CN218518957U

CN218518957U - Cutting wire tensioning mechanism of wafer cutting machine

Info

Publication number: CN218518957U
Application number: CN202222933277.2U
Authority: CN
Inventors: 陈海龙
Original assignee: Xinmao Jiaxing Semiconductor Technology Co ltd
Current assignee: Xinmao Jiaxing Semiconductor Technology Co ltd
Priority date: 2022-11-04
Filing date: 2022-11-04
Publication date: 2023-02-24
Anticipated expiration: 2032-11-04

Abstract

The utility model relates to a multi-wire saw field especially involves a wafer cutting machine's cutting wire rod straining device, which comprises a frame and a mounting panel, the mounting panel with the frame rotates the connection, the fixed baffle that is provided with on the mounting panel, it is provided with two gyro wheels to rotate on the baffle, be provided with the storage tank on the baffle, two the gyro wheel sets up the both sides of storage tank, it is provided with an adjusting roller to slide on the mounting panel, still fix a tension tester that is provided with on the mounting panel. The utility model discloses a setting of dancer rools and tension tester for can be when the mounting panel swings, adjust the tension of wire in real time through the dancer rools, thereby guarantee that the tension of wire keeps in certain extent, the condition of having avoided the wire to break takes place, has promoted the security of production.

Description

Cutting wire tensioning mechanism of wafer cutting machine

Technical Field

The utility model relates to a multi-wire saw field especially involves a cutting wire rod straining device of wafer cutting machine.

Background

The multi-wire cutting is a novel cutting processing method which carries grinding materials into a semiconductor processing area for grinding through high-speed reciprocating motion of a metal wire and simultaneously cuts hard and brittle materials such as semiconductors into hundreds of thin slices at one time. The numerical control multi-wire cutting machine has gradually replaced the traditional internal circle cutting and becomes the main mode of silicon wafer cutting processing.

At present, when a silicon wafer is cut, in order to increase the cutting speed, a regular shaking cutting device is adopted by a multi-wire cutting machine of some types to enable the contact between a product and a metal wire to be more sufficient. However, the swing can cause the tension on the metal wire to change regularly, and once the tension of the metal wire is greater than the tensile limit of the metal wire, the metal wire can be broken, thereby causing production accidents. Therefore, there is a need for an improved structure that overcomes the above-mentioned deficiencies.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to overcome prior art's is not enough, provides a wafer cutting machine's cutting wire tensioning mechanism, the utility model discloses a realize through following technical scheme:

the utility model provides a wafer cutting machine's cutting wire rod straining device, includes frame and mounting panel, the mounting panel with the frame rotates to be connected, the fixed baffle that is provided with on the mounting panel, it is provided with two gyro wheels to rotate on the baffle, be provided with the storage tank on the baffle, two the gyro wheel sets up the both sides of storage tank, it is provided with an adjusting roller to slide on the mounting panel, still the fixed tensiometer that is provided with on the mounting panel.

In the above technical scheme: the frame is used for supporting the rest parts; the mounting plate and the rack rotate and are used for realizing shaking in cutting; the partition board is used for arranging the roller and other components; the roller is used for setting the track of the metal wire for cutting; the containing groove is a product containing space during processing; the adjusting roller is used for realizing tension adjustment of the metal wire; the tension tester is used for testing the tension received by the metal wire, so that the position of the adjusting roller is changed in real time, and the tension of the metal wire is kept within a certain range.

The utility model discloses a further set up to: rotate in the frame and be provided with reel and guide roll, the pivot trend of reel with the pivot trend of guide roll is parallel, just the left side limit of reel with the left side limit of guide roll is located same vertical plane.

In the above technical scheme: the reel is used for winding the metal wire and has the effect of supplying and storing the metal wire; the guide roller is used for guiding the direction of the metal wire to make the metal wire turn to the position of the roller; the rotating shaft of the reel is parallel to the rotating shaft of the guide roller, so that the tension of the metal wire cannot be changed due to different positions of the metal wire on the guide roller, and the tension of the metal wire is more stable.

The utility model discloses a further set up to: the sliding direction of the adjusting roller is perpendicular to a connecting line of midpoints of the two rollers.

In the above technical scheme: the sliding direction of the adjusting roller is perpendicular to a connecting line of the middle points of the two rollers, so that the moving distance of the adjusting roller is smaller when the pressure of the metal wire is adjusted, and the adjustment is quicker.

The utility model discloses a further set up to: be provided with the sliding tray on the mounting panel, the dancer rools setting is in the sliding tray.

In the above technical scheme: the sliding groove is used for guiding the trend of the adjusting roller.

The utility model discloses a further set up to: the adjusting roller and the tension tester are arranged in the accommodating groove.

In the above technical scheme: the adjusting roller is arranged in the accommodating groove, so that the partition plate can be prevented from interfering with the adjusting roller; the tension tester is arranged in the accommodating groove, so that the tension tester is closer to the adjusting roller, and the tension change of the metal wire can be quickly measured.

The utility model discloses a further set up to: the inside of the containing groove is also fixedly provided with a baffle, and the baffle is obliquely arranged.

In the above technical scheme: the baffle is used for avoiding cutting fluid to produce the influence to the tensiometer.

The utility model discloses a further set up to: still rotate on the mounting panel and be provided with two at least direction roller bearings, just the direction roller bearing sets up the baffle is close to one side of guide roll.

In the above technical scheme: the mounting plate is provided with guide rollers for enabling the wires to remain in contact with the rollers when the mounting plate is shaken.

The utility model discloses a wafer cutting machine's cutting wire rod straining device compares with prior art:

1. the utility model can adjust the tension of the metal wire in real time through the adjusting roller when the mounting plate swings through the arrangement of the adjusting roller and the tension tester, thereby ensuring that the tension of the metal wire is kept in a certain range, avoiding the situation of the metal wire breaking and improving the safety of production;

2. the utility model discloses a control of the trend of dancer roll to and the setting of the distance between dancer roll and the tension tester, make the dancer roll more swift to the tensile regulation of wire, the tension tester is more sensitive to the tensile change of wire, has improved the efficiency and the degree of accuracy of adjusting.

Drawings

FIG. 1 is a schematic view of the present invention;

fig. 2 is a schematic view of the roller of the present invention;

fig. 3 is a plan view of the separator of the present invention.

The corresponding part names indicated by the numbers and letters in the drawings: 10-a frame; 20-mounting a plate; 201-sliding groove; 30-a separator; 301-a receiving groove; 40-a roller; 50-a regulating roller; 60-a tensile tester; 70-a reel; 80-a guide roller; 90-a baffle; 100-guide roller.

Detailed Description

The embodiments of the present invention will be described in detail below, and the present embodiment is implemented on the premise of the technical solution of the present invention, and a detailed implementation manner and a specific operation process are given, but the scope of the present invention is not limited to the following embodiments.

As shown in fig. 1-3, the utility model provides a wafer cutting machine's cutting wire tensioning mechanism, including frame 10 and mounting panel 20, mounting panel 20 with frame 10 rotates to be connected, the fixed baffle 30 that is provided with on mounting panel 20, it is provided with two gyro wheels 40 to rotate on the baffle 30, be provided with storage tank 301 on the baffle 30, two gyro wheel 40 sets up storage tank 301's both sides, it is provided with an adjusting roll 50 to slide on the mounting panel 20, still fix on the mounting panel 20 and be provided with the tension tester 60. Wherein the frame 10 is a main frame of the multi-wire cutting machine; the two sides of the mounting plate 20 are arc-shaped to reduce the possibility of interference during shaking; the length of the partition board 30 is smaller than that of the mounting plate 20, and the center of the partition board 30 is coincident with the rotation center of the mounting plate 20; the two rollers 40 are symmetrically arranged about a rotation center line of the partition plate 30; the mounting plate 20 is further fixedly provided with a motor, an output shaft of the motor is connected with a lead screw, and the adjusting roller 50 is fixedly connected with an output platform of the lead screw.

As shown in fig. 1-3, the utility model provides a cutting wire tensioning mechanism of wafer cutting machine, the rotation is provided with reel 70 and guide roll 80 on frame 10, the pivot trend of reel 70 with the pivot trend of guide roll 80 is parallel, just the left side limit of reel 70 with the left side limit of guide roll 80 is located same vertical plane. Wherein, preferably, the reel 70 is movable in the reverse direction of its own rotation axis so that the wires can be spaced apart on the guide roller 80 and the roller 40, thereby achieving multi-wire cutting.

As shown in fig. 1-3, the sliding direction of the adjusting roller 50 is perpendicular to the line connecting the middle points of the two rollers 40. Wherein the length of the regulating roller 50 is identical to that of the roller 40; preferably, a limiting block is fixedly arranged on the partition plate 30, one end of the adjusting roller 50 is connected with the output platform of the screw rod, and the other end of the adjusting roller is connected with the limiting block in a sliding manner.

As shown in fig. 1-3, the utility model provides a cutting wire tensioning mechanism of wafer cutting machine, be provided with sliding tray 201 on the mounting panel 20, the adjusting roller 50 sets up in the sliding tray 201. Wherein, the output platform of lead screw with sliding tray 201 sliding connection.

As shown in fig. 1-3, the utility model provides a cutting wire tensioning mechanism of wafer cutting machine, dancer 50 with tension tester 60 sets up in storage tank 301.

As shown in fig. 1-3, the utility model provides a cutting wire tensioning mechanism of wafer cutting machine, still fixedly in the storage tank 301 be provided with baffle 90, just baffle 90 slopes to set up. The inclined angle of the end of the baffle 90 is larger to prevent the water from impacting the inner side of the accommodating groove 301 and rebounding to the tension tester 60.

As shown in fig. 1-3, the utility model provides a cutting wire tensioning mechanism of wafer cutting machine, still rotate on the mounting panel 20 and be provided with two at least guiding roller 100, just guiding roller 100 sets up baffle 30 is close to one side of guiding roller 80. Wherein the wire passes between the guide roller 100 and the roller 40, and the length of the guide roller 100 is identical to that of the roller 40.

The utility model discloses a theory of operation does:

a) The metal wire starts from the winding wheel, passes through the guide roller, the idler wheel, the adjusting roller, the tension tester and the guide roller shaft, and then returns to the winding wheel;

b) When the product is cut by the multi-wire cutting machine, the mounting plate is shaken left and right to increase the cutting speed;

c) The mounting plate inclines left and right, the tension on the metal wire is larger, the data measured by the tension tester is compared with a nominal numerical range, and then the adjusting roller is far away from the roller, so that the tension of the metal wire is reduced;

d) When the mounting plate returns to the horizontal position, the tension on the metal wire is small, the tension tester measures data and compares the data with a nominal numerical range, and then the adjusting roller is made to be close to the roller, so that the tension of the metal wire is increased.

Above, only be the embodiment of the preferred of the present invention, but the protection scope of the present invention is not limited thereto, and any person skilled in the art is in the technical scope of the present invention, according to the technical solution of the present invention and the design of the present invention, equivalent replacement or change should be included in the protection scope of the present invention.

It should be noted that, in this document, relational terms such as first and second, and the like are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrases "comprising a," "8230," "8230," or "comprising" does not exclude the presence of additional like elements in a process, method, article, or apparatus that comprises the element.

Claims

1. The utility model provides a wafer cutting machine's cutting wire rod straining device, includes frame (10) and mounting panel (20), mounting panel (20) with frame (10) rotate to be connected its characterized in that: the fixed baffle (30) that is provided with on mounting panel (20), it is provided with two gyro wheels (40) to rotate on baffle (30), be provided with storage tank (301) on baffle (30), two gyro wheel (40) set up the both sides of storage tank (301), it is provided with an adjusting roller (50) to slide on mounting panel (20), still the fixed tension tester (60) that is provided with on mounting panel (20).

2. The cutting wire tensioning mechanism of the wafer cutting machine according to claim 1, characterized in that: the rotary type fishing device is characterized in that a reel (70) and a guide roller (80) are arranged on the rack (10) in a rotating mode, the rotating shaft direction of the reel (70) is parallel to the rotating shaft direction of the guide roller (80), and the left side edge of the reel (70) is located on the same vertical plane with the left side edge of the guide roller (80).

3. The cutting wire tensioning mechanism of the wafer cutting machine according to claim 2, characterized in that: the sliding direction of the adjusting roller (50) is perpendicular to a connecting line of the midpoints of the two rollers (40).

4. The cutting wire tensioning mechanism of the wafer cutting machine according to claim 3, characterized in that: be provided with sliding tray (201) on mounting panel (20), dancer rools (50) set up in sliding tray (201).

5. The cutting wire tensioning mechanism of a wafer cutting machine according to claim 2 or 4, characterized in that: the adjusting roller (50) and the tension tester (60) are arranged in the accommodating groove (301).

6. The cutting wire tensioning mechanism of a wafer cutting machine according to claim 5, characterized in that: a baffle (90) is fixedly arranged in the accommodating groove (301), and the baffle (90) is obliquely arranged.

7. The cutting wire tensioning mechanism of the wafer cutting machine as set forth in claim 6, wherein: still rotate on mounting panel (20) and be provided with two at least direction roller bearing (100), just direction roller bearing (100) set up baffle (30) are close to one side of guide roll (80).