CN218632690U - High speed connector - Google Patents

High speed connector Download PDF

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Publication number
CN218632690U
CN218632690U CN202223293944.1U CN202223293944U CN218632690U CN 218632690 U CN218632690 U CN 218632690U CN 202223293944 U CN202223293944 U CN 202223293944U CN 218632690 U CN218632690 U CN 218632690U
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China
Prior art keywords
insulator
speed connector
mating
connector
terminal
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CN202223293944.1U
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Chinese (zh)
Inventor
叶美
关海飞
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Ampov Connector System Nantong Co ltd
Delphi Electrical Centers Shanghai Co Ltd
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Ampov Connector System Nantong Co ltd
Delphi Electrical Centers Shanghai Co Ltd
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Abstract

The present disclosure provides a high speed connector. The high-speed connector includes: a terminal module, the terminal module comprising: the insulator is formed on the at least one conductive terminal and wraps the at least one conductive terminal; a shield case defining an accommodation chamber in which the terminal module is detachably fixed; and a plastic housing defining a mating channel in which the shield housing is removably secured, wherein the at least one insulator is of a different material than the plastic housing.

Description

High speed connector
Technical Field
The present disclosure relates to connectors, and more particularly to a high speed connector.
Background
An electronic connector is a conductor device for connecting electrical lines. The component can be used as a terminal for connecting different elements in a circuit system, or can be used for providing power and data connection between different circuit systems and devices. It is widely used in various electric lines to connect or disconnect the circuit. Such connections may be temporary and convenient to plug and unplug, or may be permanent junctions between electrical devices or cables.
In existing high speed connectors (e.g., existing high speed single channel ethernet board end connectors), the terminal insulator is typically designed as a one-piece boot with the board end connector. For example, fig. 1A and 1B show a front view and a left view, respectively, of a prior art HMTD ethernet connector 1. As shown in fig. 1A and 1B, the ethernet connector 1 may include conductive terminals 2 and a plastic housing 3. The conductive terminals 2 are directly inserted into and penetrate the plastic housing 3. The plastic shell 3 is integrally formed. A portion of the plastic housing 3 surrounding the conductive terminals 3 is used to achieve insulation between the conductive terminals 2 and the shielding housing 4.
However, for the increasingly demanding vehicle-mounted application environment, the dielectric constant of the commonly used raw materials cannot meet the transmission rate requirement of 10Gbps, and the special dielectric constant material meeting the high-speed requirement is high in cost, so that the cost of the integrally designed product material is high. For the structure shown in fig. 1A and 1B, the material of the entire plastic housing 3 needs to be replaced by a high dielectric constant material to meet the requirement of high-speed data transmission, resulting in a significant increase in cost.
SUMMERY OF THE UTILITY MODEL
The present disclosure provides a high-speed connector capable of ensuring high reliability of the high-speed connector while reducing manufacturing cost of the high-speed connector.
In one embodiment of the present disclosure to solve the above problems, there is provided a high-speed connector including: a terminal module, the terminal module comprising: the insulator is formed on the at least one conductive terminal and wraps the at least one conductive terminal; a shield case defining an accommodation chamber in which the terminal module is detachably fixed; and a plastic housing defining a mating channel, the shield housing being removably secured within the mating channel, wherein the at least one insulator is of a different material than the plastic housing.
In an embodiment of the disclosure, a dielectric constant of a material of the insulator is higher than a dielectric constant of a material of the plastic housing.
In an embodiment of the present disclosure, the at least one insulator includes: a first insulator positioned in the middle of the at least one conductive terminal; and a second insulator located near an end of the at least one conductive terminal.
In an embodiment of the present disclosure, the at least one conductive terminal is a signal terminal for transmitting a data signal.
In an embodiment of the present disclosure, the insulator is molded on the at least one conductive terminal by an injection molding process.
In an embodiment of the present disclosure, a first mating structure is formed on the insulator, and a second mating structure for mating with the first mating structure is formed on an inner wall of the shield shell.
In an embodiment of the disclosure, a third mating structure is formed on an outer wall of the shielding shell, and a fourth mating structure for mating with the third mating structure is formed on an inner side wall of the plastic shell.
In an embodiment of the present disclosure, the high speed connector is a board end connector.
Drawings
FIG. 1A is a front view showing a prior art Ethernet connector;
FIG. 1B is a left side view showing a prior art Ethernet connector;
FIG. 2 is a perspective view illustrating an exemplary high speed connector according to an embodiment of the present disclosure;
FIG. 3 is an exploded view illustrating an exemplary high speed connector according to an embodiment of the present disclosure;
FIG. 4 is a perspective view from the direction of arrow II in FIG. 3 illustrating an exemplary high speed connector according to an embodiment of the present disclosure;
FIG. 5 is a front view, as viewed from the direction of arrow I in FIG. 2, illustrating an exemplary high speed connector according to embodiments of the present disclosure;
FIG. 6 isbase:Sub>A cross-sectional view taken along line A-A shown in FIG. 5 illustrating an exemplary high speed connector according to an embodiment of the present disclosure; and is
Fig. 7 is a flow chart illustrating an example method for manufacturing a high speed connector according to an embodiment of the present disclosure.
Detailed Description
Other advantages and technical effects of the present disclosure will be apparent to those skilled in the art from the disclosure of the present specification, which is described in the following detailed description. In addition, the present disclosure is not limited to the specific embodiments described below, and may be implemented or applied by other different embodiments, and various modifications and changes may be made to the specific contents in the present specification without departing from the spirit of the present disclosure.
Specific embodiments of the present disclosure will be described in detail below with reference to the accompanying drawings. The drawings are for simplicity of illustration only and are not drawn to scale, nor are the actual dimensions of the structures shown and described. To facilitate understanding, identical reference numerals have been used, where possible, to designate identical elements that are common to the figures. The figures are not drawn to scale and may be simplified for clarity. Elements and features of one embodiment may be beneficially incorporated in other embodiments without further recitation.
Conventionally, in order to satisfy high-speed data transmission applications, it is necessary to replace the entire material of the plastic housing 3 in the connector 1 shown in fig. 1A and 1B with a high dielectric constant material, for example. This can result in a significant increase in the cost of the connector. The present disclosure redesigns the connector structure so that the plastic housing and the insulator around the terminal are independent of each other. The plastic shell can be made of original insulating materials. The insulator around the terminal can be selected from materials having higher dielectric constants depending on the desired data transmission rate, and high-speed data transmission can be achieved while suppressing an increase in cost.
An exemplary high speed connector 100 according to an embodiment is described below with reference to fig. 2-6.
Referring to fig. 2 to 6, fig. 2 showsbase:Sub>A perspective view of the high-speed connector 100, fig. 3 shows an exploded view of the high-speed connector 100, fig. 4 shows an exploded view of the high-speed connector 100 as viewed from the direction of arrow II of fig. 3, fig. 5 showsbase:Sub>A front view of the high-speed connector 100 as viewed from the direction of arrow I of fig. 1, and fig. 6 isbase:Sub>A sectional view taken along the linebase:Sub>A-base:Sub>A of fig. 4.
As shown in fig. 2 to 6, the high-speed connector 100 may include a terminal module 110, a shield shell 120, and a plastic shell 130.
The terminal module 110 may include at least one conductive terminal 111 and at least one insulator 112. At least one insulator 112 may be formed on the at least one conductive terminal 111 and wrap around the at least one conductive terminal 111. The term "wrap" is used herein to mean a tight wrap with substantially no gaps or only very small gaps therebetween. As one non-limiting example, the insulator 112 may be molded on the conductive terminals 111 by insert molding (insert molding) and wrap the conductive terminals 111. However, without limitation, the insulator 112 may be formed or molded on a portion or all of the conductive terminals 111 by various other molding methods (including, but not limited to, dip molding, spray molding, deposition molding, and the like). The insulator 112 may be made of various insulating materials. For example, insulator 112 may be made of an insulating material having a particular dielectric constant capable of meeting data transmission requirements of 10Gbps or greater, such as a nylon material or the like.
As a non-limiting example, some or all of the at least one conductive terminal 111 of the terminal module 110 may be signal terminals for transmitting data signals. For example, the conductive terminals 111 may be signal terminals suitable for an H-MTD (High Speed-modulated Twisted-pair Data) connector, an HSD (High Speed Data) connector, an HFM (High-Speed FAKRA-Mini) connector, an MTD (modulated Twisted-pair Data) connector, and the like. Fig. 2 to 6 show an example having two conductive terminals 111, however, not limited thereto, any number of conductive terminals 111 may be provided.
As a non-limiting example, referring to fig. 3, 4, 6, the insulator 112 may include a first insulator 112a and a second insulator 112b. The first insulator 112a may be positioned in the middle of the at least one conductive terminal 111. The second insulator 112b may be located near an end of the at least one conductive terminal 111.
The shield case 120 may define a receiving cavity 121. The terminal module 110 may be detachably fixed in the receiving cavity 121. The shielding shell 120 may be made of any suitable shielding material, such as a metal material, so as to provide sufficient electromagnetic shielding effect to the conductive terminals 111 mounted therein when the terminal module 110 is fixed in place in the receiving cavity 121.
As a non-limiting example, a first fitting structure 1121 may be formed on the insulator 112, and a second fitting structure 122 for fitting with the first fitting structure 1121 may be formed on an inner wall of the shield case 120. The terminal module 110 can be detachably fixed in place in the receiving cavity 121 in a fixed orientation by the engagement of the first engagement structure 1121 with the second engagement structure 122.
As a non-limiting example, as shown in fig. 3, 4, the first mating structure 1121 may be a boss and the second mating structure 122 may be a recess, which may be secured to each other by an interference fit. However, without limitation, the first and second mating structures 1121 and 122 may employ any type of mating structure, for example, the first mating structure 1121 may be a groove and the second mating structure 122 may be a boss or a beam, the first mating structure 1121 may be a pin and the second mating structure 122 may be a socket, the first mating structure 1121 may be a groove and the second mating structure 122 may be an elastic tongue, etc. In addition, in addition to providing the mating structures on the shielding shell 120 and the terminal module 110 and mating the mating structures, the terminal module 110 may be detachably fixed in the accommodating cavity 121 in other manners, such as adhering to each other by a non-permanent adhesive, fastening to each other by bolts or pins, and the like.
The plastic housing 130 may define a mating channel 131. The shield case 120 may be detachably fixed in the mating passage 131. As a non-limiting example, a third mating structure 123 may be formed on an outer wall of the shield case 120, and a fourth mating structure 132 for mating with the third mating structure 123 may be formed on an inner side wall of the plastic case 130. By the mating of the third mating structure 123 with the fourth mating structure 132, the shield shell 120 may be removably secured in place within the mating channel 131 in a fixed orientation for subsequent mating with other connectors (not shown). For example, as shown in fig. 3 and 4, the third mating structure 123 may be a barb-shaped protrusion and the fourth mating structure 132 may be a groove, which may be fixed to each other by an interference fit. However, without being limited thereto, the third mating structure 123 and the fourth mating structure 132 may adopt any type of mating structure, for example, the third mating structure 123 may be a groove and the fourth mating structure 132 may be a boss or a convex beam, the third mating structure 123 may be a pin and the fourth mating structure 132 may be a socket, the third mating structure 123 may be a groove and the fourth mating structure 132 may be an elastic tongue, etc. In addition, in addition to providing and engaging the plastic housing 130 and the shielding housing 120 with engaging structures, the shielding housing 120 may be detachably fixed in the mating channel 131 by other methods, such as adhering to each other by non-permanent adhesives, fastening to each other by bolts or pins, and the like.
The plastic housing 140 may be formed by various forming methods (including but not limited to molding, 3D printing, etc.). The plastic housing 140 may be made of various insulating materials. The material of the plastic housing 140 may be different from the material of the insulator 112. For example, the plastic housing 140 may be made of a less expensive insulating material, including but not limited to a general purpose plastic material that meets vehicle specifications. Alternatively, the dielectric constant of the material of the plastic housing 140 may be lower than the dielectric constant of the material of the insulator 112.
As a non-limiting example, the high speed connector 100 may function as a board-side connector. For example, the high-speed connector 100 may function as an H-MTD connector, HSD connector, HFM connector, MTD connector, or the like for board-end connection of a printed circuit board.
Further, fig. 2-6 show examples of single channels, but it is understood that the design of the present disclosure is applicable to other channel numbers.
An exemplary method 200 according to an embodiment is described below with reference to fig. 7. The method 200 may be used to manufacture a high speed connector, such as the high speed connector 100 described above.
The method may start in step S201. At step S201, at least one insulator 112 may be formed on at least one conductive terminal 111 through a molding process. The at least one insulator 112 may encase the at least one conductive terminal 111. The molding process includes, but is not limited to, insert injection molding, dip molding, spray molding, deposition molding, and the like or combinations thereof.
At step 202, the at least one insulator 112 along with the at least one conductive terminal 111 may be fitted into the receiving cavity 121 of the shield shell 120.
At step S203, the shield case 120 may be assembled into the mating channel 131 of the plastic case 130 along with the at least one insulator 112 and the at least one conductive terminal 111. The insulator 112 may be of a different material than the plastic housing 120. For example, the dielectric constant of the material of the insulator 112 may be higher than the dielectric constant of the material of the plastic housing 120.
With the exemplary high speed connector 100 and method 200 of the present disclosure, at least the following beneficial technical effects can be achieved:
through more reasonable material selection of the insulator 112 and the separated structure design of the insulator 112 and the plastic housing 130, the effective transmission of ethernet signals at higher speed (such as more than 10 Gbps) under severe working conditions can be satisfied, thereby achieving higher reliability of the high-speed connector 100.
In addition, the high-speed connector 100 utilizes a separate design in which the insulator 112 is separated from the plastic housing 130, so that the cost of the high-speed connector 100 can be reduced while different materials are used to meet the requirement of high transmission rate.
Alternative embodiments of the present disclosure are described in detail above. It will be appreciated that various embodiments and modifications may be made thereto without departing from the broader spirit and scope of the disclosure. Many modifications and variations will be apparent to those of ordinary skill in the art in light of the teachings of this disclosure without undue experimentation. As a non-limiting example, one skilled in the art may omit one or more of the various components of the above-described system or structure, add one or more components to the above-described system or structure, or replace some or all of the various structures or systems involved in the present embodiment with other components having the same or similar functions. Therefore, the technical solutions available to those skilled in the art through logic analysis, reasoning or limited experiments based on the concepts of the present disclosure should fall within the scope of protection defined by the claims of the present disclosure.

Claims (8)

1. A high speed connector, comprising:
a terminal module, the terminal module comprising:
at least one electrically conductive terminal, and
at least one insulator molded over and encasing the at least one conductive terminal;
a shield case defining an accommodation chamber in which the terminal module is detachably fixed; and
a plastic housing defining a mating channel, the shield housing being removably secured within the mating channel,
wherein the material of the at least one insulator is different from the material of the plastic shell.
2. The high-speed connector of claim 1, wherein a dielectric constant of a material of the insulator is higher than a dielectric constant of a material of the plastic housing.
3. The high-speed connector of claim 1, wherein the at least one insulator comprises:
a first insulator positioned in the middle of the at least one conductive terminal; and
a second insulator located near an end of the at least one conductive terminal.
4. The high-speed connector of claim 1, wherein the at least one conductive terminal is a signal terminal for transmitting data signals.
5. The high-speed connector of claim 1, wherein said insulator is molded onto said at least one conductive terminal by an injection molding process.
6. The high-speed connector of claim 1, wherein a first mating structure is formed on the insulator and a second mating structure is formed on an inner wall of the shield shell for mating with the first mating structure.
7. The high-speed connector of claim 1, wherein a third mating structure is formed on an outer wall of the shield housing and a fourth mating structure is formed on an inner sidewall of the plastic housing for mating with the third mating structure.
8. The high-speed connector of claim 1, wherein the high-speed connector is a board-end connector.
CN202223293944.1U 2022-12-08 2022-12-08 High speed connector Active CN218632690U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202223293944.1U CN218632690U (en) 2022-12-08 2022-12-08 High speed connector

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202223293944.1U CN218632690U (en) 2022-12-08 2022-12-08 High speed connector

Publications (1)

Publication Number Publication Date
CN218632690U true CN218632690U (en) 2023-03-14

Family

ID=85453325

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202223293944.1U Active CN218632690U (en) 2022-12-08 2022-12-08 High speed connector

Country Status (1)

Country Link
CN (1) CN218632690U (en)

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