CN218550307U - Board warping and flattening device - Google Patents
Board warping and flattening device Download PDFInfo
- Publication number
- CN218550307U CN218550307U CN202222376168.5U CN202222376168U CN218550307U CN 218550307 U CN218550307 U CN 218550307U CN 202222376168 U CN202222376168 U CN 202222376168U CN 218550307 U CN218550307 U CN 218550307U
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- Prior art keywords
- board
- limiting
- plate
- leveling
- slide
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Links
- 230000000694 effects Effects 0.000 claims abstract description 6
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 8
- 239000000741 silica gel Substances 0.000 claims description 8
- 229910002027 silica gel Inorganic materials 0.000 claims description 8
- 238000004519 manufacturing process Methods 0.000 abstract description 2
- 230000006835 compression Effects 0.000 description 6
- 238000007906 compression Methods 0.000 description 6
- 238000003825 pressing Methods 0.000 description 5
- 238000010438 heat treatment Methods 0.000 description 2
- 206010053615 Thermal burn Diseases 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 239000012774 insulation material Substances 0.000 description 1
- 239000011229 interlayer Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Images
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- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The utility model relates to a circuit board production and processing technology field, concretely relates to board perk leveling device, including leveling equipment body and the board of placing of sliding connection at leveling equipment body incasement bottom, this board perk leveling device, place the board through setting up in leveling equipment body bottom, it sets up movable slide to place the inboard, set up flexible slide in the movable slide, when the user needs to take out the circuit board, through pulling flexible slide and movable slide, it comes out to drive to place the board in leveling equipment body bottom slip, after placing board and leveling equipment body break away from, the board is placed in 180 degrees upsets, pour the circuit board can on accepting the platform, through this setting, make the user can be more convenient take out the circuit board, do not receive the space restriction of incasement, take flexible slide and movable slide's cooperation simultaneously and slide, make it reach hidden effect, can not cause the influence to closing of chamber door, the practicality of the device has further been improved.
Description
Technical Field
The utility model relates to a circuit board production and processing technology field specifically is a board perk leveling device.
Background
With the rapid development of social economy, electrical equipment is one of indispensable devices in daily life, and the most common electrical components in the electrical equipment are printed circuit boards;
in the prior art, a board warp leveling device for processing a circuit board is provided in patent technology of patent No. CN216782631U, which comprises a machine body, a machine door and a pressing plate, and is characterized in that the periphery of the bottom end of the machine body is respectively fixedly connected with the top end of a bottom block, the periphery of the top end of the machine body is respectively fixedly connected with the middle part of an air compression rod, the middle part of the top end of the machine body is fixedly connected with the bottom end of an air compression pump, the top end of the air compression pump is provided with a control valve, the periphery of the top end of the control valve is connected with a pipeline at one end of an air pipe, the other end of the air pipe is respectively connected with a pipeline at the top end of the air compression rod, the pressing plate is installed at the bottom end of the air compression rod, the top end of the pressing plate is fixedly connected with an air compression rod, the bottom end of the pressing plate is fixedly connected with the top end of a rubber pad, the pressing plate is fixedly connected with a first heating plate, one side of the machine body is provided with a control switch, a heat-resistant base plate is installed at the bottom end inside of the machine body, and a first heating plate is installed in an interlayer of the machine body. The utility model discloses simple structure, convenient operation.
However, the above technical solutions have the following disadvantages:
1. the circuit board need be taken out the circuit board after the flattening, however the thickness of printed circuit board body is just comparatively single thin, and because the heat-resisting board that is used for placing the circuit board among the device is fixed connection with bottom of the body, this just leads to when taking out the circuit board, and the staff can only take out the circuit board from the heat-resisting board is vertical upwards, and the incasement space is limited, and it is inconvenient to take.
2. Because the inside first hot plate that is equipped with of organism, when the staff is taking out the circuit board, receive the influence of temperature, still can wear thermal-insulated gloves and take the circuit board, this degree of difficulty that just leads to further having increased the circuit board and take.
SUMMERY OF THE UTILITY MODEL
Not enough to prior art, the utility model provides a board perk leveling device to solve one of the problem that the background art provided at least, make the convenience more of taking of circuit board.
In order to achieve the above object, the utility model provides a following technical scheme: the utility model provides a board perk leveling device, includes leveling apparatus body and the board of placing of sliding connection at leveling apparatus body incasement bottom, it is equipped with movable assembly to place the inboard, movable assembly includes the sliding connection swing joint in placing the inboard, sliding connection has flexible slide in the swing joint.
Preferably, two limiting plates are fixedly connected to the bottom of the leveling equipment body and symmetrically arranged, and two limiting sliding grooves matched with the limiting plates are formed in the bottom surface of the lower end of the placing plate.
Preferably, two chamfers are arranged at one end, located at the box door, of the limiting plate, and the two chamfers are symmetrically arranged.
Preferably, an L-shaped plate is arranged at one end, located at the box door, of the telescopic sliding plate, and the L-shaped plate is rotatably connected with the telescopic sliding plate.
Preferably, the bottom is located chamber door one side and has seted up the shifting chute in the leveling equipment body incasement, sliding connection has spacing piece of supporting in the shifting chute, spacing piece lower extreme fixedly connected with and shifting chute bottom fixed connection's spring of supporting, spacing piece of supporting is close to flexible slide one side and places the board lateral wall and offsets, and spacing piece of supporting is located the lower extreme of L template.
Preferably, a chamfer is formed on one side, close to the telescopic sliding plate, of the limiting abutting block.
Preferably, an arc-shaped chamfer is formed on one side, away from the telescopic sliding plate, of the limiting abutting block.
Preferably, place board upper end top and be equipped with heat-resisting silica gel plate, heat-resisting silica gel plate with place board fixed connection.
Compared with the prior art, the utility model discloses possess following beneficial effect:
1. this board perk leveling device, place the board through setting up in leveling equipment body bottom, place the inboard and set up movable slide, set up flexible slide in the movable slide, when the user need take out the circuit board, stimulate flexible slide, make flexible slide one section distance in movable slide, drive flexible slide simultaneously and place one section distance in the inboard of sliding, then, the user holds flexible slide, continue to stimulate flexible slide, it slides out to drive to place the board in leveling equipment body bottom, after placing board and leveling equipment body and breaking away from, can will place board upset 180 degrees, pour the circuit board on accepting the platform can, through this setting, make the user can be more convenient take out the circuit board, do not receive the space restriction of incasement, take flexible slide and movable slide's cooperation to slide simultaneously, make it reach hidden effect, can not cause the influence to closing of chamber door, the practicality of the device has further been improved.
2. This board perk leveling device, limiting plate through setting up two symmetries in leveling equipment body bottom and setting up, place board lower extreme bottom surface and set up two spacing spouts that match with the limiting plate, when the user places the board in the slip, spacing spout relative slip on the limiting plate, the setting of limiting plate can be to placing the board at this internal spacing of leveling equipment, control the removal in preventing, when the user will place the board and slide again into leveling equipment originally internally at the user simultaneously, the accessible limiting plate leads and slides in, thereby make the position of placing the board more accurate.
Drawings
FIG. 1 is a schematic view of the overall three-dimensional structure of the present invention;
FIG. 2 is a schematic view of the three-dimensional cross-sectional structure of the local state of the present invention
FIG. 3 is an enlarged perspective view of A in FIG. 2;
fig. 4 is a schematic view of the three-dimensional structure of the limiting plate in a local state;
FIG. 5 is a schematic view of a three-dimensional cross-sectional structure of the placement board according to the present invention;
FIG. 6 is a schematic view of a three-dimensional cross-sectional structure of the movable skateboard of the present invention;
fig. 7 is a schematic view of the three-dimensional structure of the limiting abutting block of the present invention.
In the figure: 1. leveling equipment bodies; 2. placing the plate; 3. a heat-resistant silica gel plate; 4. a movable component; 401. a movable skateboard; 402. a telescopic sliding plate; 5. a limiting plate; 6. an L-shaped plate; 7. a moving groove; 8. a spring; 9. a limiting abutting block; 10. and a limiting sliding groove.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Examples
As shown in fig. 1 to 7, a board warping and leveling device comprises a leveling device body 1 and a placing board 2 connected to the bottom of the box of the leveling device body 1 in a sliding manner, wherein a movable assembly 4 is arranged in the placing board 2, the movable assembly 4 comprises a sliding connection movable sliding board 401 in the placing board 2, and a telescopic sliding board 402 is connected in the movable sliding board 401 in a sliding manner.
The utility model provides a leveling device, when the user need take out the circuit board, stimulate telescopic slide 402, make telescopic slide 402 slide one section distance in movable sliding plate 401, drive telescopic slide 402 and slide one section distance in placing board 2 simultaneously, at this moment, the user holds telescopic slide 402, continue to stimulate telescopic slide 402, it slides out to drive to place board 2 in leveling equipment body 1 bottom, when placing board 2 and leveling equipment body 1 and break away from the back, can will place board 2 upset 180 degrees, pour the circuit board can on accepting the platform, through this setting, make the user can more convenient take out the circuit board, do not receive the space restriction of incasement, take telescopic slide 402 and movable sliding plate 401's cooperation simultaneously and slide, make it reach hidden effect, can not cause the influence to closing of chamber door, the device's practicality has further been improved, in addition, because all coating has heat-resisting on telescopic slide (402) and movable sliding plate (401), thermal insulation material, make the user can not cause the scald to user's hand when taking.
Further, as figure 1, figure 2, figure 4 and figure 5 show, two limiting plates 5 of 1 bottom fixedly connected with of flattening equipment body, two limiting plates 5 set up for the symmetry, place 2 lower extreme bottom surfaces of board and set up two limiting chute 10 that match with limiting plate 5, when the user places board 2 in the slip, limiting chute 10 is relative slip on limiting plate 5, limiting plate 5's setting can be to placing the spacing of board 2 in flattening equipment body 1, avoid carrying out the in-process of flattening work, prevent it from taking place to remove, when the user will place board 2 and slide again in flattening equipment body 1 simultaneously, accessible limiting plate 5 leads and slides in, thereby make the position of placing board 2 more accurate.
Further, as shown in fig. 1, fig. 2 and fig. 4, two chamfers have been seted up to limiting plate 5 is located chamber door one end, and two chamfers are the symmetry setting, when the user is in will placing board 2 and slide into leveling equipment body 1 again, place the spacing spout 10 of 2 lower extreme bottom surfaces of board and can with limiting plate 5 relative movement, and the setting of chamfer then can play the guide effect when spacing spout 10 begins to slide in, make the more convenient board 2 that will place of user slide into leveling equipment body 1 in, the speed of pegging graft has also been improved simultaneously, further increase the convenience.
Further, as shown in fig. 2 and 3, the telescopic sliding plate 402 is provided with an L-shaped plate 6,L-shaped plate 6 at one end of the box door for being rotatably connected with the telescopic sliding plate 402, and when a user needs to pull the telescopic sliding plate 402, the user can directly pull the L-shaped plate 6, so that the L-shaped plate 6 drives the telescopic sliding plate 402 to move, and the user is more convenient to move the telescopic sliding plate 402.
Further, as shown in fig. 2 and fig. 3, a moving groove 7 is formed in one side of the box door at the bottom of the leveling device body 1, a limiting abutting block 9 is connected in the moving groove 7 in a sliding mode, a spring 8 fixedly connected with the bottom of the moving groove 7 is fixedly connected with the lower end of the limiting abutting block 9, the limiting abutting block 9 abuts against the side wall of the plate 2 on one side close to the telescopic sliding plate 402, and when the plate 2 is placed at the lower end of the L-shaped plate 6, the limiting abutting block 9 receives the elastic force of the spring 8, the inner side wall of the limiting abutting block 9 abuts against the outer side wall of the plate 2, so that the plate 2 can be placed in a limiting mode, the plate 2 is placed in the leveling device body 1 and abutted against the limiting abutting block 9, and the stability of the plate 2 is further improved.
Further, as shown in fig. 2, fig. 3 and fig. 7, a chamfer is formed on one side of the limiting abutting block 9 close to the telescopic sliding plate 402, when a user pulls the L-shaped plate 6, the user can rotate the L-shaped plate 6 downwards and press the L-shaped plate 6 downwards, so that the L-shaped plate 6 presses the limiting abutting block 9, the limiting abutting block 9 moves downwards into the moving groove 7 after being pressed, and when the user moves to the chamfer position, the user can pull the L-shaped plate 6 to drive the telescopic sliding plate 402 to move at the moment, the L-shaped plate 6 can be rotated through the arrangement, the linkage with the limiting abutting block 9 is realized, the limiting abutting block 9 can be pressed without manpower, the convenience of the device is further improved, meanwhile, the outer side of the L-shaped plate 6 is coated with heat-resistant and heat-insulating materials, and when the user pulls the L-shaped plate 6, and scalding is avoided.
Further, as shown in fig. 2, fig. 3 and fig. 7, an arc-shaped chamfer is formed on one side, away from the telescopic sliding plate 402, of the limiting abutting block 9, when the user slides the placing plate 2 into the leveling device body 1, the front end of the placing plate 2 abuts against the limiting abutting block 9, the placing plate 2 is continuously pushed at the moment, and due to the chamfer setting, when the chamfer position of the limiting abutting block 9 is squeezed, the limiting abutting block 9 moves downwards into the moving groove 7, the limiting abutting block 9 is not required to be manually pressed, and the convenience is further improved.
Further, as shown in fig. 1, 2 and 3, place 2 upper ends tops of board and be equipped with heat-resisting silica gel board 3, heat-resisting silica gel board 3 with place 2 fixed connection of board, the user can place the circuit board on heat-resisting silica gel board 3, simultaneously at the flattening during operation, also can not cause the damage to the circuit board body.
It is obvious to a person skilled in the art that the invention is not restricted to details of the above-described exemplary embodiments, but that it can be implemented in other specific forms without departing from the spirit or essential characteristics of the invention. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (8)
1. The utility model provides a board perk leveling device, includes that leveling equipment body (1) and sliding connection place board (2) at leveling equipment body (1) incasement bottom, its characterized in that, it is equipped with movable assembly (4) in board (2) to place, movable assembly (4) include sliding connection activity slide (401) placing in board (2), sliding connection has telescopic sliding plate (402) in activity slide (401).
2. A board warping and flattening device according to claim 1, characterized in that two limiting plates (5) are fixedly connected to the bottom of the flattening device body (1), the two limiting plates (5) are symmetrically arranged, and two limiting sliding grooves (10) matched with the limiting plates (5) are formed in the bottom surface of the lower end of the placing board (2).
3. A warping and flattening device according to claim 2, characterized in that the limiting plate (5) has two chamfers at one end of the box door, and the two chamfers are symmetrically arranged.
4. A plate flattening device according to claim 1, characterized in that an L-shaped plate (6) is arranged at one end of the telescopic sliding plate (402) positioned at the box door, and the L-shaped plate (6) is rotatably connected with the telescopic sliding plate (402).
5. A board warping and leveling device according to claim 1, wherein a moving groove (7) is formed in the bottom of the leveling device body (1) on one side of a box door, a limiting abutting block (9) is slidably connected in the moving groove (7), a spring (8) fixedly connected with the bottom of the moving groove (7) is fixedly connected to the lower end of the limiting abutting block (9), the side wall of the board (2) is placed on the side, close to the telescopic sliding plate (402), of the limiting abutting block (9) to abut against, and the limiting abutting block (9) is located at the lower end of the L-shaped board (6).
6. A board warping and leveling device according to claim 5, wherein a chamfer is formed on one side of the limiting and abutting block (9) close to the telescopic sliding board (402).
7. A warped flattening device according to claim 5, wherein an arc-shaped chamfer is formed on one side of the limiting abutting block (9) away from the telescopic sliding plate (402).
8. A board warping and flattening device according to claim 1, characterized in that a heat-resistant silica gel board (3) is arranged on the top of the upper end of the placing board (2), and the heat-resistant silica gel board (3) is fixedly connected with the placing board (2).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222376168.5U CN218550307U (en) | 2022-09-07 | 2022-09-07 | Board warping and flattening device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222376168.5U CN218550307U (en) | 2022-09-07 | 2022-09-07 | Board warping and flattening device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN218550307U true CN218550307U (en) | 2023-02-28 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202222376168.5U Active CN218550307U (en) | 2022-09-07 | 2022-09-07 | Board warping and flattening device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN218550307U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116939978A (en) * | 2023-09-14 | 2023-10-24 | 南通华隆微电子股份有限公司 | Leveling device for PCB processing |
-
2022
- 2022-09-07 CN CN202222376168.5U patent/CN218550307U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116939978A (en) * | 2023-09-14 | 2023-10-24 | 南通华隆微电子股份有限公司 | Leveling device for PCB processing |
| CN116939978B (en) * | 2023-09-14 | 2023-11-28 | 南通华隆微电子股份有限公司 | Leveling device for PCB processing |
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|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20240116 Address after: 432000 South of Huawu Road and West of Hancai Avenue in Hanchuan Economic Development Zone, Xiaogan City, Hubei Province Patentee after: Hubei Linsen Purification Board Industry Co.,Ltd. Address before: 341900 Electronic Industry District, Futian Industrial Zone, Dingnan County, Ganzhou City, Jiangxi Province Patentee before: Jiangxi Baishun Circuit Technology Co.,Ltd. |