CN218638107U

CN218638107U - Wafer plasma cleaning device

Info

Publication number: CN218638107U
Application number: CN202223042289.2U
Authority: CN
Inventors: 山贵叶; 王谦歌
Original assignee: Xi'an Huaxin Micro Semiconductor Co ltd
Current assignee: Xi'an Huaxin Micro Semiconductor Co ltd
Priority date: 2022-11-16
Filing date: 2022-11-16
Publication date: 2023-03-17
Anticipated expiration: 2032-11-16

Abstract

The application discloses wafer plasma belt cleaning device belongs to plasma belt cleaning device technical field, open-ended box has been opened including the front side, the opening of box articulates there is the chamber door, the inside downside of box is provided with the horizontally rolling disc, the vertical first pivot of lower extreme middle part fixedly connected with of rolling disc, the lower extreme of first pivot is connected through the lower side inner wall rotation of first antifriction bearing with the box, the fixed motor that is equipped with of bottom center department of box, the output of motor run through to the inside of box and with the lower extreme fixed connection of first pivot, the upside of rolling disc is provided with the horizontally and places the dish, place the upper end of dish and set up a plurality of evenly distributed's standing groove, the vertical sliding hole of having seted up in tank bottom center department of a plurality of standing grooves, the equal vertical sliding connection in inside of a plurality of sliding holes has the fore-set. The cleaning device is convenient for uniformly cleaning a plurality of wafers, and is time-saving, labor-saving and high in efficiency; the wafer is convenient to take and place.

Description

Wafer plasma cleaning device

Technical Field

The application relates to the technical field of plasma cleaning devices, in particular to a wafer plasma cleaning device.

Background

The plasma cleaning machine is also called as a plasma cleaning machine or a plasma surface treatment instrument, the plasma is utilized to achieve the effect which cannot be achieved by the conventional cleaning method, the plasma is utilized to treat the surface of a sample, and therefore the purposes of cleaning, coating and the like are achieved, and the application fields of the plasma cleaning machine comprise rubber, composite materials, glass, cloth, metal and the like.

The conventional wafer plasma cleaning device is inconvenient for uniformly cleaning a plurality of wafers, wastes time and labor and has low efficiency, so that the wafer plasma cleaning device is provided.

SUMMERY OF THE UTILITY MODEL

The application provides a wafer plasma belt cleaning device to solve the current plasma belt cleaning device who provides among the above-mentioned background art and be not convenient for evenly wash a plurality of wafers, waste time and energy the problem of inefficiency.

In order to achieve the purpose, the following technical scheme is adopted in the application:

the utility model provides a wafer plasma cleaning device, includes that the front side is opened and is equipped with open-ended box, the opening of box articulates there is the chamber door, the inside downside of box is provided with the horizontally rolling disc, the vertical first pivot of lower extreme middle part fixedly connected with of rolling disc, the lower extreme of first pivot is connected through the rotation of first antifriction bearing and the downside inner wall of box, the fixed motor that is equipped with in bottom center department of box, the output of motor run through to the inside of box and with the lower extreme fixed connection of first pivot, the upside of rolling disc is provided with the horizontally and places the dish, place the upper end of dish and offer a plurality of evenly distributed's standing groove, it is a plurality of the vertical sliding hole of having seted up in tank bottom center department of standing groove, it is a plurality of the equal vertical sliding connection in inside of sliding hole has the fore-set, a plurality of the upper end of fore-set all extends to the outside of sliding hole, a plurality of the lower extreme of fore-set all with the upper end fixed connection of rolling disc, a plurality of the upper end equal fixed connection has the horizontal limiting plate in the upper end of fore-set, the upper end of fore-set middle part of rotating disc middle part is equipped with the corresponding plasma generator, the lower extreme of the fixed disc fixed box of the fixed blind hole, the left and the corresponding plasma generator of the left and the box, the plasma generator, the fixed box, the plasma generator is equipped with the corresponding left side of the fixed plasma generator, the fixed box, the plasma generator is equipped with the inside of the fixed blind hole, the vertical plasma generator.

As a preferred embodiment, stop gear includes gag lever post, dead lever and second spring, the vertical slip setting of gag lever post is in the inside of blind hole, the lower extreme of gag lever post extends to the outside of blind hole, the bar hole has been seted up to the front side lateral wall of gag lever post, dead lever longitudinal sliding sets up the inside upside in the bar hole, the both ends of dead lever all extend to the outside in bar hole and with the pore wall fixed connection of blind hole, a plurality of spacing grooves with gag lever post matched with have evenly been seted up to the downside inner wall of box, the both ends of second spring respectively with the top of the hole of blind hole and the upper end fixed connection of gag lever post.

In a preferred embodiment, the lower end of the limiting rod is provided with a spherical surface.

As a preferred embodiment, the middle part of the upper end of the placing disc is rotatably connected with a vertical second rotating shaft through a second rolling bearing, and the upper end of the second rotating shaft is fixedly connected with a rectangular frame.

As a preferred embodiment, a rotating ring is arranged outside the placing disc, and a connecting rod is fixedly connected between the inner ring walls on the left and right sides of the rotating ring and the outer side wall of the placing disc.

As a preferred embodiment, vertical support rods are fixedly connected to four corners of the bottom of the box body.

In a preferred embodiment, a buffer ring is fixedly connected to each of the side walls of the plurality of placement grooves.

As a preferred embodiment, the upper ends of the plurality of limiting plates are fixedly connected with non-slip mats.

The beneficial effect of this application:

1. the wafer plasma cleaning device is convenient for uniformly cleaning a plurality of wafers through the rotating disc, the top column, the placing disc, the placing groove, the first rotating shaft, the second rotating shaft, the motor, the plasma generator and the plasma spray pipe, and is time-saving, labor-saving and high in efficiency;

2. this wafer plasma cleaning device is convenient for get the wafer and put through rolling disc, fore-set, place dish, standing groove, first pivot, second pivot and the first spring that is equipped with.

Drawings

FIG. 1 is a schematic structural diagram of the present application;

FIG. 2 is a schematic top view of the tray of FIG. 1;

fig. 3 is an enlarged schematic view of a portion a of fig. 1.

The reference numbers in the figures: 1. a top pillar; 2. a first rotating shaft; 3. a motor; 4. a first spring; 5. rotating the disc; 6. placing a tray; 7. a limiting plate; 8. a rectangular frame; 9. a second rotating shaft; 10. a placement groove; 11. a rotating ring; 12. a vacuum tube; 13. a plasma generator; 14. a plasma torch; 15. a box body; 16. a box door; 17. a second spring; 18. fixing the rod; 19. a limiting rod.

Detailed Description

The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only a part of the embodiments of the present application, and not all of the embodiments.

Referring to fig. 1 and 2, a wafer plasma cleaning device, open the open-ended box 15 including the front side, the opening of box 15 articulates there is chamber door 16, the equal vertical bracing piece of fixedly connected with in bottom four corners department of box 15, the inside downside of box 15 is provided with horizontally rolling disc 5, the vertical first pivot 2 of lower extreme middle part fixedly connected with of rolling disc 5, the lower extreme of first pivot 2 rotates through the downside inner wall of first antifriction bearing with box 15 to be connected, the fixed motor 3 that is equipped with in bottom center department of box 15, the output of motor 3 run through to box 15 inside and with the lower extreme fixed connection of first pivot 2, the upside of rolling disc 5 is provided with the horizontally and places dish 6, the upper end middle part of placing dish 6 rotates through the second antifriction bearing and is connected with vertical second pivot 9, the upper end fixedly connected with rectangle frame 8 of second pivot 9.

Referring to fig. 1 and 2, place a plurality of evenly distributed's standing groove 10 in the upper end of dish 6, the equal fixedly connected with buffer ring of the groove lateral wall of a plurality of standing grooves 10, the vertical slide opening of having seted up in the tank bottom center department of a plurality of standing grooves 10, the equal vertical sliding connection in inside of a plurality of slide openings has fore-set 1, the upper and lower both ends of a plurality of fore-set 1 all extend to the outside of slide opening, the lower extreme of a plurality of fore-set 1 all with the upper end fixed connection of rolling disc 5, the equal fixedly connected with horizontally limiting plate 7 in upper end of a plurality of fore-set 1, the equal fixedly connected with slipmat in upper end of a plurality of limiting plate 19, the first spring 4 of upper end middle part fixedly connected with of rolling disc 5, the other end of first spring 4 and the lower extreme middle part fixed connection of placing dish 6, first spring 4 can be convenient for placing dish 6 and reset.

Referring to fig. 1 and 2, the outer part of the placing disc 6 is provided with a rotating ring 11, connecting rods are fixedly connected between the inner annular walls of the left side and the right side of the rotating ring 11 and the outer side wall of the placing disc 6, and the rotating ring 11 can be used for conveniently pushing the placing disc 6 to rotate through the connecting rods.

Refer to fig. 1 and fig. 3, the equal vertical blind hole of having seted up in the lower extreme left and right sides of rolling disc 5, the inside of two blind holes is all fixed and is equipped with stop gear, stop gear includes gag lever post 19, dead lever 18 and

second spring

17, 19 vertical slides of gag lever post set up the inside at the blind hole, 19 lower extreme of gag lever post extends to the outside of blind hole, the bar hole has been seted up to 19 front side pole wall of gag lever post, 18 longitudinal sliding of dead lever sets up the inside upside in the bar hole, 18 both ends of dead lever all extend to the outside in bar hole and with the pore wall fixed connection of blind hole, a plurality of and gag lever post 19 matched with spacing grooves have evenly been seted up to the downside inner wall of box 15, second spring 17's both ends respectively with the hole top of blind hole and 19's upper end fixed connection of gag lever post, spherical face has been seted up to 19's lower extreme, spherical face is convenient for gag lever post 19 from the spacing inslot roll-off. The limiting mechanism can facilitate limiting of the rotating disc 5.

Referring to fig. 1, a horizontal vacuum tube 12 is fixedly communicated with the middle of the outer wall of the left side of a box body 15, a plasma generator 13 is fixedly arranged at the upper end of the box body 15, a vertical plasma spray tube 14 is fixedly connected with the output end of the plasma generator 13, the lower end of the plasma spray tube 14 penetrates into the box body 15, and the plasma spray tube 14 corresponds to one of the placing grooves 10.

The working principle is as follows: the rotating ring 11 is rotated, the rotating ring 11 drives the rotating disc 5 to rotate through the placing disc 6 and the top post 1, a plurality of wafers are sequentially placed on the top post 1 in the placing groove 10 in the rotating process of the rotating disc 5, after the box door 16 is closed, the box body is firstly vacuumized through the vacuum tube 12, the plasma generator 13 and the motor 3 are started, the motor 3 drives the placing disc 6 to rotate through the first rotating shaft 2 and the rotating disc 5 and the top post 1, the placing disc 6 drives the wafers to rotate around the first rotating shaft 2, the plasma generator 13 uniformly cleans the wafers through the plasma spray tube 14, the rectangular frame 8 is grabbed to press downwards after cleaning is finished, the rectangular frame 8 drives the placing disc 6 to extrude the first spring through the second rotating shaft 9, at the moment, the top post 1 pushes the wafers out of the placing groove 10, the wafers can be conveniently taken out, and in the process of taking out the wafers, due to random limiting of the limiting mechanism, the rotating disc 5 cannot rotate.

In the description of the present application, it is to be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," and the like are used in an orientation or positional relationship indicated in the drawings for convenience in describing the present application and to simplify the description, and are not intended to indicate or imply that the device or element so referred to must have a particular orientation, be constructed and operated in a particular orientation, and are not to be construed as limiting the present application.

Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or to implicitly indicate the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present application, "a plurality" means two or more unless specifically limited otherwise.

The above description is only for the preferred embodiments of the present application, but the scope of the present application is not limited thereto, and any person skilled in the art should be considered as the technical solutions and the inventive concepts of the present application in the scope of the present application.

Claims

1. The utility model provides a wafer plasma cleaning device, includes that the front side is opened and is equipped with open-ended box (15), its characterized in that, the opening of box (15) articulates there is chamber door (16), the inside downside of box (15) is provided with horizontally rolling disc (5), the lower extreme middle part fixedly connected with vertical first pivot (2) of rolling disc (5), the lower extreme of first pivot (2) is connected through the lower side inner wall rotation of first antifriction bearing with box (15), the bottom center department of box (15) is fixed and is equipped with motor (3), the output of motor (3) run through to the inside of box (15) and with the lower extreme fixed connection of first pivot (2), the upside of rolling disc (5) is provided with horizontally placing disc (6), a plurality of evenly distributed's standing groove (10) are seted up to the upper end of placing disc (6), a plurality of the bottom center department of placing groove (10) vertically seted up the slide opening, a plurality of the inside of slide opening all vertically slide opening is connected with fore-set (1), a plurality of the upper and lower extreme that the upper end of the slide opening (1) all extends to the outside fixed post (5) of limiting plate (5) is connected with the upper end of the first fixed spring (7), a plurality of the upper end of the fixed plate (5) is connected with the upper end of the fixed plate (4), the other end of first spring (4) and the lower extreme middle part fixed connection who places dish (6), the equal vertical blind hole of having seted up in the lower extreme left and right sides of rolling disc (5), two the inside of blind hole is all fixed and is equipped with stop gear, the fixed horizontally vacuum tube (12) that communicates in left side outer wall middle part of box (15), the fixed plasma generator (13) that is equipped with in upper end of box (15), the output fixedly connected with vertical plasma spray tube (14) of plasma generator (13), the lower extreme of plasma spray tube (14) runs through to the inside of box (15), plasma spray tube (14) are corresponding with the position of one of them standing groove (10).

2. The wafer plasma cleaning device as recited in claim 1, wherein the limiting mechanism comprises a limiting rod (19), a fixing rod (18) and a second spring (17), the limiting rod (19) is vertically slidably disposed inside the blind hole, the lower end of the limiting rod (19) extends to the outside of the blind hole, a strip-shaped hole is formed in the front side rod wall of the limiting rod (19), the fixing rod (18) is longitudinally slidably disposed on the upper side of the strip-shaped hole, two ends of the fixing rod (18) both extend to the outside of the strip-shaped hole and are fixedly connected with the hole wall of the blind hole, a plurality of limiting grooves matched with the limiting rod (19) are uniformly formed in the inner wall of the lower side of the box body (15), and two ends of the second spring (17) are respectively fixedly connected with the top of the blind hole and the upper end of the limiting rod (19).

3. The wafer plasma cleaning device according to claim 2, wherein the lower end of the stopper rod (19) is provided with a spherical surface.

4. The wafer plasma cleaning device according to claim 1, characterized in that a vertical second rotating shaft (9) is rotatably connected to the middle of the upper end of the placing plate (6) through a second rolling bearing, and a rectangular frame (8) is fixedly connected to the upper end of the second rotating shaft (9).

5. The wafer plasma cleaning device according to claim 1, wherein a rotating ring (11) is arranged outside the placing disc (6), and a connecting rod is fixedly connected between the inner ring wall of the left side and the outer ring wall of the placing disc (6) and the inner ring wall of the right side and the outer ring wall of the rotating ring (11).

6. The wafer plasma cleaning device as claimed in claim 1, wherein vertical support rods are fixedly connected to four corners of the bottom of the box body (15).

7. The wafer plasma cleaning apparatus according to claim 1, wherein a buffer ring is fixedly attached to each of the groove side walls of the plurality of placing grooves (10).

8. The wafer plasma cleaning device according to claim 1, wherein the upper ends of the plurality of limiting plates (7) are fixedly connected with anti-slip pads.