CN218679756U - Heat dissipation component, electronic module and motor vehicle - Google Patents

Abstract

A heat dissipating member for an electronic module (10), an electronic module and a motor vehicle are provided. The heat dissipation member (100) includes: a plate-shaped body (110) having one surface defined with a heat dissipation region (111) in which a substrate (300) carrying a heat generating element (200) of the electronic module is adapted to be mounted to dissipate heat generated by the heat generating element by the heat dissipation member; at least one extension, each extension extending outward from an edge of the plate-shaped body, in which at least one vent hole (121, 131) penetrating the extension in a first direction (Z) is formed; and at least one heat dissipating fin, each heat dissipating fin extending from a corresponding extension.

Description

Heat dissipation component, electronic module and motor vehicle

Technical Field

Embodiments of the present disclosure generally relate to the field of heat dissipation, and more particularly, to a heat dissipation member having improved heat dissipation effects, and an electronic module and a motor vehicle equipped with such a heat dissipation member.

Background

In order to avoid heat accumulation in a relatively narrow space inside the device housing to generate high temperature and affect the normal operation of the device, a heat sink is usually disposed in the device housing, especially on the substrate of the device, for heat dissipation.

For example, the light sources of many types of light fixtures emit light while also releasing a large amount of heat. This heat build-up can lead to localized high temperatures of the lamp that can damage the components. This phenomenon is particularly severe in led lamps. Therefore, the role of heat sinks in light fixtures is also becoming increasingly important. Heat sinks are widely used, for example, in automotive lamps (e.g., headlamps, signal lamps, etc.).

Some conventional heat sinks are typically in the form of a plate heat sink positioned on the back of a substrate on which the heat generating components (e.g., light sources) are mounted, wherein the plate heat sink is attached to the back of the substrate to dissipate heat generated by the heat generating components during operation. With the requirement of cost reduction, the area of the substrate needs to be reduced, and the substrate with a small area can also play a role in heat dissipation, so that the heat dissipation effect of the plate-type heat sink is poor due to the small area of the substrate.

SUMMERY OF THE UTILITY MODEL

It is an object of the present disclosure to address or overcome at least one of the above-mentioned and other problems and deficiencies in the prior art.

According to an aspect of the present disclosure, there is provided a heat dissipation member for an electronic module, the heat dissipation member including: a plate-shaped main body having one surface thereof defined with a heat dissipation region in which a substrate of the electronic module carrying a heating element is adapted to be mounted so as to dissipate heat generated by the heating element by the heat dissipation member; at least one extension, each extension extending outward from an edge of the plate-shaped main body, in which at least one vent hole penetrating the extension in a first direction is formed; and at least one heat dissipating fin, each heat dissipating fin extending from a corresponding extension.

In some embodiments, the extension portion extends outward from an edge of the plate-shaped body substantially in a plate surface direction of the plate-shaped body, and the first direction is transverse to the plate surface direction of the plate-shaped body.

In some embodiments, in the mounting position of the heat dissipating member, the first direction coincides with a direction of gravity.

In some embodiments, each of the heat dissipating fins extends from an edge of the corresponding extension in a direction transverse to the plate-face direction of the plate-like body.

In some embodiments, each of the heat dissipating fins includes at least one pair of fin portions extending from an edge of a corresponding one of the vent holes toward an opposite side of the vent hole in a direction transverse to the plate-face direction of the plate-like body.

In some embodiments, each pair of fin portions forms a "zig-zag" profile.

In some embodiments, one fin portion of each pair of fin portions has the same shape as the shape of the corresponding vent hole and a size smaller than the size of the vent hole.

In some embodiments, one or more of the at least one heat sink fin includes a plurality of pairs of the fin portions, adjacent pairs of the fin portions having a gap therebetween leading to the heat dissipation area.

In some embodiments, the heat dissipating member includes a plurality of the extensions, and a gap is provided between adjacent extensions.

In some embodiments, the plurality of extensions comprises: a pair of first extending portions positioned on opposite sides of the plate-shaped body in a second direction perpendicular to the first direction; and a pair of second extending portions positioned at other opposite sides of the plate-shaped body in a third direction perpendicular to the first and second directions.

In some embodiments, a dimension of each first extension in the third direction is greater than a dimension of the plate-like body in the third direction.

In some embodiments, the at least one heat sink fin comprises: a pair of first heat dissipating fins extending from the pair of first extensions; and a pair of second heat dissipation fins extending from the pair of second extensions.

In some embodiments, the heat dissipating member is a unitary member stamped and bent from sheet metal.

In some embodiments, the size of the heat dissipation area is greater than or equal to the size of the substrate.

According to another aspect of the present disclosure, embodiments also provide an electronic module including a substrate and a heat generating element mounted on the substrate, and further including the heat dissipation member described in any of the embodiments of the present disclosure, the substrate on which the heat generating element is mounted being attached within a heat dissipation region of the heat dissipation member.

In some embodiments, the heat generating element comprises a light source.

In some embodiments, the electronic module comprises a vehicle light for a motor vehicle.

According to yet another aspect of the present disclosure, embodiments also provide a motor vehicle including the heat dissipation member or the electronic module described in any of the embodiments of the present disclosure.

Other objects and advantages of the present disclosure will become apparent from the following detailed description, which proceeds with reference to the accompanying drawings, and will assist in a comprehensive understanding of the disclosure.

Drawings

These and/or other aspects, features and advantages of the present disclosure will become apparent and readily appreciated from the following description of the illustrative embodiments, taken in conjunction with the accompanying drawings of which:

fig. 1 is a perspective view showing the arrangement of an electronic module according to an exemplary embodiment of the present disclosure;

fig. 2 is a bottom perspective view schematically illustrating the structure of an electronic module according to an exemplary embodiment of the present disclosure;

fig. 3 is a bottom perspective view schematically illustrating the structure of a heat dissipation member according to an exemplary embodiment of the present disclosure; and

fig. 4 is a schematic view illustrating a process of manufacturing a heat discharging member according to an exemplary embodiment of the present disclosure.

Detailed Description

Embodiments of the present disclosure will be described in detail below with reference to the accompanying drawings. In the present specification, the same or similar components are denoted by the same or similar reference numerals. The following description of the embodiments of the present disclosure with reference to the accompanying drawings is intended to explain the general inventive concept of the present disclosure and should not be construed as limiting the present disclosure.

Furthermore, in the following detailed description, for purposes of explanation, numerous specific details are set forth in order to provide a thorough understanding of the embodiments of the disclosure. It may be evident, however, that one or more embodiments may be practiced without these specific details. In other instances, well-known structures and devices are shown in schematic form in order to simplify the drawing.

Fig. 1 and 2 schematically illustrate the structure of a portion of an electronic module 10 provided in accordance with an exemplary embodiment of the present disclosure, which may be used, for example, as a lighting or signaling device such as a vehicle lamp or a component thereof. As shown, the electronic module includes a heat dissipation member 100 for dissipating at least heat generated by a heat generating element 200 in the electronic module during operation, and the heat generating element 200 may include, for example, a light source such as an LED, or other optical or electronic elements that generate heat during operation. Illustratively, the heat generating element 200 is mounted on a front surface of a substrate 300 (e.g., a circuit board such as a PCB), and the heat dissipation member 100 is mounted (e.g., attached) on a rear surface of the substrate 300.

In fig. 1 to 3, a structure of a heat dissipation member 100 provided according to an exemplary embodiment of the present disclosure is schematically illustrated. As shown in the drawings, the heat discharging member 100 includes a plate-shaped body 110 and ventilation holes 121, 131 and/or heat discharging fins 140, 150 (described below) formed outside the plate-shaped body 110, to enhance a heat discharging effect, unlike a conventional plate-type heat sink. The plate-shaped body 110 is in contact with or attached to the substrate 300 on which the heat generating element 200 is mounted to receive heat transferred from the heat generating element 200, thereby radiating heat from the entire heat radiating member. One surface of the plate-shaped body 110 defines a heat dissipation region 111, and the substrate 300 carrying the heat generating element 200 is adapted to be mounted in the heat dissipation region 111.

Illustratively, the heat dissipation area 111 may be shaped to conform or match the shape of the substrate 300, such as a rectangular shape, to facilitate assembly therebetween. In some examples, the size or area of the plate-like body 110 or its heat dissipation region 111 may be greater than or equal to the size or area of the substrate 300, such that the entire substrate 300 may be positioned within the heat dissipation region 111.

In an exemplary embodiment according to the present disclosure, the heat discharging member 100 further includes at least one extension 120, 130, each extending outward from an edge of the plate-shaped body 110, for example, the extension extends outward from the edge of the plate-shaped body 110 substantially in a plate surface direction of the plate-shaped body 110. The plate surface direction of the plate-shaped body 110 may refer to a direction in which the surface defining the heat dissipation region 111 extends. At least one ventilation hole 121, 131 is formed in the extension portion 120, 130, and penetrates the extension portion in the first direction Z, for example, so as to facilitate air convection via the ventilation hole 121, 131, enhance heat exchange between the airflow and the substrate, and take away heat received or accumulated in the substrate 300 or the heat dissipation area 111, thereby improving heat dissipation efficiency. In some examples, in the electronic module, in the installation position of the heat dissipation member or in the installation state of the heat dissipation member, the first direction Z is a thickness direction of the extendable portions 120 and 130, i.e., the first direction Z is transverse to the plate surface direction of the plate-shaped main body 110, and may coincide with the gravity or the vertical direction, for example, so as to facilitate rapid heat dissipation in the upward direction.

The extensions 120, 130 of the heat discharging member 100 may extend outward from the edge of the plate-shaped body 110 in a direction intersecting (e.g., perpendicular or oblique) the first direction Z, for example, as shown in the drawings, the extensions 120, 130 extend outward from the edge of the plate-shaped body 110 substantially in the plate surface direction of the plate-shaped body 110.

In the illustrated embodiment, the heat discharging member 100 further includes at least one heat discharging fin 140, 150, each extending from a corresponding extension, for example, in a direction transverse to the plate surface of the plate-shaped body 110, which can increase a heat exchanging area between the heat discharging member 100 and the air outside the base plate 300 to provide further heat discharging capability. The heat radiating fins may take various forms such as a sheet, a plate, a column, etc., which are not particularly limited in this disclosure.

In the exemplary embodiment of the present disclosure, the vent holes 121, 131 or the heat dissipation fins 140, 150 of the heat dissipation member 100 are located outside the heat dissipation region 111 and the base plate 300, for example, as shown in fig. 1 to 3, the vent holes 121, 131 and the heat dissipation fins 140, 150 are positioned outside the plate-shaped body 110 and the base plate 300 in a direction perpendicular to the first direction Z, so that the convection of air via the vent holes 121, 131 is not obstructed, and the effective heat exchange area between the heat dissipation member 100 and the air can also be increased.

As an example, a conventional board heat sink and a corresponding PCB have, for example, dimensions of 30mm × 30mm, respectively; with the demand for cost reduction, the size of the PCB is reduced to 18mm × 16mm, for example, but in the case of still using a 30mm × 30mm plate heat sink, the peripheral portion of the plate heat sink cannot provide an effective heat dissipation capability, and there is a phenomenon that the temperature at the heat generating components mounted on the PCB rises and cannot be effectively reduced. However, experiments have shown that with the heat dissipation member provided by the embodiments of the present disclosure, in which the plate-shaped body and the substrate such as the PCB may take a size of 18mm × 16mm, an area saving of 68% is achieved, and the heat dissipation effect may be maintained as good as or better than the case where the plate-shaped heat sink and the corresponding PCB both have a size of 30mm × 30mm, without increasing the weight of the heat sink. Also, although the heat dissipation member provided by the embodiments of the present disclosure slightly increases in manufacturing cost, since the area of a substrate such as a PCB may be significantly reduced while maintaining the same or better heat dissipation effect, the overall cost of an optical module equipped with such a heat dissipation member can be reduced.

In the embodiment as shown in fig. 1 to 3, the heat discharging member 100 has a plate-shaped body 110, and includes a pair of first extensions 120 and a pair of second extensions 130 positioned at the periphery of the plate-shaped body 110, the pair of first extensions 120 extending outward from two opposite side edges of the plate-shaped body 110 in a second direction X perpendicular to the first direction Z or positioned at opposite sides of the plate-shaped body 110, and the pair of second extensions 130 extending outward from the other two opposite side edges of the plate-shaped body 110 in a third direction Y perpendicular to the first direction Z and the second direction X or positioned at the other opposite sides of the plate-shaped body 110. As an example, the plate-shaped body 110 may have a substantially rectangular shape, but the present disclosure is not limited thereto, and may have any suitable shape suitable for mounting or matching the substrate 300.

In some examples, the heat dissipation member may include a plurality of extensions, and adjacent extensions may have a gap therebetween. For example, as shown in fig. 1 to 4, there may be a gap 101 between the first extension portion 120 and the adjacent second extension portion 130, which may further enhance air convection and improve heat dissipation.

Accordingly, the heat discharging member 100 may include at least one first vent hole 121 formed through the first extension 120 in the first direction Z, and/or at least one second vent hole 131 formed through the second extension 130 in the first direction Z. In the illustrated embodiment, two spaced apart first ventilation holes 121 are formed in each first extension 120, and one second ventilation hole 131 is formed in each second extension 130, but the present disclosure is not limited thereto.

As shown in fig. 1 to 3, a dimension of the first extension 120 in the third direction Y may be greater than a dimension of the plate-shaped body 110 in the third direction Y, and a dimension of the second extension 130 in the second direction X may be smaller than the dimension of the plate-shaped body 110 in the second direction X, and each second extension 130 may be positioned between two first extensions 120. However, the disclosure is not limited thereto, and in other embodiments, the respective sizes of the plate-shaped main body 110, the first extending portion 120, and the second extending portion 130 may be reasonably designed according to requirements such as heat dissipation, installation, and the like.

In an exemplary embodiment of the present disclosure, the heat dissipation fins 140, 150 extend from the edges of the corresponding extensions 120, 130 away from the heat dissipation area 111 in a plane different from the surface of the plate-shaped body 110, i.e., in a direction intersecting the surface of the plate-shaped body 110, for example, in a first direction Z perpendicular to the surface of the plate-shaped body 110 or in a direction inclined with respect to the surface of the plate-shaped body 110.

The heat discharging member 100 may include a pair of first heat discharging fins 140 and second heat discharging fins 150, each of the first heat discharging fins 140 extending from an outer edge of the corresponding first extension portion 120, and each of the second heat discharging fins 150 extending from an outer edge of the corresponding second extension portion 130.

In an exemplary embodiment, each of the heat dissipating fins may include a plurality of fin portions, such as at least one pair of fin portions, located at opposite sides of the corresponding extension in the first direction Z, i.e., the heat dissipating member 100 has fin portions at opposite sides of the surface of the plate-shaped body 110 to enhance a heat dissipating effect of the plate-shaped body 110 at the opposite sides in the first direction Z. For example, each of the heat dissipation fins may include at least one pair of fin portions extending from an edge of a corresponding one of the vent holes toward an opposite side of the vent hole in a direction transverse to the plate-surface direction of the plate-shaped body 110.

In some embodiments, the one or more heat dissipation fins may include at least two fin portions or a plurality of pairs of fin portions, and adjacent two of the fin portions may have a gap therebetween to the heat dissipation area to achieve air convection for facilitating heat dissipation. As an example, as shown in fig. 1 to 3, each of the first heat dissipating fins 140 includes two pairs of fin portions 141, 142, and each of the second heat dissipating fins 150 includes a pair of fin portions 151, 152. As shown, each pair of fin portions may form a "zig-zag" profile. Between the two fin portions 142 of the first heat dissipation fin 140, there is a gap 143, which is open to the heat dissipation region 111 to allow air convection between the heat dissipation region 111 and a region outside the heat dissipation member to further enhance the heat dissipation effect.

In the illustrated embodiment, one fin portion of each pair of fin portions of the heat dissipation fin extends from an edge of a corresponding one of the vent holes, and has the same shape as and a size smaller than that of the vent hole. For example, the fin portions 142, 152 extend from the edges of the corresponding ventilation holes 121, 131, respectively, away from the heat dissipation area 111.

In some examples, the heat dissipation member 100 may be made of a heat dissipation material such as metal. For example, the heat dissipation member 100 may be an integral member formed by punching and bending a metal plate. As an example, as shown in fig. 4, the metal plate 1 is first stamped to form a plurality of gaps 101 and a plurality of slots 102, 103, such as U-shaped slots, in the metal plate 1 around a central portion, and then an edge portion of the metal plate 1 is bent along a dotted line shown in fig. 4, such as in a direction inward or outward from the paper, to form the heat dissipation member 100, wherein the central portion of the metal plate 1 forms the plate-shaped body 110 of the heat dissipation member 100, and the edge portion forms the heat dissipation fins, and the holes (including the slots 102, 103) left after bending the edge portion form the ventilation holes 121, 131, so that the heat dissipation member having a significantly improved heat dissipation effect can be provided in a simple manufacturing process.

In some embodiments of the present disclosure, the heat generating element 200 of the electronic module 10 includes a light source, such as an LED. The electronic module provided may, for example, comprise or be used in various light fixtures, in particular in various types of motor vehicle lights and/or signaling lights, such as headlights, center high-mount stop lights, turn signals, position lights, tail stop lights, etc.

Embodiments of the present disclosure also provide a motor vehicle including a heat dissipation member or an electronic module as described in any of the above embodiments.

Although the present disclosure has been described in connection with the accompanying drawings, the embodiments disclosed in the drawings are intended to be illustrative of preferred embodiments of the disclosure, and should not be construed as limiting the disclosure. The dimensional proportions in the drawings are merely illustrative and are not to be construed as limiting the disclosure.

Although a few embodiments of the present general inventive concept have been shown and described, it would be appreciated by those skilled in the art that changes may be made in these embodiments without departing from the principles and spirit of the general inventive concept, the scope of which is defined in the claims and their equivalents.

Claims (18)

1. A heat dissipating member (100) for an electronic module (10), characterized in that it comprises:

a plate-shaped main body (110) having one surface defined with a heat dissipation area (111) in which a substrate (300) carrying a heat-generating element (200) of the electronic module is adapted to be mounted to dissipate heat generated by the heat-generating element by the heat dissipation member;

at least one extension, each extension extending outward from an edge of the plate-shaped body, in which at least one vent hole (121, 131) penetrating the extension in a first direction (Z) is formed; and

at least one heat sink fin, each heat sink fin extending from a corresponding extension.

2. The heat dissipating member according to claim 1,

the extending portion extends outward from an edge of the plate-shaped body (110) substantially in a plate surface direction of the plate-shaped body (110), and the first direction is transverse to the plate surface direction of the plate-shaped body (110).

3. The heat dissipating member according to claim 2, wherein the first direction coincides with a direction of gravity in the mounting position of the heat dissipating member.

4. The heat dissipation member as claimed in claim 2, wherein each of the heat dissipation fins extends from an edge of the corresponding extension in a direction transverse to a plate-face direction of the plate-like body (110).

5. The heat dissipation member as recited in claim 4, wherein each of the heat dissipation fins includes at least one pair of fin portions extending from an edge of a corresponding one of the vent holes toward an opposite side of the vent hole in a direction transverse to a plate-face direction of the plate-like body (110).

6. The fin member of claim 5, wherein each pair of fin portions forms a "zig-zag" profile.

7. The heat discharging member as claimed in claim 6, wherein one fin portion of each pair of fin portions has the same shape as that of the corresponding vent hole and a size smaller than that of the vent hole.

8. The heat dissipating member of claim 6, wherein one or more of the at least one heat dissipating fin comprises a plurality of pairs of said fin portions with a gap (143) between adjacent pairs of said fin portions that opens into the heat dissipating area.

9. The heat dissipating member according to any one of claims 1 to 8, wherein the heat dissipating member comprises a plurality of the extensions, with a gap (101) between adjacent extensions.

10. The heat dissipating member of claim 9, wherein the plurality of extensions comprises:

a pair of first extensions (120) positioned on opposite sides of the plate-shaped body in a second direction (X) perpendicular to the first direction; and

a pair of second extending portions (130) positioned at other opposite sides of the plate-shaped body in a third direction (Y) perpendicular to the first and second directions.

11. The radiant member according to claim 10, characterized in that each first extension has a dimension in the third direction (Y) greater than the dimension of the plate-like body in the third direction (Y).

12. The heat dissipating member of claim 10, wherein the at least one heat dissipating fin comprises:

a pair of first heat dissipation fins (140) extending from the pair of first extensions; and

a pair of second heat dissipating fins (150) extending from the pair of second extensions.

13. The heat dissipating member according to any one of claims 1 to 8 and 10 to 12, wherein the heat dissipating member is an integral member stamped and bent from a metal plate.

14. The heat dissipating member of any of claims 1-8, 10-12, wherein the size of the heat dissipating area is greater than or equal to the size of the substrate.

15. An electronic module comprising a substrate (300) and a heat generating component (200) mounted on the substrate, characterized in that the electronic module further comprises a heat dissipating member according to any one of claims 1 to 14, the substrate mounted with the heat generating component being attached within a heat dissipating area of the heat dissipating member.

16. The electronic module of claim 15, wherein the heat generating component comprises a light source.

17. The electronic module of claim 15, wherein the electronic module comprises a lamp for a motor vehicle.

18. A motor vehicle, characterized in that it comprises a radiator element according to any one of claims 1 to 14, or an electronic module according to any one of claims 15 to 17.

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