CN218675936U

CN218675936U - Computer hardware heat sink

Info

Publication number: CN218675936U
Application number: CN202222960508.9U
Authority: CN
Inventors: 白星復; 宫海涛
Original assignee: Shenyang Rongxin Technology Co ltd
Current assignee: Shenyang Rongxin Technology Co ltd
Priority date: 2022-11-08
Filing date: 2022-11-08
Publication date: 2023-03-21
Anticipated expiration: 2032-11-08

Abstract

The utility model discloses a computer hardware heat sink, including box, first fan, second fan, semiconductor refrigeration piece and heat conduction silicone grease, the tip hinge connection of box upper end has the apron, and the lower extreme outer wall fixed mounting of apron has the base to the box lower extreme inner wall fixedly connected with net support of apron avris, the box is kept away from the tip inner wall of apron and is installed first fan, and the box tip outer wall of first fan avris is provided with filter mechanism to the box upper end inner wall swing joint of first fan avris has an installation section of thick bamboo, the fixed second fan that is provided with of upper end inner wall of an installation section of thick bamboo, and the surface symmetry of installation section of thick bamboo lower extreme has seted up the ventilation hole to the installation section of thick bamboo inner wall fixedly connected with locating rack of ventilation hole avris. This computer hardware heat sink has promoted the radiating effect, avoids the phenomenon production of high temperature damage computer, and the convenient dismantlement of heat sink is maintained simultaneously, is favorable to the stable use of guarantee device.

Description

Computer hardware heat sink

Technical Field

The utility model relates to a heat sink technical field specifically is a computer hardware heat sink.

Background

Computers are common electronic equipment, are closely related to the production life of people, can be divided into super computers, industrial control computers, personal computers and the like, are composed of a plurality of hardware, can generate heat when working, and can influence the service life of the computers if the hardware of the computers is not cooled and radiated in time.

However, although a computer hardware cooling device with publication number CN212181397U and publication number 20201218 can cool computer hardware, it only uses air flow to dissipate heat, which is not enough in heat dissipation effect, and is easy to cause high temperature damage to computer.

Aiming at the problems, innovative design is urgently needed on the basis of the original computer hardware cooling device.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a computer hardware heat sink to it is not enough to solve the radiating effect that above-mentioned background art provided current computer hardware heat sink, easily leads to the phenomenon of high temperature damage computer to produce, and the inconvenient dismantlement of heat sink is maintained simultaneously, easily influences device stability in use's problem.

In order to achieve the above object, the utility model provides a following technical scheme: the utility model provides a computer hardware heat sink, includes box, first fan, second fan, semiconductor refrigeration piece and heat conduction silicone grease, the tip hinge connection of box upper end has the apron, and the lower extreme outer wall fixed mounting of apron has the base to the box lower extreme inner wall fixedly connected with net support of apron avris, the box is kept away from the tip inner wall of apron and is installed first fan, and the box tip outer wall of first fan avris is provided with filter mechanism to the box upper end inner wall swing joint of first fan avris has an installation section of thick bamboo, the upper end inner wall of an installation section of thick bamboo is fixed and is provided with the second fan, and the surface symmetry of installation section of thick bamboo lower extreme has seted up the ventilation hole to the installation section of thick bamboo inner wall fixedly connected with locating rack of ventilation hole avris, the lower surface swing joint of locating rack has the semiconductor refrigeration piece moreover, and semiconductor refrigeration piece lower surface is connected through heat conduction silicone grease and heat dissipation fin simultaneously.

Preferably, the inner wall of the base is movably provided with a pull rod, the outer wall of the lower end of the pull rod is fixedly provided with a baffle, and the baffle is connected with the base through a spring.

Preferably, the pull rod, the box body and the base form a sliding structure, and the shape of the right cross section of the pull rod is L-shaped.

Preferably, the filtering mechanism comprises a filtering cover and a dust filtering net, the filtering cover is in threaded connection with the outer wall of the end part of the box body on the side of the first fan, and the inner wall of the end part of the filtering cover is fixedly connected with the dust filtering net.

Preferably, the mounting cylinder is in threaded connection with the box body, and the mounting cylinder and the heat dissipation fins are in threaded arrangement.

Preferably, the shape of the positioning frame in plan view is a cross shape, and the positioning frame is attached to the semiconductor refrigeration sheet.

Compared with the prior art, the beneficial effects of the utility model are that: the computer hardware cooling device improves the heat dissipation effect, avoids the phenomenon that a computer is damaged by high temperature, is convenient to disassemble and maintain, and is favorable for ensuring the stable use of the device;

1. the air in the box body is refrigerated through the semiconductor refrigerating pieces and the radiating fins, and then the low-temperature air is blown by the first fan to flow to the computer, so that the radiating effect of the device is improved, and the phenomenon that the computer is damaged by high temperature is avoided;

2. through the rotation of straining the lid for filter mechanism disengaging device, the rotation of rethread installation section of thick bamboo makes installation section of thick bamboo disengaging device, and rotatory heat dissipation fin of dismantling afterwards makes device convenient to detach maintain, is favorable to guaranteeing the stable use of device.

Drawings

FIG. 1 is a schematic view of the front cut structure of the present invention;

FIG. 2 is a schematic side sectional view of the present invention;

FIG. 3 is an enlarged schematic view of the structure at A of FIG. 1 according to the present invention;

FIG. 4 is an enlarged schematic view of the structure of the utility model at B in FIG. 1;

FIG. 5 is a schematic view of a front cross-section structure of the installation cylinder of the present invention;

FIG. 6 is a schematic top view of the positioning frame of the present invention;

fig. 7 is a schematic view of the bottom view of the heat dissipating fins of the present invention.

In the figure: 1. a box body; 2. a cover plate; 3. a base; 4. a pull rod; 5. a baffle plate; 6. a grid support; 7. a first fan; 8. a filtering mechanism; 801. a filter cover; 802. a dust filter screen; 9. mounting the cylinder; 10. a second fan; 11. a vent hole; 12. a positioning frame; 13. a semiconductor refrigerating sheet; 14. heat-conducting silicone grease; 15. and a heat dissipation fin.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts all belong to the protection scope of the present invention.

Referring to fig. 1-7, the present invention provides a technical solution: the utility model provides a computer hardware heat sink, which comprises a box body 1, apron 2, base 3, pull rod 4, baffle 5, net support 6, first fan 7, filter mechanism 8, filter lid 801, filter dust net 802, an installation section of thick bamboo 9, second fan 10, ventilation hole 11, locating rack 12, semiconductor refrigeration piece 13, heat conduction silicone grease 14 and heat dissipation fin 15, the tip hinge connection of box 1 upper end has apron 2, and the lower extreme outer wall fixed mounting of apron 2 has

base

3, and 1 lower extreme inner wall fixedly connected with net support 6 of box of 2 avris of apron, box 1 keeps away from the tip inner wall of apron 2 and installs

first fan

7, and 1 tip outer wall of box of first fan 7 avris is provided with

filter mechanism

8, and 1 upper end inner wall swing joint of box of first fan 7 avris has an installation section of thick bamboo 9, the upper end inner wall fixed second fan 10 that is provided with of installation section of thick bamboo 9, and the ventilation hole 11 has been seted up to the surface symmetry of installation section of thick bamboo 9 lower extreme, and the installation section of thick bamboo 9 inner wall fixedly connected with locating rack 12 of ventilation hole 11 avris, and the lower surface swing joint of locating rack 12 has semiconductor piece 13, simultaneously refrigeration piece 13 and heat dissipation fin 15 are connected through refrigeration piece.

The inner wall movable mounting of base 3 has pull rod 4, and the lower extreme outer wall fixed mounting of pull rod 4 has baffle 5 to baffle 5 is connected through spring and base 3, and the spring of being convenient for promotes baffle 5, makes pull rod 4 stably insert in box 1, carries on spacingly to apron 2.

The pull rod 4 forms a sliding structure with the box body 1 and the base 3 respectively, and the shape of the right cross section of the pull rod 4 is set to be L-shaped, so that a user can pull the pull rod 4 to slide relative to the box body 1 and the base 3 conveniently, and the pull rod 4 can move stably and is connected with or separated from the box body 1.

The filter mechanism 8 comprises a filter cover 801 and a dust filter net 802, the filter cover 801 is in threaded connection with the outer wall of the end part of the box body 1 on the side of the first fan 7, the dust filter net 802 is fixedly connected with the inner wall of the end part of the filter cover 801, dust entering the box body 1 is convenient to reduce through the filter mechanism 8, the filter cover 801 is convenient to rotate to separate from the box body 1, and the filter mechanism 8 is detached and cleaned.

Installation section of thick bamboo 9 and box 1 threaded connection, and installation section of thick bamboo 9 and heat dissipation fin 15 are the screw thread setting, and the rotatory installation section of thick bamboo 9 of being convenient for breaks away from box 1, carries out the dismantlement of installation section of thick bamboo 9 to and convenient rotatory heat dissipation fin 15 of dismantling, carry out the maintenance of device.

The overlooking shape of the positioning frame 12 is set to be in a cross shape, the positioning frame 12 is attached to the semiconductor refrigerating sheet 13, the semiconductor refrigerating sheet 13 is limited through the positioning frame 12, and the semiconductor refrigerating sheet 13 is convenient to dissipate heat.

The working principle is as follows: when the computer hardware cooling device is used, firstly as shown in fig. 1 and 3, a mobile computer case is placed on a grid support 6, then a pull rod 4 is pulled to drive a baffle 5 to compress a spring, then a cover plate 2 is rotated to close, then the pull rod 4 is loosened, then the spring resets to push the baffle 5 to drive the pull rod 4 to move in a base 3 and be inserted into a case 1 as shown in fig. 1-2 and 5-7, then a first fan 7, a second fan 10 and a semiconductor refrigeration sheet 13 are started, at this time, the semiconductor refrigeration sheet 13 reduces the air temperature in the case 1 through a heat conduction silicone grease 14 and a heat dissipation fin 15, the second fan 10 discharges hot air in a mounting cylinder 9, the semiconductor refrigeration sheet 13 dissipates heat, and a vent hole 11 ensures that the air in the mounting cylinder 9 flows sufficiently, as shown in fig. 1-2 and 4-5, then the first fan 7 blows cold air to flow through the case on the grid support 6, so that the case is sufficiently cooled, the grid support 6 is tightly attached to prevent the case from affecting the bottom heat dissipation of the case, and at the same time, the first fan 7 blows the air to filter 802 to reduce the damage of the air inside the computer, and further avoid the high-temperature accumulation of the computer;

as shown in fig. 1-2 and fig. 4-6, when the maintenance device needs to be disassembled, the first fan 7, the second fan 10 and the semiconductor refrigeration sheet 13 are closed, then the filter cover 801 is rotated to be separated from the box body 1, so that the dust filter net 802 is disassembled, then the mounting cylinder 9 is rotated to be separated from the box body 1, then the heat dissipation fin 15 is rotated to be separated from the mounting cylinder 9, and then the semiconductor refrigeration sheet 13 in the mounting cylinder 9 is poured out, so that the disassembly of the device is completed, the maintenance of the device is facilitated, and the stable use of the device is guaranteed.

Although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications may be made to the embodiments or portions thereof without departing from the spirit and scope of the invention.

Claims

1. The utility model provides a computer hardware heat sink, includes box (1), first fan (7), second fan (10), semiconductor refrigeration piece (13) and heat conduction silicone grease (14), its characterized in that: the utility model discloses a semiconductor refrigeration device, including box (1), fan (7), and box (1) lower extreme inner wall swing joint have an installation section of thick bamboo (9), the tip hinge connection of box (1) upper end has apron (2), and the lower extreme outer wall fixed mounting of apron (2) has base (3), and box (1) lower extreme inner wall fixedly connected with net support (6) of apron (2) avris, box (1) keeps away from the tip inner wall of apron (2) and installs first fan (7), and box (1) tip outer wall of first fan (7) avris is provided with filter mechanism (8), and box (1) upper end inner wall swing joint of first fan (7) avris has an installation section of thick bamboo (9), the upper end inner wall of installation section of thick bamboo (9) is fixed and is provided with second fan (10), and ventilation hole (11) have been seted up to the surface symmetry of installation section of thick bamboo (9) lower extreme, and the installation section of thick bamboo (9) inner wall fixedly connected with locating rack (12), and the lower surface swing joint of locating rack (12) has semiconductor refrigeration piece (13), and semiconductor refrigeration piece (13) lower surface is connected with heat dissipation fin (15) through heat conduction silicone grease (14) through semiconductor refrigeration piece (13) simultaneously.

2. The computer hardware cooling device of claim 1, wherein: the inner wall movable mounting of base (3) has pull rod (4), and the lower extreme outer wall fixed mounting of pull rod (4) has baffle (5) to baffle (5) are connected through spring and base (3).

3. The computer hardware cooling device of claim 2, wherein: the pull rod (4) forms a sliding structure with the box body (1) and the base (3) respectively, and the shape of the right section of the pull rod (4) is L-shaped.

4. The computer hardware cooling device of claim 1, wherein: the filtering mechanism (8) comprises a filtering cover (801) and a dust filtering net (802), the filtering cover (801) is in threaded connection with the outer wall of the end part of the box body (1) at the side of the first fan (7), and the inner wall of the end part of the filtering cover (801) is fixedly connected with the dust filtering net (802).

5. The computer hardware cooling device of claim 1, wherein: the mounting cylinder (9) is in threaded connection with the box body (1), and the mounting cylinder (9) and the heat dissipation fins (15) are arranged in a threaded mode.

6. The computer hardware cooling device of claim 1, wherein: the overlooking shape of the positioning frame (12) is arranged to be a cross shape, and the positioning frame (12) is attached to the semiconductor refrigerating sheet (13).