CN218585289U - Industrial control mainboard assembly - Google Patents
Industrial control mainboard assembly Download PDFInfo
- Publication number
- CN218585289U CN218585289U CN202222965713.4U CN202222965713U CN218585289U CN 218585289 U CN218585289 U CN 218585289U CN 202222965713 U CN202222965713 U CN 202222965713U CN 218585289 U CN218585289 U CN 218585289U
- Authority
- CN
- China
- Prior art keywords
- industrial control
- control mainboard
- heat dissipation
- dissipation frame
- air inlet
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model discloses an industry control mainboard subassembly, include: the industrial control mainboard, heat dissipation frame inside has two base plates, is located the middle part of this base plate and is provided with a plurality of fan along the length direction interval, and this base plate surface has seted up a plurality of fresh air inlet, and is located to be provided with two at least fresh air inlets between two adjacent fans, industrial control mainboard detachably installs at heat dissipation frame's top, and has the clearance between industrial control mainboard and the base plate, be provided with a link between two base plates, the both sides of this link have a plurality of hole of airing exhaust, and this interval distribution's the hole of airing exhaust sets up about heat dissipation frame's axis symmetry. The utility model discloses industry control mainboard subassembly is through blowing external low temperature air to the industry control mainboard to the air that will carry the heat is in time discharged, avoids the heat to pile up inside the subassembly, has promoted the radiating effect of industry control mainboard.
Description
Technical Field
The utility model relates to an industry control mainboard technical field especially relates to an industry control mainboard subassembly.
Background
The industrial control mainboard assembly is a mainboard applied to industrial occasions, is adopted by an industrial computer, can adapt to wide-temperature environment according to requirements, can adapt to severe environment, can work under high load for a long time and the like, and the terminal product of the industrial control mainboard is widely applied to aspects such as ATM machines, VTM machines, medical equipment, supermarkets, shopping mall cash registers, intelligent robots and the like.
However, in the prior art, the industrial control mainboard is continuously overheated due to long-time continuous work, and if the heat is not timely discharged, the normal work of the industrial control mainboard is affected.
Disclosure of Invention
The utility model aims at providing an industrial control mainboard subassembly, this industrial control mainboard subassembly blows to the industrial control mainboard through introducing external low temperature air to in time discharging the air that will carry the heat, avoid the heat to pile up inside the subassembly, promoted the radiating effect of industrial control mainboard.
In order to achieve the purpose, the utility model adopts the technical proposal that: an industrial control motherboard assembly, comprising: the heat dissipation structure comprises an industrial control main board and a heat dissipation frame, wherein two substrates are arranged in the heat dissipation frame, a plurality of fans are arranged in the middle of each substrate at intervals along the length direction, a plurality of air inlet holes are formed in the surface of each substrate, at least two air inlet holes are formed between every two adjacent fans, the industrial control main board is detachably mounted at the top of the heat dissipation frame, and a gap is formed between the industrial control main board and the substrates;
a connecting frame is arranged between the two substrates, a plurality of air exhaust holes are arranged on two sides of the connecting frame, and the air exhaust holes distributed at intervals are symmetrically arranged relative to the axis of the heat dissipation frame.
The further improved scheme in the technical scheme is as follows:
1. in the above scheme, the outer walls of two sides of the heat dissipation frame are provided with fixing lugs.
2. In the above scheme, the two fixing lugs located on the same side are arranged oppositely.
3. In the above scheme, the fresh air inlet is circular fresh air inlet.
4. In the above scheme, the opposite sides of the substrate are provided with a flow guide block.
Because of above-mentioned technical scheme's application, compared with the prior art, the utility model have the following advantage:
the utility model discloses industrial control mainboard subassembly, it is located two base plates that have inside the heat dissipation frame of industrial control mainboard below, the middle part that is located this base plate and be provided with a plurality of fan along the length direction interval, and this substrate surface has seted up a plurality of fresh air inlet, and be located and be provided with two at least fresh air inlets between two adjacent fans, industrial control mainboard detachably installs the top at heat dissipation frame, and have the clearance between industrial control mainboard and the base plate, be provided with a link between two base plates, the both sides of this link have a plurality of hole of airing exhaust, this interval distribution's the hole of airing exhaust is about heat dissipation frame's axis symmetry setting, two fans on through the base plate blow external low temperature air to the industrial control mainboard, promote simultaneously and carry thermal gas to discharge from the hole of airing exhaust between two base plates in the heat dissipation frame, the flow of industrial control mainboard surface air has been accelerated, avoid the heat to pile up inside the subassembly, the radiating effect of industrial control mainboard has been promoted.
Drawings
FIG. 1 is a schematic diagram of the overall structure of the industrial control motherboard assembly of the present invention;
FIG. 2 is a schematic diagram of the internal structure of the industrial control motherboard assembly of the present invention;
fig. 3 is the utility model discloses the local structure schematic diagram of industry control mainboard subassembly.
In the drawings above: 1. an industrial control main board; 2. a heat dissipation frame; 3. a substrate; 4. a fan; 5. an air inlet hole; 6. connecting a frame block; 7. an air exhaust hole; 8. fixing the ear; 9. buckling grooves; 10. a movable block; 11. and a flow guide block.
Detailed Description
In the description of this patent, it is noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, merely for convenience of description and simplification of description, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore should not be construed as limiting the invention; the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance; furthermore, unless expressly stated or limited otherwise, the terms "mounted," "connected," and "coupled" are to be construed broadly and encompass, for example, both fixed and removable coupling as well as integral coupling; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The meaning of the above terms in this patent may be specifically understood by those of ordinary skill in the art.
The invention will be further described with reference to the following examples:
example 1: an industrial control motherboard assembly, comprising: the heat dissipation structure comprises an industrial control main board 1 and a heat dissipation frame 2, wherein two substrates 3 are arranged inside the heat dissipation frame 2, a plurality of fans 4 are arranged in the middle of the substrate 3 at intervals along the length direction, a plurality of air inlet holes 5 are formed in the surface of the substrate 3, at least two air inlet holes 5 are formed between every two adjacent fans 4, the industrial control main board 1 is detachably mounted at the top of the heat dissipation frame 2, and a gap is formed between the industrial control main board 1 and the substrates 3;
start fan 4, fan 4 forms the negative pressure between base plate 3 and fresh air inlet 5, thereby introduce inside heat dissipation frame 2 with the outside air, fan 4 on two base plates 3 of displacement pushes the outside air to industrial control mainboard 1 after that, make and carry the thermal air and discharge in the hole 7 of airing exhaust between the base plate 3, realize the heat dissipation to industrial control mainboard 1, the mobility of the inside air of subassembly has been improved greatly, thereby the heat dispersion of industrial control mainboard has been improved.
A connecting frame 6 is arranged between the two substrates 3, a plurality of air exhaust holes 7 are arranged at two sides of the connecting frame 6, and the air exhaust holes 7 distributed at intervals are symmetrically arranged relative to the axis of the heat radiation frame 2.
The outer walls of the two sides of the heat dissipation frame 2 are provided with fixing lugs 8; the two fixing lugs 8 on the same side are arranged oppositely.
A deflector block 11 is disposed on each of opposite sides of the substrate 3.
Example 2: an industrial control motherboard assembly, comprising: the heat dissipation structure comprises an industrial control main board 1 and a heat dissipation frame 2, wherein two substrates 3 are arranged inside the heat dissipation frame 2, a plurality of fans 4 are arranged in the middle of the substrate 3 at intervals along the length direction, a plurality of air inlet holes 5 are formed in the surface of the substrate 3, at least two air inlet holes 5 are formed between every two adjacent fans 4, the industrial control main board 1 is detachably mounted at the top of the heat dissipation frame 2, and a gap is formed between the industrial control main board 1 and the substrates 3;
for the inside hot-air of subassembly, the outside air is the low temperature air, introduces the outside low temperature air through two fans on the base plate and blows to the industrial control mainboard, promotes simultaneously in the heat radiation frame and carries thermal gas and discharge from the hole of airing exhaust 7 between two base plates 3, has improved the mobility of the inside air of subassembly greatly to the heat dispersion of industrial control mainboard has been improved.
A connecting frame 6 is arranged between the two substrates 3, a plurality of air exhaust holes 7 are arranged on two sides of the connecting frame 6, and the air exhaust holes 7 distributed at intervals are symmetrically arranged relative to the axis of the heat radiation frame 2.
The outer walls of the two sides of the heat dissipation frame 2 are provided with fixing lugs 8.
The air inlet 5 is a circular air inlet.
A flow guide block 11 is arranged on the opposite side of the substrate 3; the diversion blocks 11 are arranged above the exhaust holes 7 at equal intervals.
The inner wall of the heat dissipation frame 2 is provided with a plurality of catching grooves 9, a movable block 10 can be rotatably connected in the catching grooves 9, the movable block 10 rotates upwards to stand up, then the industrial control mainboard 1 is placed at the top of the heat dissipation frame 2, and the movable block 10 is pressed to be buckled on the surface of the industrial control mainboard 1, so that the industrial control mainboard 1 and the heat dissipation frame 2 are fixed.
The utility model discloses the theory of operation does: during the use, start fan 4, fan 4 forms the negative pressure between base plate 3 and fresh air inlet 5 to inside introducing heat radiation frame 2 with the outside air, fan 4 on two base plates 3 of displacement pushes the outside air to industrial control mainboard 1 after that, make the air that carries the heat discharge in the hole 7 of airing exhaust between two base plates 3, realize the heat dissipation to industrial control mainboard 1, improved the mobility of subassembly inside air greatly, thereby improved the heat dispersion of industrial control mainboard.
When adopting above-mentioned industrial control mainboard subassembly, it blows external low temperature air to the industrial control mainboard through two fans on the base plate, promotes simultaneously and carries thermal gas in the heat radiation frame and discharges from the hole of airing exhaust between two base plates, avoids the heat to pile up inside the subassembly, has accelerateed the flow of industrial control mainboard surface air, has promoted the radiating effect of industrial control mainboard.
The above embodiments are only for illustrating the technical concept and features of the present invention, and the purpose of the embodiments is to enable people skilled in the art to understand the contents of the present invention and to implement the present invention, which cannot limit the protection scope of the present invention. All equivalent changes and modifications made according to the spirit of the present invention should be covered by the protection scope of the present invention.
Claims (5)
1. An industrial control motherboard assembly, comprising: industry control mainboard (1), heat dissipation frame (2), its characterized in that: the heat dissipation frame (2) is internally provided with two substrates (3), a plurality of fans (4) are arranged in the middle of the substrates (3) at intervals along the length direction, a plurality of air inlet holes (5) are formed in the surface of each substrate (3), at least two air inlet holes (5) are formed between every two adjacent fans (4), the industrial control main board (1) is detachably mounted at the top of the heat dissipation frame (2), and a gap is formed between the industrial control main board (1) and the substrates (3);
a connecting frame (6) is arranged between the two substrates (3), a plurality of air exhaust holes (7) are arranged on two sides of the connecting frame (6), and the air exhaust holes (7) distributed at intervals are symmetrically arranged relative to the axis of the heat dissipation frame (2).
2. The industrial control motherboard assembly of claim 1, wherein: the outer walls of two sides of the heat dissipation frame (2) are provided with fixing lugs (8).
3. The industrial control motherboard assembly of claim 2, wherein: the two fixing ears (8) positioned on the same side are arranged oppositely.
4. The industrial control motherboard assembly of claim 1, wherein: the air inlet holes (5) are circular air inlet holes.
5. The industrial control motherboard assembly of claim 1, wherein: and the opposite sides of the base plate (3) are provided with a flow guide block.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222965713.4U CN218585289U (en) | 2022-11-07 | 2022-11-07 | Industrial control mainboard assembly |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222965713.4U CN218585289U (en) | 2022-11-07 | 2022-11-07 | Industrial control mainboard assembly |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN218585289U true CN218585289U (en) | 2023-03-07 |
Family
ID=85376695
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202222965713.4U Active CN218585289U (en) | 2022-11-07 | 2022-11-07 | Industrial control mainboard assembly |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN218585289U (en) |
-
2022
- 2022-11-07 CN CN202222965713.4U patent/CN218585289U/en active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN110265749B (en) | Battery box | |
| CN218585289U (en) | Industrial control mainboard assembly | |
| CN211744148U (en) | Wireless charging base | |
| CN101453856A (en) | Communication equipment | |
| CN207911234U (en) | A kind of shell structure of vehicle communication terminal | |
| CN216162109U (en) | Laser cooling device and laser equipment | |
| CN110323387A (en) | A kind of battery case | |
| CN101338976B (en) | Cooling device for sheet treated product and heat treatment system mounting the device | |
| CN211174366U (en) | Cylinder and engine | |
| CN210252184U (en) | Directional exhaust structure | |
| US20200378688A1 (en) | Cooling fan and heat dissipating module including the same | |
| CN217686336U (en) | Agricultural product drying equipment | |
| CN211710278U (en) | Annular air cooling device for attaching PTC electric heating film | |
| CN217741019U (en) | Electrical engineering is with possessing high-efficient quick radiating electric appliance cabinet | |
| CN215814125U (en) | Information interaction screen for hospital | |
| CN214175041U (en) | Cooling device for computer and cooling mechanism thereof | |
| CN216490563U (en) | Industrial Ethernet switch with surface convenient for ash removal treatment | |
| CN211226901U (en) | Device for bending steel single-sheet air grid | |
| CN219350391U (en) | Air-cooled battery pack | |
| CN219955832U (en) | Cooling tunnel furnace | |
| US20230054689A1 (en) | Double-sided uniform air discharge ceiling cassette | |
| CN221222864U (en) | Outdoor unit and air treatment device having the same | |
| CN219199652U (en) | Welding rod cooling device | |
| CN110682718B (en) | Coding steel seal device for transformer shell production | |
| CN218825451U (en) | Heat dissipation industrial control mainboard |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |