CN218514761U

CN218514761U - Packaging structure for pressure sensing chip

Info

Publication number: CN218514761U
Application number: CN202222681256.6U
Authority: CN
Inventors: 江伟安
Original assignee: Yusheng Electronics Shenzhen Co ltd
Current assignee: Yusheng Electronics Shenzhen Co ltd
Priority date: 2022-10-12
Filing date: 2022-10-12
Publication date: 2023-02-21
Anticipated expiration: 2032-10-12

Abstract

The utility model relates to a pressure sensor technical field discloses a packaging structure for pressure sensing chip, including the packaging structure main part, the packaging structure main part includes the rubber roof, the fixed pressure tube that is provided with in the middle of the rubber roof up end, the pressure tube upper end is provided with the import, the fixed corrosion-resistant layer that is provided with of packaging structure main part inner wall, the fixed base plate that is provided with in bottom in the corrosion-resistant layer, set up flutedly in the middle of the base plate up end, the inside fixed pressure sensing chip that is provided with of recess, be provided with the guide block in the middle of the pressure sensing chip up end. The utility model discloses in, this a packaging structure for pressure sensing chip has dual anti-corrosion's function, can detect pressure under the condition that the pressure conduction medium does not contact the chip, and this a packaging structure for pressure sensing chip that should be used for connects closely simultaneously, has the stable efficiency of detection effect.

Description

Packaging structure for pressure sensing chip

Technical Field

The utility model relates to a pressure sensor technical field especially relates to a packaging structure for pressure sensing chip.

Background

A pressure sensor is a device or apparatus that can sense a pressure signal and convert the pressure signal into a usable output electrical signal according to a certain rule, and the pressure sensor generally comprises a pressure sensitive element and a signal processing unit. According to different test pressure types, the pressure sensor can be divided into a gauge pressure sensor, a differential pressure sensor and an absolute pressure sensor, is the most common sensor in industrial practice, is widely applied to various industrial automatic control environments, and relates to various industries such as water conservancy and hydropower, railway traffic, intelligent buildings, production automatic control, aerospace, war industry, petrifaction, oil wells, electric power, ships, machine tools, pipelines and the like. The pressure sensing chip is an important structure of the pressure sensor, but the pressure sensing chip is very fragile and easy to corrode, so that a packaging structure is needed to protect the pressure sensing chip from corrosion.

The existing packaging structure has few structures for simultaneously preventing corrosion of pressure conduction media, external gas and liquid, and the anticorrosion measures for the chip are not perfect enough. Therefore, those skilled in the art have provided a package structure for a pressure sensing chip to solve the above problems in the background art.

SUMMERY OF THE UTILITY MODEL

The utility model aims at solving the shortcoming that exists among the prior art, and the packaging structure for the pressure sensing chip that proposes, this a packaging structure for the pressure sensing chip has dual anticorrosive function, can detect pressure under the condition of pressure conduction medium contactless chip, and this a packaging structure for the pressure sensing chip that should be used for connects closely simultaneously, has the stable efficiency of detection effect.

In order to achieve the above purpose, the utility model provides a following technical scheme:

the utility model provides a pressure sensing packaging structure for chip, includes the packaging structure main part, the packaging structure main part includes the rubber roof, the fixed pressure inlet pipe that is provided with in the middle of the rubber roof up end, the pressure inlet pipe upper end is provided with the import, the fixed corrosion-resistant layer that is provided with of packaging structure main part inner wall, the fixed base plate that is provided with in bottom in the corrosion-resistant layer, set up flutedly in the middle of the base plate up end, the inside fixed pressure sensing chip that is provided with of recess, be provided with the conduction piece in the middle of the pressure sensing chip up end, top fixed connection in conduction piece upper end and the corrosion-resistant layer, the fixed connection chamber that is provided with of packaging structure main part lower extreme.

Through the technical scheme, the pressure can be detected under the condition that the pressure medium does not contact the chip through the pressure inlet pipe, the corrosion-resistant layer and the conduction block, the contact between the pressure sensing chip and the pressure conduction medium is reduced, the pressure sensing chip is effectively prevented from being corroded, and meanwhile, the corrosion of external gas and liquid to the chip can be prevented under the action of the corrosion-resistant layer.

Further, one side of the outer wall of the pressure inlet pipe is provided with external threads;

through the technical scheme, the connection of the pressure inlet pipe and the device to be tested can be facilitated through the external threads.

Furthermore, a model identification area is fixedly arranged on one side of the outer wall of the packaging structure main body;

through the technical scheme, the model of the pressure sensing chip can be conveniently known through the model identification area.

Further, a rubber gasket is sleeved on the outer wall of the pressure sensing chip close to the lower end;

through above-mentioned technical scheme, can prevent through the rubber packing ring that the chip from receiving the collision and damaging.

Furthermore, a plurality of metal pins are fixedly arranged on two sides of the lower end face of the pressure sensing chip, and extend out of the packaging structure body;

through above-mentioned technical scheme, make things convenient for the transmission of pressure information through a plurality of metal pin.

Furthermore, insulating sleeves are sleeved on the outer walls of the plurality of metal pins close to the upper ends of the metal pins;

through above-mentioned technical scheme, can prevent through insulating cover that external signal of telecommunication from passing through packaging structure main part to metal pin's interference.

Further, the insulating sleeve is made of a rubber material;

through the technical scheme, the production cost can be reduced.

Furthermore, the inner wall of the connecting cavity is provided with an internal thread;

through above-mentioned technical scheme, can conveniently be connected with other components and parts through the internal thread.

The utility model discloses following beneficial effect has:

1. the utility model provides a pair of packaging structure for pressure sensing chip, compare in current packaging structure, this packaging structure is through setting up the pressure inlet pipe and conduction piece, can detect out pressure under the condition of pressure conduction medium contactless chip, reduce the contact of pressure sensing chip and pressure conduction medium, prevent effectively that the pressure sensing chip from being corroded, be provided with corrosion resistant layer and under the effect of whole sealing at packaging structure main part inner wall, prevented that outside gas and liquid from getting into inside the packaging structure main part, reached the efficiency that prevents the corruption of outside gas and liquid to the chip, the life of pressure sensing chip has been prolonged.

2. The utility model provides a pair of packaging structure for pressure sensing chip compares in current packaging structure, and this packaging structure's structural connection is inseparable, and pressure information can stabilize the conduction, has reached the stable efficiency of detection effect.

3. The utility model provides a pair of packaging structure for pressure sensing chip compares in current packaging structure, and this packaging structure simple structure, convenient operation, the practicality is strong.

Drawings

Fig. 1 is an isometric view of a package structure for a pressure sensing chip according to the present invention;

fig. 2 is a cross-sectional view of a package structure for a pressure sensing chip according to the present invention;

fig. 3 is a schematic structural diagram of a substrate of a package structure for a pressure sensing chip according to the present invention;

fig. 4 is a schematic structural diagram of an internal thread of the package structure for a pressure sensing chip according to the present invention.

Illustration of the drawings:

1. packaging the structure body; 2. a pressure inlet pipe; 3. an external thread; 4. an inlet; 5. a model identification area; 6. a corrosion-resistant layer; 7. a rubber top plate; 8. a conductive block; 9. a pressure sensing chip; 10. a rubber gasket; 11. a substrate; 12. an insulating sleeve; 13. a metal pin; 14. a groove; 15. an internal thread; 16. a connecting cavity.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts all belong to the protection scope of the present invention.

Referring to fig. 1-4, the present invention provides an embodiment: the utility model provides a packaging structure for pressure sensing chip, including packaging structure main part 1, packaging structure main part 1 includes rubber roof 7, fixedly in the middle of the up end of rubber roof 7 be provided with the pressure inlet pipe 2, pressure inlet pipe 2 upper end is provided with import 4, packaging structure main part 1 inner wall is fixed and is provided with corrosion-resistant layer 6, the fixed base plate 11 that is provided with in corrosion-resistant layer 6 bottom, set up recess 14 in the middle of the up end of base plate 11, the inside fixed pressure sensing chip 9 that is provided with of recess 14, be provided with conducting block 8 in the middle of the up end of pressure sensing chip 9, top fixed connection in conducting block 8 upper end and corrosion-resistant layer 6, packaging structure main part 1 lower extreme is fixed and is provided with connecting cavity 16, can detect pressure under the condition that the pressure medium does not contact the chip through pressure inlet pipe 2, corrosion-resistant layer 6 and conducting block 8, reduce the contact of pressure sensing chip 9 and pressure conducting medium, effectively prevent that pressure sensing chip 9 from being corroded, can prevent the corrosion of outside gas and liquid to the chip under the effect of corrosion-resistant layer 6 simultaneously.

External thread 3 is opened to 2 outer walls of pressure inlet pipe one side, can make things convenient for pressure inlet pipe 2 and the device to be tested to be connected through external screw thread 3, the fixed model identification district 5 that is provided with in 1 outer wall one side of packaging structure main part, can conveniently know this pressure sensing chip 9's model through model identification district 5, pressure sensing chip 9 outer wall is by lower pot head cover be equipped with rubber packing ring 10, can prevent through rubber packing ring 10 that the chip from receiving the collision and damaging, terminal surface both sides are all fixed under pressure sensing chip 9 and are provided with a plurality of metal pin 13, a plurality of metal pin 13 all stretch out packaging structure main part 1, make things convenient for the transmission of pressure information through a plurality of metal pin 13, a plurality of metal pin 13 outer walls are by the equal cover of upper end and are equipped with insulating cover 12, can prevent through insulating cover 12 that external signal of telecommunication from passing through packaging structure main part 1 to metal pin 13 interference, insulating cover 12 comprises rubber materials, can reduce manufacturing cost, connect 16 inner walls of chamber and offer internal thread 15, can conveniently be connected with other components through internal thread 15.

The working principle is as follows: the utility model discloses when using, at first be connected packaging structure main part 1 with other components and parts, rethread external screw thread 3 is connected packaging structure main part 1 and the device under test, then detect, pressure conduction medium gets into the inlet tube 2 inside from import 4, extrusion rubber roof 7, make conduction block 8 extrude pressure measurement department of pressure sensing chip 9, rethread pressure sensing chip 9 and other components and parts cooperation, measure the pressure that awaits measuring, just reached and just can measure the efficiency of pressure under the condition not with the chip contact, rethread corrosion resistant layer 6 has just reached dual anticorrosive efficiency.

Finally, it should be noted that: although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions on some technical features, and any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the scope of the present invention.

Claims

1. The utility model provides a pressure sensing packaging structure for chip, includes packaging structure main part (1), its characterized in that: packaging structure main part (1) includes rubber roof (7), fixedly in the middle of rubber roof (7) up end be provided with the pressure inlet pipe (2), pressure inlet pipe (2) upper end is provided with import (4), packaging structure main part (1) inner wall is fixed and is provided with corrosion resistant layer (6), the bottom is fixed and is provided with base plate (11) in corrosion resistant layer (6), recess (14) have been seted up in the middle of base plate (11) up end, recess (14) inside fixed pressure sensing chip (9) that is provided with, be provided with in the middle of pressure sensing chip (9) up end guide block (8), top fixed connection in guide block (8) upper end and corrosion resistant layer (6), packaging structure main part (1) lower extreme is fixed and is provided with connection chamber (16).

2. The package structure for pressure sensing chip according to claim 1, wherein: and one side of the outer wall of the pressure inlet pipe (2) is provided with an external thread (3).

3. The package structure for the pressure sensing chip according to claim 1, wherein: and a model identification area (5) is fixedly arranged on one side of the outer wall of the packaging structure main body (1).

4. The package structure for pressure sensing chip according to claim 1, wherein: the outer wall of the pressure sensing chip (9) close to the lower end is sleeved with a rubber gasket (10).

5. The package structure for pressure sensing chip according to claim 1, wherein: both sides of the lower end face of the pressure sensing chip (9) are fixedly provided with a plurality of metal pins (13), and the metal pins (13) extend out of the packaging structure body (1).

6. The package structure for the pressure sensing chip according to claim 5, wherein: and insulating sleeves (12) are sleeved on the outer walls of the metal pins (13) close to the upper ends of the metal pins.

7. The package structure for pressure sensing chip according to claim 6, wherein: the insulating sleeve (12) is made of rubber material.

8. The package structure for the pressure sensing chip according to claim 1, wherein: the inner wall of the connecting cavity (16) is provided with internal threads (15).