CN218570457U

CN218570457U - Loudspeaker module and electronic equipment

Info

Publication number: CN218570457U
Application number: CN202222453856.7U
Authority: CN
Inventors: 刘金华
Original assignee: Honor Device Co Ltd
Current assignee: Honor Device Co Ltd
Priority date: 2022-09-16
Filing date: 2022-09-16
Publication date: 2023-03-03
Anticipated expiration: 2032-09-16

Abstract

The application discloses a loudspeaker module and electronic equipment.A voice coil is fixedly connected below a diaphragm group in a vibration system of the loudspeaker module; one end of the FPC is fixedly attached to the outer side wall of the voice coil, the end of the FPC is electrically connected with a voice coil lead of the voice coil, and the height position of the FPC relative to the voice coil is located between the upper surface and the lower surface of the voice coil; magnetic circuit among the speaker module is located vibration system's below, and magnetic circuit is used for cooperating with the voice coil loudspeaker voice coil in order to drive vibrating diaphragm group vibration sound production. Therefore, the FPC and the voice coil are in a left-right position relationship, avoidance in a Z-direction space is realized, a sufficient vibration space of a diaphragm group is ensured, and the sound effect is improved; the Z-direction space height of the loudspeaker module can be reduced, the loudspeaker module is thinned, and the overall lightness, thinness and sound effect performance of the electronic equipment are guaranteed.

Description

Loudspeaker module and electronic equipment

Technical Field

The application relates to the technical field of electronic equipment, in particular to a loudspeaker module and electronic equipment.

Background

With the development of electronic device technologies, the popularity of speaker modules in electronic devices (such as mobile phones, tablet computers, notebook computers, etc.) is increasing. People do not only limit to the playing of video and audio to the requirement of speaker module, have higher requirement to the tone quality of speaker module broadcast sound more.

In order to improve the sound effect of the electronic device, the low frequency performance of the speaker module needs to be improved. In the related art, the improvement of the low-frequency performance of the speaker module is usually achieved by increasing the maximum amplitude of the speaker module. However, in the case of large amplitude applications, the volume of the speaker module is also increased, which is not favorable for implementing the light and thin design of the electronic device.

SUMMERY OF THE UTILITY MODEL

The application provides a speaker module and electronic equipment to solve the problem that the speaker module can't compromise sound production performance and frivolousization design.

In a first aspect, the present application provides a speaker module, comprising: the vibration system comprises a vibration diaphragm group, a Flexible Printed Circuit (FPC) and a voice coil; the voice coil is fixedly connected below the diaphragm group; one end of the FPC is fixedly attached to the outer side wall of the voice coil, one end of the FPC is electrically connected with a voice coil lead of the voice coil, the height position of the FPC relative to the voice coil is located between the upper surface and the lower surface of the voice coil, the other end of the FPC is connected with an external circuit, and the FPC and the voice coil are used for providing electric signals; and the magnetic circuit system is positioned below the vibration system and is used for being matched with the voice coil to drive the vibration diaphragm group to vibrate and sound. Therefore, the FPC and the voice coil are in a left-right position relationship, and the height position of the FPC relative to the voice coil is located between the upper surface and the lower surface of the voice coil, so that avoidance in a Z-direction space is realized, a sufficient vibration space of a diaphragm group is ensured, and the sound effect is improved; the Z-direction space height of the loudspeaker module can be reduced, and the loudspeaker module is thinned.

In some embodiments of the present application, the vibration system further comprises a plurality of FPC skeletons; the FPC frameworks are fixedly attached to the outer side wall of the voice coil, and the bottom surfaces of the FPC frameworks are located between the upper surface and the lower surface of the voice coil; a plurality of FPC skeleton respectively with FPC's with the one end fixed connection that the voice coil loudspeaker voice coil electricity is connected, it is a plurality of FPC skeleton is used for the fixed stay FPC. Like this, through FPC skeleton fixed FPC, can avoid producing relative displacement between FPC and the voice coil loudspeaker voice coil, and then avoid the voice coil loudspeaker voice coil lead wire fracture, guarantee the normal transmission of signal of telecommunication, the speaker module can normally sound production.

In some embodiments of the present application, the FPC skeleton includes a bearing portion and an attaching portion; the fitting part is fixedly fitted on the outer side wall of the voice coil, one end of the fitting part is connected with one end of the bearing part at a preset angle, and the other end of the bearing part extends in the direction far away from the outer side wall; the bottom surface of the bearing part is positioned between the upper surface and the lower surface of the voice coil, and the bearing part is used for fixedly connecting the FPC. Like this, the first FPC skeleton of formation both can with FPC fixed connection, also can fix and bond at the lateral wall of voice coil loudspeaker voice coil, can realize higher fixed strength, prevents to drop.

In some embodiments of the present application, the FPC frame further includes a fixing portion; the one end of fixed part with the other end of laminating portion is and presets the angle and connects, the fixed part laminating is in the upper surface of voice coil loudspeaker voice coil. Like this, the second kind FPC skeleton of formation can further improve fixed strength when realizing that FPC and voice coil loudspeaker voice coil are connected, prevents to drop.

In some embodiments, the present application further comprises a communicating member; the intercommunication piece laminating is in the upper surface of voice coil loudspeaker voice coil is located the below of diaphragm group, the intercommunication piece is used for fixed a plurality ofly the FPC skeleton. Like this, the connecting piece can be with a plurality of the FPC skeleton forms the third kind of FPC skeleton, and the third kind of FPC skeleton can further improve fixed strength, prevents to drop.

In some embodiments of the present application, the communication member is an annular structure, and the outer annular side wall of the communication member is connected to the bonding portions of the plurality of FPC frames at a predetermined angle; or, the communicating piece is an annular structure with a plurality of fractures, the communicating piece is fixedly connected with the fixing parts of the FPC frameworks through the fractures respectively, and the fractures are used for accommodating the fixing parts. Like this, third kind FPC skeleton can be formed by connecting piece and first kind FPC skeleton, also can be formed by connecting piece and second kind FPC skeleton to obtain different FPC skeletons, realize different fixed effects.

In some embodiments of the present application, the voice coil has a rectangular cross-sectional shape with four R corners; the plurality of FPC frameworks comprise a first FPC framework, a second FPC framework, a third FPC framework and a fourth FPC framework; the first FPC framework and the second FPC framework are fixedly attached to the outer side walls corresponding to two R corners of the voice coil respectively; and the third FPC framework and the fourth FPC framework are fixedly attached to the outer side walls corresponding to the other two R corners of the voice coil respectively. Therefore, different FPC frameworks are fixed at different positions of the voice coil, so that the FPC can be fixedly connected, and the electric connection between each end part of the FPC and the voice coil is realized to form a closed loop.

In some embodiments of the present application, the FPC includes a first FPC and a second FPC; the first FPC is located on one side of the voice coil corresponding to the two R corners, and the second FPC is located on one side of the voice coil corresponding to the other two R corners; the outer side part of the first FPC is connected with an external circuit, one end of the inner side part of the first FPC is fixedly connected with the bearing part of the first FPC framework, and one end of the inner side part of the first FPC is electrically connected with a first voice coil lead of the voice coil; the other end of the inner side part of the first FPC is fixedly connected with the bearing part of the second FPC framework, the other end of the inner side part of the first FPC is electrically connected with a second voice coil lead of the voice coil, and the height position of the first FPC relative to the voice coil is located between the upper surface and the lower surface of the voice coil; the outer side part of the second FPC is connected with an external circuit, one end of the inner side part of the second FPC is fixedly connected with the bearing part of the fourth FPC framework, and one end of the inner side part of the second FPC is electrically connected with a third voice coil lead of the voice coil; the other end of the inner side portion of the second FPC is fixedly connected with the bearing portion of the third FPC framework, the other end of the inner side portion of the second FPC is electrically connected with a fourth voice coil lead of the voice coil, and the height position of the second FPC, relative to the voice coil, is located between the upper surface and the lower surface of the voice coil. Like this, different FPC utilize different FPC skeletons to be connected with the voice coil loudspeaker voice coil electricity, guarantee that each FPC's height all is located between the upper and lower surface of voice coil loudspeaker voice coil to realize dodging to the space of Z.

In some embodiments of the present application, the diaphragm set includes a dome and a diaphragm; the vibration diaphragm is of an annular structure, the ball top is located at the center of the vibration diaphragm, the edge of the ball top is fixedly connected with the edge of the inner ring of the vibration diaphragm, and the lower portion of the ball top is fixedly connected with the voice coil. Like this, the voice coil loudspeaker voice coil can drive the vibrating diaphragm vibration through the ball top to realize the sound production.

In some embodiments of the present application, the dome comprises a top plate, a female ring, and an extension; the concave ring and the extension part are both of annular structures, the top plate is located in the center of the concave ring, the edge of the top plate is connected with the inner ring side of the concave ring, the outer ring side of the concave ring is connected with the inner ring side of the extension part, and the upper surface of the extension part is fixedly connected with the lower surface of the inner ring side of the vibrating diaphragm. Thus, the voice coil framework for fixing the voice coil is formed by the ball top, the voice coil framework does not need to be additionally and separately installed, and the thickness of the Z-direction space can be further reduced.

In some embodiments of the present application, the voice coil is fixedly connected to a lower portion of the concave ring, or the voice coil is fixedly connected to a lower portion of the concave ring, where a communication member is attached to the upper surface; a first height between a lower surface of the extension portion and an upper surface of the sound ring is smaller than a second height between a lower surface of the top plate and the upper surface of the sound ring. Therefore, the voice coil is fixed by the concave ring, the voice coil framework does not need to be additionally and independently installed, and the thickness of the Z-direction space can be further reduced.

In a second aspect, the present application provides an electronic device, including display screen and casing, the display screen lock is in on the casing, form the closed cavity, including the first aspect in the closed cavity the speaker module. Therefore, the loudspeaker module can meet the requirements of lightness, thinness, large amplitude and high performance of devices at the same time, and further ensure the lightness, thinness and sound effect performance of the whole electronic equipment.

Drawings

In order to more clearly explain the technical solution of the present application, the drawings needed to be used in the embodiments will be briefly described below, and it is obvious to those skilled in the art that other drawings can be obtained according to the drawings without any creative effort.

Fig. 1 is a schematic structural diagram of an electronic device 100 according to an embodiment of the present application.

Fig. 2 is an exploded view of the electronic device 100 according to the embodiment of the present disclosure.

Fig. 3 is a perspective view of a speaker module 50 according to an embodiment of the present disclosure.

Fig. 4 is a perspective view of a first speaker module 50 according to an embodiment of the present disclosure.

Fig. 5 is a partial view of portion B of fig. 4.

Fig. 6 isbase:Sub>A first structural schematic view of sectionbase:Sub>A-base:Sub>A in fig. 3.

Fig. 7 is a partial view of a portion C1 in fig. 6.

Fig. 8 is a schematic diagram of a first connection between the dome 140 and the diaphragm 150 according to an embodiment of the present disclosure.

Fig. 9 is a first top view of a second speaker module 50 according to an embodiment of the present disclosure.

Fig. 10 is a first perspective view of a second speaker module 50 according to an embodiment of the present application.

Fig. 11 is a partial view of a portion D1 in fig. 10.

Fig. 12 is a second top view of a second speaker module 50 according to an embodiment of the present disclosure.

Fig. 13 is a second perspective view of a second speaker module 50 according to an embodiment of the present application.

Fig. 14 is a partial view of a portion D2 in fig. 13.

Fig. 15 is a first top view of a third speaker module 50 according to an embodiment of the present disclosure.

Fig. 16 is a first perspective view of a third speaker module 50 according to an embodiment of the present disclosure.

Fig. 17 is a partial view of a portion E1 in fig. 16.

Fig. 18 is a second top view of a third speaker module 50 according to an embodiment of the present application.

Fig. 19 is a second perspective view of a third speaker module 50 according to an embodiment of the present application.

Fig. 20 is a partial view of the portion E2 in fig. 19.

Fig. 21 is a perspective view of a fourth speaker module 50 according to an embodiment of the present application.

FIG. 22 isbase:Sub>A second configuration at section A-A of FIG. 3.

Fig. 23 is a schematic diagram of a second connection between the dome 140 and the diaphragm 150 according to an embodiment of the present disclosure.

Fig. 24 is a partial view of portion F of fig. 21.

Detailed Description

The technical solutions in the embodiments of the present application will be clearly described below with reference to the drawings in the embodiments of the present application. It should be apparent that the described embodiments are only some of the embodiments of the present application, and not all embodiments. Other embodiments based on the embodiments of the present application and obtained by a person of ordinary skill in the art without any creative effort belong to the protection scope of the present application.

In the following, the terms "first", "second", etc. are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or as implying any indication of the number of technical features indicated. Thus, a feature defined as "first," "second," etc. may explicitly or implicitly include one or more of that feature. In the description of the present application, the meaning of "a plurality" is two or more unless otherwise specified.

Further, in the present application, directional terms such as "upper," "lower," "left," "right," "top," "bottom," and the like are defined relative to the schematically-disposed orientation of components in the drawings, and it is to be understood that these directional terms are relative terms, which are used for descriptive and clarifying purposes relative to each other and which can vary accordingly depending on the orientation in which the components are disposed in the drawings.

The electronic equipment provided by the embodiment of the application is the electronic equipment with a sound playing function. Specifically, the electronic device includes, but is not limited to, a mobile phone, a notebook computer, a tablet computer, a laptop computer, a personal digital assistant or a wearable device, a walkman, a radio, a television, a sound box, and the like. Wherein, wearable device includes but not limited to intelligent bracelet, intelligent wrist-watch, intelligent head-mounted display, intelligent glasses etc.. The following description will be made by taking an electronic device as a mobile phone.

Fig. 1 is a schematic structural diagram of an electronic device 100 according to an embodiment of the present disclosure. Fig. 2 is an exploded view of an electronic device 100 according to an embodiment of the present disclosure.

As shown in fig. 1 and 2, the electronic device 100 may include a display screen 10, a housing 20, a circuit board 30, a battery 40, and a speaker assembly 50. The housing 20 includes a middle frame 21 and a rear case 22. The display screen 10, the middle frame 21 and the rear shell 22 are sequentially buckled together to form a closed cavity, and the circuit board 30, the battery 40 and the speaker assembly 50 are uniformly arranged in the closed cavity. The circuit board 30, the battery 40 and the speaker module 50 may be fixed on the surface of the display screen 10 facing the rear case 22 by means of screw connection, snap connection, welding, etc., or may be fixed on the inner surface of the rear case 22 by means of screw connection, snap connection, welding, etc. It is to be understood that fig. 1 and 2 and the related drawings below only schematically illustrate some components included in the electronic device 100, and the actual shape, the actual size, the actual position and the actual configuration of these components are not limited by fig. 1 and 2 and the following drawings.

The circuit board 30 is used for controlling the display screen 10 to display images, and the battery 40 is used for providing power to electronic devices such as the display screen 10, the circuit board 20, the speaker module 50 and the like in the electronic device 100. The speaker module 50 is used to restore audio signals such as music and voice into sound, and can support the function of audio playing. The speaker module 50 is electrically connected to the circuit board 30, and the circuit board 30 transmits the audio electrical signal to the speaker module 50, and further converts the audio electrical signal into an audio signal through the speaker module 50 for outputting. Specifically, the speaker module 50 has a sound outlet channel (not shown), and the sound signal output by the speaker module 50 is output through the sound outlet channel.

To improve the user experience, the electronic device 100 is designed to be more and more slim, and better sound effect experience is also required. For a slim and thin whole machine, particularly in an electronic device such as a folding mobile phone, an ultra-thin speaker module 50 is required. And good sound effect experience needs larger loudspeaker vibration amplitude to realize good low-frequency play-out effect.

However, in the present speaker module 50, one way to realize this is to arrange a Flexible Printed Circuit (FPC) on top of the voice coil, and the width of the FPC needs to be larger than that of the voice coil, which affects the magnetic Circuit gap. Meanwhile, because the FPC is located between the voice coil and the vibrating diaphragm, the loudspeaker module cannot be designed with a reverse corrugated rim structure, so that the loudspeaker module occupies too large space during application, and is not beneficial to light and thin of the whole machine. The other realization mode is that the FPC is positioned at the bottom of the voice coil, and the height of the FPC conflicts with the height of the magnet in the Z-direction height direction, so that the FPC and the magnetic circuit interfere with each other and occupy larger magnetic circuit space. The loudspeaker Bl is low, the performance of the product is influenced by small driving force, and the sound effect experience is poor.

Wherein, the height in the Z direction refers to the thickness direction. An XYZ coordinate system is established based on the speaker module 50, and exemplarily, the width direction of the speaker module 50 is defined as an X-axis direction, the length direction of the speaker module 50 is defined as a Y-axis direction, and the thickness direction of the speaker module 50 is defined as a Z-axis direction. It is understood that the coordinate system of the speaker module 50 can be flexibly configured according to actual needs, and is not limited in any way.

The embodiment of the present application provides a speaker module 50, which can simultaneously meet the requirements of light and thin components, large amplitude, and high performance, and further ensure the overall lightness, thinness, and sound performance of the electronic device 100.

As shown in fig. 3, in some embodiments, the speaker module 50 may include a frame 160, a vibration system, and a magnetic circuit system. The frame 160 has an accommodation space for fixing the vibration system and the magnetic circuit system. It is understood that the speaker module 50 may further include a bottom case (not shown) connected to the frame 160 to form a containing cavity for fixing and containing the vibration system and the magnetic circuit system.

Fig. 4 is a perspective view of a first speaker module 50 according to an embodiment of the present disclosure. Wherein, the illustration of the dome 140, the diaphragm 150 and the frame 160 is omitted in fig. 4.

As shown in fig. 4, in conjunction with fig. 3, in some embodiments, the vibration system may include a diaphragm assembly, a flexible circuit board FPC110, and a voice coil 120. The FPC110 includes an outer portion and an inner portion, one end of the FPC110 serving as the outer portion may penetrate the frame 160 and be fixed to the frame 160 through a pad, one end of the FPC110 serving as the outer portion is connected to an external circuit, and one end of the FPC110 serving as the inner portion is fixed to the outer wall 121 of the voice coil 120. The outer portion of the FPC110 refers to a portion located outside the speaker module 50, the inner portion of the FPC110 refers to a portion located inside the speaker module 50, and the external circuit refers to a circuit provided by the battery 40 in the electronic device 100.

In order to ensure the adhesion stability of the outer side wall 121 of the FPC110 and the voice coil 120, the outer side walls 121 of the FPC110 and the voice coil 120 may be fixed by gluing, so as to ensure that the FPC110 and the voice coil 120 are in a left-right position relationship, and avoid the occurrence of relative displacement between the FPC110 and the voice coil 120 to cause the breakage of the voice coil lead between the FPC110 and the voice coil 120, so as to ensure the large amplitude performance of the speaker module 50.

The voice coil 120 has a ring-shaped structure, the cross-sectional shape of the voice coil 120 is a rectangle having four R corners, and the voice coil 120 includes a pair of major axis sides and a pair of minor axis sides, and the adjacent major axis sides and minor axis sides each form an R corner. Wherein the R angle can be understood as a corner.

Fig. 5 is a partial view of portion B of fig. 4.

As shown in fig. 5, in some embodiments, the voice coil 120 may be a coil winding formed by coils wound in a stacked configuration. The voice coil 120 has at least two voice coil leads 123, and illustratively, one voice coil lead 123 extends from an inner side of one R corner of the voice coil 120 and the other voice coil lead 123 extends from an outer side of the other R corner of the voice coil 120. The number of voice coil leads 123 is related to the number of FPCs 110, illustratively, if one FPC110 is included in the speaker module 50, the voice coil 120 has two voice coil leads 123; if two FPCs 110 are included in speaker module 50, voice coil 120 has four voice coil leads 123.

One end of the FPC110 as an inner portion includes two end portions (111 a and 111 b), one of the end portions 111a being electrically connected to one voice coil lead 123 of the voice coil 120, and the other end portion 111b being electrically connected to the other voice coil lead 123 of the voice coil 120. In this way, the FPC110 and the voice coil 120 may form a closed loop, facilitating the circuitry that makes up the speaker module 50 to provide electrical signals to the speaker module 50. The FPC110 is used for transmitting an electrical signal transmitted by an external circuit to the voice coil 120, and the voice coil 120 is used for supplying current and generating a magnetic field to generate a driving force in the magnetic field and drive the diaphragm set to vibrate and generate sound.

Height position H of FPC110 with respect to voice coil 120 ₁₁₀ Between the upper and lower surfaces of the voice coil 120, and the FPC110 is in a left-right positional relationship with the voice coil 120 to reduce the Z-direction height of the speaker module 50. Wherein the height position H ₁₁₀ Refers to the position of the bottom surface of the FPC110 relative to the voice coil 120 in the height direction (Z direction) of the voice coil 120. Height position H ₁₁₀ It can also be understood as the height H from the bottom surface of FPC110 to the upper surface 122 of voice coil 120 ₁₁₀ ，H ₁₁₀ Is less than height H of voice coil 120 ₁₂₀ 。

Fig. 6 isbase:Sub>A first structural schematic view of sectionbase:Sub>A-base:Sub>A in fig. 3. Fig. 7 is a partial view of a portion C1 in fig. 6.

As shown in fig. 6 and 7, in some embodiments, the voice coil 120 is fixedly attached below a diaphragm set, which may include a dome 140 and a diaphragm 150. The diaphragm 150 has a ring structure, and the dome 140 has a rectangular plate structure. The outer ring edge of the diaphragm 150 is fixed on the frame 160, the dome 140 is located at the center of the diaphragm 150, the edge of the dome 140 is fixedly connected with the inner ring edge of the diaphragm 150, and the voice coil 120 is fixedly connected below the dome 140.

The diaphragm 150 can be made of plastic film and is easy to deform; the dome 140 is made of metal or alloy, such as aluminum, and is not easily deformed. Therefore, during assembly, the diaphragm 150 is pre-assembled with the dome 140 to form an assembly, and the assembly is then fixedly mounted on the frame 160. Illustratively, the dome 140 may have a thickness of about 0.05 mm.

In some embodiments, the magnetic circuit system is used to provide magnetic force, and the magnetic circuit system is located below the vibration system, and the magnetic circuit system is used to cooperate with the voice coil 120 to drive the diaphragm set to vibrate and generate sound. After the voice coil 120 is powered on, an induced magnetic field can be generated, and the magnetic circuit system can respond to the induced magnetic field, so that the voice coil 120 is displaced under the action of the magnetic force of the magnetic circuit system to drive the diaphragm set to vibrate and push air to vibrate to form sound.

The magnetic circuit system may include a magnet 170, an upper magnetic circuit 180, and a lower magnetic circuit 190. The upper magnetic circuit 180 is located above the magnet 170, and the lower magnetic circuit 190 is located below the magnet 170. The magnet 170 includes a center magnet 172 and a side magnet 171, and the side magnet 171 is disposed around the circumference of the center magnet 172. The center magnet 172 and the side magnets 171 define a magnetic space therebetween into which an end of the voice coil 120 remote from the dome 140 protrudes.

Upper magnetic circuit 180 may include an upper central magnetic circuit 182 and an upper magnetic circuit 181. The upper center magnetic path 182 is provided on the surface of the center magnet 172 near the diaphragm group, and the upper magnetic path 181 is provided on the surface of the side magnet 171 near the diaphragm group. The lower magnetic circuit 190 is disposed on a surface of the center magnet 172 away from the diaphragm group, and the center magnet 172 and the side magnets 171 are fixed above the lower magnetic circuit 190.

When the speaker module 50 vibrates to generate sound, after the voice coil 120 is conducted with an electrical signal of an external circuit through the FPC110, the voice coil 120 vibrates under the action of a magnetic field formed in a magnetic space defined by a magnetic circuit system. The vibrating voice coil 120 drives the diaphragm 150 to vibrate through the ball top 140, and the diaphragm 150 vibrates to push air to produce sound.

Fig. 8 is a schematic diagram of a first connection between the dome 140 and the diaphragm 150 according to an embodiment of the present disclosure. In order to better illustrate the connection relationship and the component structure between the dome 140 and the diaphragm 150, the remaining irrelevant structural components are not shown in fig. 8, and fig. 8 may be regarded as a part of fig. 7.

As shown in fig. 8, in some embodiments, the dome 140 may include a top plate 141, a female ring 142, and an extension 143. The top plate 141 has a plate-like structure, and the female ring 142 and the extension 143 have ring-like structures. Illustratively, the top plate 141, the female ring 142, and the extension 143 are each a rectangular structure having a cross-sectional shape with 4R corners, similar to the shape of the voice coil 120, so that the female ring 142 can fix the voice coil 120.

The top plate 141 is located at the center of the female ring 142, the edge of the top plate 141 is connected to the inner ring side of the female ring 142, and the outer ring side of the female ring 142 is connected to the inner ring side of the extension 143. Illustratively, the top plate 141, the female ring 142, and the extension 143 may be integrally formed to provide the dome 140. The longitudinal sectional shape of the concave ring 142 is approximately trapezoidal, and the concave ring 142 having a trapezoidal structure may serve as a voice coil bobbin of the voice coil 120. The voice coil 120 is fixedly connected to the lower portion of the concave ring 142, four R corners of the concave ring 142 correspond to four R corners of the voice coil 120 one by one, and the position of the voice coil 120 is adjusted by the concave ring 142. Thus, the voice coil 120 does not need to be separately provided with a voice coil frame in the speaker module 50, so as to reduce the height in the Z direction and reduce the thickness of the speaker module 50. Meanwhile, the voice coil 120 is supported and fixed by the concave ring 142, so that the voice coil 120 can be kept to vibrate only in the Z direction, the vibration balance is good, the voice coil 120 is prevented from hitting a magnetic circuit system, and the sound effect of the speaker module 50 is improved.

In order to satisfy the requirement that the concave ring 142 can be used as the voice coil bobbin of the voice coil 120, the first height H between the lower surface of the extension 143 and the upper surface of the voice coil 120 is required to be satisfied ₁ And a second height H is required between the lower surface of the top plate 141 and the upper surface of the voice coil 120 ₂ . Wherein H ₁ And H ₂ Are all between 0.1mm and 0.4 mm. Bottom width W of the concave ring 142 ₁₄₂ Is smaller than the width W of the voice coil 120 ₁₂₀ Width of bottom side W ₁₄₂ Is set on condition that the female ring 142 can secure the voice coil 120 and does not interfere with the vibration of the voice coil 120.

In some embodiments, the diaphragm 150 includes an inner fixing portion 151, a corrugated rim 152, and an outer fixing portion (not shown). The inner fixing portion 151 and the outer fixing portion serve to perform a fixing function, and the corrugated rim 152 serves to perform vibration sound generation. The outer ring side of the outer fixing portion is fixedly connected to the frame 160, the outer ring side of the folded ring 152 is connected to the inner ring side of the outer fixing portion, and the inner ring side of the folded ring 152 is connected to the outer ring side of the inner fixing portion 151. The lower surface of the inner fixing portion 151 on the inner ring side is fixedly connected to the upper surface of the extension 143 of the dome 140.

When the diaphragm 150 is preassembled with the dome 140, the inner fixing portion 151 is attached to the extension portion 143. In order to secure the vibration effect and prevent the extension portion 143 from obstructing the vibration of the diaphragm 150, the distance between the end of the inner fixing portion 151 and the adjacent side of the extension portion 143 may be set to be the first distance L ₁ . Wherein L is ₁ May be 0.3mm to 0.5mm.

The upper surface of the inner fixing portion 151 may be located on the same horizontal plane as the upper surface of the extension portion 143. Then to accommodate this connection, the dome 140 assumes an unequal height configuration. Illustratively, the height of the extension 151 connected to the inner fixing portion 151 in the dome 140 is lower than the height of the top plate 141. For example, the first height H of the extension 151 ₁ Is less than the corresponding second height H of the top plate 141 ₂ 。

When the speaker module 50 vibrates to generate sound, after the voice coil 120 is electrically connected to an external circuit through the FPC110, the voice coil 120 vibrates under the action of a magnetic field formed in a magnetic space defined by the magnetic circuit system. The vibrating voice coil 120 drives the concave ring 142 fixedly connected with the voice coil to vibrate, the vibrating concave ring 142 drives the inner fixing portion 151 of the diaphragm 150 to vibrate through the extension portion 143, the vibrating inner fixing portion 151 drives the corrugated rim 152 to vibrate, and the corrugated rim 152 vibrates to push air to sound.

When the speaker module 50 provided in the embodiment of the present application is assembled, for example, the dome 140 and the diaphragm 150 may be pre-assembled to form an assembly. The magnetic circuit system and the FPC110 are fixed to the frame 160 in their respective positions, and the voice coil 120 is placed above the magnetic circuit system with one end of the voice coil 120 extending into a magnetic space defined by the magnetic circuit system. The FPC110 is electrically connected to the voice coil lead of the voice coil 120, and each end of the FPC110 is fixedly connected to the outer sidewall 121 of the voice coil 120, and the fixing connection may be in the form of glue, a pad, or the like. Finally the assembly is secured above the frame 160 and the voice coil 120 is secured below the dome 140.

In this way, the FPC110 is fixed on one side of the voice coil 120 in the horizontal direction, so that the FPC110 and the voice coil 120 are in a left-right position relationship, and the height position of the FPC110 relative to the voice coil 120 is located between the upper surface and the lower surface of the voice coil 120, thereby realizing avoidance in the Z-direction space, ensuring that the diaphragm group has a sufficient vibration space, namely ensuring the large-amplitude performance of the speaker module 50, and improving the sound effect; the Z-direction space height of the speaker module 50 can be reduced, and the thinning of the speaker module 50 is realized.

Fig. 9 is a first top view of a second speaker module 50 according to an embodiment of the present disclosure. In fig. 9, the dome 140, the diaphragm 150, the frame 160, and the FPC110 are not shown.

As shown in fig. 9 in conjunction with fig. 3, in some embodiments, the vibration system of the second speaker module 50 may include a diaphragm group, a flexible circuit board FPC110, a voice coil 120, and a plurality of FPC skeletons 130. The contents of the diaphragm module, the structure and the position relationship of the flexible printed circuit FPC110 and the voice coil 120 can refer to the contents of the first speaker module 50, and the FPC frame 130 and its related contents are only illustrated here.

The FPC frameworks 130 are fixedly attached to the outer side wall 121 of the voice coil 120, and the bottom surfaces of the FPC frameworks 130 are positioned between the upper surface and the lower surface of the voice coil 120; the FPC skeletons 130 are respectively fixedly connected to one end of the FPC110 electrically connected to the voice coil 120, and the FPC skeletons 130 are used to fixedly support the FPC110, so as to further ensure that no relative displacement is generated between the FPC110 and the voice coil 120. The FPC frame 130 may be made of aluminum or other materials with certain strength.

Fig. 10 is a first perspective view of a second speaker module 50 according to an embodiment of the present application. In fig. 10, the dome 140, the diaphragm 150, the frame 160, and the FPC110 are not shown.

As shown in fig. 10, in some embodiments, the magnetic circuit system may further include a plurality of vacant areas formed by the magnet 170 and the upper magnetic circuit 180. Illustratively, the plurality of vacant areas may be formed by the upper center magnetic path 182 and the upper side magnetic path 181 in the upper magnetic path 180, and may be formed by the center magnet 172 and the side magnet 171 in the magnet 170. The plurality of vacant areas formed by the upper magnetic circuit 180 and the plurality of vacant areas formed by the magnets 170 are communicated in a one-to-one correspondence manner, so that a plurality of vacant areas formed by the magnetic circuit system are obtained. A plurality of idle regions are formed at four R corners corresponding to the voice coil 120, and may include, for example, a first region 180a, a second region 180b, a third region 180c, and a fourth region 180d.

In order to facilitate the electrical connection between the voice coil 120 and the FPC110 and ensure the positioning accuracy of the FPC110, in the embodiment of the present application, the FPC skeleton 130 is used to fixedly connect the FPC110 and the outer sidewall 121 of the voice coil 120, so as to prevent the voice coil lead between the FPC110 and the voice coil 120 from being broken due to the relative displacement between the two. Meanwhile, in order to ensure the large amplitude performance of the speaker module 50, the FPC110 is fixedly connected to the outer sidewall 121 of the voice coil 120 by gluing. The FPC110 and the voice coil 120 are connected in a left-right positional relationship, and the Z-direction height of the speaker module 50 can be reduced.

The plurality of FPC frameworks 130 are fixedly attached to the outer side wall 121 of the voice coil 120, so that the plurality of FPC frameworks 130 can fix the FPC110 conveniently, and the connection between the FPC110 and the outer side wall 121 of the voice coil 120 is ensured. The number of FPC frames 130 to be provided may be determined according to the number of FPCs 110 provided in the speaker module 50, and the number of ends of one FPC110 to be electrically connected to the voice coil leads of the voice coil 120. If two FPCs 110 are disposed in the speaker module 50, and the number of the end portions of each FPC110 to be electrically connected to the voice coil leads of the voice coil 120 is 2, four FPC frames 130 need to be attached to the outer side wall 121 of the voice coil 120, and the voice coil 120 needs to have four voice coil leads (not shown in the figure), and the position of each voice coil lead is opposite to the position of each FPC frame 130.

Illustratively, the four FPC frameworks 130 include a first FPC framework 131, a second FPC framework 132, a third FPC framework 133, and a fourth FPC framework 134. The first FPC frame 131 and the second FPC frame 132 are respectively fixed to the outer side walls 121 corresponding to two R corners of the voice coil 120, that is, to the outer side wall 121 of the left short axis side of the voice coil 120; the third FPC bobbin 133 and the fourth FPC bobbin 134 are respectively fixed to the outer side walls 121 corresponding to the other two R corners of the voice coil 120, that is, the outer side walls 121 attached to the right minor axis side of the voice coil 120. Wherein the left and right orientation definitions are based on the current state of the speaker module 50 shown in fig. 10.

The plurality of vacant areas formed by the magnetic circuit system accommodate the plurality of FPC skeletons 130 to leave a sufficient space for fixedly attaching the FPC110 to the FPC skeletons 130. Illustratively, the first region 180a houses the first FPC backbone 131, the second region 180b houses the second FPC backbone 132, the third region 180c houses the third FPC backbone 133, and the fourth region 180d houses the fourth FPC backbone 134.

Fig. 11 is a partial view of a portion D1 in fig. 10. In fig. 11, the voice coil lead 123 is omitted.

As shown in fig. 11, in some embodiments, the structures of the plurality of FPC frameworks 130 may be the same. The first FPC skeleton 130 provided in the embodiment of the present application may include a bearing portion 130a and an attaching portion 130b. The attaching portion 130b is fixedly attached to the outer sidewall 121 of the voice coil 120, one end of the attaching portion 130b is connected to one end of the bearing portion 130a at a predetermined angle, and the other end of the bearing portion 130a extends in a direction away from the outer sidewall 121. For example, one end of the bearing portion 130a is connected to one end of the attaching portion 130b, which is far away from the upper surface 122 of the voice coil 120, and the predetermined angle between the attaching portion 130b and the bearing portion 130a may be a right angle, an acute angle, or an obtuse angle, and is preferably a right angle. The carrier 130a is used for fixedly connecting the FPC110. For example, the bearing portion 130a and the attaching portion 130b may be integrally molded to form the first FPC skeleton 130.

The voice coil lead of the voice coil 120 may be located at a position where the outer sidewall 121 is attached to the FPC frame 130, and after one end of the FPC110 is fixedly connected to the carrying portion 130a of the FPC frame 130 through a bonding pad, one end of the FPC110 is electrically connected to the corresponding voice coil lead of the voice coil 120.

In some embodiments, height H of FPC backbone 130 ₁₃₀ Is less than height H of voice coil 120 ₁₂₀ . The upper surface of FPC frame 130 may be flush with upper surface 122 of voice coil 120 or may be lower than upper surface 122 of voice coil 120, but at least the bottom surface of FPC frame 130 is ensured to be located between the upper and lower surfaces of voice coil 120, so as to ensure that the height position of FPC110 relative to voice coil 120 is located between the upper and lower surfaces of voice coil 120, so as to reduce the Z-direction height of speaker module 50.

The structures of the plurality of FPC frames 130 are the same, and taking the first FPC frame 131 as an example, the bottom surface of the first FPC frame 131 is located between the upper and lower surfaces of the voice coil 120, that is, the bottom surface of the bearing portion 130a of the first FPC frame 131 is located between the upper and lower surfaces of the voice coil 120.

Fig. 12 is a second top view of a second speaker module 50 according to an embodiment of the present disclosure. Fig. 13 is a second perspective view of a second speaker module 50 according to an embodiment of the present application. In fig. 12 and 13, the dome 140 and the diaphragm 150 are not shown, and in fig. 13, the basin stand 160 is not shown.

As shown in fig. 12 and 13, in some embodiments, the speaker module 50 may be provided with two FPCs 110, and each FPC110 has two ends electrically connected to the voice coil leads of the voice coil 120. For example, the FPC110 may include a first FPC111 and a second FPC112, an inner portion of the first FPC111 may include two end portions (111 a and 111 b), and an inner portion of the second FPC112 may include two end portions (112 a and 112 b). The first FPC111 is located on one side of the voice coil 120 corresponding to two R angles, that is, the first FPC111 is located on the left side of the voice coil 120; the second FPC112 is located on the side of the voice coil 120 corresponding to the other two R corners, i.e., the second FPC112 is located on the right side of the voice coil 120.

Set up one FPC110 in speaker module 50 and can realize the voice coil vibration and drive the vibration sound production of diaphragm group, and set up two FPC110, can guarantee the vibration balance of the relative both sides of voice coil 120, improve speaker module 50's sound generating performance.

The outer portion of the first FPC111 is connected to an external circuit, one end 111a of the inner portion of the first FPC111 is fixedly connected to the carrier 130a of the first FPC frame 131, and one end 111a of the inner portion of the first FPC111 is electrically connected to the first voice coil lead of the voice coil 120. The other end 111b of the inner portion of the first FPC111 is fixedly connected to the carrier 130a of the second FPC frame 132, and the other end 111b of the inner portion of the first FPC111 is electrically connected to the second voice coil lead of the voice coil 120. Here, the inner and outer orientation is defined based on the inner and outer sides of the speaker module 50, and the inner side is located inside the speaker module 50 and the outer side is located outside the speaker module 50.

Similarly, the outer portion of the second FPC112 is connected to an external circuit, one end 112a of the inner portion of the second FPC112 is fixedly connected to the carrier 130a of the fourth FPC frame 134, and one end 112a of the inner portion of the second FPC112 is electrically connected to the third coil lead of the voice coil 120. The other end 112b of the inner portion of the second FPC112 is fixedly connected to the carrier 130a of the third FPC skeleton 133, and the other end 112b of the inner portion of the second FPC112 is electrically connected to the fourth voice coil lead of the voice coil 120.

Fig. 14 is a partial view of a portion D2 in fig. 13. In fig. 14, the voice coil lead 123 is not shown.

As shown in fig. 14, in some embodiments, taking the first FPC111 and the first FPC frame 131 as an example of fixed connection, after the end 111a of the first FPC111 is fixedly connected to the bearing portion 130a of the first FPC frame 131 through the pad, since the bottom surface of the bearing portion 130a of the first FPC frame 131 is located between the upper and lower surfaces of the voice coil 120, the height position H of the first FPC111 relative to the voice coil 120 is ₁₁₀ Between the upper and lower surfaces of the voice coil 120. The first FPC111 and the second FPC112 are fixed in the same manner, and then the height position of the second FPC112 with respect to the voice coil 120 is also located between the upper and lower surfaces of the voice coil 120.

When the speaker module 50 provided in the embodiment of the present application is assembled, on the basis of the assembly process of the first speaker module 50, each end of each FPC110 may be fixedly connected to the corresponding bearing portion 130a of the FPC frame 130 in advance, and the fixed connection manner may adopt a form of a pad or a spring contact. The bonding portion 130b of the FPC frame 130 is bonded to the outer wall 121 of the voice coil 120 by using an adhesive or a bonding pad. Because the areas of the outer side surfaces of the FPC framework 130 and the voice coil 120 are larger, higher bonding strength can be realized, and bonding failure is prevented; and, the area of the tip of FPC110 and FPC skeleton 130 is also all great, can realize higher fixed strength, prevents to drop.

In this way, by fixing the FPC110 to one side of the voice coil 120 in the horizontal direction so that the FPC110 and the voice coil 120 are in a left-right positional relationship, the voice coil lead of the FPC110 and the voice coil 120 can be electrically connected. The height position of the FPC110 relative to the voice coil 120 is located between the upper surface and the lower surface of the voice coil 120, so that avoidance in a Z-direction space is realized, a sufficient vibration space of a vibration diaphragm group is ensured, and a sound effect is improved; the Z-direction space height of the speaker module 50 can be reduced, and the thinning of the speaker module 50 is realized. Meanwhile, the FPC skeleton 130 increases the bonding strength between the voice coil 120 and the FPC110, and prevents the voice coil 120 and the FPC110 from generating relative displacement; the FPC framework 130 can also avoid the problems of assembling deflection, inclination and the like of the FPC110 caused by poor positioning accuracy of the FPC110. In addition, since the FPC bobbin 130 and the voice coil 120 are bonded to each other in the Z direction (the Z direction where the outer wall 121 is located), the height of the FPC bobbin 130 and the height of the FPC110 themselves can be accurately positioned, and high-precision assembly can be achieved.

Fig. 15 is a first top view of a third speaker module 50 according to an embodiment of the present disclosure. Fig. 16 is a first perspective view of a third speaker module 50 according to an embodiment of the present disclosure. In fig. 15 and 16, the dome 140, the diaphragm 150, the frame 160, and the FPC110 are not shown.

As shown in fig. 15 and 16, in some embodiments, the structure of the third speaker module 50 provided in the embodiments of the present application is different from the structure of the second speaker module 50 in that the structure of the FPC frame 130 is different, and the rest of the structural characteristics can refer to the contents of the first speaker module 50 and the second speaker module 50, which are not described herein again.

Fig. 17 is a partial view of a portion E1 in fig. 16. In fig. 17, the voice coil lead 123 is not shown.

As shown in fig. 17, in some embodiments, the second FPC skeleton 130 provided in the embodiments of the present application may include a bearing portion 130a, an attaching portion 130b, and a fixing portion 130c. The connection manner and the structural characteristics of the bearing portion 130a and the attaching portion 130b can refer to the contents of the first FPC frame 130, which is not described herein again. For example, the bearing portion 130a, the attaching portion 130b and the fixing portion 130c may be integrally molded to form the second FPC frame 130.

The fixing portion 130c may be regarded as a portion for increasing the fixing strength between the first FPC frame 130 and the voice coil 120. One end of the fixing portion 130c is connected to one end of the bonding portion 130b, which is not connected to the carrier portion 130a, and the fixing portion 130c is bonded to the upper surface 122 of the voice coil 120. The fixing portion 130c is opposite to the extending direction of the bearing portion 130a relative to the outer sidewall 121 of the voice coil 120, the bearing portion 130a extends outwards along the outer sidewall 121 of the voice coil 120, and the fixing portion 130c extends inwards along the outer sidewall 121 of the voice coil 120. The plane of the fixing portion 130c and the plane of the bearing portion 130a may be parallel or not, preferably parallel; the fixing portion 130c and the attaching portion 130b may be perpendicular or not, and preferably may be perpendicular.

Due to the presence of the fixing portion 130c, the upper surface of the second FPC skeleton 130 is higher than the upper surface 122 of the voice coil 120. Height H of second FPC skeleton 130 ₁₃₀ ' less than height H of voice coil 120 ₁₂₀ And the height H of the second FPC skeleton 130 ₁₃₀ ' greater than height H of first FPC skeleton 130 ₁₃₀ . But at least the bottom surface of the second FPC frame 130 is ensured to be located between the upper and lower surfaces of the voice coil 120, so that the height position of the FPC110 with respect to the voice coil 120 can be ensured to be located between the upper and lower surfaces of the voice coil 120 to reduce the Z-direction height of the speaker module 50.

Fig. 18 is a second top view of a third speaker module 50 according to an embodiment of the present disclosure. Fig. 19 is a second perspective view of a third speaker module 50 according to an embodiment of the present application. In fig. 18 and 19, the illustration of the dome 140 and the diaphragm 150 is omitted.

As shown in fig. 18 and 19, in some embodiments, two FPCs 110 may be disposed in the speaker module 50, and the structures and connection manners of the two FPCs 110 and the corresponding FPC frameworks 130 can refer to the contents of the second speaker module 50, which is not described herein again.

Fig. 20 is a partial view of the portion E2 in fig. 19. In fig. 20, the voice coil lead 123 is omitted.

As shown in fig. 20, in some embodiments, taking the first FPC111 and the first FPC frame 131 as an example of being fixedly connected, the fixing portion 130c of the first FPC frame 131 is attached to the upper surface 122 of the voice coil 120, the attaching portion 130b of the first FPC frame 131 is attached to the outer side wall 121 of the voice coil 120, and the bearing portion 130a of the first FPC frame 131 and the attaching portion 130b are connected at a predetermined angle and extend in a direction away from the voice coil 120. One end 111a of the first FPC111 is fixedly connected to the carrying portion 130a of the first FPC frame 131 through a pad, and the first FPC frameHeight position H of FPC111 with respect to voice coil 120 ₁₁₀ Between the upper and lower surfaces of the voice coil 120.

In the speaker module 50 according to the embodiment of the present application, each end of each FPC110 is fixedly connected to the corresponding carrying portion 130a of the FPC frame 130 in advance, the attaching portion 130b of the FPC frame 130 is attached to the outer side wall 121 of the voice coil 120, and the fixing portion 130c of the FPC frame 130 is attached to the upper surface 122 of the voice coil 120. This can further improve the adhesion strength between the FPC bobbin 130 and the voice coil 120, and improve the fixing strength between the end of the FPC110 and the FPC bobbin 130, to further prevent the voice coil 120 and the FPC110 from being displaced relative to each other.

When the voice coil 120 with the FPC bobbin 130 and the FPC110 is fixed below the dome 140, the concave ring 142 at the position in the dome 140 may be depressed upward, i.e., the depth of the concave ring 142 may be reduced, at the dome 140 corresponding to the position of the voice coil 120 to which the fixing portion 130c is attached, so that a gap exists between the position of the concave ring 142 and the upper surface 122 of the voice coil 120, and the height of the fixing portion 130c is accommodated by the gap. Like this, need not to change the former mounted position of diaphragm group, adopt second kind FPC skeleton 130 can not exert an influence to the required vibration space of diaphragm group promptly, also can not increase speaker module 50's whole thickness (Z to the height), can guarantee speaker module 50's frivolous and big amplitude, high performance's demand simultaneously, and then guarantee electronic equipment 100's the frivolous and sound effect performance of complete machine.

Fig. 21 is a perspective view of a fourth speaker module 50 according to an embodiment of the present application. In fig. 21, the illustration of the dome 140 and the diaphragm 150 is omitted.

As shown in fig. 21, in some embodiments, the structure of the fourth speaker module 50 provided in the present embodiment is different from the structure of the second speaker module 50 or the third speaker module 50 in that the structure of the FPC frame 130 is different, and the rest of the structural characteristics can refer to the content of the first speaker module 50, the second speaker module 50 or the third speaker module 50, which is not described herein again.

The fourth speaker module 50 further includes a communication member 130d. The connection member 130d is attached to the upper surface 122 of the voice coil 120 and located below the diaphragm group, and the connection member 130d is used for fixing a plurality of FPC frameworks 130, so as to further ensure the bonding strength between the FPC frameworks 130 and the voice coil 120, and further fix the FPC110 through the FPC frameworks 130, so as to prevent the voice coil 120 and the FPC110 from generating relative displacement.

The connecting member 130d can be applied to the first FPC frame 130 provided in the second speaker module 50, and in this case, the connecting member 130d can be a ring structure. The outer ring side wall of the annular communicating member 130d is connected to the attaching portions 130b of the plurality of FPC frames 130 at a predetermined angle. In this way, the third FPC skeleton 130 may be formed of the communication member 130d and the plurality of FPC skeletons 130 to improve the adhesive strength of each FPC skeleton 130 with the voice coil 120. For example, the carrier portion 130a, the attaching portion 130b and the communicating member 130d may be integrally molded to form the third FPC frame 130.

The connecting member 130d can also be applied to the second FPC frame 130 provided in the third speaker module 50, in which case the connecting member 130d is a ring structure having a plurality of fractures (not shown). The annular communicating member 130d having the fracture is fixedly connected to the fixing portions 130c of the plurality of FPC frames 130 through the plurality of fractures, respectively. If four FPC frameworks 130 need to be arranged in the speaker module 50, four fractures need to be formed on the communicating member 130d, and the position of each fracture is opposite to the fixed position of the FPC framework 130, and the fracture is used for accommodating the fixing portion 130c of the second FPC framework 130.

During assembly, the second FPC frame 130 may be attached to the outer sidewall 121 and the upper surface 122 of the voice coil 120, and then the annular communicating member 130d having the fracture may be attached to the upper surface 122 of the voice coil 120. The fixing portion 130c of each second FPC frame 130 is inserted into the corresponding fracture to form a third FPC frame 130. The fixing portion 130c and the corresponding fracture may be connected by gluing or welding, and the fixing portion 130c and the annular communicating member 130d having the fracture may improve the bonding strength between the FPC frame 130 and the voice coil 120. For example, the carrier portion 130a, the attaching portion 130b, the fixing portion 130c and the communicating member 130d may be integrally molded to form the third FPC frame 130.

FIG. 22 isbase:Sub>A second configuration at section A-A of FIG. 3.

As shown in fig. 22, in some embodiments, when the fourth speaker module 50 is used, the communication member 130d is attached to the upper surface of the voice coil 120. Then, when the voice coil 120 is fixed to the dome 140, there is also a communication member 130d between the voice coil 120 and the dome 140.

Fig. 23 is a second connection diagram of the dome 140 and the diaphragm 150 according to an embodiment of the present disclosure. In order to better illustrate the connection relationship and the component structure of the dome 140, the diaphragm 150, and the communication member 130d, the remaining irrelevant structural components are not shown in fig. 23, and fig. 23 may be regarded as a part of a portion C2 in fig. 22.

As shown in fig. 23, in some embodiments, the voice coil 120 having the communication member 130d attached to the upper surface 122 is fixedly coupled to the lower portion of the concave ring 142 of the dome 140. To avoid increasing the overall thickness of the speaker module 50, the first height H is ensured between the lower surface of the extension 143 and the upper surface of the voice coil 120 ₁ And a second height H is satisfied between the lower surface of the top plate 141 and the upper surface of the voice coil 120 ₂ The depth of the female ring 142 may be reduced, i.e., the female ring 142 is recessed upward by a certain distance. At this time, the height H between the lower surface of the top plate 141 and the upper surface of the communication member 130d ₂ ' less than second height H ₂ 。

By reducing the depth of the female ring 142, there is a gap between the female ring 142 and the upper surface 122 of the voice coil 120 to accommodate the height of the communication member 130d by the gap. Like this, need not to change the former mounted position of diaphragm group, adopt third kind FPC skeleton 130 can not exert an influence to the required vibration space of diaphragm group promptly, also can not increase speaker module 50's whole thickness (Z to the height), can guarantee speaker module 50's frivolous and big amplitude, high performance's demand simultaneously, and then guarantee electronic equipment 100's the frivolous and sound effect performance of complete machine.

In some embodiments, the width W of the communication member 130d _130d Is smaller than the width W of the voice coil 120 ₁₂₀ The communication member 130d is prevented from being too wide to interfere with the vibration of the voice coil 120.

Fig. 24 is a partial view of portion F of fig. 21.

As shown in fig. 24, in some embodiments, the assembling manner and sequence of the fourth speaker module 50 can be according to the content of the foregoing embodiments, which is not described herein again.

The upper surface of the third FPC skeleton 130 is higher than the upper surface 122 of the voice coil 120 due to the presence of the communication member 130d. Height H of third FPC skeleton 130 ₁₃₀ ' less than height H of voice coil 120 ₁₂₀ And the height H of the third FPC frame 130 ₁₃₀ ' greater than height H of first FPC skeleton 130 ₁₃₀ . However, at least the bottom surface of the third FPC bobbin 130 is located between the upper and lower surfaces of the voice coil 120, so that the height position H of the FPC110 with respect to the voice coil 120 can be ensured ₁₁₀ Between the upper and lower surfaces of the voice coil 120 to reduce the Z-height of the speaker module 50.

The speaker module 50 provided in the embodiment of the present application utilizes the third FPC frame 130 to fix the FPC110, so as to prevent the voice coil 120 and the FPC110 from generating relative displacement. The FPC110 is fixed on one side of the voice coil 120 in the horizontal direction, so that the FPC110 and the voice coil 120 are in a left-right position relation, and the height position of the FPC110 relative to the voice coil 120 is located between the upper surface and the lower surface of the voice coil 120, so that avoidance in a Z-direction space is realized, a sufficient vibration space of a vibration diaphragm group is ensured, and a sound effect is improved; the height of the Z-direction space of the loudspeaker module 50 can be reduced, and the loudspeaker module 50 can be thinned. Meanwhile, the third FPC skeleton 130 may further avoid the problems of the FPC110 assembly deflection, inclination, and the like caused by poor positioning accuracy of the FPC110. In addition, since the third FPC frame 130 and the voice coil 120 are bonded by the Z-direction (the Z-direction in which the outer sidewall 121 is located), the height of the third FPC frame 130 and the height of the FPC110 themselves can be further accurately positioned, and high-precision assembly can be achieved.

In some embodiments, when the FPC110 is fixed to the outer sidewall 121 of the voice coil 120 through the FPC frame 130 provided in the above embodiments, the FPC110 may be attached to the outer sidewall 121 of the voice coil 120 by using glue at the same time, so as to further improve the fixing strength.

In some embodiments, the overall thickness of the conventional speaker module 50 is between 2mm and 2.5 mm. The overall thickness of the speaker module 50 provided in the embodiments of the present application can be reduced to about 1.8mm, which is thinner and lighter.

It is noted that other embodiments of the present application will become apparent to those skilled in the art from consideration of the specification and practice of the application disclosed herein. This application is intended to cover any variations, uses, or adaptations of the invention following, in general, the principles of the application and including such departures from the present disclosure as come within known or customary practice within the art to which the invention pertains. It is intended that the specification and examples be considered as exemplary only, with a true scope and spirit of the application being indicated by the following claims.

It will be understood that the present application is not limited to the precise arrangements that have been described above and shown in the drawings, and that various modifications and changes may be made without departing from the scope thereof. The scope of the application is limited only by the appended claims.

Claims

1. A speaker module, comprising:

a vibration system including a diaphragm group, a flexible circuit board FPC (110), and a voice coil (120);

the voice coil (120) is fixedly connected below the diaphragm group;

one end of the FPC (110) is fixedly attached to the outer side wall (121) of the voice coil (120), one end of the FPC (110) is electrically connected with a voice coil lead (123) of the voice coil (120), the height position of the FPC (110) relative to the voice coil (120) is located between the upper surface and the lower surface of the voice coil (120), the other end of the FPC (110) is connected with an external circuit, and the FPC (110) and the voice coil (120) are used for providing electric signals;

and the magnetic circuit system is positioned below the vibration system and is used for being matched with the voice coil (120) to drive the diaphragm group to vibrate and sound.

2. The speaker module as recited in claim 1, characterized in that the vibration system further comprises a plurality of FPC skeletons (130);

the FPC frameworks (130) are fixedly attached to the outer side wall (121) of the voice coil (120), and the bottom surfaces of the FPC frameworks (130) are located between the upper surface and the lower surface of the voice coil (120);

the FPC frameworks (130) are fixedly connected with one ends, electrically connected with the voice coils (120), of the FPCs (110) respectively, and the FPC frameworks (130) are used for fixedly supporting the FPCs (110).

3. The speaker module as claimed in claim 2, wherein the FPC skeleton (130) comprises a carrier portion (130 a) and an attachment portion (130 b);

the attaching part (130 b) is fixedly attached to the outer side wall (121) of the voice coil (120), one end of the attaching part (130 b) is connected with one end of the bearing part (130 a) at a preset angle, and the other end of the bearing part (130 a) extends in a direction far away from the outer side wall (121);

the bottom surface of the bearing part (130 a) is positioned between the upper surface and the lower surface of the voice coil (120), and the bearing part (130 a) is used for fixedly connecting the FPC (110).

4. The speaker module as claimed in claim 3, wherein the FPC skeleton (130) further comprises a fixing portion (130 c);

one end of the fixing portion (130 c) is connected with the other end of the attaching portion (130 b) at a preset angle, and the fixing portion (130 c) is attached to the upper surface (122) of the voice coil (120).

5. A loudspeaker module according to claim 3 or 4, further comprising a communication member (130 d);

the communicating piece (130 d) is attached to the upper surface (122) of the voice coil (120) and located below the diaphragm group, and the communicating piece (130 d) is used for fixing the FPC frameworks (130).

6. The speaker module as recited in claim 5,

the communication piece (130 d) is of an annular structure, and the outer annular side wall of the communication piece (130 d) is connected with the attaching parts (130 b) of the FPC frameworks (130) at preset angles respectively;

or,

the communicating piece (130 d) is of an annular structure with a plurality of fractures, the communicating piece (130 d) is fixedly connected with the fixing portions (130 c) of the FPC frameworks (130) through the fractures, and the fractures are used for accommodating the fixing portions (130 c).

7. The speaker module as claimed in claim 6, wherein the voice coil (120) has a rectangular cross-sectional shape having four R corners;

the plurality of FPC frameworks (130) comprise a first FPC framework (131), a second FPC framework (132), a third FPC framework (133) and a fourth FPC framework (134);

the first FPC framework (131) and the second FPC framework (132) are fixedly attached to outer side walls (121) corresponding to two R corners of the voice coil (120) respectively;

and the third FPC framework (133) and the fourth FPC framework (134) are fixedly attached to the outer side walls (121) corresponding to the other two R angles of the voice coil (120) respectively.

8. A speaker module as claimed in claim 7, wherein the FPC (110) comprises a first FPC (111) and a second FPC (112);

the first FPC (111) is positioned on one side of the voice coil (120) corresponding to the two R angles, and the second FPC (112) is positioned on one side of the voice coil (120) corresponding to the other two R angles;

the outer side part of the first FPC (111) is connected with an external circuit, one end (111 a) of the inner side part of the first FPC (111) is fixedly connected with a bearing part (130 a) of the first FPC framework (131), and one end (111 a) of the inner side part of the first FPC (111) is electrically connected with a first voice coil lead of the voice coil (120); the other end (111 b) of the inner part of the first FPC (111) is fixedly connected with the bearing part (130 a) of the second FPC framework (132), the other end (111 b) of the inner part of the first FPC (111) is electrically connected with a second voice coil lead of the voice coil (120), and the height position of the first FPC (111) relative to the voice coil (120) is positioned between the upper surface and the lower surface of the voice coil (120);

the outer side part of the second FPC (112) is connected with an external circuit, one end (112 a) of the inner side part of the second FPC (112) is fixedly connected with a bearing part (130 a) of the fourth FPC framework (134), and one end (112 a) of the inner side part of the second FPC (112) is electrically connected with a third voice coil lead of the voice coil (120); the other end (112 b) of the inner portion of the second FPC (112) is fixedly connected with the bearing portion (130 a) of the third FPC framework (133), the other end (112 b) of the inner portion of the second FPC (112) is electrically connected with a fourth voice coil lead of the voice coil (120), and the height position of the second FPC (112) relative to the voice coil (120) is located between the upper surface and the lower surface of the voice coil (120).

9. A loudspeaker module according to claim 6, wherein the diaphragm assembly comprises a dome (140) and a diaphragm (150);

the vibrating diaphragm (150) is of an annular structure, the ball top (140) is located in the center of the vibrating diaphragm (150), the edge of the ball top (140) is fixedly connected with the edge of the inner ring of the vibrating diaphragm (150), and the voice coil (120) is fixedly connected below the ball top (140).

10. A speaker module as claimed in claim 9, wherein the dome (140) comprises a top plate (141), a female ring (142) and an extension (143);

the concave ring (142) and the extension part (143) are both of a ring structure, the top plate (141) is located in the center of the concave ring (142), the edge of the top plate (141) is connected with the inner ring side of the concave ring (142), the outer ring side of the concave ring (142) is connected with the inner ring side of the extension part (143), and the upper surface of the extension part (143) is fixedly connected with the lower surface of the inner ring side of the diaphragm (150).

11. The speaker module as claimed in claim 10, wherein the voice coil (120) is fixedly connected below the concave ring (142), or the voice coil (120) with a communication member (130 d) attached to the upper surface (122) is fixedly connected below the concave ring (142);

a first height between a lower surface of the extension portion (143) and an upper surface of the voice coil (120) is smaller than a second height between a lower surface of the top plate (141) and the upper surface of the voice coil (120).

12. An electronic device, comprising a display screen and a housing, wherein the display screen is fastened to the housing to form a closed cavity, and the speaker module according to any one of claims 1-11 is included in the closed cavity.