CN218647883U - Ball grid array ball planting machine - Google Patents
Ball grid array ball planting machine Download PDFInfo
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- CN218647883U CN218647883U CN202222503454.3U CN202222503454U CN218647883U CN 218647883 U CN218647883 U CN 218647883U CN 202222503454 U CN202222503454 U CN 202222503454U CN 218647883 U CN218647883 U CN 218647883U
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Abstract
The application provides a ball grid array ball planting machine, include workstation, moving mechanism and locate spraying mechanism, ball planting mechanism, optical detection mechanism, the ball of mending on the workstation removes ball mechanism and heating mechanism. The ball grid array ball planting machine can use a single substrate mode to carry out ball planting processing, can avoid the influence of the size expansion and shrinkage of the substrate, and is also beneficial to the micro-shrinkage of products. The ball grid array ball planting machine integrates an optical detection mechanism, a ball supplementing and removing mechanism, a heating mechanism and the like, has a single reflow function and a detection function, does not need to change a clamping jig according to design, can also carry out repair operation in real time, and meets the requirement of a single line body for completing a complete work station. The ball grid array ball planting machine has the advantages that the size is reduced, more functions can be integrated, and the ball grid array ball planting machine is beneficial to optimizing the manufacturing process and reducing the use of jigs.
Description
Technical Field
The application relates to semiconductor production equipment, in particular to a ball grid array ball planting machine.
Background
The Ball Grid Array (BGA) Ball mounting method is commonly used: manufacturing a printing screen plate (steel mesh) according to a drawing of a substrate (circuit board), then covering the corresponding steel mesh on the substrate, leaking the solder balls with the corresponding specifications on a bonding pad of the BGA substrate, connecting the solder balls with the bonding pad in an integral backflow mode, and completing ball planting operation.
With the development of electronic products toward miniaturization, the input/output (I/O) pad density of an integrated circuit package is increasing, and the pad pitch is decreasing, so that poor ball mounting occurs when the mesh and the pad are offset slightly. In addition, as the substrate is made thinner, it is seriously swelled and shrunk during the packaging process. When a region of the substrate is aligned correctly, if the expansion and contraction size of the substrate is accumulated to exceed the region of the bonding pad size 1/4, the ball mounting can not be carried out.
The prior ball planting method usually adopts a sheet substrate or strip mode for production, and a plurality of balls can be produced at one time. Although the productivity is large, the problems of inaccurate alignment and low ball-planting yield caused by the expansion and contraction of the substrate cannot be improved, and the problem of ball falling with a certain probability is caused by excessive ball-planting numbers of single chips. In addition, the ball-planting process generally uses sticky resin type soldering flux, and after reflow soldering, a liquid medicine is needed to wash away the residual soldering flux. In addition, the area of the steel mesh cannot be reduced, and although the openings of the steel mesh can be generally reduced, the pitch of the openings cannot be reduced to less than 75 μm due to the influence of tensile tension and the like.
SUMMERY OF THE UTILITY MODEL
In view of the above, the present application provides a ball grid array ball mounting machine to solve at least one of the above problems.
An embodiment of the application provides a ball grid array ball planting machine, includes workstation, moving mechanism and locates spraying mechanism, ball planting mechanism, optical detection mechanism, benefit ball on the workstation remove ball mechanism and heating mechanism. The moving mechanism comprises a track and a movable element connected with the track in a sliding mode, a telescopic rod is arranged on the movable element, and a suction nozzle is arranged at the end portion of the telescopic rod. The moving mechanism is used for moving the substrate among the spraying mechanism, the ball planting mechanism, the optical detection mechanism, the ball supplementing and removing mechanism and the heating mechanism. The spraying mechanism is used for spraying soldering flux on a substrate to be subjected to ball planting, the ball planting mechanism is used for arranging solder balls on the substrate sprayed with the soldering flux, and the heating mechanism is used for heating the solder balls to melt the solder balls.
In one embodiment, the ball planting mechanism comprises a ball planting seat fixed on the workbench and a ball planting head connected with the ball planting seat, and an opening is formed in the bottom of the ball planting head.
In one embodiment, the ball-planting seat is provided with a ball storage groove for storing and placing solder balls, and the ball storage groove is communicated with the ball-planting head.
In one embodiment, the bottom of the ball planting head is further provided with a sweeping and scraping part.
In one embodiment, the spraying mechanism comprises a spraying base fixed on the workbench and a nozzle connected with the spraying base.
In one embodiment, the optical detection mechanism includes a lens mount fixed on the worktable and a lens connected to the lens mount, and the lens is used for taking a picture of the substrate and the solder ball.
In one embodiment, the heating mechanism includes a heating base fixed on the worktable and a heating source connected to the heating base.
In one embodiment, the ball supplementing and removing mechanism comprises a fixed seat fixed on the workbench, and a ball removing head, a ball supplementing head and an adding head which are connected with the fixed seat.
In one embodiment, the ball grid array ball mounting machine further comprises a driving mechanism for driving the movable element to slide in the track.
In one embodiment, the drive mechanism comprises a motor.
The ball grid array ball planting machine can use a single substrate mode (namely, the full-size substrate is cut into a single substrate, the unilateral length of the full-size substrate can be 100-500 mm, and the unilateral length of the single substrate can be 10-50 mm) to carry out ball planting process, and can avoid the influence of the expansion and contraction of the size of the substrate. The single-grain mode production can reduce the volume of the steel mesh (the opening distance is smaller and less than 75 mu m), reduce the cost and is more beneficial to the micro-production of the product. The ball grid array ball planting machine forms the water-washing type soldering flux in a spraying mode, does not need to use a printing screen plate, and does not need to use liquid medicine to remove. The ball grid array ball planting machine integrates an optical detection mechanism, a ball supplementing and removing mechanism, a heating mechanism and the like, has a single reflow function and a detection function, does not need to change a clamping jig according to design, can also carry out repair operation in real time, and meets the requirement of a single line body for completing a complete work station. The ball grid array ball planting machine has the advantages that the size is reduced, more functions can be integrated, and the ball grid array ball planting machine is beneficial to optimizing the manufacturing process and reducing the use of jigs.
Drawings
Fig. 1 is a schematic structural diagram of a ball grid array ball mounter according to an embodiment of the present application.
Fig. 2 is a plan view of the ball grid array ball mounter shown in fig. 1.
Fig. 3 is a partially enlarged sectional view illustrating an operation state of the ball mounting mechanism shown in fig. 1.
Description of the main elements
Ball grid array ball mounting machine 100
Working table 10
Ball supplementing and removing mechanism 60
Tee 401
Lens 502
Fixed seat 601
Add head 604
The following detailed description will further describe embodiments of the present application in conjunction with the above-described figures.
Detailed Description
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which the embodiments of this application belong. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the embodiments of the present application.
It should be noted that all the directional indicators (such as upper, lower, left, right, front, and rear … …) in the present embodiment are only used to explain the relative position relationship between the components, the motion situation, etc. in a specific posture (as shown in the drawings), and if the specific posture is changed, the directional indicator is changed accordingly.
Embodiments of the present application are described herein with reference to cross-sectional illustrations that are schematic illustrations of idealized embodiments (and intermediate constructions) of the present application. Thus, variations in the shapes of the illustrations as a result of manufacturing processes and/or tolerances are to be expected. Accordingly, embodiments of the present application should not be construed as limited to the particular shapes of regions illustrated herein but are to include deviations in shapes that result, for example, from manufacturing. The regions illustrated in the figures are schematic in nature and their shapes are not intended to illustrate the actual shape of the device and are not intended to limit the scope of the present application.
Some embodiments of the present application will be described in detail below with reference to the accompanying drawings. In the following embodiments, features of the embodiments may be combined with each other without conflict.
Referring to fig. 1 and fig. 2, an embodiment of the present invention provides a ball grid array ball mounting machine 100, which includes a worktable 10, a moving mechanism 20, and a spraying mechanism 30, a ball mounting mechanism 40, an optical detection mechanism 50, a ball supplementing and removing mechanism 60, and a heating mechanism 70, which are disposed on the worktable 10. The spraying mechanism 30, the ball mounting mechanism 40, the optical detection mechanism 50, the ball supplementing and removing mechanism 60 and the heating mechanism 70 are arranged on the workbench 10 in sequence.
The moving mechanism 20 includes a rail 201 and a movable element 202 slidably connected to the rail 201. The rail 201 is installed above the table 10 and extends substantially in the arrangement direction of the spray mechanism 30, the ball mounting mechanism 40, the optical detection mechanism 50, the ball repairing and removing mechanism 60, and the heating mechanism 70. The movable element 202 is adapted to the track 201 and adapted to move on the track 201. A plurality of telescopic rods 203 are arranged on the movable element 202, and the telescopic rods 203 extend substantially along the vertical direction and are substantially perpendicular to the movable element 202. The telescopic rod 203 can move up and down in the vertical direction. The end of the telescopic rod 203 facing away from the movable element 202 is provided with a suction nozzle 204, and the suction nozzle 204 can be used for sucking various materials, such as a substrate, a steel mesh, solder balls and the like. The moving mechanism 20 is used for moving materials such as a substrate (not shown) among the spraying mechanism 30, the ball mounting mechanism 40, the optical detection mechanism 50, the ball repairing and removing mechanism 60, and the heating mechanism 70.
The spraying mechanism 30 is used for spraying flux (not shown) on the substrate 200 to be ball-mounted, as shown in fig. 3, a plurality of bonding pads 210 are disposed on the substrate 200. The soldering flux can improve the soldering effect by cleaning the surface oxidation layer of the metal at the soldering part or reducing the tension of the material on the soldering surface. In this embodiment, the flux may be a conventional or unconventional water-washing flux in the art. The water-washing type soldering flux can be removed only by washing without washing the redundant part with a liquid medicine. For example, water washing may be performed by, but not limited to, an ultrasonic water washer to remove excess water-washed flux. As shown in fig. 3, the ball-mounting mechanism 40 is used to dispose the solder balls 300 on the substrate 200 sprayed with the flux (not shown), so that the solder balls 300 correspond to the pads 210 on the substrate 200 one by one. In this embodiment, the solder ball 300 is a solder ball.
The optical inspection mechanism 50 is used for optically inspecting the substrate 200 passing through the ball-mounting mechanism 40 to determine whether there is a problem such as ball drop (no solder ball 300 on the pad 210) or abnormal multiple balls. If there is an abnormality, the substrate 200 is sent to the ball-filling and ball-removing mechanism 60 to fill the solder pads 210 of the solder balls 300 or remove the excess solder balls 300, and then the substrate 200 is sent to the heating mechanism 70. If there is no abnormality, the substrate 200 may be directly sent to the heating mechanism 70. The heating mechanism 70 is used for heating the solder balls 300 to melt the solder balls 300, so that the solder balls 300 are connected with the bonding pads 210, and the ball mounting operation is completed.
In some embodiments, as shown in fig. 1, the spraying mechanism 30 may include a spray base 301 fixed to the table 10 and a nozzle 302 connected to the spray base 301. The nozzle 302 can uniformly spray the flux on the surface of the substrate.
In some embodiments, as shown in fig. 1, the ball planting mechanism 40 may include a ball planting seat 401 fixed on the work table 10 and a ball planting head 402 connected to the ball planting seat 401, and an opening 4021 is formed at a bottom of the ball planting head 402. The ball-implanting head 402 may be rotated to drop the solder balls 300 onto the solder pads 210.
Further, the ball planting seat 401 is provided with a ball storage groove 4011, and the ball storage groove 4011 is used for storing and placing the solder balls 300. It can be appreciated that the ball storage well 4011 is in communication with the ball implanting head 402. Further, a sweeping part (not shown) is disposed at the bottom of the ball planting head 402. The sweeping portion is used for brushing the solder balls 300 onto the corresponding pads 210, and the sweeping portion may be, but not limited to, a brush or the like.
In some embodiments, as shown in fig. 1, the optical detection mechanism 50 includes a lens mount 501 fixed on the worktable 10 and a lens 502 connected to the lens mount 501. The lens 502 is used for photographing the substrate 200 and the solder balls 300 to determine whether there is a problem such as ball dropping (no solder ball 300 on the pad 210) or abnormal multiple balls. The lens 502 may be, but is not limited to, a CCD camera.
In some embodiments, as shown in fig. 1, the ball supplementing and removing mechanism 60 includes a fixing base 601 fixed on the workbench, and a ball removing head 602, a ball supplementing head 603, and an adding head 604 connected to the fixing base 601. The ball removing head 602 is used for removing the redundant solder balls 300, the ball supplementing head 603 is used for supplementing the solder balls of the bonding pads 210 without the solder balls 300, and the adding head 604 is used for supplementing the soldering flux.
In some embodiments, as shown in fig. 1, the heating mechanism 70 includes a heating base 701 fixed on the working table 10 and a heating source 702 connected to the heating base 701. The heating source 702 may be, but is not limited to, infrared or laser.
In some embodiments, the ball grid array ball mounter 100 further comprises a driving mechanism (not shown) for driving the movable element 202 to slide in the rail 201. Further, the driving mechanism may be, but is not limited to, a motor or the like.
The ball mounting process of the ball grid array ball mounting machine 100 will be briefly described below.
First, the full-size substrate is cut into individual substrates and washed with water, and the cut substrate 200 is transferred to a position below the spray mechanism 30 by the transfer mechanism 20. Then, the spraying mechanism 30 uniformly sprays the flux on the surface of the substrate 200, the suction nozzle 204 is used to suck the substrate 200 coated with the flux, and the telescopic rod 203 and the movable element 202 cooperate to transfer the substrate 200 to the lower part of the ball-planting mechanism 40. Next, the steel net 400 is disposed on the surface of the substrate 200. As shown in fig. 3, the steel net 400 is manufactured according to the drawing of the substrate 200, that is: the steel mesh 400 is provided with a plurality of openings 410, the openings 410 correspond to the pads 210 on the substrate 200 one by one, and the solder balls 300 are implanted on the pads 210 of the substrate 200 through the openings 410. Then, the ball-planting head 402 drops the solder balls 300 on the steel net 400, and the solder balls 300 are planted on the corresponding pads 210 through the openings 410 by brushing the solder balls with a wiper (brush). Next, the steel net 400 is removed, and the substrate 200 is transferred to a position below the optical detection mechanism 50. The optical inspection mechanism 50 optically inspects the substrate 200 passing through the ball-mounting mechanism 40 to determine whether there is a problem such as ball drop (no solder ball 300 on the pad 210) or a multi-ball abnormality. If there is an abnormality, the substrate 200 is sent to the ball-filling and ball-removing mechanism 60 to fill the solder balls 300 on the pads 210, or remove the excess solder balls 300, and this step can be repeated several times until the optical detection mechanism 50 detects no error, and then the substrate 200 is sent to the heating mechanism 70. If there is no abnormality, the substrate 200 may be directly sent to the heating mechanism 70. Then, the heating mechanism 70 heats the solder ball 300 (the wafer-implanting region) to melt the solder ball 300, so as to achieve the reflow effect and complete the ball-implanting operation.
The ball grid array ball-planting machine 100 of the present application can use a single substrate manner (i.e., the full-size substrate is cut into a single substrate, the single-edge length of the full-size substrate can be 100-500 mm, and the single-edge length of the single substrate can be 10-50 mm) to perform the ball-planting process, and can avoid the influence of the size expansion and shrinkage of the substrate 200. The single-grain mode production not only can reduce the volume of the steel mesh 400 (the distance between the openings 410 is smaller and is smaller than 75 μm), and reduce the cost, but also is more beneficial to the miniaturization of the product. The ball grid array ball mounting machine 100 forms the water-washing type soldering flux in a spraying mode, a printing screen plate does not need to be used, and liquid medicine does not need to be used for removing. The ball grid array ball planting machine 100 integrates the optical detection mechanism 50, the ball supplementing and removing mechanism 60, the heating mechanism 70 and the like, has a single reflow function and a detection function, does not need to change a clamping jig according to design, can also carry out repair operation in real time, and meets the requirement that a single line body completes a complete work station. The ball grid array ball mounting machine 100 of the present application has a reduced volume, and can integrate more functions therein, which is beneficial to optimizing the manufacturing process and reducing the use of jigs.
The above description is a few specific embodiments of the present application, but in practical applications, the present application is not limited to these embodiments. Other modifications and variations to the technical concept of the present application should fall within the scope of the present application for those skilled in the art.
Claims (10)
1. A ball grid array ball planting machine is characterized by comprising a workbench, a moving mechanism, a spraying mechanism, a ball planting mechanism, an optical detection mechanism, a ball supplementing and removing mechanism and a heating mechanism, wherein the spraying mechanism, the ball planting mechanism, the optical detection mechanism, the ball supplementing and removing mechanism and the heating mechanism are arranged on the workbench; the moving mechanism comprises a track and a movable element connected with the track in a sliding manner, a telescopic rod is arranged on the movable element, and a suction nozzle is arranged at the end part of the telescopic rod; the moving mechanism is used for moving the substrate among the spraying mechanism, the ball planting mechanism, the optical detection mechanism, the ball supplementing and removing mechanism and the heating mechanism; the spraying mechanism is used for spraying soldering flux on a substrate to be subjected to ball planting, the ball planting mechanism is used for arranging solder balls on the substrate sprayed with the soldering flux, and the heating mechanism is used for heating the solder balls to melt the solder balls.
2. The ball grid array ball mounter according to claim 1, wherein said ball mounting mechanism includes a ball mounting base fixed to said table and a ball mounting head connected to said ball mounting base, said ball mounting head having an opening at a bottom thereof.
3. The ball grid array ball mounter according to claim 2, wherein said ball mounting base is provided with a ball storage groove for storing and placing solder balls, said ball storage groove being in communication with said ball mounting head.
4. The ball grid array ball mounter of claim 2 wherein a wiper is further provided at the bottom of said ball mounting head.
5. The ball grid array ball mounter according to claim 1, wherein said spraying mechanism includes a spraying base fixed to said table and a nozzle connected to said spraying base.
6. The ball grid array ball mounter according to claim 1, wherein said optical detection mechanism includes a lens mount fixed to said table and a lens attached to said lens mount, said lens being adapted to photograph said substrate and said solder balls.
7. The ball grid array ball mounter according to claim 1, wherein said heating mechanism includes a heating base fixed to said table and a heating source connected to said heating base.
8. The ball grid array ball mounter according to claim 1, wherein said ball-supplementing and ball-removing mechanism includes a fixing base fixed to said table, and a ball-removing head, a ball-supplementing head and an adding head connected to said fixing base.
9. The ball grid array ball mounter of claim 1 further comprising a drive mechanism for driving said movable member to slide within said track.
10. The ball grid array ball mounter of claim 9 wherein said drive mechanism includes a motor.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222503454.3U CN218647883U (en) | 2022-09-21 | 2022-09-21 | Ball grid array ball planting machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222503454.3U CN218647883U (en) | 2022-09-21 | 2022-09-21 | Ball grid array ball planting machine |
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| Publication Number | Publication Date |
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| CN218647883U true CN218647883U (en) | 2023-03-17 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202222503454.3U Active CN218647883U (en) | 2022-09-21 | 2022-09-21 | Ball grid array ball planting machine |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117423649A (en) * | 2023-12-19 | 2024-01-19 | 江苏中科智芯集成科技有限公司 | Full-automatic ball planting machine for chip packaging and ball planting process thereof |
-
2022
- 2022-09-21 CN CN202222503454.3U patent/CN218647883U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117423649A (en) * | 2023-12-19 | 2024-01-19 | 江苏中科智芯集成科技有限公司 | Full-automatic ball planting machine for chip packaging and ball planting process thereof |
| CN117423649B (en) * | 2023-12-19 | 2024-02-23 | 江苏中科智芯集成科技有限公司 | Chip packaging full-automatic ball planting machine and ball planting method thereof |
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