CN218612283U

CN218612283U - Conducting material laser etching device

Info

Publication number: CN218612283U
Application number: CN202222363230.7U
Authority: CN
Inventors: 袁聪; 汪伟
Original assignee: Wuhan Tailai Technology Co ltd
Current assignee: Wuhan Tailai Technology Co ltd
Priority date: 2022-09-06
Filing date: 2022-09-06
Publication date: 2023-03-14
Anticipated expiration: 2032-09-06

Abstract

The utility model relates to a conducting material laser etching device, including box, mounting panel, telescopic link, mounting bracket, dwang and stop pin, the box upper end is provided with the mounting panel, mounting panel both sides side is provided with first movable block, first movable block upper end is provided with the mounting bracket, the box upper surface is provided with the installation piece, installation piece upper end is provided with the stop pin, the dwang has been cup jointed to the stop pin outer wall, the inside telescopic link that is provided with of dwang. The utility model discloses have the function of location work piece, solved current laser etching device and lacked the fixed problem of being processed the work piece function, when the shake that appears the workstation in the course of the work, the work piece can take place relative aversion with the device, leads to the etching result ideal as far as possible.

Description

Conducting material laser etching device

Technical Field

The utility model relates to a laser etching technical field, concretely relates to conducting material laser etching device.

Background

The method is a technology for etching a fine small groove with the width of ten to fifty microns and the depth of five to one thousand microns on the surface of a part by adopting a high-energy pulse laser beam so as to improve the surface lubrication characteristic of a material.

After mass search, it is found that the prior art is CN205074678U, and a laser etching apparatus is disclosed, the laser etching apparatus is used for patterning a conductive layer of a transparent conductive substrate, wherein the conductive layer has a plurality of operation areas for performing laser etching operation, and a connection interface is provided between two adjacent operation areas, the laser etching apparatus includes an operation platform, a laser light source module and an etching execution device, the laser light source module is positioned above the operation platform, and the etching execution device is disposed on the operation platform and used for transferring the transparent conductive substrate, so that the operation areas sequentially receive the laser etching operation applied by the laser light source module and drive the transparent conductive substrate to stop buffering, and in this way, an etching line segment in any etching pattern formed can have an extended etching length crossing the connection interface. The utility model provides a laser etching equipment can effectively improve the excessive etching phenomenon of picture joint area and connect the bad problem of opening a way between the picture interface.

In summary, the conventional laser etching apparatus lacks a function of fixing a workpiece to be processed, and when a worktable shakes during a working process, the workpiece and the apparatus may shift relative to each other, so that an etching result is not ideal.

SUMMERY OF THE UTILITY MODEL

The utility model provides a conducting material laser etching device has solved above technical problem.

The utility model provides a scheme as follows of above-mentioned technical problem: the utility model provides a conducting material laser etching device, includes box, mounting panel, telescopic link, mounting bracket, dwang and banking pin, the box upper end is provided with the mounting panel, mounting panel both sides side is provided with first movable block, first movable block upper end is provided with the mounting bracket, the box upper surface is provided with the installation piece, installation piece upper end is provided with the banking pin, the dwang has been cup jointed to the banking pin outer wall, the inside telescopic link that is provided with of dwang.

The utility model has the advantages that: this device utilizes the cooperation that has elastic dwang and telescopic link, can realize treating the quick location of photoetching work piece to the mounting panel top, prevents to influence laser etching's normal effect owing to accidental collision leads to the work piece to shift in the work.

On the basis of the technical scheme, the utility model discloses can also do following improvement.

Further, the box lower surface is provided with the base, the length of base is less than the width of box lower surface, the quantity of base is two, the mounting panel upper surface is provided with and is square array distribution the through-hole.

The beneficial effect of adopting the further scheme is that: the base is used for improving the stability of the device, and the through holes are used for facilitating the positioning of workpieces.

Further, the banking pin outer wall is provided with the spring, the spring with dwang looks adaptation.

The beneficial effect of adopting the further scheme is that: the effect of spring makes telescopic link and dwang lift upwards and can laminate with the mounting panel again after rotating, has the effect of better fixed work piece.

Further, the inside recess that is provided with of dwang, the telescopic link is installed inside the recess.

The beneficial effect of adopting the further scheme is that: the groove is used for installing the telescopic rod, so that the telescopic rod can fix workpieces with different sizes.

Further, a first guide rail is arranged on the upper surface of the box body, the first moving block is installed inside the first guide rail, a first motor is arranged on one side of the first moving block, and the first motor is matched with the first guide rail.

The beneficial effect of adopting the above further scheme is: the first motor can drive the first moving block to move in the first guide rail, and the longitudinal position adjusting effect of the laser head is achieved.

Further, the telescopic link deviates from dwang one end is provided with the stopper, the stopper with be provided with between the mounting panel upper surface the rubber pad.

The beneficial effect of adopting the further scheme is that: the stopper is the arc design, conveniently mentions, and the rubber pad can increase and install between frictional force, optimizes the location effect.

Further, a second guide rail is arranged inside the mounting frame, a second moving block is movably mounted inside the second guide rail, a second motor is arranged on one side of the second moving block, and the second motor is matched with the second guide rail.

The beneficial effect of adopting the above further scheme is: the second motor can drive the second moving block to move in the second guide rail, and the transverse position adjustment of the laser head is achieved.

The above description is only an overview of the technical solution of the present invention, and in order to make the technical means of the present invention clearer and can be implemented according to the content of the description, the following detailed description is made with reference to the preferred embodiments of the present invention and accompanying drawings. The detailed description of the present invention is given by the following examples and the accompanying drawings.

Drawings

The accompanying drawings, which are included to provide a further understanding of the invention and are incorporated in and constitute a part of this application, illustrate embodiment(s) of the invention and together with the description serve to explain the invention without undue limitation to the invention. In the drawings:

fig. 1 is a schematic three-dimensional view of a conductive material laser etching apparatus according to an embodiment of the present invention;

fig. 2 is a schematic view of a second moving block and a laser of a conductive material laser etching apparatus according to an embodiment of the present invention;

fig. 3 is a schematic top view of an apparatus for laser etching conductive material according to an embodiment of the present invention;

fig. 4 is a schematic view of a limiting block of a conductive material laser etching apparatus according to an embodiment of the present invention;

fig. 5 is a schematic view of a stop pin and a spring of a conductive material laser etching apparatus according to an embodiment of the present invention.

In the drawings, the components represented by the respective reference numerals are listed below:

1. a box body; 2. a through hole; 3. mounting a plate; 4. a telescopic rod; 5. a first motor; 6. a mounting frame; 7. rotating the rod; 8. a base; 9. a limit pin; 10. a spring; 11. a limiting block; 12. a rubber pad; 13. mounting blocks; 14. a first moving block; 15. a first guide rail; 16. a second guide rail; 17. a second motor; 18. a second moving block; 19. and (6) a laser head.

Detailed Description

The principles and features of the present invention are described below in conjunction with the accompanying fig. 1-5, the examples given are intended to illustrate the present invention and are not intended to limit the scope of the invention. The invention is described in more detail in the following paragraphs by way of example with reference to the accompanying drawings. The advantages and features of the present invention will become more fully apparent from the following description and appended claims. It should be noted that the drawings are in simplified form and are not to precise scale, and are provided for convenience and clarity in order to facilitate the description of the embodiments of the present invention.

It will be understood that when an element is referred to as being "secured to" another element, it can be directly on the other element or intervening elements may also be present. When a component is referred to as being "connected" to another component, it can be directly connected to the other component or intervening components may also be present. When a component is referred to as being "disposed on" another component, it can be directly on the other component or intervening components may also be present. The terms "vertical," "horizontal," "left," "right," and the like as used herein are for illustrative purposes only.

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used herein in the description of the invention is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.

As shown in fig. 1 to 5, the present invention provides an embodiment of a conductive material laser etching apparatus:

the device comprises a box body 1, a mounting plate 3, a telescopic rod 4, a mounting rack 6, a rotating rod 7 and limit nails 9, wherein the lower surface of the box body 1 is provided with a base 8, the length of the base 8 is smaller than the width of the lower surface of the box body 1, the number of the base 8 is two, the base 8 is used for improving the stability of the device, the upper end of the box body 1 is provided with the mounting plate 3, the upper surface of the mounting plate 3 is provided with through holes 2 distributed in a square array, the through holes 2 are used for facilitating the positioning of a workpiece, two sides of the mounting plate 3 are provided with first moving blocks 14, the upper end of each first moving block 14 is provided with the mounting rack 6, the upper surface of the box body 1 is provided with a mounting block 13, the upper end of each mounting block 13 is provided with the limit nail 9, the outer wall of the limit nail 9 is provided with a spring 10, the spring 10 is matched with the rotating rod 7, and the telescopic rod 4 and the rotating rod 7 can be attached to the mounting plate 3 again after being lifted and rotated upwards, the fixture has the advantages that the fixture has a good effect of fixing workpieces, the outer wall of the limit nail 9 is sleeved with the rotating rod 7, the telescopic rod 4 is arranged inside the rotating rod 7, the groove is formed inside the rotating rod 7, the telescopic rod 4 is installed inside the groove, the telescopic rod 4 can fix workpieces with different sizes, the end, away from the rotating rod 7, of the telescopic rod 4 is provided with the limit block 11, the rubber pad 12 is arranged between the limit block 11 and the upper surface of the installation plate 3, the limit block 11 is in an arc-shaped design and is convenient to lift, the friction force between the rubber pad 12 and the fixture can be increased, the positioning effect is optimized, in the scheme, the motion modes that the first motor 5 drives the first moving block 14 to move in the first guide rail 15 and the second motor 17 drives the second moving block 18 to move in the second guide rail 16 are both electromagnetic drive, the fixture belongs to the prior art, and are not described herein, and the laser head 19 in the device should be able to move up and down according to the conventional theory, and the design point is not in this, so it is not described in detail, but it does not represent that the laser head 19 in the present application lacks the corresponding moving property.

Preferably, the lower surface of the box body 1 is provided with a base 8, the length of the base 8 is smaller than the width of the lower surface of the box body 1, the number of the base 8 is two, the base 8 is used for improving the stability of the device, the upper surface of the mounting plate 3 is provided with through holes 2 distributed in a square array, and the through holes 2 are used for facilitating the positioning of workpieces.

Preferably, the 9 outer walls of spacing nail are provided with spring 10, spring 10 and dwang 7 looks adaptation, and spring 10's effect makes telescopic link 4 and dwang 7 can laminate with mounting panel 3 once more after upwards lifting the rotation, has the effect of better fixed work piece.

Preferably, the rotating rod 7 is internally provided with a groove, the telescopic rod 4 is arranged in the groove, and the groove is used for installing the telescopic rod 4, so that workpieces of different sizes can be fixed by the telescopic rod 4.

Preferably, the upper surface of the box body 1 is provided with a first guide rail 15, the first moving block 14 is installed inside the first guide rail 15, one side of the first moving block 14 is provided with a first motor 5, the first motor 5 is matched with the first guide rail 15, and the first motor 5 can drive the first moving block 14 to move inside the first guide rail 15, so that the longitudinal position adjusting effect of the laser head 19 is realized.

Preferably, telescopic link 4 deviates from 7 one ends of dwang and is provided with stopper 11, is provided with rubber pad 12 between stopper 11 and the 3 upper surfaces of mounting panel, and stopper 11 is the arc design, conveniently mentions, rubber pad 12 can increase and the device between frictional force, optimize location effect.

Preferably, a second guide rail 16 is arranged in the mounting frame 6, a second moving block 18 is movably mounted in the second guide rail 16, a second motor 17 is arranged on one side of the second moving block 18, the second motor 17 is matched with the second guide rail 16, and the second motor 17 can drive the second moving block 18 to move in the second guide rail 16, so that the transverse position of the laser head 19 is adjusted.

The utility model discloses a concrete theory of operation and application method do: this device utilizes the cooperation that has elastic dwang 7 and telescopic link 4, can realize the quick location of treating the photoetching work piece to mounting panel 3 top, prevents to influence laser etching's normal effect owing to accidental collision leads to the work piece to shift in the work, the utility model discloses have the function of location work piece, solved current laser etching device and lacked the problem of fixed work piece function of being processed, when the shake of workstation appears in the course of the work, the work piece can take place relative aversion with the device, leads to the etching result not ideal as far as possible.

The above description is only a preferred embodiment of the present invention, and is not intended to limit the present invention in any way; the present invention can be smoothly implemented by those skilled in the art according to the drawings and the above description; however, those skilled in the art should understand that changes, modifications and variations made by the above-described technology can be made without departing from the scope of the present invention, and all such changes, modifications and variations are equivalent embodiments of the present invention; meanwhile, any changes, modifications, evolutions, etc. of the above embodiments, which are equivalent to the actual techniques of the present invention, still belong to the protection scope of the technical solution of the present invention.

Claims

1. A laser etching device for conductive materials is characterized in that: including box (1), mounting panel (3), telescopic link (4), mounting bracket (6), dwang (7) and banking pin (9), box (1) upper end is provided with mounting panel (3), mounting panel (3) both sides side is provided with first movable block (14), first movable block (14) upper end is provided with mounting bracket (6), box (1) upper surface is provided with installation piece (13), installation piece (13) upper end is provided with banking pin (9), dwang (7) have been cup jointed to banking pin (9) outer wall, dwang (7) inside is provided with telescopic link (4).

2. The laser etching apparatus for conductive material according to claim 1, wherein: the box (1) lower surface is provided with base (8), the length of base (8) is less than the width of box (1) lower surface, the quantity of base (8) is two, mounting panel (3) upper surface is provided with through-hole (2) that are square array distribution.

3. The laser etching apparatus for conductive material according to claim 1, wherein: the outer wall of the limit pin (9) is provided with a spring (10), and the spring (10) is matched with the rotating rod (7).

4. The laser etching apparatus for conductive material according to claim 1, wherein: the inside recess that is provided with of dwang (7), telescopic link (4) are installed inside the recess.

5. The laser etching apparatus for conductive material according to claim 1, wherein: the upper surface of the box body (1) is provided with a first guide rail (15), the first moving block (14) is installed inside the first guide rail (15), one side of the first moving block (14) is provided with a first motor (5), and the first motor (5) is matched with the first guide rail (15).

6. The laser etching apparatus for conductive material according to claim 1, wherein: telescopic link (4) deviate from dwang (7) one end is provided with stopper (11), stopper (11) with be provided with rubber pad (12) between mounting panel (3) upper surface.

7. The laser etching apparatus for conductive material according to claim 1, wherein: the laser welding device is characterized in that a second guide rail (16) is arranged in the mounting frame (6), a second moving block (18) is movably mounted in the second guide rail (16), a second motor (17) is arranged on one side of the second moving block (18), the second motor (17) is matched with the second guide rail (16), and a laser head (19) is arranged at the lower end of the second moving block (18).