CN218531631U

CN218531631U - Flexible glue sealing mold based on solar silicon wafer glue overflow prevention attaching

Info

Publication number: CN218531631U
Application number: CN202222835643.0U
Authority: CN
Inventors: 吕凯; 高满意; 王有潇
Original assignee: Jiangsu Yuhui Photovoltaic Technology Co ltd
Current assignee: Zhongrun Solar Technology Xuzhou Co ltd
Priority date: 2022-10-27
Filing date: 2022-10-27
Publication date: 2023-02-28
Anticipated expiration: 2032-10-27

Abstract

The utility model discloses a flexible glue sealing mould based on solar silicon chip anti-overflow glues laminating, the on-line screen storage device comprises a base, be equipped with on the base and be used for carrying out the gluey platform of sealing to solar silicon chip, it is equipped with the gluey panel of sealing to seal the gluey bench, the position that the base is close to the gluey platform is equipped with and is used for carrying out the first anti-overflow unit of viscose anti-overflow to solar silicon chip border position and is used for carrying out the second anti-overflow unit of viscose anti-overflow to solar silicon chip corner position, first anti-overflow unit includes a plurality of drive plates, second anti-overflow unit includes the anti-overflow round platform, the position that the base is close to a plurality of drive plates is equipped with the groove of sliding, drive plate sliding connection is in the inslot portion of sliding, aim at setting up multiple anti-overflow unit, border position and corner position to solar silicon chip divide the territory anti-overflow, protect and the check to the overflow of solar silicon chip different regions, avoid the viscose to pollute the silicon chip.

Description

Flexible glue sealing mold based on solar silicon wafer glue overflow prevention attaching

Technical Field

The utility model relates to a solar energy silicon chip field specifically is a flexible glue sealing mold based on solar energy silicon chip prevents overflowing gluing the laminating.

Background

Solar energy is widely distributed as a green pollution-free clean energy, and is the first choice on the national energy sustainable development road. The photovoltaic power generation has great significance for energy conservation and emission reduction, winning the blue sky guard battle and building beautiful China.

Gluing techniques are used to achieve cell packaging, frame bonding and sealing, and junction boxes. The adhesive bonding with the back plate, the potting of the junction box and the cutting and sealing of the bottom plate become development trends and are adopted by more and more manufacturers. The technical and economic benefits obtained by the application of the adhesive enable the solar cell module industry to be greatly increased. Great attention and concern. The silicone rubber sealant has the advantages of convenient use, high bonding strength, good sealant performance, wide range of bonding materials, good electrical insulation performance and excellent weather resistance. The adhesive is widely used for bonding and sealing the solar cell module. EVA series adhesives have excellent light transmittance properties and are commonly used for the encapsulation of solar cells, glass, and back sheets.

The assembly of the frame and the frame requires that the laminated plates are tightly attached and firmly connected. A good seal between the frame and the laminate is necessary. While a snug fit, it is desirable not to damage the glass. The press-in type sealing strip has the advantages of simple and quick assembly, but the bonding strength is not high. The microscopic unevenness in the sealing gap is filled by means of elastic deformation of the rubber strip, the deformation capacity of the rubber strip is limited, and particularly, small defects cannot be completely filled, so that the sealing reliability is low. The liquid adhesive can fully fill the sealing gap and can well fill microscopic irregularities on the surface. An elastic adhesive layer is formed after curing, and the sealing performance is obviously improved; the laminate part and the frame are joined by an adhesive to achieve a continuous and high strength joint.

At present, operating personnel carries out the viscose to solar energy and handles the condition that the excessive glue appears easily, can only set up the baffle near the silicon chip and block the viscose, but there is the gap between baffle and the silicon chip, make baffle and silicon chip adhesion together very easily on the one hand, cause the damage of silicon chip, on the other hand viscose flows out in the gap easily, pollute the operation board, this application aims at setting up multiple anti-overflow unit, carry out the subregion anti-overflow to the border position and the corner position of solar energy silicon chip, protect and block the excessive glue of solar energy silicon chip different regions, avoid the viscose to pollute the silicon chip.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a flexible glue sealing mold based on excessive gluey laminating of solar wafer is prevented to solve the problem among the prior art.

In order to achieve the above purpose, the utility model provides a following technical scheme:

the utility model provides a flexible glue sealing mold based on laminating is glued in solar energy silicon chip anti-overflow, the mould includes the base, be equipped with on the base and be used for carrying out the gluey platform of sealing that glues to solar energy silicon chip, it is equipped with the glue sealing panel to seal the bench, the position that the base is close to the gluey platform of sealing is equipped with and is used for carrying out the first anti-overflow unit of viscose anti-overflow to solar energy silicon chip border position and is used for carrying out the second anti-overflow unit of viscose anti-overflow to solar energy silicon chip corner position, first anti-overflow unit includes a plurality of drive plates, second anti-overflow unit includes the anti-overflow round platform, the position that the base is close to a plurality of drive plates is equipped with the sliding groove, drive plate sliding connection is inside the sliding groove.

By adopting the technical scheme: the glue sealing table can support glue sealing installation of the solar silicon wafer, the glue sealing panel can support glue sealing of the silicon wafer, the first anti-overflow unit can perform glue overflow prevention on the peripheral edge positions of the solar silicon wafer, and the second anti-overflow unit can perform glue overflow prevention on the four corner positions of the solar silicon wafer.

Further setting: the first anti-overflow unit comprises anti-overflow plates, the number of the anti-overflow plates is four, the anti-overflow plates are respectively arranged on four sides of the adhesive sealing table, the edge position of the adhesive sealing table is provided with a moving groove, the anti-overflow plates slide in the moving groove, the drive plate is arranged at the bottom of the anti-overflow plates, the moving groove is provided with a driving cylinder used for driving the drive plate to move in the moving groove, the position of the anti-overflow plate far away from the adhesive sealing table is provided with a glue blocking plate used for blocking the overflow glue, and the glue blocking plate is detachably connected with the anti-overflow plates.

By adopting the technical scheme: the anti-overflow board can carry out the anti-overflow to silicon chip border position, drives actuating cylinder and can drives the drive plate and remove at the inslot portion that slides to drive the anti-overflow board and remove at the inslot portion that slides, set up the anti-overflow board in the packaging panel below, carry out the anti-overflow and collect the viscose, keep off the offset plate and can block the inside viscose of anti-overflow board, avoid dropping.

Further setting: the second anti-overflow unit includes supplementary round platform, and the anti-overflow round platform rack is established on supplementary round platform, and can dismantle with supplementary round platform and be connected, is equipped with on anti-overflow round platform and the supplementary round platform to be used for inlaying the right angle breach of establishing and sealing the gluey platform and sealing the gluey panel, and the inside lift cylinder that is used for driving the adjustment of anti-overflow round platform and inlaying the height that is equipped with of supplementary round platform, and the inside position that corresponds the anti-overflow plate of anti-overflow round platform is equipped with and is used for making the anti-overflow plate remove to sealing the removal opening that removes the movable trough in the gluey platform.

By adopting the technical scheme: the anti-overflow circular truncated cone can inlay solar energy silicon chip four corners position and establish, avoids gluing the panel four corners and has the space, and supplementary circular truncated cone can support the anti-overflow circular truncated cone, and the lift cylinder can drive the anti-overflow circular truncated cone and go up and down to it establishes to glue the panel and carry out the card in four corners.

Further setting: it is equipped with the elevating platform that is used for driving to seal the glue panel and goes on going up and down to seal the glue platform and be close to sealing the glue panel, seals to be equipped with on the glue panel to be used for carrying out the location strake of fixing a position solar wafer, fixes a position the inside pressure sensor who is used for responding to solar wafer that is equipped with of strake.

By adopting the technical scheme: the elevating platform can go up and down to gluing the gluey panel, and the position of gluing the panel is glued in the adjustment, and cooperation anti-overflow board and anti-overflow round platform, location strake can fix a position the silicon chip position, and pressure sensor can respond to the silicon chip to the position of control anti-overflow board and anti-overflow round platform.

Further setting: the spill-proof plate and the spill-proof circular platform are paved with flexible rubber sheets, and the rubber blocking plate is provided with buckles for clamping the flexible rubber sheets.

By adopting the technical scheme: the flexible rubber sheet can collect the silicon wafer adhesive, and the adhesive is prevented from polluting the anti-overflow plate and the anti-overflow circular truncated cone.

Further setting: the surface of the mould is coated with a non-stick coating.

Compared with the prior art, the beneficial effects of the utility model are that: the anti-overflow device aims to be provided with multiple anti-overflow units, perform regional anti-overflow on the edge position and the corner position of the solar silicon wafer, protect and block overflow glue in different regions of the solar silicon wafer, and avoid the silicon wafer from being polluted by viscose glue.

Drawings

In order that the present invention may be more clearly understood, the following detailed description is given with reference to the accompanying drawings.

Fig. 1 is a schematic structural view of the flexible glue sealing mold based on the overflow glue lamination of the solar silicon wafer of the present invention;

FIG. 2 is a top view of the flexible molding die for preventing overflow of the solar silicon wafer;

fig. 3 is the utility model relates to a section view of flexible glue sealing die based on excessive gluey laminating of solar energy silicon chip.

In the figure, 1, a base; 2. a glue sealing table; 3. sealing a glue panel; 4. a lifting platform; 5. positioning the edge strips; 6. a drive plate; 7. an anti-overflow plate; 8. a driving cylinder; 9. a glue blocking plate; 10. the spill-proof circular table; 11. an auxiliary circular table; 12. a pressure sensor.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Referring to fig. 1 to 3, in an embodiment of the present invention, a flexible sealing mold based on the overflow glue lamination of a solar silicon wafer has a non-stick coating coated on the surface of the mold.

The mould includes base 1, is equipped with on base 1 to be used for sealing the gluey platform 2 of gluing of solar wafer, seals to glue and is equipped with on the platform 2 to seal and glues a panel 3, seals to glue the platform 2 and is close to seal and glues panel 3 and be equipped with and be used for driving and seal elevating platform 4 that the panel 3 goes up and down, seals to be equipped with on the panel 3 and be used for carrying out the location strake 5 of fixing a position to the solar wafer, fixes a position 5 inside pressure sensor 12 that are used for responding to the solar wafer that are equipped with of strake.

Elevating platform 4 can go up and down to gluing panel 3, and the position of gluing panel 3 is glued in the adjustment, and cooperation anti-overflow board 7 and anti-overflow round platform 10, location strake 5 can fix a position the silicon chip position, and pressure sensor 12 can respond to the silicon chip to the position of control anti-overflow board 7 and anti-overflow round platform 10.

The position that base 1 is close to sealing gluey platform 2 is equipped with the first anti-overflow unit that is used for carrying out the viscose anti-overflow to solar wafer border position and is used for carrying out the second anti-overflow unit of viscose anti-overflow to solar wafer corner position, and first anti-overflow unit includes a plurality of drive plates 6, and second anti-overflow unit includes anti-overflow round platform 10, and base 1 is close to the position of a plurality of drive plates 6 and is equipped with the sliding groove, and 6 sliding connection of drive plate are inside the sliding groove.

The glue sealing table 2 can support glue sealing installation of the solar silicon wafer, the glue sealing panel 3 can support glue sealing of the silicon wafer, the first anti-overflow unit can perform glue overflow prevention on the peripheral edge positions of the solar silicon wafer, and the second anti-overflow unit can perform glue overflow prevention on the four corner positions of the solar silicon wafer.

First anti-overflow unit includes anti-overflow board 7, anti-overflow board 7's quantity is four, set up respectively and seal gluey 2 four sides of platform, it is equipped with the shifting chute to seal gluey 2 border position of platform, anti-overflow board 7 slides in the shifting chute inside, drive plate 6 sets up in anti-overflow board 7 bottom, the inside drive actuating cylinder 8 that is used for driving drive plate 6 and removes in the shifting chute inside that slides that is equipped with of shifting chute, anti-overflow board 7 keeps away from to seal gluey position of platform 2 and is equipped with and is used for carrying out the fender offset plate 9 that blocks to overflowing gluey, keep off offset plate 9 and anti-overflow board 7 can dismantle and be connected, drive actuating cylinder 8 and pressure sensor 12 electricity and be connected.

The anti-overflow board 7 can carry out the anti-overflow to silicon chip border position, drives actuating cylinder 8 and can drives drive plate 6 and remove in the inslot portion that slides to drive anti-overflow board 7 and remove in the inslot portion that slides, set up anti-overflow board 7 in the encapsulation panel below, carry out the anti-overflow and collect the viscose, keep off offset plate 9 and can block the inside viscose of anti-overflow board 7, avoid dropping.

The second anti-overflow unit includes supplementary round platform 11, and anti-overflow round platform 10 erects on supplementary round platform 11, and can dismantle with supplementary round platform 11 and be connected, is equipped with on anti-overflow round platform 10 and the supplementary round platform 11 and is used for inlaying the right angle breach of establishing and sealing gluey platform 2 and gluing panel 3, and the inside lift cylinder that is used for driving anti-overflow round platform 10 adjustment and inlays the height that is equipped with of supplementary round platform 11, and the inside position that corresponds anti-overflow plate 7 of anti-overflow round platform 10 is equipped with and is used for making anti-overflow plate 7 remove to sealing the removal opening of moving groove in the platform 2.

The anti-overflow circular truncated cone 10 can inlay the position of solar silicon chip four corners and establish, avoids gluing 3 four corners of panel and has the space, and supplementary circular truncated cone 11 can support anti-overflow circular truncated cone 10, and the lift cylinder can drive anti-overflow circular truncated cone 10 and go up and down to it establishes to glue panel 3 and carry out the card in four corners.

The overflow prevention plate 7 and the overflow prevention circular truncated cone 10 are paved with flexible rubber sheets, the glue blocking plate 9 is provided with buckles for clamping the flexible rubber sheets, the flexible rubber sheets can collect silicon wafer glue, and the glue is prevented from polluting the overflow prevention plate 7 and the overflow prevention circular truncated cone 10.

The utility model discloses a theory of operation is: operating personnel establishes the flexible sheet rubber card and planishes on keeping off buckle on offset plate 9 and on anti-overflow round platform 10, then place the solar wafer on the encapsulation panel according to the position of location adhesive tape on the encapsulation panel, pressure sensor 12 responds to the silicon chip, control drives actuating cylinder 8 and drives drive plate 6 and remove in the inslot portion that slides, thereby drive anti-overflow plate 7 and remove in the inslot portion that slides, set up anti-overflow plate 7 in the encapsulation panel below, it goes up and down to open lift cylinder and drive anti-overflow round platform 10, thereby to seal glue panel 3 and carry out the four corners and inlay and establish, implement at last and carry out the viscose operation to the solar wafer.

It is obvious to a person skilled in the art that the invention is not restricted to details of the above-described exemplary embodiments, but that it can be implemented in other specific forms without departing from the spirit or essential characteristics of the invention. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.

Claims

1. The utility model provides a flexible glue sealing mould based on excessive gluing laminating is prevented to solar energy silicon chip which characterized in that: the mould includes base (1), be equipped with on base (1) and be used for carrying out the gluey platform (2) of gluing to solar wafer, it glues to be equipped with on platform (2) and seals gluey panel (3), base (1) is close to the position of sealing gluey platform (2) and is equipped with the first anti-overflow unit that is used for carrying out the viscose anti-overflow to solar wafer border position and is used for carrying out the second anti-overflow unit of viscose anti-overflow to solar wafer corner position, first anti-overflow unit includes a plurality of drive plates (6), second anti-overflow unit includes anti-overflow round platform (10), the position that base (1) is close to a plurality of drive plates (6) is equipped with the sliding tray, drive plate (6) sliding connection is inside the sliding tray.

2. The flexible glue sealing mold based on solar silicon wafer glue overflow prevention gluing according to claim 1, wherein the first overflow prevention unit comprises four overflow prevention plates (7), the four overflow prevention plates (7) are respectively arranged on four sides of the glue sealing table (2), a moving groove is formed in the edge position of the glue sealing table (2), the overflow prevention plates (7) slide in the moving groove, the driving plate (6) is arranged at the bottom of the overflow prevention plates (7), a driving cylinder (8) for driving the driving plate (6) to move in the moving groove is arranged in the moving groove, a glue blocking plate (9) for blocking glue overflow is arranged in a position, away from the glue sealing table (2), of the overflow prevention plates (7), and the glue blocking plate (9) is detachably connected with the overflow prevention plates (7).

3. The flexible glue sealing die based on the solar silicon wafer glue overflow prevention bonding is characterized in that the second overflow prevention unit comprises an auxiliary circular truncated cone (11), the overflow prevention circular truncated cone (10) is erected on the auxiliary circular truncated cone (11) and is detachably connected with the auxiliary circular truncated cone (11), right-angle notches for embedding the glue sealing table (2) and the glue sealing panel (3) are formed in the overflow prevention circular truncated cone (10) and the auxiliary circular truncated cone (11), a lifting cylinder for driving the overflow prevention circular truncated cone (10) to adjust the embedding height is arranged inside the auxiliary circular truncated cone (11), and a position, corresponding to the overflow prevention plate (7), inside the overflow prevention circular truncated cone (10) is provided with a movement for enabling the overflow prevention plate (7) to move to a moving groove in the glue sealing table (2).

4. The flexible adhesive sealing mold based on the solar silicon wafer anti-overflow gluing and gluing of claim 1, wherein the adhesive sealing table (2) is provided with a lifting table (4) close to the adhesive sealing panel (3) for driving the adhesive sealing panel (3) to lift, a positioning edge strip (5) for positioning the solar silicon wafer is arranged on the adhesive sealing panel (3), and a pressure sensor (12) for sensing the solar silicon wafer is arranged inside the positioning edge strip (5).

5. The flexible glue sealing mold based on the solar silicon wafer glue overflow prevention attachment is characterized in that flexible rubber sheets are laid on the overflow prevention plate (7) and the overflow prevention circular truncated cone (10), and a buckle used for clamping the flexible rubber sheets is arranged on the glue blocking plate (9).

6. The flexible sealing glue mold based on the solar silicon wafer glue overflow prevention attachment as claimed in claim 1, wherein the mold surface is coated with a non-stick coating.