CN218601633U - Anti-interference cover plate and module - Google Patents
Anti-interference cover plate and module Download PDFInfo
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- CN218601633U CN218601633U CN202222126638.2U CN202222126638U CN218601633U CN 218601633 U CN218601633 U CN 218601633U CN 202222126638 U CN202222126638 U CN 202222126638U CN 218601633 U CN218601633 U CN 218601633U
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Abstract
The utility model discloses a jam-proof apron, including the apron base plate, the apron base plate includes the IC region corresponding with display panel's drive IC, be provided with the electromagnetic shield layer on the IC region. The anti-interference cover plate is attached to the display panel and can shield electromagnetic signals generated by a driving IC in the display panel. The utility model also discloses a module, including above-mentioned jam-proof apron.
Description
Technical Field
The utility model relates to a display technology especially relates to an jam-proof apron and module.
Background
The display panel comprises an upper substrate and a lower substrate which are arranged oppositely up and down, an upper polarizer is arranged on the outer surface of the upper substrate, a lower polarizer is arranged on the outer surface of the lower substrate, and a liquid crystal material is sealed between the upper substrate and the lower substrate; when the liquid crystal display panel works, a deflection electric field is applied to the liquid crystal material to deflect the liquid crystal material, so that light rays are driven to deflect, and the light rays can penetrate through the upper polarizer and the lower polarizer to be displayed. The display panel generally includes a display region and a non-display region, the lower substrate generally has a driving IC and a circuit board bound to the non-display region, the driving IC provides a driving voltage required for forming a deflection electric field, and the circuit board connects the driving IC to an external controller and a power source.
In intelligent communication equipment such as a mobile phone and the like, when a driving IC of a display panel works, an internal clock circuit and a booster circuit can generate electromagnetic signals, radio frequency interference is caused to a radio frequency module of the mobile phone, the EMI problem is generated, and the communication function of the mobile phone is further influenced.
Chinese patent No. CN201721616012.2 discloses a display panel with low radio frequency interference, in which a driver IC is bound on one side and connected to a circuit board, the driver IC and the circuit board are adhered with copper foils, and the copper foils and the circuit board are electrically connected to ground. The display panel is characterized in that a layer of copper foil covers the drive IC to form an EMI shielding layer, so that a clock circuit and a booster circuit in the drive IC and interference signals generated by signal circuits in the circuit board in the working and electrifying process can be cut off, and the interference signals are prevented from leaking to generate radio frequency interference on radio frequency modules of intelligent communication terminals such as mobile phones.
However, with the development of the light and thin display panel, the driver IC is thin, the thickness is only about 150um, the occupied area is small, the size is only about 30000 × 1000um, the lower substrate binding the driver IC is also thin, the thickness is only about 150um, when the copper foil is attached to the driver IC, extreme care is required, the operation cannot be performed too fast, otherwise the driver IC and the lower substrate are easily fractured by improper force, and the display panel is discarded.
SUMMERY OF THE UTILITY MODEL
In order to solve the defects of the prior art, the utility model provides an anti-interference cover plate which is used for being attached to a display panel and can shield the electromagnetic signal generated by a drive IC in the display panel.
The utility model also provides a module, including above-mentioned jam-proof cover plate.
The utility model discloses the technical problem that will solve realizes through following technical scheme:
an anti-interference cover plate comprises a cover plate substrate, wherein the cover plate substrate comprises an IC area corresponding to a drive IC of a display panel, and an electromagnetic shielding layer is arranged on the IC area.
Further, the cover substrate further comprises a visible area and a frame area, wherein the frame area surrounds the visible area; the IC area is arranged in the frame area, the frame area is arranged on the frame ink layer, and the electromagnetic shielding layer is attached to the frame ink layer.
Further, the electromagnetic shielding layer at least comprises a metal film layer.
Furthermore, the electromagnetic shielding layer further comprises an adhesive layer, and the adhesive layer is arranged on one surface of the metal film layer facing the cover plate substrate.
Furthermore, the electromagnetic shielding layer further comprises a gasket layer, and the gasket layer is arranged on one surface of the metal film layer, which faces away from the cover plate substrate.
Further, the cover plate substrate is provided with a bonding alignment mark on the periphery of the IC area, and the bonding alignment mark is used for framing the range of the IC area.
Furthermore, the electromagnetic shielding layer is an electromagnetic target plating layer.
A module comprises a display panel and the anti-interference cover plate, wherein the anti-interference cover plate is attached to the display panel; and a driving IC is bound on one surface of the display panel facing the anti-interference cover plate, and the projection range of the electromagnetic shielding layer on the display panel covers the driving IC.
Further, the projection range of the electromagnetic shielding layer on the display panel exceeds the driving IC.
Further, the thickness of the cover substrate is greater than that of the lower substrate of the display substrate.
The utility model discloses following beneficial effect has: the electromagnetic shielding layer corresponding to the driving IC of the display panel is arranged on the anti-interference cover plate, although the electromagnetic shielding layer is not directly arranged on the driving IC of the display panel, after the anti-interference cover plate is attached to the display panel, the distance between the anti-interference cover plate and the driving IC on the display panel is very small, the anti-interference cover plate can also play a role in stopping shielding electromagnetic signals generated by the driving IC, so that the electromagnetic signals generated by the driving IC are prevented from interfering radio frequency modules of terminals such as mobile phones, the communication quality is ensured, the driving IC and the display panel are not arranged, the electromagnetic shielding layer is attached to the driving IC and the display panel, the problem of pressure breakage is solved, and the product yield can be improved.
Drawings
In order to illustrate the solution of the present application more clearly, the drawings that are needed in the description of the embodiments will be briefly described below, and it is obvious that the drawings in the following description are some embodiments of the present application, and that other drawings can be obtained by those skilled in the art without inventive effort.
Fig. 1 is a schematic front view of an interference-proof cover plate according to the present invention;
fig. 2 is a schematic cross-sectional view of the interference-proof cover plate provided by the present invention;
fig. 3 is a schematic diagram of alignment marks in the anti-interference cover plate provided by the present invention;
fig. 4 is a schematic cross-sectional view of the module according to the present invention.
Detailed Description
The invention is described in detail below with reference to the drawings and embodiments, examples of which are illustrated in the drawings, wherein like or similar reference numerals refer to like or similar elements or elements having like or similar functions throughout. The embodiments described below with reference to the drawings are exemplary and intended to be used for explaining the present invention, and should not be construed as limiting the present invention.
In the description of the present invention, it is to be understood that the terms "length," "width," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like are used in the orientation or positional relationship indicated in the drawings for convenience in describing the present invention and for simplicity in description, and are not intended to indicate or imply that the device or element so referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus should not be construed as limiting the present invention.
Furthermore, the terms "first", "second", "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first," "second," or "third" may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless specifically limited otherwise.
In the present invention, unless otherwise expressly stated or limited, the terms "mounted," "connected," "secured," and "disposed" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral part; can be mechanically or electrically connected; they may be directly connected or indirectly connected through intervening media, or may be connected through the interconnection of two elements or through the interaction of two elements. The specific meaning of the above terms in the present invention can be understood according to specific situations by those skilled in the art.
Example one
An interference-proof cover plate, as shown in fig. 1 and 2, includes a cover plate substrate 11, the cover plate substrate 11 includes an IC region 103 corresponding to a driving IC of a display panel, and an electromagnetic shielding layer 13 is disposed on the IC region 103.
The electromagnetic shielding layer 13 corresponding to the driving IC of the display panel is arranged on the anti-interference cover plate, although the electromagnetic shielding layer 13 is not directly arranged on the driving IC of the display panel, after the anti-interference cover plate is attached to the display panel, the distance between the anti-interference cover plate and the driving IC on the display panel is very small, the anti-interference cover plate can also play a role of shielding the electromagnetic signal generated by the driving IC, so that the electromagnetic signal generated by the driving IC is prevented from interfering the radio frequency modules of terminals such as mobile phones, the communication quality is ensured, the problem that the driving IC and the display panel are pressed and broken when the electromagnetic shielding layer 13 is attached to the driving IC and the display panel is solved, and the product yield can be improved.
The cover substrate 11 further comprises a visible area 101 and a frame area 102, wherein the frame area 102 surrounds the visible area 101; the visible region 101 corresponds to a display region of the display panel, and the bezel region 102 corresponds to a non-display region of the display panel.
When the anti-interference cover plate is attached to the display panel, the visible region 101 of the cover plate substrate 11 is attached to the display region of the display panel, and the frame region 102 of the cover plate substrate 11 is attached to the non-display region of the display panel.
The cover plate substrate 11 is provided with a frame ink layer 12 on the frame region 102, the frame ink layer 12 is generally black ink, and may also be white ink, red ink, blue ink, or the like, which may be determined according to customer requirements, and the color of the frame ink layer 12 is not limited herein.
The IC region 103 is disposed in the frame region 102, and the electromagnetic shielding layer 13 is disposed on the frame ink layer 12.
Example two
As an optimization solution of the first embodiment, in the present embodiment, as shown in fig. 2, the electromagnetic shielding layer 13 includes a metal film layer 132, an adhesive layer 131 and a gasket layer 133, the adhesive layer 131 is disposed on one surface of the metal film layer 132 facing the cover substrate 11, and the gasket layer 133 is disposed on one surface of the metal film layer 132 opposite to the cover substrate 11.
The metal film layer 132 is the core of the electromagnetic shielding layer 13, and plays a role of electromagnetic shielding, and is preferably, but not limited to, a copper foil; the adhesive layer 131 is used for attaching the electromagnetic shielding layer 13 to the cover substrate 11, and is preferably, but not limited to, an insulating adhesive; the gasket layer 133 is used to protect the metal film layer 132, and is preferably, but not limited to, a PET gasket.
As shown in fig. 3, the cover substrate 11 is provided with an attachment alignment mark 14 on the periphery of the IC region 103, and the attachment alignment mark 14 is used for framing the range of the IC region 103 so as to allow a technician or a machine vision system to recognize and align when attaching the electromagnetic shielding layer 13.
The attaching alignment mark 14 is also formed on the frame ink layer 12, the attaching alignment mark 14 is generally white ink, and may also be black ink, blue ink, red ink, or the like, and the color of the attaching alignment mark 14 is not limited herein according to actual production requirements, however, the color of the attaching alignment mark 14 should be different from the color of the frame ink layer 12, and the larger the visual difference is, the better the visual difference is.
The cover substrate 11 may be, but is not limited to, a glass substrate, a plastic substrate, or a sapphire substrate, and preferably, the rigidity thereof is increased by a strengthening process to improve the rigid supporting capability thereof.
The preparation method of the anti-interference cover plate comprises the following steps:
step one, cleaning the cover plate substrate 11 by adopting deionized water and ultrasonic waves, and then drying the cover plate substrate 11;
step two, adopting a silk-screen printing plate to silk-screen frame ink on a frame area 102 of the cover plate substrate 11 to form a frame ink layer 12, and then drying and curing the frame ink layer 12;
step three, adopting a silk-screen printing plate to print marking ink on the frame ink layer 12 of the IC area 103 of the cover plate substrate 11 in a silk-screen manner to form a bonding alignment mark 14, and then drying and curing the bonding alignment mark 14;
and fourthly, tearing off the release film from the prefabricated electromagnetic shielding layer 13, and attaching the electromagnetic shielding layer to the IC area 103 of the cover plate substrate 11, or sequentially attaching the adhesive layer 131, the metal film layer 132 and the gasket layer 133 to the IC area 103 of the cover plate substrate 11 in an aligned manner to form the electromagnetic shielding layer 13.
EXAMPLE III
As an optimized solution of the first embodiment, in this embodiment, the electromagnetic shielding layer 13 is an electromagnetic target plating layer.
The electromagnetic shielding layer 13 is formed directly on the IC region 103 by an electromagnetic target through a vacuum sputtering process.
The electromagnetic target material may be, but is not limited to, a gold target material, a silver target material, a copper target material, or the like.
The preparation method of the anti-interference cover plate comprises the following steps:
step one, cleaning the cover plate substrate 11 by adopting deionized water and ultrasonic waves, and then drying the cover plate substrate 11;
step two, adopting a silk-screen printing plate to print frame ink on a frame area 102 of the cover plate substrate 11 to form a frame ink layer 12, and then drying and curing the frame ink layer 12;
step three, printing marking ink on the frame ink layer 12 of the IC area 103 of the cover plate substrate 11 by adopting a screen printing plate in a screen printing manner to form a bonding alignment mark 14, and then drying and curing the bonding alignment mark 14;
step four, shielding other areas except the IC area 103 on the cover plate substrate 11 by using a mask, and directly forming an electromagnetic target on the IC area 103 by using a vacuum sputtering process;
step five: the mask on the cover substrate 11 is peeled off.
Example four
A module, as shown in fig. 4, includes a display panel 2 and an anti-interference cover plate 1 described in the first embodiment, the second embodiment or the third embodiment, wherein the anti-interference cover plate 1 is attached to the display panel 2; a driving IC 26 is bound on one surface of the display panel 2 facing the anti-interference cover plate 1, and a projection range of the electromagnetic shielding layer 13 on the display panel 2 covers the driving IC 26.
Because the electromagnetic shielding layer 13 is not directly attached to the driver IC 26, and a gap exists between the electromagnetic shielding layer and the driver IC 26, a part of the electromagnetic signal generated by the driver IC 26 can be leaked from the gap at a certain angle, and therefore, preferably, the projection range of the electromagnetic shielding layer 13 on the display panel 2 exceeds the driver IC 26, for example, the length of the driver IC 26 is 30000 μm, the width of the driver IC 26 is 1000um, and the length of the electromagnetic shielding layer 13 is greater than 30000 μm, and the width of the electromagnetic shielding layer is greater than 1000um.
The module utilizes the advantage that the area of the anti-interference cover plate 1 is large, and the area of the electromagnetic shielding layer 13 is enlarged to enlarge the signal shielding cut-off range and make up the problem that electromagnetic signals are leaked due to the gap between the electromagnetic shielding layer 13 and the drive IC 26.
The anti-interference cover plate 1 is completely attached to the display panel 2 through OCA glue; the display panel 2 comprises an upper substrate 21, a lower substrate 22, an upper polarizer 23 and a lower polarizer 24, wherein the upper substrate 21 and the lower substrate 22 are relatively sealed through a sealing rubber frame 25; the upper polarizer 23 is attached to one surface of the upper substrate 21, which faces away from the lower substrate 22, and the lower polarizer 24 is attached to one surface of the lower substrate 22, which faces away from the upper substrate 21; the space enclosed and sealed among the upper substrate 21, the lower substrate 22 and the sealant frame 25 is filled with a liquid crystal material.
The display panel 2 includes a display area and a non-display area, wherein an area located inside the sealant frame 25 is the display area of the display panel 2, and an area located outside the sealant frame 25 is the non-display area of the display panel 2.
The non-display area is provided with a single-layer substrate area 220, the single-layer substrate area 220 is formed by extending one side of the lower substrate 22 to the outside of the upper substrate 21, and after the anti-interference cover plate 1 is attached to the display panel 2, the frame area 102 of the anti-interference cover plate 1 and the single-layer substrate area 220 of the display panel 2 are suspended (not contacted); a bonding region is provided in the single-layer substrate region 220, and the driver IC 26 is provided on the bonding region.
The thickness of the cover substrate 11 is greater than the thickness of the lower substrate 22 of the display substrate, for example, the thickness of the lower substrate 22 is about 150 μm, and the thickness of the cover substrate 11 is greater than 150 μm.
By utilizing the advantages of large thickness and capability of bearing larger pressure of the cover plate substrate 11, the electromagnetic shielding layer 13 is attached to the cover plate substrate 11, so that the risk of pressure fracture of the cover plate substrate 11 is small compared with the scheme that the electromagnetic shielding layer 13 is directly attached to the driving IC 26 in the prior art; the cover substrate 11 may be strengthened to increase its rigidity, and the lower substrate 22 may not be strengthened due to the need of fabricating circuits.
Finally, it should be noted that the above embodiments are only used for illustrating the technical solutions of the embodiments of the present invention and not for limiting the same, and although the embodiments of the present invention are described in detail with reference to the preferred embodiments, it should be understood by those skilled in the art that the technical solutions of the embodiments of the present invention can still be modified or replaced with equivalents, and these modifications or equivalent replacements cannot make the modified technical solutions depart from the scope of the technical solutions of the embodiments of the present invention.
Claims (9)
1. An anti-interference cover plate comprises a cover plate substrate, and is characterized in that the cover plate substrate comprises an IC area corresponding to a drive IC of a display panel, and an electromagnetic shielding layer is arranged on the IC area; the cover plate substrate further comprises a visible area and a frame area, the frame area surrounds the periphery of the visible area, and the frame area is arranged on the frame ink layer; the IC area is arranged in the frame area, and the electromagnetic shielding layer is attached to the frame ink layer.
2. The tamper-proof cover sheet of claim 1 wherein the electromagnetic shielding layer comprises at least a metal film layer.
3. The tamper-proof cover plate of claim 2, wherein the electromagnetic shielding layer further comprises an adhesive layer disposed on a surface of the metal film layer facing the cover plate substrate.
4. The tamper-proof cover plate of claim 2 or 3, wherein the electromagnetic shielding layer further comprises a gasket layer disposed on a side of the metal film layer facing away from the cover plate substrate.
5. The tamper-proof cover of claim 1, wherein the cover substrate is provided with attachment alignment marks on a periphery of the IC area, the attachment alignment marks being used to outline an extent of the IC area.
6. The tamper-proof cover plate of claim 1, wherein the electromagnetic shielding layer is an electromagnetic target plating.
7. A module comprising a display panel and the tamper-proof cover of any one of claims 1-6, the tamper-proof cover being attached to the display panel; and a driving IC is bound on one surface of the display panel facing the anti-interference cover plate, and the projection range of the electromagnetic shielding layer on the display panel covers the driving IC.
8. The module of claim 7, wherein a projection range of the electromagnetic shielding layer on the display panel exceeds the driving IC.
9. The module of claim 7, wherein the cover substrate thickness is greater than the lower substrate thickness of the display substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222126638.2U CN218601633U (en) | 2022-08-12 | 2022-08-12 | Anti-interference cover plate and module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222126638.2U CN218601633U (en) | 2022-08-12 | 2022-08-12 | Anti-interference cover plate and module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN218601633U true CN218601633U (en) | 2023-03-10 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202222126638.2U Active CN218601633U (en) | 2022-08-12 | 2022-08-12 | Anti-interference cover plate and module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN218601633U (en) |
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2022
- 2022-08-12 CN CN202222126638.2U patent/CN218601633U/en active Active
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