CN218550097U - Sound box equipment - Google Patents

Abstract

The utility model provides a sound box equipment relates to audio amplifier technical field. The speaker device includes: the loudspeaker comprises a shell assembly, a first loudspeaker module and a second loudspeaker module; the first loudspeaker module and the second loudspeaker module are respectively positioned in the shell component, the first loudspeaker module is positioned at the upper part of the shell component, and the first loudspeaker module faces downwards to the sound outlet end; the second loudspeaker module is positioned at the lower part of the shell assembly and emits sound towards the circumferential side wall of the shell assembly; a first sound outlet channel is arranged on the circumferential side wall of the lower part of the shell component; the sound output of the first loudspeaker module is transmitted downwards in the shell assembly and then transmitted to the circumferential direction of the shell assembly through the first sound output channel; the sound of the second loudspeaker module is transmitted to the circumferential direction of the shell component through the first sound outlet channel. The utility model discloses an audio amplifier equipment, overall structure is compact, is favorable to reducing the assembly degree of difficulty of product, improves assembly efficiency and assembly precision.

Description

Sound box equipment

Technical Field

The utility model relates to an audio amplifier technical field, in particular to audio amplifier equipment.

Background

With the improvement of the quality of life of people, the use of electronic products is more popular, and the loudspeaker box equipment is popular among people as one class.

In order to improve the product competitiveness of sound box equipment, the appearance structure of the sound box equipment is more and more exquisite, and more functional modules are integrated inside. However, the addition of the functional modules makes the spatial layout in the sound box device more compact, and the assembly difficulty of the product is increased, thereby bringing great challenges to the assembly precision and the assembly efficiency.

SUMMERY OF THE UTILITY MODEL

The utility model provides an audio amplifier equipment can reduce the assembly degree of difficulty, improves assembly precision and assembly efficiency.

The technical scheme is as follows:

an acoustic enclosure apparatus, comprising: the loudspeaker comprises a shell assembly, a first loudspeaker module and a second loudspeaker module;

the first loudspeaker module and the second loudspeaker module are respectively positioned in the shell assembly, the first loudspeaker module is positioned at the upper part of the shell assembly, and the first loudspeaker module faces downwards to a sound outlet end;

the second loudspeaker module is positioned at the lower part of the shell assembly and emits sound towards the circumferential side wall of the shell assembly;

a first sound outlet channel is arranged on the circumferential side wall of the lower part of the shell component;

the sound output of the first loudspeaker module is transmitted downwards in the shell assembly and then transmitted to the circumferential direction of the shell assembly through the first sound output channel; and the sound output of the second loudspeaker module is transmitted to the circumferential direction of the shell assembly through the first sound output channel.

In some embodiments, the first speaker module comprises a sound cavity and a first bracket, and the second speaker module comprises a second bracket;

the second bracket is provided with at least one first connecting part; the inner wall of the lower part of the shell assembly is provided with at least one second connecting part, the at least one first connecting part is connected with the at least one second connecting part, and the second support and the shell assembly are positioned and connected with each other;

the sound cavity is connected with the first support, and the lower end of the first support is connected with the shell assembly through the second support.

In some embodiments, the first speaker module further comprises at least one woofer;

the sound cavity body is positioned at the upper part of the shell assembly, and the lower end of the sound cavity body is open; the at least one woofer is positioned in the sound cavity, and a low-sound-out end of the at least one woofer faces downwards;

the first support is connected to the lower end of the sound cavity, a second sound outlet channel is arranged on the first support, and the second sound outlet channel is communicated with the first sound outlet channel;

and/or the presence of a gas in the gas,

the second loudspeaker module also comprises at least one full-frequency loudspeaker; at least one full frequency loudspeaker connect in the second support, at least one full frequency loudspeaker's full frequency goes out the sound end and follows casing assembly's circumference is arranged.

In some embodiments, the housing assembly comprises an upper housing and a lower housing;

the upper shell and the lower shell are coaxially connected, the first loudspeaker module is positioned in the upper shell, the second loudspeaker module is positioned in the lower shell, and the first sound outlet channel is positioned on the circumferential side wall of the lower shell;

and a light-transmitting window is arranged in the area of the upper shell close to the lower end part.

In some embodiments, the enclosure apparatus further comprises a circuit board assembly, a light guide, and a heat conducting block;

the circuit board assembly is positioned between the first loudspeaker module and the second loudspeaker module, and a plurality of annularly arranged luminous bodies and at least one heating element are arranged on the upper surface of the circuit board assembly;

the light guide piece is in a cone cylinder shape, is positioned between the circuit board assembly and the first loudspeaker module, and is arranged with the lower bottom surface corresponding to the luminous body; the outer side surface of the light guide part corresponds to the position of the light-transmitting window;

the heat conduction block is positioned in the light guide piece, the shape of the heat conduction block corresponds to that of the light guide piece, the lower bottom surface of the heat conduction block is in contact with the luminous body and the at least one heating element, and the upper bottom surface of the heat conduction block is connected with the first loudspeaker module.

In some embodiments, the lower surface of the circuit board assembly is connected with the second speaker module;

the lower surface of the circuit board assembly is provided with at least one group of first connecting terminals;

the at least one group of first connecting terminals extend towards the second loudspeaker module, the circuit board assembly is connected with the second loudspeaker module, and the at least one group of first connecting terminals are electrically connected with the second loudspeaker module.

In some embodiments, the second speaker module includes a plurality of full-band speakers, the full-band speakers are circumferentially spaced apart from and corresponding to the first sound emitting channel, and the full-band speakers achieve circumferential sound emission;

the number of the first connecting terminals is the same as that of the full-frequency speakers, the first connecting terminals are annularly arranged on the lower surface of the circuit board assembly, and each first connecting terminal corresponds to one full-frequency speaker;

the circuit board assembly is connected with the second loudspeaker module, and each first connecting terminal is electrically connected with one full-frequency loudspeaker.

In some embodiments, the upper bottom surface of the heat conducting block is provided with a non-circular groove, and the lower end of the first loudspeaker module is provided with a non-circular convex block;

the non-circular groove is connected with the non-circular convex block, and the first loudspeaker module and the heat conducting block are circumferentially positioned.

In some embodiments, at least two positioning columns are arranged on the lower bottom surface of the heat conducting block, and the at least two positioning columns penetrate through the circuit board assembly and extend to the second loudspeaker module;

the second loudspeaker module is provided with at least two positioning holes, the at least two positioning holes are connected with the at least two positioning columns, and the heat conduction block, the circuit board assembly and the second loudspeaker module realize circumferential positioning.

In some embodiments, the housing assembly further comprises an upper cover and a lower cover;

the upper cover body is arranged at the top end of the upper shell in a covering manner, and the lower cover body is arranged at the bottom end of the lower shell in a covering manner; the upper cover body is provided with at least one control key; the lower cover body is provided with a power supply module;

in some embodiments, the upper housing is of a full-transparent structure, and a cylindrical decoration is disposed in the upper housing and covers the outer side of the first speaker module.

The utility model provides a beneficial effect that technical scheme brought includes at least:

the utility model discloses an audio amplifier equipment, first speaker module and second speaker module have, two speaker modules are located the upper portion and the lower part of casing subassembly respectively, wherein the lower part circumference lateral wall of casing subassembly is equipped with first sound channel, the first speaker module that is located casing upper portion goes out the sound downwards, the second speaker module goes out the sound towards circumference, the sound of two speaker modules outwards transmits after first sound channel mixes, arrange from top to bottom two speaker modules, the bottom goes out the sound, make audio amplifier equipment overall structure compact, be favorable to reducing the assembly degree of difficulty of product, improve assembly efficiency and assembly precision.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings used in the description of the embodiments will be briefly described below, and it is obvious that the drawings in the description are only some embodiments of the present invention, and it is obvious for those skilled in the art that other drawings can be obtained without creative efforts.

Fig. 1 is a schematic structural diagram of a sound box apparatus provided in an embodiment of the present invention;

fig. 2 is a sectional view of a sound box device provided in an embodiment of the present invention;

fig. 3 is an exploded view of a sound box device according to an embodiment of the present invention;

fig. 4 is a schematic view of a connection structure between a second speaker module and a housing assembly according to an embodiment of the present invention;

fig. 5 is a schematic diagram illustrating relative positions of a first speaker module and a second speaker module according to an embodiment of the present invention;

fig. 6 is a schematic diagram of a relative position between a second speaker module and a circuit board assembly according to an embodiment of the present invention;

fig. 7 is a schematic view of a connection structure of the first support, the heat conduction block, and the second support according to an embodiment of the present invention.

The reference numerals in the figures are denoted respectively by:

1. a housing assembly; 11. a first sound outlet channel; 12. a second connecting portion; 13. an upper housing; 131. a light-transmitting window; 14. a lower housing; 15. an upper cover body; 151. a control key; 16. a lower cover body; 161. a power supply module; 1611. arranging wires;

2. a first speaker module; 21. a sound cavity; 22. a first bracket; 221. a second sound outlet channel; 222. a non-circular boss; 23. a woofer; 231. a bass sound output end;

3. a second speaker module; 31. a second bracket; 311. a first connection portion; 312. positioning holes; 313. a first avoidance hole; 314. a second avoidance hole; 32. a full frequency speaker; 321. a full-frequency output end; 322. a second connection terminal;

4. a circuit board assembly; 41. a light emitter; 42. a heating element; 43. a first connection terminal; 44. a third avoidance hole;

5. a light guide;

6. a heat conducting block; 61. a non-circular groove; 62. a positioning column;

7. and (7) a decorative piece.

Detailed Description

Reference will now be made in detail to the exemplary embodiments, examples of which are illustrated in the accompanying drawings. When the following description refers to the accompanying drawings, like numbers in different drawings represent the same or similar elements unless otherwise indicated. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with the present invention. Rather, they are merely examples of apparatus and methods consistent with certain aspects of the invention, as detailed in the appended claims.

In the description of the present invention, it is to be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. indicate the orientation or positional relationship based on that shown in fig. 2, and are used only for the convenience of description and simplification of the description, but do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore should not be construed as limiting the present invention.

Unless defined otherwise, all technical terms used in the embodiments of the present invention have the same meaning as commonly understood by one of ordinary skill in the art.

In order to make the objects, technical solutions and advantages of the present invention clearer, embodiments of the present invention will be described in further detail below with reference to the accompanying drawings.

Fig. 1 is a schematic structural view of a sound box device provided by an embodiment of the present invention; fig. 2 is a sectional view of the sound box device according to an embodiment of the present invention.

As shown in fig. 1 and 2, the present embodiment provides an acoustic enclosure device, including: the loudspeaker module comprises a shell assembly 1, a first loudspeaker module 2 and a second loudspeaker module 3.

The first loudspeaker module 2 and the second loudspeaker module 3 are respectively positioned in the shell component 1, the first loudspeaker module 2 is positioned at the upper part of the shell component 1, and the first loudspeaker module 2 faces downwards to a sound outlet end; the second loudspeaker module 3 is positioned at the lower part of the shell component 1, and the second loudspeaker module 3 emits sound towards the circumferential side wall of the shell component 1; the circumferential side wall of the lower part of the housing assembly 1 is provided with a first sound outlet channel 11.

The sound emitted from the first loudspeaker module 2 is transmitted downwards in the shell component 1 and then transmitted to the circumferential direction of the shell component 1 through the first sound emitting channel 11; the sound output from the second speaker module 3 is transmitted to the circumferential direction of the housing assembly 1 through the first sound output channel 11.

The audio amplifier equipment of this embodiment, first speaker module 2 and second speaker module 3 have, two speaker modules are located casing assembly 1's upper portion and lower part respectively, wherein casing assembly 1's lower part circumference lateral wall is equipped with first sound channel 11, the sound is gone out towards the below to first speaker module 2 that is located casing upper portion, second speaker module 3 goes out the sound towards circumference, the sound of two speaker modules outwards transmits after first sound channel 11 mixes, two speaker modules arrange from top to bottom, the sound is gone out to the bottom, make audio amplifier equipment overall structure compact, be favorable to reducing the assembly degree of difficulty of product, improve assembly efficiency and assembly precision.

In this embodiment, the first speaker module 2 and the second speaker module 3 are configured to convert an electrical signal into an acoustic signal, so as to realize electro-acoustic conversion. Optionally, the first speaker module 2 and the second speaker module 3 have different acoustic performances, for example, the first speaker module 2 is used for low-frequency sound output, and the second speaker module 3 is used for full-frequency sound output, so that the sound box device has rich sound effects.

In some possible implementation modes, the shell assembly 1 is cylindrical, has a round and smooth appearance, has better attractiveness and artistic impression, is suitable for being placed indoors, and can achieve a certain decorative effect on the premise of meeting the function of electroacoustic conversion.

To the casing subassembly 1 of cylinder, arrange about first speaker module 2 and the coaxial of second speaker module 3, improve the space utilization in the casing subassembly 1 to can reduce inner structure's the assembly degree of difficulty.

As shown in fig. 3 and 4, in some embodiments, the first speaker module 2 includes a sound cavity 21 and a first support 22, and the second speaker module 3 includes a second support 31.

The second bracket 31 is provided with at least one first connection portion 311; the inner wall of the lower part of the shell component 1 is provided with at least one second connecting part 12, at least one first connecting part 311 is connected with at least one second connecting part 12, and the second bracket 31 and the shell component 1 are positioned and connected with each other; the sound cavity 21 is connected with the first bracket 22, and the lower end of the first bracket 22 is connected with the housing assembly 1 through the second bracket 31.

The use of the first bracket 22 of the first loudspeaker module 2 and the second bracket 31 of the second loudspeaker module 3 involves a secure mounting of the two loudspeaker modules in the housing assembly 1. Wherein the second bracket 31 is directly connected to the housing assembly 1 and the first bracket 22 is connected to the first bracket 22 and thereby indirectly connected to the housing assembly 1.

Alternatively, the first speaker module 2 and the second speaker module 3 are integrally installed in the housing assembly 1 from the bottom of the housing assembly 1 after being externally assembled and connected, and the first connecting portion 311 and the second connecting portion 12 are located at the lower portion, so that the connection is more convenient to operate.

Illustratively, the number of the first connection portions 311 is the same as that of the second connection portions 12, and the specific number is, for example, one, two, three, four, and so on. When the number of the first connection portions 311 and the second connection portions 12 is plural, the plural first connection portions 311 and the plural second connection portions 12 are arranged at intervals in the circumferential direction, thereby achieving the reliable connection of the second bracket 31 and the case assembly 1 in the circumferential direction.

The first connecting portion 311 and the second connecting portion 12 can also realize circumferential positioning of the second bracket 31 and the housing assembly 1, so as to reduce the difficulty in assembling the second bracket 31 and the housing assembly 1.

As shown in connection with fig. 2, 3 and 5, in some embodiments, the first speaker module 2 further includes at least one woofer 23; the sound cavity 21 is positioned at the upper part of the shell component 1, and the lower end of the sound cavity 21 is opened; the at least one woofer 23 is located in the sound cavity 21, and a low sound output end 231 of the at least one woofer 23 faces downward; the first support 22 is connected to the lower end of the sound cavity 21, the first support 22 is provided with a second sound outlet channel 221, and the second sound outlet channel 221 is communicated with the first sound outlet channel 11.

The woofer 23 is used for emitting bass, so that the sound box apparatus can emit sound waves with longer wavelengths, and the sound effect of the sound box apparatus is enriched.

As shown in fig. 2, 3 and 5, in some embodiments, the second speaker module 3 further includes at least one full-band speaker 32; at least one full range speaker 32 is connected to the second bracket 31, and a full range sound outlet 321 of the at least one full range speaker 32 is arranged along the circumference of the housing assembly 1.

The full-range speaker 32 (or full-wave speaker) is used for emitting sound waves in a full-frequency range, can cover wavelengths of 1.4cm to 6.9m (50 to 25000 Hz), can basically cover sound in all frequency ranges which can be heard by human ears, and can bring better sound field, imaging degree, musical instrument separation degree and gradation.

As shown in connection with fig. 2 and 3, in some embodiments, the housing assembly 1 includes an upper housing 13 and a lower housing 14; the upper shell 13 and the lower shell 14 are coaxially connected, the first loudspeaker module 2 is positioned in the upper shell 13, the second loudspeaker module 3 is positioned in the lower shell 14, and the first sound outlet channel 11 is positioned on the circumferential side wall of the lower shell 14; a light-transmitting window 131 is provided in a region of the upper case 13 near the lower end portion.

The housing assembly 1 of the present embodiment includes an upper housing 13 and a lower housing 14, wherein the upper housing 13 is used for accommodating the first speaker module 2 and has a transparent window 131 for displaying the decorative light effect of the speaker device. The lower casing 14 is used for bearing the first sound outlet channel 11, so as to realize sound outlet of the sound box device.

In some possible implementation manners, the outer side surface of the lower shell 14 is provided with a protective mesh, and the protective mesh covers the outside of the first sound outlet channel 11, so that when sound is optimized, impurities such as dust can be prevented from entering.

As shown in fig. 2, 3, and 5, in some embodiments, the speaker device further includes a circuit board assembly 4, a light guide 5, and a heat conduction block 6.

The circuit board assembly 4 is located between the first speaker module 2 and the second speaker module 3, and the upper surface of the circuit board assembly 4 is provided with a plurality of annularly arranged luminous bodies 41 and at least one heating element 42.

The light guide piece 5 is in a cone shape, the light guide piece 5 is positioned between the circuit board assembly 4 and the first loudspeaker module 2, and the lower bottom surface of the light guide piece 5 is arranged corresponding to the luminous body 41; the outer side surface of the light guide 5 corresponds to the position of the light transmission window 131.

The light inlet face of the cone-shaped light guide piece 5 corresponds to the light emitting body 41, and light emitted by the light emitting body 41 enters the light guide piece 5, so that the light guide piece 5 can realize gradual change type and differentiated light effects from bottom to top, the light effects can be displayed outwards through the light-transmitting window 131 on the upper shell 13, and the attractiveness and artistic impression of the sound box equipment are improved.

The heat conduction block 6 is located in the light guide member 5, the shape of the heat conduction block 6 corresponds to that of the light guide member 5, the lower bottom surface of the heat conduction block 6 is in contact with the luminous body 41 and the at least one heating element 42, and the upper bottom surface of the heat conduction block 6 is connected with the first speaker module 2.

Since the upper surface of the circuit board assembly 4 is substantially irradiated into the tapered cylindrical light guide 5 and heat generated by the heating element 42 and the heating element of the circuit board assembly 4 cannot be dissipated, the heat conducting block 6 is disposed inside the light guide 5 to conduct the heat of the circuit board assembly 4.

Illustratively, the upper bottom surface of the heat conducting block 6 is connected to the first support 22 of the first speaker module 2, so that the heat conducting block 6 transfers the heat of the heating element 42 and the light emitting body 41 upward to the first support 22, the first support 22 is located in the sound emitting direction of the woofer 23, when the woofer 23 is operated, the diaphragm blows air downward, and the air flows through the second sound emitting channel 221 of the first support 22, carries the heat away, and is finally delivered to the outside of the housing assembly 1.

Optionally, the first support 22 and the heat conducting block 6 are made of light metal with high heat conductivity, which can meet the requirement of good heat conduction and ensure high strength. Such as aluminum alloys, titanium alloys, and the like.

In some possible implementations, the circuit board assembly 4 uses a Printed Circuit Board (PCB) as a substrate, the surface or the inside of the substrate has a circuit trace structure, and the at least one heating element 4211 is electrically connected to the circuit trace structure to implement a corresponding function.

The heating element 42 may be an Integrated Circuit (IC) mounted on a printed circuit board (or called a microcircuit), a microchip, a chip, a transistor, a diode, a passive element (such as a resistor, a capacitor, a connector, etc.), and other various electronic components.

The Light emitting body 41 is a Light-emitting diode (LED) which can emit Light by releasing energy through recombination of electrons and holes. Alternatively, the light emitting colors of the light emitting bodies 41 include, but are not limited to, red, blue, green, white, and the like, and the light emitting different colors of different light emitting bodies 41 can be mixed to form light of a plurality of colors.

The printed circuit board is made of copper clad laminate, the main raw material is resin, paper, glass cloth, copper foil and the like, the resin can be soaked by petroleum wood pulp paper or glass fiber cloth and the like serving as a reinforcing material, the copper foil is coated on one side or two sides, and the printed circuit board is formed by hot pressing.

As shown in fig. 6, in some embodiments, the lower surface of the circuit board assembly 4 is connected to the second speaker module 3.

At least one group of first connecting terminals 43 is arranged on the lower surface of the circuit board assembly 4; the at least one set of first connection terminals 43 extends toward the second speaker module 3, the circuit board assembly 4 is connected to the second speaker module 3, and the at least one set of first connection terminals 43 is electrically connected to the second speaker module 3.

In order to further reduce the power connection difficulty of the second speaker module 3, the first connection terminal 43 is designed on the lower surface of the circuit board assembly 4, and when the circuit board assembly 4 and the second speaker module 3 are assembled in place, the first connection terminal 43 and the second speaker module 3 are electrically connected in synchronization, so that the power connection process is omitted, and the assembly difficulty of the second speaker module 3 is reduced.

In some possible implementations, at least one first avoiding hole 313 is formed in the second bracket 31, the first avoiding hole 313 corresponds to the position of the first connecting terminal 43, and after the circuit board assembly 4 and the second speaker module 3 are assembled in place, the first connecting terminal 43 can penetrate into the second speaker module 3 through the first avoiding hole 313 and is electrically connected to the full-band speaker 32.

In other possible implementations, a set of second connection terminals 322 is disposed at the rear end of the full-band speaker 32, and the second connection terminals 322 can be matched with the first connection terminals 43 to electrically connect the full-band speaker 32.

As shown in fig. 3 and 4, in some embodiments, the second speaker module 3 includes a plurality of full-band speakers 32, the full-band speakers 32 are circumferentially spaced from the first sound emitting channel 11, and the full-band speakers 32 achieve circumferential sound emission.

The number of the first connection terminals 43 is the same as that of the full-range speakers 32, and the first connection terminals 43 are annularly arranged on the lower surface of the circuit board assembly 4, and each first connection terminal 43 corresponds to one full-range speaker 32; the circuit board assembly 4 is connected to the second speaker module 3, and each of the first connection terminals 43 is electrically connected to one of the full-band speakers 32.

Illustratively, the number of first connection terminals 43 and full range speakers 32 is, for example, one, two, three, six, etc. When the quantity of first connection terminal 43 and full frequency speaker 32 be a plurality of, a plurality of first connection terminals 43 and a plurality of full frequency speaker 32 are arranged along the even interval of circumference, realize 360 degrees no dead angles and go out the sound.

Referring to fig. 7, in some embodiments, the upper bottom surface of the heat conducting block 6 is provided with a non-circular groove 61, and the lower end of the first speaker module 2 is provided with a non-circular protrusion 222; the non-circular groove 61 is connected with the non-circular bump 222, and the first speaker module 2 and the heat conduction block 6 are circumferentially positioned. Illustratively, the non-circular boss 222 is located at a lower end of the first bracket 22.

For cylindric audio amplifier equipment, because the degree of discernment of casing subassembly 1 circumference position is lower, therefore the circumference location of inside spare part is comparatively difficult, and heat conduction piece 6 and first support 22 of this embodiment carry out the erection joint through non-circular protruding piece 222 and non-circular recess 61, satisfy the circumference location demand when realizing connection function.

Exemplary cross-sectional shapes of the non-circular protrusions 222 and non-circular grooves 61 include, but are not limited to, oval, rectangular, triangular, polygonal, and the like. Preferably, the non-circular protrusion 222 and the non-circular groove 61 having an elliptical sectional shape are used.

It is understood that the positions of the non-circular protrusions 222 and the non-circular grooves 61 can be interchanged, such as the non-circular protrusions 222 are located on the heat conduction block 6, and the non-circular grooves 61 are located on the first bracket 22.

Referring to fig. 7, in some embodiments, at least two positioning pillars 62 are disposed on the bottom surface of the heat conducting block 6, and the at least two positioning pillars 62 extend through the circuit board assembly 4 to the second speaker module 3.

The second speaker module 3 is provided with at least two positioning holes 312, the at least two positioning holes 312 are connected with the at least two positioning posts 62, and the heat conducting block 6, the circuit board assembly 4 and the second speaker module 3 realize circumferential positioning. Illustratively, at least two positioning holes 312 are located on the second bracket 31.

The heat conduction block 6 and the second support 31 of the second speaker module 3 of the present embodiment utilize two positioning columns 62 and two positioning holes 312 to realize circumferential positioning, thereby reducing the assembly difficulty and improving the assembly precision.

Furthermore, two positioning posts 62 simultaneously penetrate through the circuit board assembly 4, and simultaneously circumferentially position the heat-conducting block 6 and the circuit board assembly 4.

As shown in connection with fig. 1, 2, and 3, in some embodiments, the housing assembly 1 further includes an upper cover 15 and a lower cover 16; the upper cover body 15 is arranged at the top end of the upper shell 13 in a covering manner, and the lower cover body 16 is arranged at the bottom end of the lower shell 14 in a covering manner; the upper cover body 15 is provided with at least one control key 151; the lower cover 16 is provided with a power supply module 161.

The upper cover 15 and the lower cover 16 close both ends of the housing assembly 1, wherein at least one control key 151, such as a power on/off key, a play/pause key, a volume +, a volume-, a next, a previous, etc., is disposed on the top of the upper cover 15. Alternatively, the control keys 151 may be physical keys or virtual keys displayed on the touch panel.

In some possible implementations, the power supply module 161 is connected to a flat cable 1611, the flat cable 1611 extends upward through the second avoiding hole 314 at the axis of the second bracket 31, and the flat cable 1611 is electrically connected to at least the circuit board assembly 4 for supplying electric energy to the heating element 42 and the heating element.

In another example, the flat cable 1611 extends upward to sequentially pass through the second frame, the circuit board assembly 4, the heat conducting block 6 and the first frame 22, and is electrically connected to the woofer 23.

Referring to fig. 3, in some embodiments, the upper housing 13 has a full-transparent structure, a cylindrical decoration 7 is disposed in the upper housing 13, and the decoration 7 covers the first speaker module 2.

By designing the upper case 13 entirely as a light-transmitting structure and arranging the cylindrical decoration 7 therein, the entire upper portion of the speaker device has a better aesthetic and artistic appearance. Go up first speaker module 2 in the casing 13 and rely on heat conduction piece 6, the second support 31 etc. of bottom to provide the fixed stay, go up casing 13 and do not have the assembly demand, the interior external surface uniformity is good, has good outward appearance effect.

In some possible implementations, the loudspeaker device may include a memory with one or more computer-readable storage media, an input unit, a sensor, audio circuitry, a Wi-Fi module, a processor including one or more processing cores, and so on.

The memory may be used to store software programs and modules, and the processor may execute various functional applications and data processing by operating the software programs and modules stored in the memory.

The input unit may include a touch-sensitive surface as well as other input devices. Other input devices may include, but are not limited to, a physical keyboard, function keys (e.g., volume control keys, switch keys, etc.), and the like.

The audio circuitry may provide an audio interface between the user and the terminal device. The audio circuit can transmit the electrical signal after the received audio data conversion to the first speaker module 2 or the second speaker module 3, and the first speaker module 2 or the second speaker module 3 converts the electrical signal into a sound signal for output.

The processor is a control center of the terminal equipment, is connected with each part of the whole mobile phone by various interfaces and lines, and executes various functions and processing data of the terminal equipment by running or executing software programs and/or modules stored in the memory and calling the data stored in the memory, thereby carrying out the integral monitoring on the mobile phone. Optionally, the processor may include one or more processing cores; preferably, the processor may integrate an application processor and a modem processor, wherein the application processor mainly handles operations of the storage medium, the user interface, the application program, and the like, and the modem processor mainly handles wireless communication. It will be appreciated that the modem processor described above may not be integrated into the processor.

Although not shown, the speaker device may further include a microphone, a sensor, a bluetooth module, etc., which will not be described herein.

It is noted that, as used herein, references to "a plurality" or "at least one" mean one or more, and references to "a plurality" or "at least two" mean two or more. "and/or" describes the association relationship of the associated objects, meaning that there may be three relationships, e.g., a and/or B, which may mean: a exists alone, A and B exist simultaneously, and B exists alone. The character "/" generally indicates that the former and latter associated objects are in an "or" relationship.

In the description of the present invention, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; may be a mechanical connection; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meaning of the above terms in the present invention can be understood according to specific situations by those of ordinary skill in the art.

In the present application, unless expressly stated or limited otherwise, the recitation of a first feature "on" or "under" a second feature may include the recitation of the first and second features being in direct contact, and may also include the recitation of the first and second features not being in direct contact, but being in contact with another feature between them. Also, the first feature being "on," "above" and "over" the second feature includes the first feature being directly on and obliquely above the second feature, or merely indicating that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature includes the first feature being directly under and obliquely below the second feature, or simply meaning that the first feature is at a lesser elevation than the second feature.

In the description of the present specification, reference to the description of the terms "certain embodiments," "one embodiment," "some embodiments," "illustrative embodiments," "example," "specific example," or "some examples" means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the present invention.

The above description is only an embodiment of the present invention, and is not intended to limit the present invention, any modification, equivalent replacement, or improvement made within the principle of the present invention should be included within the protection scope of the present invention.

Claims (11)

1. An acoustic enclosure apparatus, comprising: the loudspeaker comprises a shell component (1), a first loudspeaker module (2) and a second loudspeaker module (3);

the first loudspeaker module (2) and the second loudspeaker module (3) are respectively positioned in the shell assembly (1), the first loudspeaker module (2) is positioned at the upper part of the shell assembly (1), and the first loudspeaker module (2) emits sound downwards;

the second loudspeaker module (3) is positioned at the lower part of the shell component (1), and the second loudspeaker module (3) emits sound towards the circumferential side wall of the shell component (1);

a first sound outlet channel (11) is arranged on the circumferential side wall of the lower part of the shell component (1);

the sound of the first loudspeaker module (2) is transmitted downwards in the shell assembly (1) and then transmitted to the circumferential direction of the shell assembly (1) through the first sound outlet channel (11); the sound of the second loudspeaker module (3) is transmitted to the circumferential direction of the shell component (1) through the first sound outlet channel (11).

2. Loudspeaker device according to claim 1, wherein the first loudspeaker module (2) comprises a sound chamber (21) and a first support (22), and the second loudspeaker module (3) comprises a second support (31);

the second bracket (31) is provided with at least one first connecting part (311); the inner wall of the lower part of the shell component (1) is provided with at least one second connecting part (12), the at least one first connecting part (311) is connected with the at least one second connecting part (12), and the second bracket (31) is mutually positioned and connected with the shell component (1);

the sound cavity (21) is connected with the first support (22), and the lower end of the first support (22) is connected with the shell component (1) through the second support (31).

3. Loudspeaker device according to claim 2, wherein the first loudspeaker module (2) further comprises at least one woofer (23);

the sound cavity (21) is positioned at the upper part of the shell component (1), and the lower end of the sound cavity (21) is open; the at least one woofer (23) is positioned in the sound cavity (21), and a low sound outlet end (231) of the at least one woofer (23) faces downwards;

the first support (22) is connected to the lower end of the sound cavity (21), a second sound outlet channel (221) is arranged on the first support (22), and the second sound outlet channel (221) is communicated with the first sound outlet channel (11);

and/or the presence of a gas in the gas,

the second loudspeaker module (3) further comprises at least one full-range loudspeaker (32); the at least one full-range loudspeaker (32) is connected to the second support (31), and a full-range sound outlet end (321) of the at least one full-range loudspeaker (32) is arranged along the circumferential direction of the shell assembly (1).

4. Loudspeaker device according to claim 1, characterised in that the housing assembly (1) comprises an upper housing (13) and a lower housing (14);

the upper shell (13) and the lower shell (14) are coaxially connected, the first loudspeaker module (2) is positioned in the upper shell (13), the second loudspeaker module (3) is positioned in the lower shell (14), and the first sound outlet channel (11) is positioned on the circumferential side wall of the lower shell (14);

and a light-transmitting window (131) is arranged in the area of the upper shell (13) close to the lower end part.

5. The enclosure device of claim 4, further comprising a circuit board assembly (4), a light guide (5) and a heat conducting block (6);

the circuit board assembly (4) is positioned between the first loudspeaker module (2) and the second loudspeaker module (3), and a plurality of annularly arranged luminous bodies (41) and at least one heating element (42) are arranged on the upper surface of the circuit board assembly (4);

the light guide piece (5) is in a cone cylinder shape, the light guide piece (5) is positioned between the circuit board assembly (4) and the first loudspeaker module (2), and the lower bottom surface of the light guide piece (5) is arranged corresponding to the luminous body (41); the outer side surface of the light guide piece (5) corresponds to the position of the light-transmitting window (131);

the heat conduction block (6) is located in the light guide piece (5), the heat conduction block (6) corresponds to the light guide piece (5) in shape, the lower bottom surface of the heat conduction block (6) is in contact with the luminous body (41) and the at least one heating element (42), and the upper bottom surface of the heat conduction block (6) is connected with the first loudspeaker module (2).

6. Loudspeaker device according to claim 5, wherein the lower surface of the circuit board assembly (4) is connected to the second loudspeaker module (3);

the lower surface of the circuit board assembly (4) is provided with at least one group of first connecting terminals (43);

the at least one group of first connecting terminals (43) extend towards the second loudspeaker module (3), the circuit board assembly (4) is connected with the second loudspeaker module (3), and the at least one group of first connecting terminals (43) are electrically connected with the second loudspeaker module (3).

7. The loudspeaker apparatus according to claim 6, wherein the second loudspeaker module (3) comprises a plurality of full-band loudspeakers (32), the plurality of full-band loudspeakers (32) being circumferentially spaced in correspondence with the first sound outlet channel (11), the plurality of full-band loudspeakers (32) realizing a circumferential sound outlet;

the number of the first connecting terminals (43) is the same as that of the full-range speakers (32), the first connecting terminals are annularly arranged on the lower surface of the circuit board assembly (4), and each first connecting terminal (43) corresponds to one full-range speaker (32);

the circuit board assembly (4) is connected with the second loudspeaker module (3), and each first connecting terminal (43) is electrically connected with one full-frequency loudspeaker (32).

8. Equipment according to claim 5, characterized in that the upper bottom surface of the block (6) is provided with a non-circular recess (61) and the lower end of the first speaker module (2) is provided with a non-circular protrusion (222);

the non-circular groove (61) is connected with the non-circular convex block (222), and the first loudspeaker module (2) and the heat conducting block (6) are circumferentially positioned.

9. Loudspeaker device according to claim 5, wherein the lower bottom surface of the heat conducting block (6) is provided with at least two positioning posts (62), the at least two positioning posts (62) extending through the circuit board assembly (4) to the second loudspeaker module (3);

the second loudspeaker module (3) is provided with at least two positioning holes (312), the at least two positioning holes (312) are connected with the at least two positioning columns (62), and the heat conducting block (6), the circuit board assembly (4) and the second loudspeaker module (3) are circumferentially positioned.

10. Loudspeaker device according to claim 4, wherein the housing assembly (1) further comprises an upper cover (15) and a lower cover (16);

the upper cover body (15) is arranged at the top end of the upper shell (13) in a covering manner, and the lower cover body (16) is arranged at the bottom end of the lower shell (14) in a covering manner; the upper cover body (15) is provided with at least one control key (151); the lower cover body (16) is provided with a power supply module (161).

11. Loudspeaker device according to claim 4, wherein the upper housing (13) is of a fully light-transmitting construction, and a tubular decoration (7) is provided in the upper housing (13), the decoration (7) being coated outside the first loudspeaker module (2).

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