CN218593867U - Metallized polymer film with multilayer structure - Google Patents
Metallized polymer film with multilayer structure Download PDFInfo
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- CN218593867U CN218593867U CN202222010811.2U CN202222010811U CN218593867U CN 218593867 U CN218593867 U CN 218593867U CN 202222010811 U CN202222010811 U CN 202222010811U CN 218593867 U CN218593867 U CN 218593867U
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- 229920006254 polymer film Polymers 0.000 title claims abstract description 33
- 239000010410 layer Substances 0.000 claims abstract description 166
- 229920000642 polymer Polymers 0.000 claims abstract description 49
- 229910052751 metal Inorganic materials 0.000 claims abstract description 47
- 239000002184 metal Substances 0.000 claims abstract description 47
- 239000011241 protective layer Substances 0.000 claims abstract description 23
- 238000001125 extrusion Methods 0.000 claims description 29
- 229920002430 Fibre-reinforced plastic Polymers 0.000 claims description 4
- 239000011151 fibre-reinforced plastic Substances 0.000 claims description 4
- 239000012792 core layer Substances 0.000 claims description 2
- 238000004519 manufacturing process Methods 0.000 abstract description 6
- 238000001465 metallisation Methods 0.000 abstract description 6
- 229920005597 polymer membrane Polymers 0.000 abstract description 6
- 230000002349 favourable effect Effects 0.000 abstract 1
- -1 polypropylene Polymers 0.000 description 18
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 10
- WHXSMMKQMYFTQS-UHFFFAOYSA-N Lithium Chemical compound [Li] WHXSMMKQMYFTQS-UHFFFAOYSA-N 0.000 description 6
- 239000004793 Polystyrene Substances 0.000 description 6
- 239000011888 foil Substances 0.000 description 6
- 229910052744 lithium Inorganic materials 0.000 description 6
- 239000000463 material Substances 0.000 description 6
- 238000000034 method Methods 0.000 description 6
- 229920002223 polystyrene Polymers 0.000 description 6
- 238000007738 vacuum evaporation Methods 0.000 description 6
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 5
- YKTSYUJCYHOUJP-UHFFFAOYSA-N [O--].[Al+3].[Al+3].[O-][Si]([O-])([O-])[O-] Chemical compound [O--].[Al+3].[Al+3].[O-][Si]([O-])([O-])[O-] YKTSYUJCYHOUJP-UHFFFAOYSA-N 0.000 description 5
- 239000011521 glass Substances 0.000 description 5
- 229910052759 nickel Inorganic materials 0.000 description 5
- 239000004698 Polyethylene Substances 0.000 description 4
- 239000004743 Polypropylene Substances 0.000 description 4
- 239000000835 fiber Substances 0.000 description 4
- 229920001707 polybutylene terephthalate Polymers 0.000 description 4
- 229920000573 polyethylene Polymers 0.000 description 4
- 229920000139 polyethylene terephthalate Polymers 0.000 description 4
- 239000005020 polyethylene terephthalate Substances 0.000 description 4
- 229920001721 polyimide Polymers 0.000 description 4
- 229920001155 polypropylene Polymers 0.000 description 4
- 229920000915 polyvinyl chloride Polymers 0.000 description 4
- 239000004800 polyvinyl chloride Substances 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 238000009713 electroplating Methods 0.000 description 3
- 238000011065 in-situ storage Methods 0.000 description 3
- 238000002161 passivation Methods 0.000 description 3
- 238000005240 physical vapour deposition Methods 0.000 description 3
- 238000002360 preparation method Methods 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 238000001755 magnetron sputter deposition Methods 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 2
- 239000004810 polytetrafluoroethylene Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- QPLDLSVMHZLSFG-UHFFFAOYSA-N Copper oxide Chemical compound [Cu]=O QPLDLSVMHZLSFG-UHFFFAOYSA-N 0.000 description 1
- 239000005751 Copper oxide Substances 0.000 description 1
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- 229910000990 Ni alloy Inorganic materials 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- WGLPBDUCMAPZCE-UHFFFAOYSA-N Trioxochromium Chemical compound O=[Cr](=O)=O WGLPBDUCMAPZCE-UHFFFAOYSA-N 0.000 description 1
- 239000006230 acetylene black Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000002134 carbon nanofiber Substances 0.000 description 1
- 229910021393 carbon nanotube Inorganic materials 0.000 description 1
- 239000002041 carbon nanotube Substances 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011651 chromium Substances 0.000 description 1
- 229910000423 chromium oxide Inorganic materials 0.000 description 1
- 229910000428 cobalt oxide Inorganic materials 0.000 description 1
- IVMYJDGYRUAWML-UHFFFAOYSA-N cobalt(ii) oxide Chemical compound [Co]=O IVMYJDGYRUAWML-UHFFFAOYSA-N 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 229910000431 copper oxide Inorganic materials 0.000 description 1
- 238000007607 die coating method Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000010894 electron beam technology Methods 0.000 description 1
- 238000004880 explosion Methods 0.000 description 1
- 238000007765 extrusion coating Methods 0.000 description 1
- 229910021389 graphene Inorganic materials 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 239000011229 interlayer Substances 0.000 description 1
- 239000003273 ketjen black Substances 0.000 description 1
- 238000010329 laser etching Methods 0.000 description 1
- 238000004093 laser heating Methods 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 239000005435 mesosphere Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical class C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910000480 nickel oxide Inorganic materials 0.000 description 1
- 229910001000 nickel titanium Inorganic materials 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- GNRSAWUEBMWBQH-UHFFFAOYSA-N oxonickel Chemical compound [Ni]=O GNRSAWUEBMWBQH-UHFFFAOYSA-N 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 239000002861 polymer material Substances 0.000 description 1
- 238000003672 processing method Methods 0.000 description 1
- 239000002096 quantum dot Substances 0.000 description 1
- 230000003014 reinforcing effect Effects 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
Images
Classifications
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
- Y02E60/10—Energy storage using batteries
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Abstract
The utility model discloses a metallization polymer film with multilayer structure belongs to conductive film production technical field, the sandwich layer of metallization polymer film is the polymer layer, is equipped with the metal level on two upper and lower surfaces of polymer layer respectively, keeps away from the polymer layer on the metal level be equipped with the protective layer on the surface. In order to improve the interface bonding strength, dovetail grooves are formed on the upper surface and the lower surface of the polymer layer, and a sawtooth-shaped structure is arranged on the surface, far away from the polymer layer, of the metal layer. The utility model discloses a metallization polymer membrane weight greatly reduced has realized the lightweight, and bonding strength is high between the while layer, consequently is favorable to the later stage of product to use.
Description
Technical Field
The utility model belongs to the technical field of conductive film production, concretely relates to metallization polymer film with multilayer structure.
Background
In the fields of printing, electrical and electronic, packaging and the like, metal foils are required to be used to realize corresponding functions by utilizing the conductive performance of the metal foils. Although the traditional metal foil has excellent conductivity, the metal has high density and heavy weight, and is difficult to realize light weight, so that the weight of the product can be greatly increased; meanwhile, the metal foil has strong high-temperature resistance and cannot shrink in volume at higher temperature, for example, when the metal foil is used as a current collector of a lithium battery, a large amount of heat is generated when a short circuit occurs due to a lithium battery fault, the metal foil cannot shrink in volume, the short circuit area cannot be reduced, and therefore the occurrence of short circuit cannot be inhibited, and accidents such as explosion and fire disasters of the lithium battery are easily caused.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a metallized polymer membrane with multilayer structure to solve the technical problem who mentions in the above-mentioned background art.
In order to achieve the above object, the present invention discloses a metallized polymer film having a multilayer structure, wherein a core layer of the metallized polymer film is a polymer layer, a metal layer is respectively disposed on an upper surface and a lower surface of the polymer layer, and a protective layer is disposed on a surface of the metal layer away from the polymer layer.
Furthermore, dovetail grooves are respectively formed in the upper surface and the lower surface of the polymer layer, and a part of the metal layer is embedded into the dovetail grooves. In order to better implement the technical means in the actual production, preferably, a laser etching method is adopted to respectively open a plurality of dovetail grooves which are arranged in parallel on the upper surface and the lower surface of the polymer layer, the intervals among the plurality of dovetail grooves are the same, the depth of each dovetail groove is 0.1-3 mu m, the width of the bottom of each dovetail groove is 0.1-2.5 mu m, and the width of the opening at the top of each dovetail groove is 0.05-2.0 mu m.
Furthermore, a sawtooth structure is arranged on the surface, far away from the polymer layer, of the metal layer, and a part of the protective layer is embedded into the sawtooth structure.
Further, the thickness of the polymer layer is 1-20 [ mu ] m. The polymer layer can be selected from a polypropylene film, a polyethylene terephthalate film, a polybutylene terephthalate film, a polyethylene film, a polyimide film, a polystyrene film, a polyvinyl chloride film or a polytetrafluoroethylene film, and the like, is used as a carrier of the metallized polymer film, and takes the rear end application requirements of the metallized polymer film into consideration, the difficulty and the cost of the preparation process into consideration, and the preferred thickness of the polymer layer is 1-20 mu m.
Further, the thickness of the metal layer is 20-2000nm. The metal layer is made of copper, copper alloy, aluminum alloy, nickel alloy, titanium or silver and the like, and is prepared by physical vapor deposition (such as resistance heating vacuum evaporation, electron beam heating vacuum evaporation, laser heating vacuum evaporation, magnetron sputtering and the like), electroplating or chemical plating and the like. The metal layers are positioned on two sides of the polymer layer, and the materials of the two metal layers are consistent and are used for conducting or blocking.
When physical vapor deposition, electroplating or chemical plating is carried out, the metal layer is arranged to be the surface with the sawtooth-shaped structure, and then the next preparation of the protective layer is carried out.
Further, the thickness of the protective layer is 10-150nm. The protective layer is made of nickel, chromium, nickel-based alloy, copper oxide, aluminum oxide, nickel oxide, chromium oxide, cobalt oxide, graphite, carbon black, acetylene black, ketjen black, carbon nano quantum dots, carbon nano tubes, carbon nano fibers or graphene. The preparation method of the protective layer is physical vapor deposition, in-situ forming or coating and the like. Wherein the vapor deposition method is preferably vacuum evaporation and magnetron sputtering; in-situ forming is preferably a method for forming a metal oxide passivation layer on the surface of the metal layer in situ; the coating method is preferably die coating, blade coating or extrusion coating.
The two protective layers positioned outside the metal layer can be made of the same or different materials, and the thicknesses can be the same or different. The protective layer functions to prevent the metal conductive layer from being chemically corroded or physically damaged.
Further, when the protective layer is used as a current collector for conducting electricity in a lithium battery, the thickness of the protective layer is not more than 1/10 of the thickness of the metal layer.
Further, the polymer layer sequentially comprises a middle layer, a first co-extrusion film layer and a second co-extrusion film layer, wherein the first co-extrusion film layer and the second co-extrusion film layer are respectively arranged on the upper surface and the lower surface of the middle layer.
Further, the intermediate layer is an insulating fiber reinforced polymer layer.
Furthermore, the thickness of the middle layer is larger than the thickness of the first co-extrusion film layer and the second co-extrusion film layer.
Compared with the prior art, the utility model discloses a metallized polymer membrane with multilayer structure has following advantage:
(1) The utility model discloses well metallized polymer film's sandwich layer structure is polymer materials, and for metal material, density is less, therefore the weight greatly reduced of product can satisfy light-weighted user demand.
(2) The utility model discloses well metallized polymer membrane uses the polymer as the sandwich layer, when the mass flow body that is used as the lithium cell, its volume shrink can take place after being heated, reduces the short circuit area to can restrain the short circuit, reduce the probability that the lithium cell explodes and the fire incident.
(3) The utility model discloses well metallized polymer membrane is provided with the dovetail on the upper and lower surface on polymer layer, is equipped with the sawtooth structure on the metal level, therefore in some meeting embedding dovetail of metal level, in some meeting embedding sawtooth structure of protective layer, can improve the bonding strength between the metallized polymer membrane mesosphere greatly, avoid appearing the phenomenon that the layer is peeled off between the layer.
(4) The utility model discloses in well metallization polymer film, the polymer layer can set up to multilayer structure, and the intermediate level on polymer layer is the polymer layer of insulating fiber reinforcing, and its mechanical strength and heat altered shape temperature are greater than the first crowded rete altogether and the second crowded rete altogether that set up in the intermediate level both sides, can be in metallization polymer film thermal deformation time division gradient take place thermal deformation, and the interlaminar peel strength when can effectively improve the heat altered shape.
(5) The metallized polymer film of the utility model has simple structure, simple processing method and easy mass production.
Drawings
FIG. 1: a schematic of the structure of the metallized polymer film having a multilayer structure in example 1.
FIG. 2: a schematic of the structure of the metallized polymer film having a multilayer structure in example 2.
Wherein, 1, a polymer layer; 2. a metal layer; 3. a protective layer; 4. a dovetail groove; 5. a saw-toothed structure; 6. an intermediate layer; 7. a first co-extruded film layer; 8. and a second co-extruded film layer.
Detailed Description
The technical scheme of the invention is explained in detail by specific examples and comparative examples.
Example 1
A metallized polymer film with a multilayer structure is an A/B/C/B/A type structure and sequentially comprises a polymer layer 1, a metal layer 2 and a protective layer 3 from inside to outside, wherein the layer A is the protective layer 3, the layer B is the metal layer 2, the layer C is the polymer layer 1, the metal layer 2 is respectively arranged on the upper surface and the lower surface of the polymer layer 1, and the protective layer 3 is arranged on the surface, far away from the polymer layer 1, of the metal layer 2.
The polymer layer 1 may be a polypropylene film, a polyethylene terephthalate film, a polybutylene terephthalate film, a polyethylene film, a polyimide film, a polystyrene film, a polyvinyl chloride film, a polytetrafluoroethylene film, or the like, according to a practical application scenario.
The two metal layers 2 on the upper and lower surfaces of the polymer layer 1 are made of the same material, are made of copper, and are plated on the upper and lower surfaces of the polymer layer 1 by adopting an electroplating process.
The two protective layers 3 positioned on the outer side of the metal layer 2 are made of the same material and are both nickel, and the vacuum evaporation process is adopted to evaporate the nickel to the outer side of the metal layer 2.
The thickness of the polymer layer 1 is 10 μm; the thicknesses of the two metal layers 2 are the same and are both 100nm; the two protective layers 3 are also of the same thickness, both 8nm.
Seted up many parallel arrangement's dovetail 4 on two upper and lower surfaces of polymer layer 1 respectively, interval between many dovetails 4 is the same, and the degree of depth of dovetail 4 is 0.5 mu m, and the bottom width of dovetail 4 is 0.8 mu m, and the top opening part width of dovetail 4 is 0.6 mu m. On the surface of the metal layer 2 remote from the polymer layer 1, a sawtooth structure 5 is provided.
A part of copper in the metal layer 2 is electroplated and embedded into a dovetail groove 4 arranged on the polymer layer 1, so that the interface bonding strength between the metal layer 2 and the polymer layer 1 can be increased; similarly, a part of the nickel in the passivation layer 3 is embedded on the surface of the saw-toothed structure 5 on the metal layer 2 by vacuum evaporation, so that the interface bonding strength between the passivation layer 2 and the metal layer 3 is increased.
Example 2
A metallized polymer film having a multilayer structure, substantially the same as the structure of example 1, except that:
the polymer layer 1 has a multilayer structure, and specifically, the polymer layer 1 sequentially includes an intermediate layer 6, and a first co-extrusion film layer 7 and a second co-extrusion film layer 8 respectively disposed on the upper and lower surfaces of the intermediate layer 6 from inside to outside.
The middle layer 6, the first co-extrusion film layer 7 and the second co-extrusion film layer 8 are prepared by adopting a multi-layer co-extrusion process.
Wherein the intermediate layer 6 is an insulating fiber reinforced polymer layer, i.e. in the intermediate layer 6, comprising polymer and insulating fibers 9, the insulating fibers 9 are uniformly dispersed in the polymer, forming a fiber reinforced polymer structure.
Specifically, the intermediate layer 6 is a glass fiber-reinforced polyethylene terephthalate film layer, a glass fiber-reinforced polybutylene terephthalate film layer, a glass fiber-reinforced polystyrene film layer, a glass fiber-reinforced polyvinyl chloride film layer, a glass fiber-reinforced polyimide film layer, an aluminum silicate fiber-reinforced polyethylene terephthalate film layer, an aluminum silicate fiber-reinforced polybutylene terephthalate film layer, an aluminum silicate fiber-reinforced polystyrene film layer, an aluminum silicate fiber-reinforced polyvinyl chloride film layer, an aluminum silicate fiber-reinforced polyimide film layer, or the like.
The first co-extrusion film layer 7 is a polyethylene film layer, a polypropylene film layer or a polystyrene film layer, the second co-extrusion film layer 8 is a polyethylene film layer, a polypropylene film layer or a polystyrene film layer, and the first co-extrusion film layer 7 and the second co-extrusion film layer 8 can be made of the same material or different materials.
The thickness of the middle layer 6 is larger than the thickness of the first co-extrusion film layer 7 and the second co-extrusion film layer 8, and the thickness of the first co-extrusion film layer 7 and the thickness of the second co-extrusion film layer 8 can be equal or unequal.
In this way, in the polymer layer 1, the intermediate layer 6 is reinforced by the insulating fibers, so the mechanical strength is higher, meanwhile, the thermal deformation temperature of the polymer for manufacturing the intermediate layer 6 is higher than that of the polymer for manufacturing the first co-extrusion film layer 7 and the second co-extrusion film layer 8, when the metallized polymer film is heated, the polymer layer 1 is subjected to thermal deformation in a gradient manner, and the first co-extrusion film layer 7 and the second co-extrusion film layer 8 with low thermal deformation temperature are deformed first. The mechanism of thermal deformation of the gradient can prevent the metallized polymer film from shrinking rapidly once being heated, thereby avoiding the stripping of the layers of the metallized polymer film with a multilayer structure, improving the stripping strength of the layers and ensuring the service performance of the metallized polymer film with the multilayer structure.
Similarly, the dovetail grooves 4 are provided on the surfaces of the first co-extruded film layer 7 and the second co-extruded film layer 8 on the side away from the intermediate layer 6 for providing the metal layer 2, and the serrated structure 5 is provided on the surface of the metal layer 2 on the side away from the intermediate layer 6 for providing the protective layer 3, which is the same as the structure arrangement of embodiment 1, so that the interlayer peel strength of the metallized polymer film having a multilayer structure can be further increased.
The above description is only the preferred embodiment of the present invention, and is not intended to limit the present invention, and any modifications, equivalent replacements, improvements, etc. made within the design concept of the present invention should be included within the protection scope of the present invention.
Claims (10)
1. A metallized polymer film having a multilayer structure, characterized by: the core layer of the metallized polymer film is a polymer layer, metal layers are respectively arranged on the upper surface and the lower surface of the polymer layer, and a protective layer is arranged on the surface, far away from the polymer layer, of the metal layer.
2. The metallized polymer film of claim 1, wherein: dovetail grooves are respectively formed in the upper surface and the lower surface of the polymer layer, and a part of the metal layer is embedded into the dovetail grooves.
3. The metallized polymer film of claim 1, wherein: and a sawtooth structure is arranged on the surface of the metal layer far away from the polymer layer, and a part of the protective layer is embedded into the sawtooth structure.
4. The metallized polymer film of claim 1, wherein: the thickness of the polymer layer is 1-20 [ mu ] m.
5. The metallized polymer film of claim 1, wherein: the thickness of the metal layer is 20-2000nm.
6. The metallized polymer film of claim 1, wherein: the thickness of the protective layer is 10-150nm.
7. The metallized polymer film of claim 1, wherein: the thickness of the protective layer is not more than 1/10 of the thickness of the metal layer.
8. The metallized polymer film of claim 1, wherein: the polymer layer sequentially comprises an intermediate layer, a first co-extrusion film layer and a second co-extrusion film layer, wherein the first co-extrusion film layer and the second co-extrusion film layer are respectively arranged on the upper surface and the lower surface of the intermediate layer.
9. The metallized polymer film of claim 8, wherein: the middle layer is an insulating fiber reinforced polymer layer.
10. The metallized polymer film of claim 8, wherein: the thickness of the middle layer is larger than the thickness of the first co-extrusion film layer and the second co-extrusion film layer.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222010811.2U CN218593867U (en) | 2022-08-02 | 2022-08-02 | Metallized polymer film with multilayer structure |
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| CN202222010811.2U CN218593867U (en) | 2022-08-02 | 2022-08-02 | Metallized polymer film with multilayer structure |
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