piece and a fan are located in a cavity formed by the cabin body and the cover plate.

By adopting the technical scheme, when the semiconductor refrigerating sheet works, the refrigerating end absorbs heat and transmits the heat to the first heat dissipation assembly through the cover plate or the cabin side wall, and the first heat dissipation assembly dissipates the heat to the external environment, so that the temperature in the chassis is reduced. In addition, the ambient temperature of refrigeration end is lower, and the fan during operation for inside heat flows, on the one hand with the cold air diffusion of refrigeration end around to other regions in the chassis inside, avoids the local heap of heat, makes semiconductor electron refrigeration piece follow inside more heats on the one hand. The whole temperature in the chassis is obviously reduced, the heat accumulation phenomenon is avoided, and a good environment is provided for the elements to normally work at a proper temperature.

In a third aspect, the present application provides a robot, which adopts the following technical solutions:

a robot comprises a power supply and the heat dissipation chassis.

In summary, the present application has the following beneficial technical effects: when the fan works, the internal heat flows, the local accumulation of the heat is avoided, the overall temperature in the chassis is obviously reduced, and a good environment is provided for the elements to normally work at a proper temperature.

Drawings

FIG. 1 is a schematic view of a robot

FIG. 2 is a schematic structural diagram of a robot heat dissipation chassis;

FIG. 3 is a top view of FIG. 2;

FIG. 4 isbase:Sub>A cross-sectional view taken along line A-A of FIG. 3;

FIG. 5 is a schematic structural diagram of a first heat dissipation assembly;

FIG. 6 is a simulated view of the internal heat distribution of a chassis without a heat dissipation system;

fig. 7 is a simulated view of the internal heat distribution of a chassis on which a heat dissipation system is mounted.

Description of the reference numerals:

1. a chassis; 2. a cover plate; 3. a first heat dissipation assembly; 31. a fixing member; 311. an end plate; 312. folding edges; 313. a fixed part; 32. a heat sink; 4. a heat conducting plate; 5. a semiconductor refrigeration sheet; 6. a second heat dissipation assembly; 7. a fan.

Detailed Description

The present application is described in further detail below with reference to figures 1-7.

The application discloses cooling system, heat dissipation chassis and robot.

Referring to fig. 1 to 4, the robot includes a heat dissipation chassis and elements located in the heat dissipation chassis, the elements include an industrial personal computer, a motor, a battery, etc., the heat dissipation chassis includes a cabin 1 and a cover plate 2 fixed on the top of the cabin 1, the cover plate 2 is provided with a heat dissipation system, and the heat dissipation system is used for cooling the inside of the heat dissipation chassis, which is beneficial to the normal operation of the elements.

There may be a plurality of sets of heat dissipation systems, where there are two sets of heat dissipation systems disposed on both sides of the cover plate 2. In other embodiments, the heat dissipation system may be one group, three groups, or more than four groups, etc. according to the needs of the heat dissipation area and the heat dissipation effect. The heat dissipation system may also be mounted to a side wall or a bottom wall of the heat dissipation chassis.

Referring to fig. 3 and 4, the heat dissipation system includes a first heat dissipation assembly 3, a semiconductor refrigeration piece 5 and a fan 7, the semiconductor refrigeration piece 5 is connected to a cover plate 2, the cover plate 2 may be a metal plate, a heating end of the semiconductor refrigeration piece 5 is attached to the cover plate 2, a refrigeration end of the semiconductor refrigeration piece 5 is far away from the cover plate 2, and the semiconductor refrigeration piece 5 is electrically connected to an external power supply; the first heat dissipation assembly 3 is fixed on the cover plate 2 and is positioned in the area where the semiconductor refrigeration piece 5 is positioned, and the first heat dissipation assembly 3 and the semiconductor refrigeration piece 5 are positioned on two sides of the cover plate 2; the fan 7 can be mounted on the heat dissipation chassis through bolts, and the fan 7 is electrically connected with an external power supply and used for enabling air in the heat dissipation chassis to flow.

Semiconductor refrigeration piece 5 during operation, the refrigeration end absorbs heat to with the heat through the heating end, the heat in heating end passes through apron 2 and transmits to first radiator unit 3, and first radiator unit 3 disperses the heat to the external environment in, thereby has reduced the temperature in the heat dissipation chassis. In addition, the ambient temperature of refrigeration end is lower, and fan 7 during operation for inside heat flows, on the one hand with the cold air diffusion of refrigeration end around to other regions of cabin 1 inside, avoids the local heap of heat, makes semiconductor refrigeration piece 5 draw more heats from inside on the one hand.

Referring to fig. 5, the first heat dissipation assembly 3 includes a fixing member 31 and a plurality of heat dissipation fins 32, the heat dissipation fins 32 are arranged side by side, a certain gap is left between two adjacent heat dissipation fins 32 to facilitate heat dissipation, the heat dissipation fins 32 are rectangular fins made of good thermal conductors, and the plurality of heat dissipation fins 32 form a rectangular structure; the fixing member 31 has two ends fixed to the longitudinal direction of the heat radiating fins 32, and the fixing member 31 is used to fix a plurality of heat radiating fins 32 side by side to the cover plate 2. The fixing member 31 includes an end plate 311, flaps 312 and a fixing portion 313, the end plate 311 is a rectangular plate, the outline of the rectangular plate is adapted to the outline of the end face of the rectangular parallelepiped formed by the heat dissipation fins 32, one of the fixing portions 313 is arranged along the edges of the rectangular plate, three flaps 312 are arranged and distributed on the remaining three edges of the rectangular plate, and the bending directions of the fixing portion 313 and the flaps 312 relative to the end plate 311 are opposite. The fixing member 31 may be made of a metal plate, the folded edge 312 may be in the same plane as the end plate 311 in an initial state, after the end plate 311 abuts against the end surface of the heat dissipation fins 32, the folded edge 312 is bent to limit the heat dissipation fins 32, the fixing portion 313 is fixed to the cover plate 2 by screws, the folded edge 312 opposite to the fixing portion 313 is used for limiting the plurality of heat dissipation fins 32 in a direction perpendicular to the height direction of the cover plate 2, and the folded edges 312 on two sides are used for limiting the heat dissipation fins 32 on two sides. When the heat sink 32 needs to be maintained and replaced, the fixing member 31 is removed.

In order to further increase the heat dissipation area, the end plate 311 is provided with one or more heat dissipation holes, which are specifically selected according to the needs.

In other embodiments, the heat sink 32 may be formed in a plurality of concentric circles or other structures, and the structure of the fixing member 31 may be adjusted adaptively, that is, the contour of the end plate 311 may vary with the shape of the heat sink 32. The plurality of heat sinks 32 may be integrally formed, and the heat sinks 32 are directly bonded or welded to the cover plate 2.

In order to improve the heat conduction rate, the heat in the heat dissipation chassis is transferred to the first heat dissipation assembly 3 as fast as possible, a heat conduction plate 4 can be further arranged between the semiconductor refrigeration piece 5 and the cover plate 2, and the heat conduction plate 4 can be a copper sheet. In other embodiments, the heat-conducting plate 4 may also be a copper-based silver-plated sheet, a copper-based gold-plated sheet, a silver-based gold-plated sheet, a gold foil, or the like. The heat conducting plate 4 is fixed to the cover plate 2 by screws, and in other embodiments, the heat conducting plate 4 may be bonded to the cover plate 2. The heat conducting plate 4 is provided with a containing groove for installing the semiconductor refrigerating sheet 5.

According to the needs, the number of the semiconductor refrigeration pieces 5 can be one, two or more than three, and the semiconductor refrigeration pieces are reasonably selected according to the power and heat dissipation needs. The heat conduction plate 4 can be one, and can cover all the semiconductor refrigeration sheets 5; or more than two heat conduction plates 4 can be arranged to cover the semiconductor refrigeration sheets 5 at the key positions.

In order to improve the heat absorption efficiency and the cold air diffusion efficiency of the refrigerating end of the semiconductor refrigerating sheet 5, the refrigerating end of the semiconductor refrigerating sheet 5 is fixedly connected with a second heat dissipation assembly 6, the second heat dissipation assembly 6 comprises a base plate and a plurality of fins fixed on the base plate, the base plate is connected with the refrigerating end, and the base plate and the fins are made of aluminum or other good thermal conductors. The fins increase the heat exchange area between the semiconductor refrigeration sheet 5 and the inner space of the heat dissipation chassis. The number of the second heat dissipation assemblies 6 can be selected according to the area of the coverage area and the area where the semiconductor chilling plates 5 are located, two semiconductor chilling plates 5 correspond to one second heat dissipation assembly 6, each semiconductor chilling plate 5 corresponds to one second heat dissipation assembly 6, or four semiconductor chilling plates 5 correspond to one second heat dissipation assembly 6.

The wind direction of the fan 7 can be opposite to the fins of the second heat dissipation assembly 6, and can also be arranged in parallel with the channels between the fins.

When the heat dissipation system is installed on the side wall or the bottom wall of the cabin 1 of the heat dissipation chassis, the cover plate 2 in fig. 3 may be adapted to represent the side wall or the bottom wall of the cabin 1.

Before and after the heat dissipation system is added, the temperature simulation in the cabin body 1 is as shown in fig. 6 and 7, and therefore, after the heat dissipation system is added, the overall temperature in the chassis is obviously reduced, the phenomenon of heat accumulation is avoided, and a good environment is provided for normal operation of elements at a proper temperature.

The above embodiments are preferred embodiments of the present application, and the protection scope of the present application is not limited by the above embodiments, so: equivalent changes in structure, shape and principle of the present application shall be covered by the protection scope of the present application.

Claims

1. A heat dissipation system, comprising: including first radiator unit (3), semiconductor refrigeration piece (5) and fan (7), during external environment was located in first radiator unit (3), the end and first radiator unit (3) heat transfer connection that generate heat of semiconductor refrigeration piece (5), the refrigeration end of semiconductor refrigeration piece (5) is close to heating element and sets up, and the wind that fan (7) produced flows the refrigeration end through semiconductor refrigeration piece (5).

2. The heat dissipating system of claim 1, wherein: a heat conducting plate (4) is arranged between the heating end of the semiconductor refrigeration piece (5) and the first heat dissipation component (3).

3. The heat dissipation system of claim 2, wherein: the heat conducting plate (4) is one of a copper sheet, a copper-based silver plating sheet, a copper-based gold plating sheet, a silver-based gold plating sheet and a gold foil.

4. The heat dissipating system of any one of claims 1 to 3, wherein: the refrigeration end of semiconductor refrigeration piece (5) is connected with second radiator unit (6), and second radiator unit (6) include a plurality of fins by the good conductor material preparation of heat.

5. The heat dissipating system of claim 4, wherein: the wind generated by the fan (7) flows directly to the channels between the fins.

6. The heat dissipating system of claim 1, 2, 3, or 5, wherein: the first heat dissipation assembly (3) comprises a fixing piece (31) and a plurality of heat dissipation fins (32), wherein the fixing piece (31) is used for fixing the plurality of heat dissipation fins (32).

7. The heat dissipation system of claim 6, wherein: the fixing piece (31) comprises an end plate (311), a folding edge (312) and a fixing portion (313) which are fixedly connected, the end plate (311) is abutted to the end portion of the radiating fin (32), the fixing portion (313) and the folding edge (312) are located on two sides of the end plate (311), the folding edge (312) is used for limiting and fixing the radiating fin (32), and the fixing portion (313) is used for connecting an external chassis (1).

8. The utility model provides a heat dissipation chassis (1), includes the cabin body and apron (2), and apron (2) lid fits the opening part in the cabin body, its characterized in that: the heat dissipation chassis (1) further comprises the heat dissipation system as claimed in any one of claims 1 to 7, the first heat dissipation assembly (3) is fixed to the cover plate (2) and/or the outer wall of the cabin, and the semiconductor refrigeration sheet (5) and the fan (7) are located in a cavity formed by the cabin and the cover plate (2).

9. A robot comprising a power source, characterized in that: further comprising a heat sink chassis (1) according to claim 8.