CN218647895U

CN218647895U - Wafer cleaning device

Info

Publication number: CN218647895U
Application number: CN202223286706.8U
Authority: CN
Inventors: 张跃锋
Original assignee: Shanghai Peimagnesium Electromechanical Technology Co ltd
Current assignee: Shanghai Peimagnesium Electromechanical Technology Co ltd
Priority date: 2022-12-07
Filing date: 2022-12-07
Publication date: 2023-03-17
Anticipated expiration: 2032-12-07

Abstract

The utility model discloses a wafer cleaning device, including drive wafer pivoted drive wheel subassembly, set up in the washing device of wafer both sides, set up in the washing liquid spray set of wafer top, along with wafer pivoted idler subassembly, with the synchronous pivoted of idler subassembly detect the wheel, be used for the test detect the speedtransmitter and the gyro wheel carrier of wheel rotational speed, the drive wheel subassembly idler subassembly and detect the wheel set up in on the gyro wheel carrier. The utility model discloses a rotational speed of speed sensor monitoring detection wheel when the unstable condition of rotational speed appears in the drive wheel subassembly to feed back control system and warning with it, thereby effectual control and stable wafer rotational speed guarantee to spray that the chemical on wafer surface is even, guarantee that the wafer surface is interior to be carved and admirable the volume unanimously, guarantee the roughness on wafer surface, thereby ensured the yields of wafer.

Description

Wafer cleaning device

Technical Field

The utility model belongs to the technical field of the semiconductor cleaning, specifically belong to a wafer belt cleaning device.

Background

The wafer refers to a silicon wafer used for manufacturing a silicon semiconductor integrated circuit, and is called a wafer because the shape of the wafer is circular, and in the process of grinding and producing the wafer, pollutants such as grinding fluid, dust particles, organic matters, inorganic matters, metal ions and other impurities are left on the surface of the wafer, so that the product yield of the wafer is influenced by the impurities, and the pollutants on the surface of the wafer are required to be removed by a chemical cleaning method; and chemical cleaning refers to a method of removing impurities attached to the surface of an object using various chemical agents and organic solvents.

In the prior art, a chemical cleaning method is to refresh a rotating wafer by using a brush and spray chemical agents, but if the rotating speed of the wafer is unstable, the chemical agents sprayed on the surface of the wafer are not uniform, so that the erosion amount in the surface of the wafer is inconsistent, the surface defect of the wafer is caused, and the qualification rate of the wafer is influenced.

SUMMERY OF THE UTILITY MODEL

In view of this, the utility model aims at overcoming the not enough among the prior art, provide a wafer cleaning device, this application provides following technical scheme:

a wafer cleaning device comprises a driving wheel assembly for driving a wafer to rotate, a washing device arranged on two sides of the wafer, a cleaning liquid spraying device arranged above the wafer, an idler wheel assembly rotating along with the wafer, a detection wheel synchronously rotating with the idler wheel assembly, a speed sensor for testing the rotating speed of the detection wheel and a roller carrier, wherein the driving wheel assembly, the idler wheel assembly and the detection wheel are arranged on the roller carrier.

In one possible embodiment, the driving wheel assembly includes a driving wheel, a rotating shaft and a driving motor, the driving wheel and the driving motor are respectively disposed on two sides of the carrier, the driving wheel and the driving motor are connected through the rotating shaft, and the wafer is disposed on the driving wheel.

In one possible embodiment, the brushing device comprises a roller and bristles arranged on said roller.

In one possible embodiment, the cleaning spray device comprises two spray pipes and spray nozzles arranged on the spray pipes, and the two spray pipes are respectively positioned on two sides of the wafer.

In a possible embodiment, the idler wheel assembly and the detection wheel are respectively arranged on two sides of the carrier, and the idler wheel assembly and the detection wheel are connected through a rolling shaft.

In one possible embodiment, the wafer is disposed on the idler assembly.

In one possible embodiment, a control system is further included, the control system driving the wheel assembly and the speed sensor connection, respectively.

In one possible embodiment, the drive wheel assembly and the idler wheel assembly are both disposed on the same side of the carrier by screws.

To sum up, owing to adopted above-mentioned technical scheme, the beneficial effects of the utility model are that:

the utility model discloses belt cleaning device to the wafer improves, rotary device has been optimized, rotary detection device has been increased, it rotates to drive the wafer through the drive wheel subassembly, spray chemical agent to the wafer surface through washing liquid spray set, and scrub the both sides face of wafer through the brushing device, can drive the idler subassembly when the wafer pivoted and rotate, the idler subassembly rotates can synchronous detection wheel and rotates, the rotational speed through speed sensor monitoring detection wheel, when the unstable condition of rotational speed appears in the drive wheel subassembly, and feed back to control system and report to the police with it, thereby effectual control stabilizes the wafer rotational speed, it is even to guarantee to spray the chemical agent on wafer surface, guarantee that the wafer is surperficial the etching volume unanimous, guarantee the roughness on wafer surface, thereby the yields of wafer has been ensured.

In order to make the aforementioned objects, features and advantages of the present application more apparent and understandable, preferred embodiments are described below in detail with reference to the accompanying drawings.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings that are required to be used in the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present invention, and therefore should not be considered as limiting the scope, and for those skilled in the art, other related drawings can be obtained according to the drawings without inventive efforts.

Fig. 1 is a schematic side view of the angle structure of the present invention.

Fig. 2 is a schematic perspective view of the present invention.

Fig. 3 is a schematic structural diagram of the roller carrier of the present invention.

Reference numerals: 1-a drive wheel assembly; 2-a washing and brushing device; 3-cleaning liquid spraying device; 4-an idler assembly; 5-detection wheel; 6-a speed sensor; 7-roller carrier; 8-wafer.

Detailed Description

Reference will now be made in detail to embodiments of the present application, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the accompanying drawings are illustrative and are only for the purpose of explaining the present application and are not to be construed as limiting the present application.

In this application, unless expressly stated or limited otherwise, the terms "mounted," "connected," "secured," and the like are to be construed broadly and can include, for example, fixed connections, removable connections, or integral parts; can be mechanically or electrically connected; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art as appropriate.

In this application, unless expressly stated or limited otherwise, the first feature "on" or "under" the second feature may be directly contacting the first and second features or indirectly contacting the first and second features through intervening media. Also, a first feature "on," "above," and "over" a second feature may be directly on or obliquely above the second feature, or simply mean that the first feature is at a higher level than the second feature. A first feature "under," "beneath," and "under" a second feature may be directly under or obliquely under the second feature, or may simply mean that the first feature is at a lesser elevation than the second feature.

Example one

Referring to fig. 1-3, a wafer 8 cleaning apparatus provided in this embodiment includes a driving wheel assembly 1 for driving a wafer 8 to rotate, a washing device 2 disposed on two sides of the wafer 8, a cleaning solution spraying device 3 disposed above the wafer 8, an idler wheel assembly 4 rotating with the wafer 8, a detection wheel 5 rotating synchronously with the idler wheel assembly 4, a speed sensor 6 for testing a rotation speed of the detection wheel 5, and a roller carrier 7, where the driving wheel assembly 1, the idler wheel assembly 4, and the detection wheel 5 are disposed on the roller carrier 7; the driving wheel assembly 1 comprises a driving wheel, a rotating shaft and a driving motor, the driving wheel and the driving motor are respectively arranged on two sides of the carrier and are connected through the rotating shaft, and the wafer 8 is arranged on the driving wheel; the device also comprises a control system, wherein the control system is respectively connected with the driving wheel assembly 1 and the speed sensor 6; the wafer 8 is arranged on the idle wheel assembly 4; the driving wheel assembly 1 and the idle wheel assembly 4 are arranged on the same side of a carrier through screws, the idle wheel assembly 4 and the detection wheel 5 are respectively arranged on two sides of the carrier, and the idle wheel assembly 4 and the detection wheel 5 are connected through rolling shafts.

When specifically implementing, the utility model discloses a wafer 8 belt cleaning device includes gyro wheel carrier 7, be the cuboid, gyro wheel carrier 7 is provided with drive wheel subassembly 1 and idler subassembly 4 with the side, wherein drive wheel subassembly 1 is by the action wheel, pivot and driving motor constitute, be provided with three action wheel and an idler subassembly 4 in this embodiment one altogether, three action wheel is the triangle and places the same side through the fix with screw at the carrier, two liang through belt interconnect and rotate simultaneously, idler subassembly 4 installs between two action wheels, install in the picture between two action wheels that lean on the right side, and idler subassembly 4 also passes through the side of fix with screw at the carrier, the another side of carrier has set up driving motor and detection wheel 5, wherein driving motor is connected with an action wheel through the pivot, it rotates with idler subassembly 4 through the roll axis to detect wheel 5, it rotates to drive the action wheel when driving motor rotates, the action wheel rotates the action wheel and drives wafer 8 rotation, wafer 8 rotates and drives idler subassembly 4 and rotates, idler subassembly 4 transmits the rotational speed for detecting wheel 5 with the rotational speed, consequently, the rotational speed that monitors detection wheel 5 through speed sensor 6, thereby the rotational speed of wafer is washhed to the washing liquid, it washes the wafer 8 to rinse the wafer, the wafer both sides of wafer 2, the wafer cleaning solution is carried out the wafer and is the wafer 2 both sides that the wafer top is carried out the wafer cleaning solution and is carried out the wafer and is the wafer cleaning solution and is carried out the wafer 2.

Use the utility model discloses the time, need set for the normal rotational speed of action wheel to set up speedtransmitter 6's alarm range, 1 rotational speed of drive wheel subassembly is unstable (if the action wheel belt appears skidding, fracture etc.), when leading to the reduction of 8 rotational speeds of wafer or not changeing, idler subassembly 4 transmits the rotation of wafer 8 for detection wheel 5, and speedtransmitter 6 detects the back and feeds back to control system, produces abnormal signal, sends unusual feedback and reports to the police.

Therefore the utility model discloses belt cleaning device to wafer 8 improves, rotary device has been optimized, rotary detection device has been increased, drive wafer 8 through drive wheel subassembly 1 and rotate, spray chemical agent to the 8 surfaces of wafer through washing liquid spray set 3, and scrub device 2 both sides face to wafer 8 through washing, can drive idler subassembly 4 when wafer 8 pivoted and rotate, idler subassembly 4 rotates and can rotate with synchronous detection wheel 5, rotational speed through speed sensor 6 monitoring detection wheel 5, when the unstable condition of rotational speed appears in drive wheel subassembly 1, and give control system and warning with its feedback, thereby effectual control stabilizes the 8 rotational speeds of wafer, it is even to guarantee to spray the chemical agent on wafer 8 surfaces, guarantee that the etching volume is unanimous in the 8 surfaces of wafer, guarantee the roughness on 8 surfaces of wafer, thereby wafer 8's yields has been ensured.

In an alternative of the first embodiment, the brushing device 2 includes a roller and bristles arranged on the roller, the cleaning and spraying device includes two spraying pipes and nozzles arranged on the spraying pipes, and the two spraying pipes are respectively located on two sides of the wafer 8.

All set up a roller bearing in wafer 8's both sides in this scheme, the roller bearing passes through motor drive slow rotation, the equipartition brush hair on the roller bearing, it is tight through roller bearing and brush hair when wafer 8 scrubs, simultaneously wafer 8 self also is rotatory through drive wheel subassembly 1, wafer 8 can anticlockwise rotation in this embodiment, be located left gyro wheel clockwise rotation, the gyro wheel anticlockwise rotation that is located the right side, wafer 8's top is provided with two washing liquid spray set 3 simultaneously, washing liquid spray set 3 includes the shower and sets up a plurality of nozzles on the shower, spray chemical respectively to wafer 8's both sides face, through setting up the same volume of spraying, set up the same roller bearing rotational speed, ensure that the cleaning brush state that wafer 8 openly and the back is the same, thereby ensure the roughness and the product yield of wafer 8 both sides face.

Although embodiments of the present application have been shown and described above, it is understood that the above embodiments are exemplary and should not be construed as limiting the present application, and that variations, modifications, substitutions and alterations may be made to the above embodiments by those of ordinary skill in the art within the scope of the present application.

Claims

1. A wafer cleaning device is characterized in that: including being used for driving wafer (8) pivoted drive wheel subassembly (1), set up in washing and brushing device (2) of wafer (8) both sides, set up in washing liquid spray set (3) of wafer (8) top, along with wafer (8) pivoted idler subassembly (4), with idler subassembly (4) synchronous rotation detect wheel (5), be used for the test detect speedtransmitter (6) and gyro wheel carrier (7) of wheel (5) rotational speed, drive wheel subassembly (1) idler subassembly (4) and detect wheel (5) set up in on gyro wheel carrier (7).

2. The wafer cleaning apparatus according to claim 1, wherein: the driving wheel assembly (1) comprises a driving wheel, a rotating shaft and a driving motor, the two sides of the carrier are respectively provided with the driving wheel and the driving motor, the driving wheel and the driving motor are connected through the rotating shaft, and the wafer (8) is arranged on the driving wheel.

3. The wafer cleaning apparatus according to claim 1, wherein: the brushing device (2) comprises a rolling shaft and brush hair arranged on the rolling shaft.

4. The wafer cleaning apparatus according to claim 1, wherein: the cleaning liquid spraying device (3) comprises two spraying pipes and nozzles arranged on the spraying pipes, and the two spraying pipes are respectively positioned on two sides of the wafer (8).

5. The wafer cleaning apparatus according to claim 1, wherein: the two sides of the carrier are respectively provided with the idle wheel assembly (4) and the detection wheel (5), and the idle wheel assembly (4) is connected with the detection wheel (5) through a rolling shaft.

6. The wafer cleaning apparatus according to claim 1, wherein: the wafer (8) is arranged on the idler wheel assembly (4).

7. The wafer cleaning apparatus according to claim 1, wherein: the device is characterized by further comprising a control system, wherein the control system is respectively connected with the driving wheel assembly (1) and the speed sensor (6).

8. The wafer cleaning apparatus according to claim 1, wherein: the driving wheel assembly (1) and the idle wheel assembly (4) are arranged on the same side of the roller carrier (7) through screws.