CN218583108U - Heat dissipation device for high-power LED lamp - Google Patents
Heat dissipation device for high-power LED lamp Download PDFInfo
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- CN218583108U CN218583108U CN202222806925.8U CN202222806925U CN218583108U CN 218583108 U CN218583108 U CN 218583108U CN 202222806925 U CN202222806925 U CN 202222806925U CN 218583108 U CN218583108 U CN 218583108U
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Abstract
The utility model relates to a high-power LED lamps and lanterns heat abstractor. Relates to the technical field of heat dissipation devices. The LED lamp assembly comprises a heat dissipation device body, a lamp positioning heat dissipation cover, a water-cooling heat dissipation structure, a component adapting frame and a heat conduction structure, wherein the lamp positioning heat dissipation cover is arranged and covers the outer side of a heat dissipation area of an LED lamp set, and meanwhile, heat is transmitted to the heat conduction structure through the heat conduction structure and the water-cooling heat dissipation structure and then dissipated to the whole body through the water cooling structure.
Description
Technical Field
The utility model relates to a heat abstractor technical field specifically is a high-power LED lamps and lanterns heat abstractor.
Background
The high-power LED lamp is one of LED energy-saving lamps, compared with the low-power LED energy-saving lamp, the high-power LED energy-saving lamp has higher single power, brighter brightness and higher price, a PN junction (a space charge region is formed at the interface of a P type semiconductor and an N type semiconductor and is called as a PN junction) is adopted at the light-emitting part of most of the existing LED lamps through diffusion, and the light energy is converted into heat energy by an absorption sheet in the PN junction and epoxy resin/silica gel, so that the heat energy has great side effect on the lamp, the internal temperature of the LED lamp is higher and higher, the brightness is lower and lower, and the service life is shorter and shorter, so that the LED lamp needs to be well radiated to keep constant brightness and prolong the service life;
the heat of the whole LED lamp is higher after the LED lamps are installed in groups, and a heat dissipation structure is arranged in the LED lamp so as not to meet the heat dissipation requirement;
meanwhile, on the premise of meeting the heat dissipation requirement of the LED lamps after being installed in a group, the adaptation degree of the heat dissipation device and the LED lamps and the assembly performance of practical use are very important, so that the heat dissipation device of the high-power LED lamp is needed to meet the requirement.
SUMMERY OF THE UTILITY MODEL
Utility model purpose: the utility model provides a high-power LED lamps and lanterns heat abstractor, solves current heat radiation structure and can not satisfy and obtain the heat dissipation demand after the LED lamps and lanterns are assembled in groups, simultaneously heat abstractor and equidistance's suitability and the not high problem of equipment flexibility ratio inadequately.
In order to achieve the above object, the utility model provides a following technical scheme:
a high-power LED lamp heat dissipation device comprises: the heat dissipation device body is fixed on the outer side of the LED lamp, the heat dissipation device body extends a preset distance to one end to form a lamp positioning heat dissipation cover of a positioning area, the heat dissipation device body is fixed on a water-cooling heat dissipation structure of one end of the lamp positioning heat dissipation cover, the heat conduction structure is arranged between the water-cooling heat dissipation structure and the heat dissipation device body, and the LED lamp dissipates heat and carries out air circulation heat dissipation work through the lamp positioning heat dissipation cover, the heat conduction structure and the water-cooling heat dissipation structure in sequence.
Through being provided with lamps and lanterns location heat exchanger that looses, its cover is located the regional outside that looses heat of LED banks, simultaneously through being provided with heat conduction structure and water-cooling heat radiation structure, heat transmission to heat conduction structure is by the water-cooling structure heat dissipation to whole again, compares in heat radiation structure adopts heat radiation fins to carry out the heat conduction after natural heat dissipation, can accelerate the radiating efficiency, satisfies the heat dissipation demand in high-power LED lamps and lanterns better, and structural performance is more comprehensive.
According to an aspect of an embodiment of the present application, the heat sink body includes: the main casing body, follow the main casing body is the rectangle and extends the extension cover of predetermined distance to the outside, is fixed in the main casing body is close to water-cooling heat radiation structure one end, is provided with four at least and connects the locating rack.
Through being provided with the connection locating rack, can make installing additional of subassembly performance stable more comprehensive, the practicality is higher.
According to an aspect of the embodiments of the present application, the luminaire-positioning heat-dissipating cover comprises: the extension positioning edge is cylindrical and hollow in the center, the radiating fan is located on the inner side of the extension positioning edge, the stabilizing frame is fixed on the extension positioning edge, the motor is arranged at the center of the stabilizing frame, and the output end of the motor is in transmission connection with the radiating fan.
Through being provided with radiator fan and extending the location limit, extend the location limit and can be according to the size structure looks adaptation of LED lamps and lanterns to satisfy the demand of heat dissipation water conservancy diversion, the motor drives radiator fan and rotates, thereby guarantee air drafting performance.
According to an aspect of an embodiment of the present application, the water-cooling heat dissipation structure includes: the water cooling tank is at least provided with two water cooling tanks which are vertically and symmetrically arranged, the water cooling circulating frame on the inner side of the water cooling tank is positioned on the water cooling circulating frame and is provided with heat conducting blocks which are attached to the heat conducting structures, and the water guiding liquid at the two ends of the outer side of the water cooling tank is connected.
Through installing water-cooling tank, water-cooling circulation frame and heat conduction piece, the heat that the heat conduction piece can give off the LED lamps and lanterns absorbs to the water-cooling circulation frame rapidly, carries out heat conduction heat dissipation work through the water-cooling circulation frame to promote the radiating efficiency, structural performance is more comprehensive perfect.
According to an aspect of an embodiment of the present application, the heat conductive structure includes: the heat-conducting positioning frame is rectangular and hollow in the middle, and the heat-radiating special-shaped fins are fixed at the hollow positions in the inner side of the heat-conducting positioning frame and are arranged in a rectangular array.
Through being provided with heat conduction locating rack and heat dissipation abnormal shape fin, heat conductivity can further be ensured to heat dissipation abnormal shape fin, and holistic structural performance is simple more comprehensive, and the radiating effect is better.
According to one aspect of the embodiment of the application, the heat dissipation special-shaped fins are corrugated, and gaps are formed between adjacent heat dissipation special-shaped fins to meet the heat dissipation requirements of the LED lamp.
According to an aspect of an embodiment of the present application, the water-cooled circulation frame includes: the water-cooling circulating pipeline is surrounded in an S shape, and the heat-conducting sleeve block is sleeved outside the water-cooling circulating pipeline and opposite to the heat-conducting block in position.
Through being provided with water-cooling circulating line, the inside coolant liquid of pipeline circulates constantly in the in-service use in-process to drive the heat and disperse fast, radiating efficiency more can satisfy high-power LED lamps and lanterns heat dissipation demand.
Compared with the prior art, the beneficial effects of the utility model are that:
through being provided with lamps and lanterns location heat exchanger that looses, it covers and locates the regional outside that looses heat of LED banks, simultaneously through being provided with heat conduction structure and water-cooling heat radiation structure, heat transmission to heat conduction structure is by the water-cooling structure heat dissipation to whole again, compare in heat radiation structure adopt heat radiation fins to carry out the heat conduction after natural heat dissipation, can accelerate the radiating efficiency, satisfy the heat dissipation demand in high-power LED lamps and lanterns better, structural performance is more comprehensive, has solved the problem that the aforesaid provided.
Drawings
Fig. 1 is a perspective view of the heat dissipation device for a high-power LED lamp of the present invention.
Fig. 2 is a schematic structural view of the heat dissipation device body of the present invention.
Fig. 3 is a rear view of the heat dissipating device of the present invention.
Fig. 4 is a schematic structural view of the heat dissipation device of the high-power LED lamp of the present invention.
Fig. 5 is a schematic structural view of the flow guiding liquid connection pipe of the present invention.
Fig. 6 is a schematic structural view of the heat conducting structure of the present invention.
In the figure: the heat dissipation device comprises a heat dissipation device body 1, a main shell 11, a cavity 12, an extension cover 13, a connection positioning frame 14, a lamp positioning heat dissipation cover 2, an extension positioning edge 21, a heat dissipation fan 22, a stabilizing frame 23, a motor 24, a water-cooling heat dissipation structure 3, a water-cooling tank 31, a water-cooling circulation frame 32, a water-cooling circulation pipeline 321, a heat conduction sleeve block 322, a heat conduction block 33, a flow guide liquid connection pipe 34, an assembly adapting frame 4, a frame body 41, a positioning hole 42, a heat conduction structure 5, a heat conduction positioning frame 51, a heat dissipation special-shaped fin 52, an LED lamp shade 6, a lamp module 7 and a heat dissipation hole 8.
Detailed Description
In the following description, numerous specific details are set forth in order to provide a more thorough understanding of the present invention. It will be apparent, however, to one skilled in the art, that the present invention may be practiced without one or more of these specific details. In other instances, well-known features have not been described in order to avoid obscuring the present invention.
Example 1:
the applicant believes that the overall heat of the existing LED lamps in the market after being installed in a group is higher, and the heat dissipation structure is arranged in the LED lamps so as not to meet the heat dissipation requirement; meanwhile, on the premise of meeting the heat dissipation requirement of the LED lamps after being installed in groups, the adaptation degree of the heat dissipation device and the LED lamps and the assembly performance of practical use are very important.
Therefore, the applicant designs a high-power LED lamp heat dissipation device, which comprises a heat dissipation device body 1, a lamp positioning heat dissipation cover 2, a water-cooling heat dissipation structure 3, a component adapting frame 4 and a heat conduction structure 5, wherein the lamp positioning heat dissipation cover 2 is arranged and covers the outside of a heat dissipation area of an LED lamp set, meanwhile, heat is transmitted to the heat conduction structure 5 through the heat conduction structure 5 and the water-cooling heat dissipation structure 3 and then dissipated to the whole body through the water-cooling structure 4, and compared with the heat dissipation structure which adopts heat dissipation fins for heat dissipation, the heat dissipation device can accelerate the heat dissipation efficiency and better meet the heat dissipation requirement of the high-power LED lamp.
Example 2:
on the basis of embodiment 1, the utility model relates to a high-power LED lamps and lanterns heat abstractor, in practical application, as shown in fig. 1 to fig. 4, including heat abstractor body 1, lamps and lanterns location heat exchanger 2, water-cooling heat radiation structure 3, subassembly adapter frame 4 and heat conduction structure 5, the intermediate position department of 1 one end of heat abstractor body is provided with lamps and lanterns location heat exchanger 2, and water-cooling heat radiation structure 3 is installed to the below of the 1 other end of heat abstractor body, and subassembly adapter frame 4 is installed to water-cooling heat radiation structure 3's top, and heat conduction structure 5 is installed to the inboard of heat abstractor body 1.
The heat dissipation device body 1 comprises a main shell 11, a cavity 12, an extension cover 13 and a connection positioning frame 14, wherein the cavity 12 is arranged on the inner side of the main shell 11, the extension cover 13 is arranged at one end, close to the lamp positioning heat dissipation cover 2, of the main shell 11, the connection positioning frame 14 is arranged at the position opposite to the position of the water-cooling heat dissipation structure 3 at the rear end of the main shell 11, and the connection positioning frame 14 is at least provided with four parts.
The lamp positioning heat radiation cover 2 comprises an extending positioning edge 21, a heat radiation fan 22, a stabilizing frame 23 and a motor 24, wherein the heat radiation fan 22 is installed inside the extending positioning edge 21, the motor 24 is installed at the rear end of the heat radiation fan 22, the stabilizing frame 23 is installed on the outer side of the motor 24, and two ends of the stabilizing frame 23 are respectively in threaded connection with the motor 24 and the extending positioning edge 21, so that the positioning stability is guaranteed.
The assembly adapting frame 4 comprises a frame body 41 and a positioning hole 42, the frame body 41 is arranged in a U shape, the positioning hole 42 is formed in the frame body 41, the positioning hole 42 is provided with a plurality of pieces, and the heat dissipation assembly can be installed on the frame body 41, so that the heat dissipation efficiency is accelerated, and the heat dissipation requirement is better met.
The water-cooling heat dissipation structure 3 comprises a water-cooling tank 31, a water-cooling circulation frame 32, a heat conduction block 33 and a flow guiding liquid connection pipe 34, wherein the water-cooling tank 31 is installed on two sides of the water-cooling circulation frame 32, the water-cooling tank 31 is fixed with the connection positioning frame 14, the heat conduction block 33 is arranged on the water-cooling circulation frame 32, and one side of the heat conduction block 33 is in contact with the heat conduction structure 5, so that the heat conduction performance is guaranteed.
Example 3:
on the basis of embodiment 1 or embodiment 2, the utility model relates to a high-power LED lamps and lanterns heat abstractor, in practical application, as shown in fig. 5, water-cooling circulation frame 32 includes water-cooling circulating line 321 and heat conduction nest of blocks 322, and wherein, water-cooling circulating line 321 sets up in water-cooling circulation frame 32 inboard, and water-cooling circulation frame 32's outside is provided with a plurality of heat conduction nest of blocks 322, and heat conduction nest of blocks 322 is located heat conduction piece 33 inboard.
In the in-service use process, inside all being provided with the coolant liquid of water-cooling circulation frame 32 and water-cooling circulation pipeline 321, water-cooling circulation pipeline 321 can the external circulating liquid can the pump body, and the inside water-cooling liquid of water-cooling circulation frame 32 and water-cooling tank 31 does not possess the mobility, and when the inside liquid flow of water-cooling circulation pipeline 321 dispelled the heat, the inside water-cooling liquid of water-cooling circulation frame 32 can dispel the heat in step, and heat radiation stability and efficiency are higher, and the practicality is higher.
Example 4:
on embodiment 1, 2 or 3' S basis, the utility model relates to a high-power LED lamps and lanterns heat abstractor, in practical application, as shown in fig. 5, heat conduction structure 5 includes heat conduction locating rack 51 and heat dissipation abnormal shape fin 52, and wherein, the inside of heat conduction locating rack 51 is provided with heat dissipation abnormal shape fin 52, and heat dissipation abnormal shape fin 52 is provided with a plurality of, and heat dissipation abnormal shape fin 52 is the S type, and interval between the adjacent heat dissipation abnormal shape fin 52 satisfies the heat dissipation demand.
In the in-service use process, as shown in fig. 1, be fixed in heat abstractor body 1 one side with LED lamp shade 6, LED lamp shade 6 is inside to have seted up louvre 8, louvre 8 position is relative with lamps and lanterns location heat exchanger 2 positions, when lamps and lanterns module 7 work produces great heat, convulsions through radiator fan 22, the heat flows through location heat exchanger 2 and gets into heat conduction structure, heat conduction structure 5 with heat water conservancy diversion to heat conduction piece 33, the water-cooling heat dissipation structure 3 carries out the water-cooling heat dissipation of rethread.
Example 5:
It is obvious to a person skilled in the art that the invention is not restricted to details of the above-described exemplary embodiments, but that it can be implemented in other specific forms without departing from the spirit or essential characteristics of the invention. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.
Claims (7)
1. A high-power LED lamp heat dissipation device is characterized by comprising:
the heat dissipation device body is fixed on the outer side of the LED lamp;
the lamp positioning heat dissipation cover extends to one end along the heat dissipation device body for a preset distance to form a positioning area;
the water-cooling heat dissipation structure is fixed at one end of the heat dissipation device body, which is far away from the lamp positioning heat dissipation cover;
the heat conduction structure is arranged between the water-cooling heat dissipation structure and the heat dissipation device body;
the heat emitted by the LED lamp sequentially passes through the lamp positioning heat dissipation cover, the heat conduction structure and the water cooling heat dissipation structure to carry out air circulation heat dissipation work.
2. The heat sink for high power LED lamp as claimed in claim 1, wherein the heat sink body comprises:
a main housing;
the cavity is arranged at one end close to the water-cooling heat dissipation structure;
an extension cover extending outwards along the main shell in a rectangular shape for a predetermined distance;
and the connecting and positioning frames are fixed at one end of the main shell close to the water-cooling heat dissipation structure and are at least provided with four connecting and positioning frames.
3. The heat sink for high power LED lamp as claimed in claim 1, wherein the lamp positioning heat sink comprises:
the extending positioning edge is cylindrical and hollow in the center;
the heat radiation fan is positioned at the inner side of the extending positioning edge;
the stabilizing frame is fixed on the extending positioning edge;
and the motor is arranged at the central position of the stabilizing frame, and the output end of the motor is in transmission connection with the radiating fan.
4. The heat sink for high power LED lamp as claimed in claim 1, wherein the water-cooling heat sink structure comprises:
the water cooling tanks are at least provided with two water cooling tanks which are vertically and symmetrically arranged;
the water-cooling circulating frame is positioned on the inner side of the water-cooling box;
the heat conducting block is positioned on the water-cooling circulating frame and is attached to the heat conducting structure;
and the flow guide liquid connecting pipes are arranged at two ends of the outer side of the water cooling tank.
5. The heat sink for high power LED lamp as claimed in claim 1, wherein the heat conducting structure comprises:
the heat conduction positioning frame is rectangular and hollow in the middle;
the heat dissipation special-shaped fins are fixed at the hollow positions on the inner side of the heat conduction positioning frame;
the radiating special-shaped fins are arranged in a rectangular array.
6. The heat dissipation device for high power LED lamp as recited in claim 5, wherein: the radiating special-shaped fins are corrugated, and gaps are formed between every two adjacent radiating special-shaped fins to meet the radiating requirement of the LED lamp.
7. The heat sink for high power LED lamp as claimed in claim 4, wherein the water cooling circulation frame comprises:
the water-cooling circulating pipeline is surrounded in an S shape;
and the heat conduction sleeve block is sleeved outside the water cooling circulating pipeline and is opposite to the heat conduction block in position.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222806925.8U CN218583108U (en) | 2022-10-24 | 2022-10-24 | Heat dissipation device for high-power LED lamp |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222806925.8U CN218583108U (en) | 2022-10-24 | 2022-10-24 | Heat dissipation device for high-power LED lamp |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN218583108U true CN218583108U (en) | 2023-03-07 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202222806925.8U Active CN218583108U (en) | 2022-10-24 | 2022-10-24 | Heat dissipation device for high-power LED lamp |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN218583108U (en) |
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2022
- 2022-10-24 CN CN202222806925.8U patent/CN218583108U/en active Active
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