CN218525831U

CN218525831U - Reverse chip card connector

Info

Publication number: CN218525831U
Application number: CN202222360733.9U
Authority: CN
Inventors: 王惠君; 陈进嵩
Original assignee: Goldenconn Electronic Technology Co Ltd
Current assignee: Goldenconn Electronic Technology Co Ltd
Priority date: 2022-09-06
Filing date: 2022-09-06
Publication date: 2023-02-24
Anticipated expiration: 2032-09-06

Abstract

The application provides a reverse chip card connector, which comprises a substrate, a first connector and a second connector, wherein the substrate is provided with an accommodating space, the upper part of the accommodating space is open, and a plug-in port is arranged on the side surface of the accommodating space; the detection terminal is clamped on the substrate, and step bulges are arranged on the substrate at the positions on two sides of the detection terminal; the substrate is also inserted with a pin module; still include interior casing, its lid is located the uncovered department in upper portion of accommodation space and with the base plate joint. The connector can prevent the wafer card from directly contacting the detection terminal in the card inserting process by arranging the step bulges at the two sides of the detection terminal, thereby prolonging the service life of the detection terminal. Preferably, through will surveying terminal and base plate joint and fixed through the plastic part, the cooperation back end hot melt technology after the equipment can ensure the firm in connection who surveys the terminal, prevents to survey the terminal and drops. Through set up static conduction shell fragment on the inner casing, can conduct the release with the static on the card.

Description

Reverse chip card connector

Technical Field

The utility model relates to a wafer card cassette technique especially relates to a reverse wafer card connector.

Background

In the devices such as card readers, a chip card (smart card) is connected with a circuit board through a connector, and in the card inserting process of the chip card, the detection terminal is easily damaged because the elastic sheet of the detection terminal is directly inserted into the card.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a reverse wafer card connector can protect and listen terminal shell fragment, increase of service life.

The following presents a simplified summary of one or more aspects in order to provide a basic understanding of such aspects. This summary is not an extensive overview of all contemplated aspects, and is intended to neither identify key or critical elements of all aspects nor delineate the scope of any or all aspects. Its sole purpose is to present some concepts of one or more aspects in a simplified form as a prelude to the more detailed description that is presented later.

According to an aspect of the utility model, a reverse wafer card connector is provided, include:

the base plate is provided with an accommodating space, the upper part of the accommodating space is opened, and the side surface of the accommodating space is provided with a plug-in port;

the detection terminal is clamped with the substrate, and step bulges are arranged on the substrate at the positions on two sides of the detection terminal;

the pin module is inserted on the substrate; and

and the inner shell is covered on the upper opening of the accommodating space and clamped with the substrate.

In one embodiment, the detection terminal includes a sinking portion and a main portion connected to each other, and the middle of the main portion has a raised resilient piece.

In one embodiment, the step protrusion extends in the insertion direction of the wafer card.

In one embodiment, the height of the step protrusion is flush with the height of the main body portion of the detection terminal.

In one embodiment, the front end of the step protrusion extends beyond the main body of the detection terminal and extends to the sinking portion.

In one embodiment, a plastic member is connected between the detection terminal and the substrate.

In one embodiment, the plastic part is inserted into the sunken part of the detection terminal, and forms a holding force to the detection terminal through an ultrasonic hot melting process during processing.

In an embodiment, the inner casing is provided with an electrostatic conduction elastic sheet, and the electrostatic conduction elastic sheet protrudes towards the inside of the accommodating space.

The embodiment of the utility model provides a beneficial effect is: the step bulges are arranged on the two sides of the detecting terminal, so that the chip card can be prevented from directly contacting the detecting terminal in the card inserting process, and the service life of the detecting terminal is prolonged. Preferably, through will surveying terminal and base plate joint and fixed through the plastic part, the cooperation back end hot melt technology after the equipment can ensure the firm in connection who surveys the terminal, prevents to survey the terminal and drops. Through set up static conduction shell fragment on the inner casing, can conduct the release with the static on the card.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings that are required to be used in the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present invention, and therefore should not be considered as limiting the scope, and for those skilled in the art, other related drawings can be obtained according to the drawings without inventive efforts.

The above features and advantages of the present invention will be better understood upon reading the detailed description of embodiments of the present disclosure in conjunction with the following drawings. In the drawings, components are not necessarily drawn to scale, and components having similar relative characteristics or features may have the same or similar reference numerals.

FIG. 1 is a schematic view of the construction of an inverted chip card connector in one embodiment (with the inner housing hidden);

fig. 2 is a partially enlarged view at a in fig. 1;

FIG. 3 is a schematic view of the structure of the inverted chip card connector of one embodiment (including the inner housing);

wherein: 1-a substrate; 11-a socket; 12-step convex; 2-a detection terminal; 21-sink fraction; 22-a body portion; 22 a-a spring plate; 3-a pin module; 4-an inner housing; 41-an electrostatic conductive spring; 5-plastic parts.

Detailed Description

The present invention will be described in detail below with reference to the accompanying drawings and specific embodiments. It is noted that the aspects described below in connection with the figures and the specific embodiments are only illustrative and should not be construed as imposing any limitation on the scope of the present invention.

As shown in fig. 1 to 3, the present embodiment provides a reverse chip card connector, which includes a substrate 1, the substrate 1 forms a receiving space for inserting a chip card, the upper portion of the receiving space is open, and the side of the receiving space has a socket 11, and the chip card is inserted into the receiving space from the socket 11 (the insertion direction is shown by the arrow in fig. 1). The substrate 1 is clamped with the detection terminal 2 and inserted with the pin module 3 to realize the electrical connection with the chip card. On the surface of the substrate 1, a step protrusion 12 is provided at the position of both sides of the detection terminal 2 to protect the detection terminal 2. An inner shell 4 is covered at the upper opening of the accommodating space, and the inner shell 4 is connected with the base plate 1 through a buckle.

Referring to fig. 2, the detection terminal 2 includes a sinking portion 21 and a main portion 22 connected to each other, and the main portion 22 has a raised spring piece 22a in the middle. In order to protect the spring plate 22a during the insertion of the chip card, the step protrusion 12 extends along the insertion direction of the chip card, and the height of the step protrusion 12 is flush with the height of the main body portion 22 of the detection terminal 2. The front end of the stepped projection 12 extends beyond the main body portion 22 of the detection terminal 2 and toward the depressed portion 21. When the chip card is inserted, it will contact the step protrusion 12 first and then contact the detection terminal 2.

A plastic member 5 is connected between the detection terminal 2 and the substrate 1. The plastic member 5 is inserted into the sinking portion 21 of the detecting terminal 2, and forms a holding force to the detecting terminal 2 by an ultrasonic hot melting process during processing, so that the detecting terminal 2 can be prevented from falling off.

In addition, as shown in fig. 3, an electrostatic conductive elastic sheet 41 is further disposed on the inner housing 4, and the electrostatic conductive elastic sheet 41 protrudes toward the inside of the accommodating space for contacting with the wafer card to implement an electrostatic conductive releasing function.

The embodiments in the present description are described in a progressive manner, each embodiment focuses on differences from other embodiments, and the same and similar parts among the embodiments are referred to each other.

The previous description of the disclosure is provided to enable any person skilled in the art to make or use the disclosure. Various modifications to the disclosure will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other variations without departing from the spirit or scope of the disclosure. Thus, the disclosure is not intended to be limited to the examples and designs described herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

The above description is only a preferred example of the present application and should not be taken as limiting the present application, and any modifications, equivalents, improvements and the like made within the spirit and principle of the present application should be included in the scope of the present application.

Claims

1. A reverse chip card connector, comprising:

the base plate is provided with an accommodating space, the upper part of the accommodating space is open, and the side surface of the accommodating space is provided with a plug port;

the pin module is inserted on the substrate; and

and the inner shell is covered on the upper opening of the accommodating space and is clamped with the substrate.

2. The reversed chip card connector according to claim 1, wherein the detecting terminal comprises a sinking portion and a main body portion connected to each other, the main body portion having a raised resilient piece at a middle portion thereof.

3. The inverted wafer card connector of claim 2 wherein said step projection extends in the direction of insertion of the wafer card.

4. The inverted chip card connector of claim 3, wherein the height of said step-like projection is flush with the height of said main body portion of said detection terminal.

5. The inverted chip card connector of claim 4, wherein the front end of said step projection extends beyond said main body portion of said detection terminal and toward said depressed portion.

6. The inverted chip card connector of claim 2, wherein a plastic member is connected between said detection terminal and said substrate.

7. The reversed chip card connector according to claim 6, wherein the plastic member is inserted through the sunken portions of the detection terminals and forms a holding force to the detection terminals by an ultrasonic heat-melting process during processing.

8. The inverted wafer card connector of claim 1, wherein the inner housing has a static conductive spring disposed thereon, the static conductive spring protruding toward the inside of the receiving space.