CN218631422U - Novel bimetal wire - Google Patents
Novel bimetal wire Download PDFInfo
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- CN218631422U CN218631422U CN202222226722.1U CN202222226722U CN218631422U CN 218631422 U CN218631422 U CN 218631422U CN 202222226722 U CN202222226722 U CN 202222226722U CN 218631422 U CN218631422 U CN 218631422U
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- bimetal
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02A—TECHNOLOGIES FOR ADAPTATION TO CLIMATE CHANGE
- Y02A30/00—Adapting or protecting infrastructure or their operation
- Y02A30/14—Extreme weather resilient electric power supply systems, e.g. strengthening power lines or underground power cables
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Abstract
The utility model relates to the field of composite wires, in particular to a new bimetal wire, which comprises an aluminum wire, and a binding layer, a copper layer and a shielding layer which are sequentially coated on the outer side of the aluminum wire; the bonding layer is a nickel layer and a zinc layer. Compared with the prior art, the utility model provides a pair of new wire rod of bimetal is through setting up the anchor coat between copper layer and aluminium core for reach the inseparable degree of metallurgical bonding between copper strips and the aluminium core wire, and at copper layer outside coating shielding layer, make it have better antistatic function on having better electric conductive property basis, shield effectually, reduced the quantity of copper by a wide margin, reduced the manufacturing cost of product.
Description
Technical Field
The utility model relates to a composite wire field, in particular to new wire rod of bimetal.
Background
The copper-clad aluminum alloy wire is widely applied to the field of cables, such as the field of high-frequency signal transmission, the field of power transmission, computer cables, control cables and other data cable inner conductor materials, the field of automobile manufacturing, the field of new energy, the field of anti-interference shielding, the field of wireless charging and the like.
SUMMERY OF THE UTILITY MODEL
In order to solve the problem, the utility model provides a new wire rod of bimetal.
The utility model adopts the technical scheme as follows: the new bimetallic wire material has the key points as follows: comprises an aluminum conductor, and a bonding layer, a copper layer and a shielding layer which are sequentially coated on the outer side of the aluminum conductor; the bonding layer is a nickel layer and a zinc layer.
Preferably, the shielding layer is a PET resin doped with an antistatic agent, and the antistatic agent contains one or more of carbon black and activated carbon fibers.
Preferably, the diameter of the aluminum wire is 1.7-1.9mm.
Preferably, the copper layer has a thickness of 0.15 to 0.35mm.
Preferably, the bonding layer has a thickness of 0.003 to 0.005mm.
Has the advantages that: compared with the prior art, the utility model provides a pair of new wire rod of bimetal is through setting up the anchor coat between copper layer and aluminium core for reach the inseparable degree of metallurgical bonding between copper strips and the aluminium core wire, and at copper layer outside coating shielding layer, make it have better antistatic function on having better electric conductive property basis, shield effectually, reduced the quantity of copper by a wide margin, reduced the manufacturing cost of product.
Drawings
Fig. 1 is a schematic structural diagram of the present invention.
Detailed Description
In order to make the technical solution of the present invention better understood by those skilled in the art, the present invention will be described in detail with reference to the accompanying drawings and the detailed description.
As shown in fig. 1, a new bimetal wire comprises an aluminum conductor 1, and a bonding layer 2, a copper layer 3 and a shielding layer 4 which are sequentially coated on the outer side of the aluminum conductor 1; the bonding layer 2 is a nickel layer and a zinc layer. The composite conductor material with the structure has a good antistatic function and a good shielding effect on the basis of good conductive performance, greatly reduces the consumption of copper, and reduces the manufacturing cost of products.
In this embodiment, the shielding layer 4 is PET resin doped with an antistatic agent, and the antistatic agent contains one or more of carbon black and activated carbon fibers. The PET resin doped with carbon black and activated carbon fibers can effectively reduce the generation and the transmission of static electricity, obviously enhance the conductivity and play a role in preventing static electricity.
In this embodiment, the diameter of the aluminum conductor 1 is 1.7-1.9mm.
In this embodiment, the thickness of the copper layer 3 is 0.15-0.35mm.
In this embodiment, the bonding layer 2 has a thickness of 0.003 to 0.005mm. So that a copper-bonding layer-aluminum double-phase melting layer is formed between the bonding layer and the aluminum core and between the bonding layer and the copper layer, the copper is tightly wrapped on the aluminum core, and the bonding strength of the whole copper-clad aluminum wire core structure is improved.
Finally, it should be noted that the above description is only a preferred embodiment of the present invention, and that those skilled in the art can make various similar representations without departing from the spirit and scope of the present invention.
Claims (4)
1. A new bimetallic wire is characterized in that: comprises an aluminum conductor (1), a bonding layer (2), a copper layer (3) and a shielding layer (4) which are sequentially coated on the outer side of the aluminum conductor (1); the bonding layer (2) is a nickel layer and a zinc layer.
2. The new bi-metallic wire of claim 1, wherein: the diameter of the aluminum conductor (1) is 1.7-1.9mm.
3. The new bi-metallic wire of claim 1, wherein: the thickness of the copper layer (3) is 0.15-0.35mm.
4. The new bi-metallic wire of claim 1, wherein: the thickness of the bonding layer (2) is 0.003-0.005mm.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202222226722.1U CN218631422U (en) | 2022-08-24 | 2022-08-24 | Novel bimetal wire |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202222226722.1U CN218631422U (en) | 2022-08-24 | 2022-08-24 | Novel bimetal wire |
Publications (1)
Publication Number | Publication Date |
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CN218631422U true CN218631422U (en) | 2023-03-14 |
Family
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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CN202222226722.1U Active CN218631422U (en) | 2022-08-24 | 2022-08-24 | Novel bimetal wire |
Country Status (1)
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CN (1) | CN218631422U (en) |
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2022
- 2022-08-24 CN CN202222226722.1U patent/CN218631422U/en active Active
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